Difference between revisions of "Equipment List"
Jump to navigation
Jump to search
| Line 1: | Line 1: | ||
= Lithography = | = Lithography = | ||
===== Electron Beam Lithography ===== | ===== Electron Beam Lithography ===== | ||
* Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV) | |||
* Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV) | * Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV) | ||
* | * Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV) | ||
* Nanometer Pattern Generation System: | * Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV) | ||
===== Ion Beam Lithography ===== | ===== Ion Beam Lithography ===== | ||
* He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga) | * He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga) | ||
| Line 13: | Line 14: | ||
= Deposition | = Deposition = | ||
===== Evaporation ===== | ===== Evaporation ===== | ||
* Al, Au, Pt & Ti: Kurt J Lesker Labline | * Al, Au, Pt & Ti: Kurt J Lesker Labline | ||
| Line 21: | Line 22: | ||
* Dielectric Sputterer: AJA International ATC Orion 8 | * Dielectric Sputterer: AJA International ATC Orion 8 | ||
* Chalcogenide Sputterer: AJA International ATC Orion 5 | * Chalcogenide Sputterer: AJA International ATC Orion 5 | ||
===== Plasma | ===== Plasma-Enhanced Deposition ===== | ||
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II | * Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II | ||
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 | * Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 | ||
* | ===== Packaging ===== | ||
* Parylene Coater: Para Tech LabTop 3000 | |||
= Etching | = Etching = | ||
===== Dry | ===== Dry Etching ===== | ||
* Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE | * Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE | ||
* Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE | * Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE | ||
| Line 34: | Line 37: | ||
* Silicon, III/V Material & Organics Etcher: Plasmatherm RIE | * Silicon, III/V Material & Organics Etcher: Plasmatherm RIE | ||
* Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE | * Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE | ||
* XeF2 Silicon Etcher | |||
===== Wet Etching ===== | ===== Wet Etching ===== | ||
* Wet Chemistry | * Available Wet Chemistry Techniques | ||
= Microscopy | = Microscopy = | ||
==== Focused Ion Beam (FIB) Systems ==== | ===== Focused Ion Beam (FIB) Systems ===== | ||
* He/Ne/Ga-FIB: Zeiss ORION NanoFab | * He/Ne/Ga-FIB: Zeiss ORION NanoFab | ||
* SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600 | * SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600 | ||
===== Scanning Electron Microscopes (SEMs) ==== | ===== Scanning Electron Microscopes (SEMs) ===== | ||
* SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200 | * SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200 | ||
* SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600 | |||
* SEM/EDS: Thermo Fisher Sirion | * SEM/EDS: Thermo Fisher Sirion | ||
* SEM/ESEM: Thermo Fisher Quanta 200F | * SEM/ESEM: Thermo Fisher Quanta 200F | ||
==== Transmission Electron Microscopes (TEMs) ==== | ===== Transmission Electron Microscopes (TEMs) ===== | ||
* TEM/STEM/EDS/EELS/EFTEM: Thermo Fisher Tecnai TF-20 (80-300 kV) | * TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-300 kV) | ||
* TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV) | * TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV) | ||
==== Scanning Probe Microscopes ==== | ===== Scanning Probe Microscopes ====== | ||
* Atomic Force Microscope (AFM): Bruker Dimension ICON | * Atomic Force Microscope (AFM): Bruker Dimension ICON | ||
* Profilometer: Veeco Dektak 3ST | * Profilometer: Veeco Dektak 3ST | ||
===== Optical Microscopes ===== | |||
* Fluorescent Microscope: Olympus Yadda-Yadda | |||
= Support Tools = | = Support Tools = | ||
==== Wafer Processing ==== | ===== Metrology ===== | ||
* Spectroscopic Ellipsometry: Woolam M-2000 | |||
* Thin Film Measurement: Filmetrics model F40 | |||
* Profilometer: Veeco Dektak 3ST | |||
===== Thermal Processing ===== | |||
* Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing) | |||
* Rapid Thermal Annealer: Jipelec Jetfirst 150 | |||
* Rapid Thermal Processer: Modular Process Technology RTP-600S | |||
===== Wafer Processing ===== | |||
* Scriber-Breaker: Dynatex GST-150 | |||
* Wafer Bonder: Suss Microtech model SB6L | |||
===== Device Processing ===== | |||
* Wedge-Wedge Wire Bonder: Westbond model 7476D-79 | |||
* Electrical Probing Station: | |||
==== Miscellaneous ==== | |||
* Critical Point Dryer: Tousimis Automegasamdri 915B | |||
Revision as of 00:31, 26 March 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
- He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)
Optical Lithography
- Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Al, Au, Pt & Ti: Kurt J Lesker Labline
- Metals & Oxides: CHA Industries Mark 40
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 5
Plasma-Enhanced Deposition
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Packaging
- Parylene Coater: Para Tech LabTop 3000
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
- Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Silicon Etcher
Wet Etching
- Available Wet Chemistry Techniques
Microscopy
Focused Ion Beam (FIB) Systems
- He/Ne/Ga-FIB: Zeiss ORION NanoFab
- SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
Scanning Electron Microscopes (SEMs)
- SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200
- SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
- SEM/EDS: Thermo Fisher Sirion
- SEM/ESEM: Thermo Fisher Quanta 200F
Transmission Electron Microscopes (TEMs)
- TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-300 kV)
- TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)
Scanning Probe Microscopes =
- Atomic Force Microscope (AFM): Bruker Dimension ICON
- Profilometer: Veeco Dektak 3ST
Optical Microscopes
- Fluorescent Microscope: Olympus Yadda-Yadda
Support Tools
Metrology
- Spectroscopic Ellipsometry: Woolam M-2000
- Thin Film Measurement: Filmetrics model F40
- Profilometer: Veeco Dektak 3ST
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Annealer: Jipelec Jetfirst 150
- Rapid Thermal Processer: Modular Process Technology RTP-600S
Wafer Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss Microtech model SB6L
Device Processing
- Wedge-Wedge Wire Bonder: Westbond model 7476D-79
- Electrical Probing Station:
Miscellaneous
- Critical Point Dryer: Tousimis Automegasamdri 915B