Wet Chemistry Resources - Revision history

Derose: /* External Laboratories */

2025-01-22T06:19:01Z

External Laboratories

← Older revision		Revision as of 06:19, 22 January 2025
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	*[https://cleanroom.byu.edu/wet_etch BYU Etching Guidance]		*[https://cleanroom.byu.edu/wet_etch BYU Etching Guidance]

	*[https://~~www~~.~~nanotech~~.ucsb.edu/wiki~~/index.php~~/Wet_Etching_Recipes UCSB Wet Etching Recipes]		*[https://wiki.nanofab.ucsb.edu/wiki/Wet_Etching_Recipes UCSB Wet Etching Recipes]

	*[https://nanolab.berkeley.edu/public/manuals/process_manual.shtml Berkeley Marvell Nanofab Process Manual]		*[https://nanolab.berkeley.edu/public/manuals/process_manual.shtml Berkeley Marvell Nanofab Process Manual]

2025-01-22T06:16:16Z

External Laboratories

← Older revision		Revision as of 06:16, 22 January 2025
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	*[http://lnf-wiki.eecs.umich.edu/wiki/Wet_etching UMich Wet Etching info]		*[http://lnf-wiki.eecs.umich.edu/wiki/Wet_etching UMich Wet Etching info]

	*[https://cleanroom.byu.edu/~~chemical_etching.html~~ BYU Etching Guidance]		*[https://cleanroom.byu.edu/wet_etch BYU Etching Guidance]

	*[https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Etching_Recipes UCSB Wet Etching Recipes]		*[https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Etching_Recipes UCSB Wet Etching Recipes]

2022-03-17T18:20:10Z

Piranha Etch

← Older revision		Revision as of 18:20, 17 March 2022
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	Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.		Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

			*[https://mmrc.caltech.edu/Safety/SOPs/Piranha%20Etch%20SOP.pdf Caltech MMRC Piranha Etch]

	*[http://lnf-wiki.eecs.umich.edu/wiki/Piranha_Etch UMich LNF Piranha Etch]		*[http://lnf-wiki.eecs.umich.edu/wiki/Piranha_Etch UMich LNF Piranha Etch]
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	*[https://www.bu.edu/photonics/files/2011/02/Piranha_clean.pdf Boston University Piranha Etch]		*[https://www.bu.edu/photonics/files/2011/02/Piranha_clean.pdf Boston University Piranha Etch]

	*[https://mmrc.caltech.edu/Safety/SOPs/Piranha%20Etch%20SOP.pdf Caltech MMRC Piranha Etch]

	===HF Dip===		===HF Dip===

2020-12-22T23:59:55Z

← Older revision		Revision as of 23:59, 22 December 2020
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	Caution. All of these processes require a buddy and adequate chemical safety training.		Caution. All of these processes require a buddy and adequate chemical safety training.

	===RCA-1===		===RCA Clean===

	Prepares wafers for high-temperature processing steps. Standardized protocol developed by RCA in 1960s.		Prepares wafers for high-temperature processing steps. Standardized protocol developed by RCA in 1960s.

2020-03-10T13:49:30Z

Nanostrip Etch

← Older revision		Revision as of 13:49, 10 March 2020
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	===Nanostrip Etch===		===Nanostrip Etch===
			Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

	*'''Nanostrip (60°C)''' -Rinse with DI		*'''Nanostrip (60°C)''' -Rinse with DI
	**https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm		**https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm

2020-03-10T13:47:50Z

Piranha Etch

← Older revision		Revision as of 13:47, 10 March 2020
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	*https://en.wikipedia.org/wiki/RCA_clean		*https://en.wikipedia.org/wiki/RCA_clean

			===Nanostrip Etch===
			*'''Nanostrip (60°C)''' -Rinse with DI
			**https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm
			**https://braungroup.beckman.illinois.edu/files/2018/02/SOP_BI-005_Nanostrip.pdf

	===Piranha Etch===		===Piranha Etch===

2020-03-10T13:45:48Z

Solvent Cleans

← Older revision		Revision as of 13:45, 10 March 2020
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	**[https://static1.squarespace.com/static/57b26cc76b8f5b7524bf9ed2/t/57f9725d725e25a7b5dd12fe/1475965533625/Remover-PG-Process.pdf Columbia University Remover PG Process]		**[https://static1.squarespace.com/static/57b26cc76b8f5b7524bf9ed2/t/57f9725d725e25a7b5dd12fe/1475965533625/Remover-PG-Process.pdf Columbia University Remover PG Process]
	*'''Dichloromethane, IPA''' -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice		*'''Dichloromethane, IPA''' -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice
	*'''Nanostrip (60°C)''' -Rinse with DI
	**https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm
	**https://braungroup.beckman.illinois.edu/files/2018/02/SOP_BI-005_Nanostrip.pdf

	==Etching Cleans==		==Etching Cleans==

2019-12-03T00:56:43Z

KNI Wet Etch Recipes Table

← Older revision		Revision as of 00:56, 3 December 2019
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	\| [[CHA: Electron Beam Evaporator \|KNI CHA]] Al<sub>2</sub>O<sub>3</sub>\|\| Phosphoric Acid \|\| X \|\| - \|\| - \|\| - \|\| Measured 11/19 by		\| [[CHA: Electron Beam Evaporator \|KNI CHA]] Al<sub>2</sub>O<sub>3</sub>\|\| Phosphoric Acid \|\| X \|\| - \|\| - \|\| - \|\| Measured 11/19 by
	\|-		\|-
	\| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) \| KNI PECVD ]] 350°C SiO<sub>2</sub> \|\| HF \|\| X \|\| Low \|\| SiO<sub>2</sub> \|\| High \|\| Measured 11/19 by		\| [[Wet thermal Oxidation \| KNI Tystar Furnace ]] 1000°C SiO<sub>2</sub> \|\| HF \|\| 111 \|\| Very Low \|\| SiO<sub>2</sub> \|\| High \|\| Measured 11/19 by Alex Wertheim
			\|-
			\| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) \| KNI PECVD ]] 350°C SiO<sub>2</sub> \|\| HF \|\| 486 \|\| Low \|\| SiO<sub>2</sub> \|\| High \|\| Measured 11/19 by Alex Wertheim
			\|-
			\| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) \| KNI PECVD ]] 200°C SiO<sub>2</sub> \|\| HF \|\| 1398 \|\| High \|\| SiO<sub>2</sub> \|\| High \|\| Measured 11/19 by Alex Wertheim
	\|-		\|-
	\| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) \| KNI PECVD ]] 350°C Si<sub>3</sub>N<sub>4</sub>\|\| Phosphoric Acid \|\| X \|\| - \|\| - \|\| - \|\| Measured 11/19 by		\| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) \| KNI PECVD ]] 350°C Si<sub>3</sub>N<sub>4</sub>\|\| Phosphoric Acid \|\| X \|\| - \|\| - \|\| - \|\| Measured 11/19 by

2019-11-08T01:21:27Z

2019-11-04T18:56:39Z

Safety Resources

← Older revision		Revision as of 18:56, 4 November 2019
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	=Safety Resources=		=Safety Resources=

	*~~KNI~~ [[Lab Rules & Safety]]		*[[Lab Rules & Safety \| KNI Lab Rules & Safety]]

	*[https://cleanroom.byu.edu/acid_safety BYU Acid Safety], [https://cleanroom.byu.edu/HF_safety HF Safety], [https://cleanroom.byu.edu/solvent_safety Solvent Safety]		*[https://cleanroom.byu.edu/acid_safety BYU Acid Safety], [https://cleanroom.byu.edu/HF_safety HF Safety], [https://cleanroom.byu.edu/solvent_safety Solvent Safety]