Usage Rates: Difference between revisions
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{| class="wikitable" style="width: 75%;" | {| class="wikitable" style="width: 75%;" | ||
|- | |- | ||
!scope="col" style="text-align:left; width: | !scope="col" style="text-align:left; width: 31%"| Name | ||
!scope="col" style="text-align:center; width: | !scope="col" style="text-align:center; width: 18%"| Category | ||
!scope="col" style="text-align:center; width: | !scope="col" style="text-align:center; width: 16%"| Caltech Rate | ||
!scope="col" style="text-align:center; width: | !scope="col" style="text-align:center; width: 19%"| JPL/Non-Caltech Acad/Govt Rate | ||
!scope="col" style="text-align:center; width: | !scope="col" style="text-align:center; width: 16%" | Corporate Rate** | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = | |EquipmentName = Contact Mask Aligners | ||
|EquipmentCategory = Lithography | |EquipmentCategory = Lithography | ||
|CaltechRate = | |CaltechRate = 36.00 | ||
|JPLNonCaltechAcadGovtRate = | |JPLNonCaltechAcadGovtRate = 59.22 | ||
|CorporateRate = | |CorporateRate = 88.83 | ||
}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = | |EquipmentName = Electron Beam Pattern Generators (100kV) | ||
|EquipmentCategory = Lithography | |EquipmentCategory = Lithography | ||
|CaltechRate = | |CaltechRate = 62.00 | ||
|JPLNonCaltechAcadGovtRate = | |JPLNonCaltechAcadGovtRate = 101.99 | ||
|CorporateRate = | |CorporateRate = 152.99 | ||
}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = Etcher: | |EquipmentName = Two-Photon Lithography ("Microscale 3D Printing") | ||
|EquipmentCategory = Lithography | |||
|CaltechRate = 8.00 | |||
|JPLNonCaltechAcadGovtRate = 13.16 | |||
|CorporateRate = 19.74 | |||
}} | |||
{{UsageRateTableItem| | |||
|EquipmentName = Etcher: Dielectric Material ("380") | |||
|EquipmentCategory = Etching | |EquipmentCategory = Etching | ||
|CaltechRate = 50.00 | |CaltechRate = 50.00 | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = Etcher: Silicon | |EquipmentName = Etcher: III/V Material, Metal & Silicon | ||
|EquipmentCategory = Etching | |EquipmentCategory = Etching | ||
|CaltechRate = 50.00 | |CaltechRate = 50.00 | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = Etcher: | |EquipmentName = Etcher: Silicon (DRIE) | ||
|EquipmentCategory = Etching | |EquipmentCategory = Etching | ||
|CaltechRate = 50.00 | |CaltechRate = 50.00 | ||
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|JPLNonCaltechAcadGovtRate = 82.25 | |JPLNonCaltechAcadGovtRate = 82.25 | ||
|CorporateRate = 123.38 | |CorporateRate = 123.38 | ||
}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = E-beam Evaporator: Metals | |EquipmentName = E-beam Evaporator: Metals Al, Au, Pt & Ti (Lesker Labline) | ||
|EquipmentCategory = Deposition | |EquipmentCategory = Deposition | ||
|CaltechRate = 24.00 | |CaltechRate = 24.00 | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = | |EquipmentName = E-beam Evaporator: Metals & Oxides (CHA) | ||
|EquipmentCategory = Deposition | |EquipmentCategory = Deposition | ||
|CaltechRate = 24.00 | |CaltechRate = 24.00 | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = Chalcogenide | |EquipmentName = Plasma-Enhanced Chemical Vapor Deposition | ||
|EquipmentCategory = Deposition | |||
|CaltechRate = 67.00 | |||
|JPLNonCaltechAcadGovtRate = 110.22 | |||
|CorporateRate = 165.32 | |||
}} | |||
{{UsageRateTableItem| | |||
|EquipmentName = Sputter: Chalcogenide Material | |||
|EquipmentCategory = Deposition | |EquipmentCategory = Deposition | ||
|CaltechRate = 70.00 | |CaltechRate = 70.00 | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = Dielectric | |EquipmentName = Sputter: Dielectric Material | ||
|EquipmentCategory = Deposition | |EquipmentCategory = Deposition | ||
|CaltechRate = 37.00 | |CaltechRate = 37.00 | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = | |EquipmentName = Atomic Force Microscope | ||
|EquipmentCategory = Microscopy | |EquipmentCategory = Microscopy | ||
|CaltechRate = | |CaltechRate = 41.00 | ||
|JPLNonCaltechAcadGovtRate = | |JPLNonCaltechAcadGovtRate = 67.45 | ||
|CorporateRate = | |CorporateRate = 101.17 | ||
}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
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}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = | |EquipmentName = SEM, EDS & WDS (Nova 200) | ||
|EquipmentCategory = Microscopy | |EquipmentCategory = Microscopy | ||
|CaltechRate = | |CaltechRate = 65.00 | ||
|JPLNonCaltechAcadGovtRate = | |JPLNonCaltechAcadGovtRate = 106.93 | ||
|CorporateRate = | |CorporateRate = 160.39 | ||
}} | }} | ||
{{UsageRateTableItem| | {{UsageRateTableItem| | ||
|EquipmentName = TEM, STEM, EDS & HAADF | |EquipmentName = TEM, STEM, EDS & HAADF (TF-30, 80-300 kV) | ||
|EquipmentCategory = Microscopy | |EquipmentCategory = Microscopy | ||
|CaltechRate = 97.00 | |CaltechRate = 97.00 | ||
Revision as of 02:26, 30 April 2019
The rates below are valid beginning October 2018 and are subject to change.
NOTE:
- Rates for JPL, Non-Caltech Academic, Government, and Corporate KNI lab members are inclusive of FY19 Caltech F&A ("overhead") fees.
- Individual Tools listed below are charged by the hour or portion thereof.
- Precious Metal Usage (e.g. gold, platinum) is billed by the gram or portion thereof. The market prices per gram are passed on to users and do not include Caltech overhead.
Equipment Rates
| Name | Category | Caltech Rate | JPL/Non-Caltech Acad/Govt Rate | Corporate Rate** |
|---|---|---|---|---|
| Contact Mask Aligners |
Lithography |
$36.00 |
$59.22 |
$88.83 |
| Direct-Write Laser System (DWL-66) |
Lithography |
$47.00 |
$77.32 |
$115.97 |
| Electron Beam Pattern Generators (100kV) |
Lithography |
$62.00 |
$101.99 |
$152.99 |
| He/Ne/Ga-FIB w/ Multibeam Pattern Generator (Orion) |
Lithography/Microscopy |
$65.00 |
$106.93 |
$160.39 |
| SEM Nanometer Pattern Generation System (Quanta) |
Lithography/Microscopy |
$39.00 |
$64.16 |
$96.23 |
| Two-Photon Lithography ("Microscale 3D Printing") |
Lithography |
$8.00 |
$13.16 |
$19.74 |
| Etcher: Dielectric Material ("380") |
Etching |
$50.00 |
$82.25 |
$123.38 |
| Etcher: III/V Material, Metal & Silicon |
Etching |
$50.00 |
$82.25 |
$123.38 |
| Etcher: Silicon (DRIE) |
Etching |
$50.00 |
$82.25 |
$123.38 |
| Etcher: Silicon, III/V Material & Organics (RIE) |
Etching |
$50.00 |
$82.25 |
$123.38 |
| Etcher: XeF2 for Silicon |
Etching |
$50.00 |
$82.25 |
$123.38 |
| Atomic Layer Deposition |
Deposition |
$67.00 |
$110.22 |
$165.32 |
| E-beam Evaporator: Metals Al, Au, Pt & Ti (Lesker Labline) |
Deposition |
$24.00 |
$39.48 |
$59.22 |
| E-beam Evaporator: Metals & Oxides (CHA) |
Deposition |
$24.00 |
$39.48 |
$59.22 |
| Plasma-Enhanced Chemical Vapor Deposition |
Deposition |
$67.00 |
$110.22 |
$165.32 |
| Sputter: Chalcogenide Material |
Deposition |
$70.00 |
$115.15 |
$172.73 |
| Sputter: Dielectric Material |
Deposition |
$37.00 |
$60.87 |
$91.30 |
| Atomic Force Microscope |
Microscopy |
$41.00 |
$67.45 |
$101.17 |
| SEM, Ga-FIB, GIS & Omniprobe (Nova 600) |
Microscopy |
$65.00 |
$106.93 |
$160.39 |
| SEM & EDS (Sirion) |
Microscopy |
$39.00 |
$64.16 |
$96.23 |
| SEM, EDS & WDS (Nova 200) |
Microscopy |
$65.00 |
$106.93 |
$160.39 |
| TEM, STEM, EDS & HAADF (TF-30, 80-300 kV) |
Microscopy |
$97.00 |
$159.57 |
$239.35 |
| Critical Point Dryer |
Support Tools |
$54.00 |
$88.83 |
$133.25 |
| Tube Furnaces |
Support Tools |
$5.00 |
$8.23 |
$12.34 |
| Monthly Base Rate* |
General Equipment* |
$655.00 |
$1,077.48 |
$1,616.21 |
*Monthly Base Rate
The Monthly Base Rate is a flat fee charged per user, per month. It includes the use of:
Profilometers, Chemical Wet Benches, Dynatex GST-150 Scriber Breaker, J.A. Woolam Spectroscopic Ellipsometer M-2000, TF20 TEM, GCA 6300 Stepper, Rapid Thermal Processor, Paratech Parylene Coater, Suss SB6L Wafer Bonder, Westbond Wire Bonder, additional optical microscopes, related metrology, miscellaneous support tools and general supplies (gowning, chemicals, equipment reservation software, etc.).
**Corporate Memberships
For full information on the KNI's corporate membership plan, please send an email to tkimoto@caltech.edu with details regarding: the number of people looking to join as KNI lab members, equipment needs, anticipated start date, and information about the company. Startup companies may qualify for limited-term reduced rates.