Equipment List: Difference between revisions

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=Lithography=
= Lithography =
===== Electron Beam Lithography =====
===== Electron Beam Lithography =====
* Raith EBPG 5000+ (100 kV)
* Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
* Raith EBPG 5200 (100 kV)
* Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
* Quanta 200F SEM with NPGS (1-30 kV)
* Nanometer Pattern Generation System: Quanta 200F SEM with NPGS (1-30 kV)
 
===== Ion Beam Lithography =====
===== Ion Beam Lithography =====
* Zeiss ORION NanoFab (5-40 kV He & Ne, 1-30 kV Ga)
* He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)
 
===== Optical Lithography =====
===== Photolithography =====
* Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
* Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
* i-Line Wafer Stepper: GCA model 6300
* i-Line Wafer Stepper: GCA model 6300
* Direct-Write Laser System: Heidelberg Instruments DWL-66
* Direct-Write Laser System: Heidelberg Instruments DWL-66
* Two-Photon Lithography (3D printing): Nanoscribe Photonic Professional GT
* Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
 


= Deposition Equipment =
= Deposition Equipment =
===== Evaporation =====
===== Evaporation =====
* Kurt J Lesker Labline (Al, Au, Pt, Ti)
* Al, Au, Pt & Ti: Kurt J Lesker Labline
* CHA Industries Mark 40 (Metals & Oxides)
* Metals & Oxides: CHA Industries Mark 40
* Leica EM ACE600 Carbon Evaporator
* Carbon: Leica EM ACE600 Carbon Evaporator
 
===== Sputtering =====
===== Sputtering =====
* Dielectric Sputterer: AJA International ATC Orion 8
* Dielectric Sputterer: AJA International ATC Orion 8
* Chalcogenide Sputterer: AJA International ATC Orion 5
* Chalcogenide Sputterer: AJA International ATC Orion 5
===== Plasma- & Thermal-Enhanced Deposition =====
===== Plasma- & Thermal-Enhanced Deposition =====
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 PECVD
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
* Tube Furnaces: Tystar Tytan (Wet & Dry Oxidation and Annealing)
* Tube Furnaces: Tystar Tytan (Wet & Dry Oxidation and Annealing)
= Etching Equipment =
===== Dry Reactive-Ion Etching (RIE) =====
* Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
* Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
* Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
* Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
* Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
===== Wet Etching =====
* Wet Chemistry
= Microscopy Instrumentation =
==== Focused Ion Beam (FIB) Systems ====
* He/Ne/Ga-FIB: Zeiss ORION NanoFab
* SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
===== Scanning Electron Microscopes (SEMs) ====
* SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
* SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200
* SEM/EDS: Thermo Fisher Sirion
* SEM/ESEM: Thermo Fisher Quanta 200F
==== Transmission Electron Microscopes (TEMs) ====
* TEM/STEM/EDS/EELS/EFTEM: Thermo Fisher Tecnai TF-20 (80-300 kV)
* TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)
==== Scanning Probe Microscopes ====
* Atomic Force Microscope (AFM): Bruker Dimension ICON
* Profilometer: Veeco Dektak 3ST
= Support Tools =
==== Wafer Processing ====

Revision as of 23:06, 25 March 2019

Lithography

Electron Beam Lithography
  • Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
  • Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
  • Nanometer Pattern Generation System: Quanta 200F SEM with NPGS (1-30 kV)
Ion Beam Lithography
  • He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)
Optical Lithography
  • Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
  • i-Line Wafer Stepper: GCA model 6300
  • Direct-Write Laser System: Heidelberg Instruments DWL-66
  • Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT


Deposition Equipment

Evaporation
  • Al, Au, Pt & Ti: Kurt J Lesker Labline
  • Metals & Oxides: CHA Industries Mark 40
  • Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
  • Dielectric Sputterer: AJA International ATC Orion 8
  • Chalcogenide Sputterer: AJA International ATC Orion 5
Plasma- & Thermal-Enhanced Deposition
  • Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
  • Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
  • Tube Furnaces: Tystar Tytan (Wet & Dry Oxidation and Annealing)


Etching Equipment

Dry Reactive-Ion Etching (RIE)
  • Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
  • Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
  • Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
  • Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
  • Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
Wet Etching
  • Wet Chemistry


Microscopy Instrumentation

Focused Ion Beam (FIB) Systems

  • He/Ne/Ga-FIB: Zeiss ORION NanoFab
  • SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600

= Scanning Electron Microscopes (SEMs)

  • SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
  • SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200
  • SEM/EDS: Thermo Fisher Sirion
  • SEM/ESEM: Thermo Fisher Quanta 200F

Transmission Electron Microscopes (TEMs)

  • TEM/STEM/EDS/EELS/EFTEM: Thermo Fisher Tecnai TF-20 (80-300 kV)
  • TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)

Scanning Probe Microscopes

  • Atomic Force Microscope (AFM): Bruker Dimension ICON
  • Profilometer: Veeco Dektak 3ST


Support Tools

Wafer Processing

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