Difference between revisions of "Equipment List"

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= Deposition =
= Deposition =
===== Evaporation =====
===== Evaporation =====
* Al, Au, Pt & Ti: Kurt J Lesker Labline  
* Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline  
* Metals & Oxides: CHA Industries Mark 40
* Metals & Oxides: CHA Industries Mark 40
* Carbon: Leica EM ACE600 Carbon Evaporator
* Carbon: Leica EM ACE600 Carbon Evaporator
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* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
===== Packaging =====
===== Dielectric Packaging / Moisture Barrier =====
* Parylene Coater: Para Tech LabTop 3000
* Parylene Coater: Para Tech LabTop 3000


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* Thin Film Measurement: Filmetrics model F40
* Thin Film Measurement: Filmetrics model F40
* Profilometer: Veeco Dektak 3ST
* Profilometer: Veeco Dektak 3ST
* Profilometer: Ambios Technology XP-2


===== Thermal Processing =====
===== Thermal Processing =====

Revision as of 00:47, 26 March 2019

Lithography

Electron Beam Lithography
  • Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
  • Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
  • Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
  • Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
  • He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)
Optical Lithography
  • Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
  • i-Line Wafer Stepper: GCA model 6300
  • Direct-Write Laser System: Heidelberg Instruments DWL-66
  • Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT


Deposition

Evaporation
  • Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline
  • Metals & Oxides: CHA Industries Mark 40
  • Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
  • Dielectric Sputterer: AJA International ATC Orion 8
  • Chalcogenide Sputterer: AJA International ATC Orion 5
Plasma-Enhanced Deposition
  • Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
  • Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
  • Parylene Coater: Para Tech LabTop 3000


Etching

Dry Etching
  • Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
  • Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
  • Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
  • Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
  • Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
  • XeF2 Silicon Etcher
Wet Etching
  • Available Wet Chemistry Techniques


Microscopy

Focused Ion Beam (FIB) Systems
  • He/Ne/Ga-FIB: Zeiss ORION NanoFab
  • SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
Scanning Electron Microscopes (SEMs)
  • SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200
  • SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
  • SEM/EDS: Thermo Fisher Sirion
  • SEM/ESEM: Thermo Fisher Quanta 200F
Transmission Electron Microscopes (TEMs)
  • TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-300 kV)
  • TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)
Scanning Probe Microscopes
  • Atomic Force Microscope (AFM): Bruker Dimension ICON
  • Profilometer: Veeco Dektak 3ST
Optical Microscopes
  • Fluorescence Microscope: Olympus IX81
  • Light Microscope: Olympus BX51M with Filmetrics model F40


Support Tools

Metrology
  • Spectroscopic Ellipsometry: Woolam M-2000
  • Thin Film Measurement: Filmetrics model F40
  • Profilometer: Veeco Dektak 3ST
Thermal Processing
  • Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
  • Rapid Thermal Processing: Modular Process Technology RTP-600S
  • Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
  • Scriber-Breaker: Dynatex GST-150
  • Wafer Bonder: Suss Microtech model SB6L
  • Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
  • Wedge-Wedge Wire Bonder: Westbond model 7476D-79
  • Electrical Probing Station: Cascade Microtech M150