Wet Chemistry Resources: Difference between revisions
Jump to navigation
Jump to search
| Line 47: | Line 47: | ||
*[https://ieeexplore.ieee.org/document/1257354 Etch rates for micromachining processing-Part II] | *[https://ieeexplore.ieee.org/document/1257354 Etch rates for micromachining processing-Part II] | ||
*[https://vector.umd.edu/images/links/Handbook_of_Metal_Etchants.pdf Handbook of Metal Etchants] | |||
==External Laboratories== | ==External Laboratories== | ||
Revision as of 12:07, 1 November 2019
Sample Cleaning Resources
Solvent Cleans
- Acetone, IPA -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
- Acetone, Methanol -Similar to above except Methanol is more toxic, and a polar molecule versus IPA which is non-polar
- Acetone, Methanol, IPA
- Acetone, Methanol, IPA, DI Water
- Remover PG (50°C), IPA
- Dichloromethane, IPA -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice
- Nanostrip (60°C) -rinse with DI
Etching Cleans
RCA-1
Recipe steps or links
https://en.wikipedia.org/wiki/RCA_clean
Piranha Etch
HF Dip
Plasma Cleans
Wet Etching Resources
find etch list book and other links
Research Papers and Books
External Laboratories
also find alternative:
Commercial Materials
KNI Wet Etch Recipes Table
Table of Wet Etch recipes from KNI Papers
And general table from you, not from papers, maybe from recipes?
| Material | Etchant | Rate (nm/min) | Anisotropy | Selective to | Selectivity | Origin and Notes |
|---|---|---|---|---|---|---|
| KNI CHA Al | Al Etch Type D | ~1000 | Highly | Al | High | Matches Transene's expected rate |
| KNI PECVD SiO2 | HF | ~1000 | Highly | SiO2 | High | measured 10/19 |
| KNI PECVD SiN3 | Ex | ~1000 | Highly | SiN3 | High | measured 10/19 |
| KNI PECVD a-Si | KOH | ~1000 | Highly | Si | High | Link to KNI member's research paper |
Other Procedures
Liftoff
Electroplating
Safety Resources
Do we have materials to link to?
https://cleanroom.byu.edu/acid_safety