Difference between revisions of "Tube Furnaces for Wet & Dry Processing"

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== Description ==
== Description ==
The system is designed for processing up to one-hundred, 150 mm (6") wafers per tube. Tube 1 is designated for wet & dry oxidation using a flask evaporator. Tube 2 is designated for dry oxidation and annealing.   
The system is designed for processing up to one-hundred, 150 mm (6") silicon wafers per tube and can accommodate smaller sample sizes also. Tube 1 is designated for wet & dry oxidation using a flask evaporator. Tube 2 is designated for dry oxidation and annealing.   
===== Applications =====
===== Applications =====
* Dry & Wet oxidation
* Dry & Wet oxidation
* Annealing
* Annealing
===== Allowed Materials =====
* Silicon that is completely free of metal or organic contamination
** Recommended to have undergone a standard RCA clean or similar beforehand
* No other sample material allowed
* No metal or organic contamination
** Wafers must not have been contacted by metal tweezers, etc. without appropriate cleaning to remove metal contamination
===== Gas List =====
* Nitrogen
* Oxygen
* Water Vapor (Tube 1)
== Resources ==
== Resources ==
===== Equipment Data =====
===== Equipment Data =====

Revision as of 17:32, 8 April 2022

Tystar Tytan Tube Furnaces 1 & 2
Tystar-Tytan-Tube-Furnaces.jpg
Instrument Type Support Tools,
Thermal Processing
Techniques Oxidation, Annealing
Staff Manager Kelly McKenzie
Staff Email kmmckenz@caltech.edu
Staff Phone 626-395-5732
Reserve time on LabRunr
Request training by email
Sign up for Tystar email list
Lab Location B235 Steele
Lab Phone 626-395-1532
Manufacturer Tystar Corporation
Model Tytan Horizontal
Diffusion Furnace

Description

The system is designed for processing up to one-hundred, 150 mm (6") silicon wafers per tube and can accommodate smaller sample sizes also. Tube 1 is designated for wet & dry oxidation using a flask evaporator. Tube 2 is designated for dry oxidation and annealing.

Applications
  • Dry & Wet oxidation
  • Annealing
Allowed Materials
  • Silicon that is completely free of metal or organic contamination
    • Recommended to have undergone a standard RCA clean or similar beforehand
  • No other sample material allowed
  • No metal or organic contamination
    • Wafers must not have been contacted by metal tweezers, etc. without appropriate cleaning to remove metal contamination
Gas List
  • Nitrogen
  • Oxygen
  • Water Vapor (Tube 1)

Resources

Equipment Data
Tystar Oxidation Recipe
SOPs & Troubleshooting