Wet Chemistry Resources: Difference between revisions
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https://cleanroom.byu.edu/clean | https://cleanroom.byu.edu/clean | ||
==Solvent Cleans== | |||
==Etching Cleans== | |||
===RCA-1=== | |||
===Piranha Etch=== | |||
===HF Dip=== | |||
==Plasma Cleans== | |||
=Wet Etching Resources= | =Wet Etching Resources= | ||
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! Material !! Etchant !! Rate (nm/min) !! Anisotropy !! Selective to !! Selectivity !! Origin and Notes | ! Material !! Etchant !! Rate (nm/min) !! Anisotropy !! Selective to !! Selectivity !! Origin and Notes | ||
|- | |- | ||
| Al|| Al Etch Type D|| ~1000 || Highly || Al || High || Transene | | KNI CHA Al|| Al Etch Type D|| ~1000 || Highly || Al || High || Transene | ||
|- | |||
| KNI PECVD SiO2 || HF || ~1000 || Highly || SiO2 || High || measured 10/19 | |||
|- | |||
| KNI PECVD SiN3|| Ex || ~1000 || Highly || SiN3 || High || measured 10/19 | |||
|- | |||
| KNI PECVD a-Si|| KOH || ~1000 || Highly || Si || High || measured 10/19 | |||
|} | |} | ||
Revision as of 08:47, 31 October 2019
cleaning procedures links, breakout
Sample Cleaning Resources
https://cleanroom.byu.edu/clean
Solvent Cleans
Etching Cleans
RCA-1
Piranha Etch
HF Dip
Plasma Cleans
Wet Etching Resources
BYU Etch list https://cleanroom.byu.edu/wet_etch
find etch list book and other links http://transene.com/etch-compatibility/
Etch rates for micromachining processing http://ieeexplore.ieee.org/abstract/document/546406/
Etch rates for micromachining processing-Part II https://ieeexplore.ieee.org/document/1257354
UMich wet etch info http://lnf-wiki.eecs.umich.edu/wiki/Wet_etching
BYU Transene Wet Etch https://transene.com/etchants/
KOH, also find alternative: https://cleanroom.byu.edu/KOH
BYU etching guidance: https://cleanroom.byu.edu/chemical_etching.html
KNI Wet Etch Recipes Table
Table of Wet Etch recipes from KNI Papers
And general table from you, not from papers, maybe from recipes?
| Material | Etchant | Rate (nm/min) | Anisotropy | Selective to | Selectivity | Origin and Notes |
|---|---|---|---|---|---|---|
| KNI CHA Al | Al Etch Type D | ~1000 | Highly | Al | High | Transene |
| KNI PECVD SiO2 | HF | ~1000 | Highly | SiO2 | High | measured 10/19 |
| KNI PECVD SiN3 | Ex | ~1000 | Highly | SiN3 | High | measured 10/19 |
| KNI PECVD a-Si | KOH | ~1000 | Highly | Si | High | measured 10/19 |
Other Procedures
Liftoff
UCSB liftoff guidance: https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Lift-Off_Techniques
Electroplating
Electroplating materials supplier: https://www.technic.com/chemistry
Safety Resources
https://cleanroom.byu.edu/acid_safety