Difference between revisions of "Equipment List"

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===== Substrate Processing =====
 
===== Substrate Processing =====
* [[Scriber–Breaker | Scriber-Breaker: Dynatex GST-150]]
+
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
 
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
 
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]

Revision as of 16:41, 21 May 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Support Tools

Thermal Processing
Substrate Processing
Device Processing
Sample Preparation

Old Support Tools (Do not edit these)

Thermal Processing
Substrate Processing
Device Processing
Sample Preparation