Difference between revisions of "Wet Chemistry Resources"

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*[https://ieeexplore.ieee.org/document/1257354 Etch rates for micromachining processing-Part II]
*[https://ieeexplore.ieee.org/document/1257354 Etch rates for micromachining processing-Part II]
*[https://vector.umd.edu/images/links/Handbook_of_Metal_Etchants.pdf Handbook of Metal Etchants]

==External Laboratories==
==External Laboratories==

Revision as of 12:07, 1 November 2019


Sample Cleaning Resources

Solvent Cleans

  • Acetone, IPA -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
  • Acetone, Methanol -Similar to above except Methanol is more toxic, and a polar molecule versus IPA which is non-polar
  • Acetone, Methanol, IPA
  • Acetone, Methanol, IPA, DI Water
  • Remover PG (50°C), IPA
  • Dichloromethane, IPA -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice
  • Nanostrip (60°C) -rinse with DI

Etching Cleans


Recipe steps or links


Piranha Etch

HF Dip

Plasma Cleans

Wet Etching Resources

find etch list book and other links

Research Papers and Books

External Laboratories

also find alternative:

Commercial Materials

KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Origin and Notes
KNI CHA Al Al Etch Type D ~1000 Highly Al High Matches Transene's expected rate
KNI PECVD SiO2 HF ~1000 Highly SiO2 High measured 10/19
KNI PECVD SiN3 Ex ~1000 Highly SiN3 High measured 10/19
KNI PECVD a-Si KOH ~1000 Highly Si High Link to KNI member's research paper

Other Procedures



Safety Resources

Do we have materials to link to?