Difference between revisions of "Wafer Bonder"

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== Resources ==
== Resources ==
===== SOPs & Troubleshooting =====
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)]
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 General SOP & Troubleshooting]
 
===== Manufacturer Manuals =====
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]

Revision as of 20:46, 23 May 2019

Suss Microtec SB6L Wafer Bonder
Wafer-Bonder Suss-SB6L.jpg
Instrument Type Support Tools
Techniques Pressure/Heat bonding
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for Wafer Bonder email list
Lab Location
Lab Phone 626-395-1539
Manufacturer Suss Microtec
Model SBL6

Description

The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.

Applications
  • MEMS & Microelectronics fabrication

Resources

SOPs & Troubleshooting
Manufacturer Manuals

Specifications

Notable Specifications
  • (COMING SOON)