Difference between revisions of "Equipment List"

From the KNI Lab at Caltech
Jump to navigation Jump to search
Line 33: Line 33:
 
= Etching =
 
= Etching =
 
===== Dry Etching =====
 
===== Dry Etching =====
* Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
+
* [[Oxford 100 DRIE: Bosch & Cryo ICP–RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE]]
* III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
+
* [[Oxford 100 ICP–RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE]]
* Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
+
* [[Oxford Dielectric 100 ICP–RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE]]
* Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
+
* [[Plasmatherm Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE]]
* Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
+
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* XeF<sub>2</sub> Silicon Etcher
+
* [[XeF<sub>2</sub> Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
  
 
===== Wet Etching =====
 
===== Wet Etching =====
* Available Wet Chemistry Techniques
+
* [[Wet Chemistry Techniques | Available Wet Chemistry Techniques]]
  
 
= Microscopy =
 
= Microscopy =

Revision as of 17:02, 23 April 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
  • TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
  • TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
  • Atomic Force Microscope (AFM): Bruker Dimension ICON
  • Profilometer: Veeco Dektak 3ST
Optical Characterization
  • Spectroscopic Ellipsometry: Woolam M-2000
  • Light Microscope: Olympus BX51M with Filmetrics model F40
  • Fluorescence Microscope: Olympus IX81

Support Tools

Thermal Processing
  • Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
  • Rapid Thermal Processing: Modular Process Technology RTP-600S
  • Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
  • Scriber-Breaker: Dynatex GST-150
  • Wafer Bonder: Suss MicroTec model SB6L
  • Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
  • Wedge-Wedge Wire Bonder: Westbond model 7476D-79
  • Electrical Probing Station: Cascade Microtech M150