Suss MicroTec model MA6 Mask Aligner (model MA6/BA6 is shown at the top of the infobox)
The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create 500-nm structures on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined with our other fabrication tools. The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.
