Optical Lithography Resources

Trove of lithography application notes from MicroChemicals covering troubleshooting, procedures, techniques, theory

KNI Photoresists

Photoresists provided by KNI:

• S1813: standard positive, withstands acid etching. (Manufacturer Spec Sheet)
• AZ5214: positive and image reversal negative, good for liftoff. (Manufacturer Spec Sheet)
• SU-8: thick polymer structures. (Manufacturer Spec Sheet)

Positive Photoresist Recipes

See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.

Resist	Wafer Prep	Spin	Thickness	Prebake	Exposure	Postbake	Flood	Development	Hardbake	Lamp	Notes
S1813	Dehydrate on hot plate	3000rpm	1.5um	115C 1min	X	-	-	X	-	Suss1 Ch1 15mW/cm^2	Measured 10/19 (Link KNI recipe doc here)
AZ5214	Dehydrate on hot plate	3500rpm	1.4um	100C 1min	25s	-	-	MF319 60s	-	Suss1 Ch1 15mW/cm^2	Measured 10/19

Negative Photoresist Recipes

See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.

Resist	Wafer Prep	Spin	Thickness	Prebake	Exposure	Postbake	Flood	Development	Hardbake	Lamp	Notes
AZ5214	Dehydrate on hot plate	2000rpm	1.8um	100C 1min	12s	110C 1min	40s	MF319 60s	-	Suss1 Ch1 15mW/cm^2	Measured 10/19
	Dehydrate on hot plate	3500rpm	1.4um	100C 1min	9s	110C 1min	30s	MF319 60s	-	Suss1 Ch1 15mW/cm^2	Measured 10/19

SU-8 Recipes

SU-8 is available in thicknesses ranging from 500nm to 500microns. Remember to use Laurel Spinner 1.

Resist thicknesses currently provided by KNI: 2050, 2005, 2001, 2000.5

BYU SU-8 Guide

Resist	Wafer Prep	Spin	Thickness	Prebake	Exposure	Postbake	Development	Hardbake	Lamp	Notes
2050	Dehydrate on hot plate	3000rpm	50um	65C 3min 95C 9min	X	65C 2min 95C 7min	SU-8 Developer X seconds	Optional	Suss1 Ch1 15mW/cm^2	Measured 10/19

Other Photoresists

• BYU Comprehensive list of photoresists

• UCSB Photoresist Recipes Page 1

• UCSB Photoresist Recipes Page 2

• BYU Photoresist Recipes

Non-KNI Photoresist Recipes

Resist	Wafer Prep	Spin	Thickness	Prebake	Exposure	Postbake	Flood	Development	Hardbake	Lamp	Notes
nLoF 2070	Dehydrate on hot plate	2500rpm	7um	110C 90s	12s	110C 90s	-	AZ 729 2min	-	Suss1 Ch1 15mW/cm^2	Measured 10/19

Addtional Photolithography Resources

• BYU Photolithography Guide

• Lithography Terminology

• Lithography Terminology 2

• Resolution Limits of Photolithography