XeF2 Etcher for Silicon

From the KNI Lab at Caltech
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XeF2 Silicon Etcher
Instrument Type Etching
Techniques Selective dry Si etching
Staff Manager Alireza Ghaffari
Staff Email alireza@caltech.edu
Staff Phone 626-395-3984
Reserve time on LabRunr
Request training by email
Lab Location B235C Steele
Lab Phone 626-395-1539
Manufacturer N/A
Model N/A


The XeF2 etcher flows pressure- and time-controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices.

  • Very high selectivity dry Si etching
  • MEMS fabrication


Equipment Status