Difference between revisions of "Labline: Electron Beam Evaporator"

From the KNI Lab at Caltech
Jump to navigation Jump to search
(Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = Labline E-beam Evaporator |HeaderColor = #F2682A |ImageOne = KJLC-Labline-Metal-Evaporator.jpg |ImageTwo = |InstrumentType = ...")
 
 
(9 intermediate revisions by 4 users not shown)
Line 1: Line 1:
{{InstrumentInfoboxOneImage|
{{InstrumentInfoboxOneImage|
|InstrumentName = Labline E-beam Evaporator
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo =  
|ImageTwo =  
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B123 Steele
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|PrimaryStaff = [[Alex Wertheim]]
Line 11: Line 11:
|StaffPhone = 626-395-3371
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Manufacturer = Kurt J. Lesker Company
|Techniques = E-beam evaporation,<br>Ion-assisted deposition (IAD),</br>Ion milling
|Model = Labline
|EmailList = kni-labline@caltech.edu
|Techniques = E-beam Evaporation,<br>Ion-Assisted Deposition (IAD),</br>Ion Milling
|EmailList = kni-labline
|EmailListName =  Labline
|EmailListName =  Labline
}}
}}
== Description ==
== Description ==
The Labline electron beam evaporator system is a load-locked platform with cryopump for fast sample turnaround and user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning and ion-assisted deposition during evaporation.
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.


===== Applications =====
===== Applications =====
Line 22: Line 23:
* Lift-off
* Lift-off
* Non-selective etch
* Non-selective etch
* Ion-assisted deposition (simultaneous etching + deposition)
* Ion-assisted deposition (simultaneous etching & deposition)


== Resources ==
== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Ebeam_Lesker from the dropdown menu)
===== SOPs & Troubleshooting =====
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]
=== Tool Reservation Rules ===
{| class="wikitable"
|-
!  !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}


===== Video Tutorials =====
===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]


== Specifications ==
== Specifications ==
===== Hardware Specifications =====
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo + scroll pumps)
* All dry pumping system (cryo & scroll pumps)
* Load lock equipped system with manual wafer transfer
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)
* 1x Argon ion source (Filament type)
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]
===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Latest revision as of 05:25, 30 June 2022

Labline Evaporator
KJLC-Labline-Metal-Evaporator.jpg
Instrument Type Deposition
Techniques E-beam Evaporation,
Ion-Assisted Deposition (IAD),
Ion Milling
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for Labline email list
Lab Location B235C Steele
Lab Phone 626-395-1539
Manufacturer Kurt J. Lesker Company
Model Labline

Description

The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

Applications
  • Metal deposition (Ti, Pt, Au, Al)
  • Lift-off
  • Non-selective etch
  • Ion-assisted deposition (simultaneous etching & deposition)

Resources

Equipment Status
SOPs & Troubleshooting

Tool Reservation Rules

Advanced Reservation (days) Limit per Reservation (hrs) Limit per week (hrs)
Weekday 7 6 18
Weeknight 7 8 18
Weekend 7 12 18
Video Tutorials

Specifications

Hardware Specifications
  • Typical base pressure: 1E-7 to 1E-8 Torr
  • All dry pumping system (cryo & scroll pumps)
  • Load-lock-equipped system with manual wafer transfer
  • Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
  • 1x Argon ion source (Filament type)
  • Accepts up to 1x 150mm wafer or smaller wafers/pieces

Related Instrumentation in the KNI

Sputtering Systems
Electron Beam Evaporation Systems
Chemical Vapor Deposition