ORION NanoFab: Helium, Neon & Gallium FIB

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ORION NanoFab
Orion-NanoFab.jpg
Instrument Type Microscopy, Lithography
Techniques High-Resolution He Imaging,
He/Ne/Ga-FIB Etching
He & Ne Ion Lithography
Charge Compensation
(with Electron Flood Gun),
Cross-Sectioning
Staff Manager Matthew S. Hunt, PhD
Staff Email matthew.hunt@caltech.edu
Staff Phone 626-395-5994
Reserve time on FBS
Request training via FBS User Dashboard
Lab Location B203D Steele
Lab Phone 626-395-1548
Manufacturer ZEISS (Carl Zeiss AG)
Model {{{Model}}}
Orion-NanoFab.jpg

Description

The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a 0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 2.0 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges, provide multitudes of nanofabrication opportunities in a single system.

Imaging Applications
  • Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
  • High depth of field imaging (compared to SEM)
  • Image non-conductive specimens using an electron flood gun for charge compensation
Etching Applications
  • Directly etch patterns into material with all three beams – He, Ne & Ga
  • Cutting & Imaging Cross-Sections (using Ga)
  • Final thinning of TEM lamellae (using Ne)
  • Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
Lithography Applications
  • High resolution patterning on resist (35 keV He can perform better than 100 keV electrons)
  • Automatic alignment to markers and automated processing
  • Resist patterning on non-conductive specimens
  • Resist Pattering on curved substrates due to high depth of field
  • Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

Resources

SOPs & Troubleshooting
Video Tutorials
Graphical Handouts
Presentations
Manufacturer Manuals

Specifications

Manufacturer Specifications
FIB Specifications
  • 0.5 to 30.0 kV
  • Apertures: 10 mm, 15 mm, 20 mmm, 30 mm
  • etc.
Raith ELPHY MultiBeam Specifications
  • 5.0 to 30.0 kV
  • 10 pA - 20 nA
  • etc.
NPVE Specifications
  • 5.0 to 30.0 kV
  • 10 pA - 20 nA
  • etc.