Difference between revisions of "Wet Chemistry Resources"

From the KNI Lab at Caltech
Jump to navigation Jump to search
Line 62: Line 62:


*[https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Etching_Recipes UCSB Wet Etching Recipes]
*[https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Etching_Recipes UCSB Wet Etching Recipes]
*https://nanolab.berkeley.edu/public/manuals/process_manual.shtml


==Commercial Materials==
==Commercial Materials==

Revision as of 12:07, 1 November 2019

Template:NOINDEX

Sample Cleaning Resources

Solvent Cleans

  • Acetone, IPA -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
  • Acetone, Methanol -Similar to above except Methanol is more toxic, and a polar molecule versus IPA which is non-polar
  • Acetone, Methanol, IPA
  • Acetone, Methanol, IPA, DI Water
  • Remover PG (50°C), IPA
  • Dichloromethane, IPA -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice
  • Nanostrip (60°C) -rinse with DI

Etching Cleans

RCA-1

Recipe steps or links

https://en.wikipedia.org/wiki/RCA_clean

Piranha Etch

HF Dip

Plasma Cleans

Wet Etching Resources

find etch list book and other links

Research Papers and Books

External Laboratories

also find alternative:

Commercial Materials


KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Origin and Notes
KNI CHA Al Al Etch Type D ~1000 Highly Al High Matches Transene's expected rate
KNI PECVD SiO2 HF ~1000 Highly SiO2 High measured 10/19
KNI PECVD SiN3 Ex ~1000 Highly SiN3 High measured 10/19
KNI PECVD a-Si KOH ~1000 Highly Si High Link to KNI member's research paper

Other Procedures

Liftoff

Electroplating

Safety Resources

Do we have materials to link to?

https://cleanroom.byu.edu/acid_safety

https://cleanroom.byu.edu/HF_safety

https://cleanroom.byu.edu/solvent_safety