Difference between revisions of "Contact Mask Aligners: MA6 & MA6/BA6"

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* [https://caltech.box.com/s/bbk4f9vi6jerhi9fcqoqa78n5npkwxkr Lamp Change SOP]
* [https://caltech.box.com/s/bbk4f9vi6jerhi9fcqoqa78n5npkwxkr Lamp Change SOP]
* [https://caltech.box.com/s/mj01k4mxgsxbnctv3fayzaje1ph4bfop Lamp Re-Ignition SOP]
* [https://caltech.box.com/s/mj01k4mxgsxbnctv3fayzaje1ph4bfop Lamp Re-Ignition SOP]
* [https://caltech.box.com/s/xq40xbslhezrn4dyrblsgxrojd21lb8g Suss 1 Lamp Re-Ignition Video]
* [https://caltech.box.com/s/f5f4z86p8v9i43nvs7ntbgkzrog44jpm Suss 2 Lamp Re-Ignition Video]


===== Optical Lithography Resources =====
===== Optical Lithography Resources =====

Revision as of 05:21, 13 September 2020

Suss Contact Mask Aligner MA6/BA6
Mask-Aligner Suss-MicroTec-MA6-BA6.jpg
Instrument Type Lithography
Techniques Frontside Alignment,
Backside Alignment,
Flood exposure
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for Photolithography email list
Lab Location B217 Steele
Lab Phone 626-395-1535
Manufacturer Suss MicroTec
Model MA6 & MA6/BA6

Description

Suss MicroTec model MA6 Mask Aligner (model MA6/BA6 is shown at the top of the infobox)

The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography). The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.

Suss1 MA6/BA6 Applications
  • Front Side Flood Exposure (no mask)
  • Front Side Alignment & Exposure
  • Back Side Alignment with Front Side Exposure
Suss2 MA6 Applications
  • Front Side Alignment & Exposure
  • Back Side Alignment with Front Side Exposure

Resources

Equipment Data
SOPs & Troubleshooting
Optical Lithography Resources
Process Recipes
Manufacturer Manuals

Specifications

Manufacturer Specifications
  • Whole wafers 2” up to 6” can be loaded.
  • Samples pieces up to 6”x6” square can be loaded.
  • Samples up to 6mm thick can be loaded..
  • Exposure Resolution:
Soft Contact Mode = 1 - 2 um
Hard Contact Mode = 1 um
Soft Vacuum Contact Mode = 1 - 0.5 um
Vacuum Contact Mode = 0.4 - 0.5 um
Suss 1 Exposure Settings
  • Channel 1 is 365nm wavelength at 15 mW/cm2.
  • Channel 2 is 405nm wavelength at 25 mW/cm2.
Suss 2 Exposure Settings
  • Channel 1 is 365nm wavelength at 10 mW/cm2.
  • Channel 2 is 405nm wavelength at 15 mW/cm2.