Equipment List: Difference between revisions
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'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.''' | |||
== Lithography == | == Lithography == | ||
===== Electron Beam Lithography ===== | ===== Electron Beam Lithography ===== | ||
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* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]] | * [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]] | ||
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]] | * [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]] | ||
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]] | <!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---> | ||
===== Ion Beam Lithography ===== | ===== Ion Beam Lithography ===== | ||
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]] | * [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]] | ||
===== Optical Lithography ===== | ===== Optical Lithography ===== | ||
* [[ | * [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]] | ||
* [[ | * [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]] | ||
* [[ | * [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]] | ||
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]] | |||
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]] | * [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]] | ||
* [[Optical Lithography Resources]] | |||
== Deposition == | == Deposition == | ||
===== Evaporation ===== | ===== Evaporation ===== | ||
* [[ | * [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]] | ||
* [[CHA | * [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]] | ||
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | * [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | ||
===== Sputtering ===== | ===== Sputtering ===== | ||
* [[ATC Orion 8: Dielectric | * [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]] | ||
* [[ATC Orion 8: Chalcogenide | * [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]] | ||
===== Chemical Vapor Deposition (CVD) ===== | ===== Chemical Vapor Deposition (CVD) ===== | ||
* [[ | * [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]] | ||
* [[ | * [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]] | ||
===== Dielectric Packaging / Moisture Barrier ===== | ===== Dielectric Packaging / Moisture Barrier ===== | ||
* [[ | * [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]] | ||
== Etching == | == Etching == | ||
===== Dry Etching ===== | ===== Dry Etching ===== | ||
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]] | * [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]] | ||
* [[ICP-RIE: III | * [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]] | ||
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]] | * [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]] | ||
* [[ | * [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | ||
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | * [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | ||
===== Wet Etching ===== | ===== Wet Etching ===== | ||
* [[Wet Chemistry | Available Wet Etching Techniques]] | * [[Wet Chemistry | Available Wet Etching Techniques]] | ||
== Microscopy == | == Microscopy == | ||
===== KNI Microscopy Policies ===== | |||
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies] | |||
===== Guide to Choosing KNI SEMs & FIBs ===== | |||
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]] | |||
===== Focused Ion Beam (FIB) Systems ===== | ===== Focused Ion Beam (FIB) Systems ===== | ||
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | * [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | ||
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Scanning Electron Microscopes (SEMs) ===== | ===== Scanning Electron Microscopes (SEMs) ===== | ||
* [[Nova 200 NanoLab: SEM | * [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]] | ||
* [[Sirion: SEM & EDS | SEM & EDS | * [[Sirion: SEM & EDS | Sirion: SEM & EDS]] | ||
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | * [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | ||
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Transmission Electron | |||
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 ( | ===== Transmission Electron Microscope (TEM) ===== | ||
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 ( | * [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]] | ||
<!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---> | |||
===== Scanning Probe Microscopes ===== | ===== Scanning Probe Microscopes ===== | ||
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]] | * [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]] | ||
* [[ | * [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]] | ||
===== Optical Characterization ===== | ===== Optical Characterization ===== | ||
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | * [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | ||
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* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | * [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | ||
===== Stubs for specimen mounting ===== | |||
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. | |||
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] | |||
== Wet Chemistry == | == Wet Chemistry == | ||
* [[Wet Chemistry | Wet Chemistry | ===== Wet Chemistry Main page===== | ||
* [[Wet Chemistry | Wet Chemistry page:]] | |||
- Facilities Procedures & Safety | |||
- Chemicals Supplied by KNI | |||
- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists | |||
- Requesting New Chemicals for use in the KNI cleanroom | |||
===== Wet Chemistry Safety page===== | |||
* [[Wet Chemistry Safety | Wet Chemistry Safety page]] | |||
- PPE Overview | |||
-Hazardous Waste Handling and Labeling | |||
-Decanting Chemicals | |||
-Hot Plate Rules | |||
-KNI Buddy System | |||
-Secondary Containment and Other Best Practices. | |||
===== Wet Chemistry Resources page===== | |||
* [[Wet Chemistry Resources | Wet Chemistry Resources page]] | |||
- Contains fabrication recipes and procedures. | |||
== Support Tools == | == Support Tools == | ||
===== Equipment Status ===== | |||
===== Thermal Processing ===== | ===== Thermal Processing ===== | ||
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | * [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | ||
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]] | <!---* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]---> | ||
===== Substrate Processing ===== | ===== Substrate Processing ===== | ||
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | * [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | ||
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===== Metrology ===== | ===== Metrology ===== | ||
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | * [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | ||
* [[ | * [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]] | ||
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]] | * [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]] | ||
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | * [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | ||
===== Sample Preparation ===== | ===== Sample Preparation ===== | ||
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | * [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | ||
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | * [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
Revision as of 21:45, 6 July 2022
NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Nano Imprint Lithography: NILT CNI-PV 2.1
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
- Optical Lithography Resources
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputter System: AJA International ATC Orion 8
- Chalcogenide Sputter System: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
- III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
- Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
KNI Microscopy Policies
Guide to Choosing KNI SEMs & FIBs
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- Nova 200 NanoLab: SEM & EDS
- Sirion: SEM & EDS
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscope (TEM)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometer: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Fluorescence Microscope: Olympus IX81
Sample Preparation for Microscopy
- Carbon Evaporator (Leica EM ACE600) to make samples conductive
- Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
- TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill
Stubs for specimen mounting
- Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.
Wet Chemistry
Wet Chemistry Main page
- Facilities Procedures & Safety
- Chemicals Supplied by KNI
- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists
- Requesting New Chemicals for use in the KNI cleanroom
Wet Chemistry Safety page
- PPE Overview
-Hazardous Waste Handling and Labeling
-Decanting Chemicals
-Hot Plate Rules
-KNI Buddy System
-Secondary Containment and Other Best Practices.
Wet Chemistry Resources page
- Contains fabrication recipes and procedures.
Support Tools
Equipment Status
Thermal Processing
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
Metrology
- Spectroscopic Ellipsometer: Woolam M-2000
- Profilometer: Veeco Dektak 3ST
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Electrical Probing Station: Cascade Microtech M150