Wafer Bonder - Revision history

Tkimoto at 18:36, 14 April 2026

2026-04-14T18:36:29Z

← Older revision		Revision as of 18:36, 14 April 2026
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	\|RoomLocation = B217 Steele		\|RoomLocation = B217 Steele
	\|LabPhone = 626-395-4075		\|LabPhone = 626-395-4075
	\|PrimaryStaff = [[Nathan Lee]]		\|PrimaryStaff = [[Nathan S. Lee]]
	\|StaffEmail = nathslee@caltech.edu		\|StaffEmail = nathslee@caltech.edu
	\|StaffPhone = 626-395-4386		\|StaffPhone = 626-395-4386

Tkimoto at 18:36, 14 April 2026

2026-04-14T18:36:00Z

← Older revision		Revision as of 18:36, 14 April 2026
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	\|InstrumentType = [[Equipment_List#Support_Tools\|Support Tools]],<br>[[Equipment_List#Substrate_Processing\|Substrate Processing]]		\|InstrumentType = [[Equipment_List#Support_Tools\|Support Tools]],<br>[[Equipment_List#Substrate_Processing\|Substrate Processing]]
	\|RoomLocation = B217 Steele		\|RoomLocation = B217 Steele
	\|LabPhone = 626-395-~~1539~~		\|LabPhone = 626-395-4075
	\|PrimaryStaff = [[~~Alireza Ghaffari~~]]		\|PrimaryStaff = [[Nathan Lee]]
	\|StaffEmail = ~~alireza~~@caltech.edu		\|StaffEmail = nathslee@caltech.edu
	\|StaffPhone = 626-395-~~3984~~		\|StaffPhone = 626-395-4386
	\|Manufacturer = Suss Microtec		\|Manufacturer = Suss Microtec
	\|Model = SBL6		\|Model = SBL6
	\|Techniques = Pressure/Heat Bonding		\|Techniques = Pressure/Heat Bonding
	\|RequestTraining = ~~alireza~~@caltech.edu		\|RequestTraining = nathslee@caltech.edu
	\|EmailList = kni-sb6l		\|EmailList = kni-sb6l
	\|EmailListName = Wafer Bonder		\|EmailListName = Wafer Bonder

Bertm: /* Resources */

2023-08-21T21:19:41Z

Resources

← Older revision		Revision as of 21:19, 21 August 2023
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	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
			* [https://caltech.box.com/s/je95chbsbq3u14f3jchch4l79itshtb5 SB6L User Manual] - The SUSS SB6L Wafer Bonder System User Manual
	* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual		* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual
	* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.		* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.

Bertm: /* SOPs */

2023-08-21T21:11:07Z

SOPs

← Older revision		Revision as of 21:11, 21 August 2023
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	== Resources ==		== Resources ==
	===== SOPs =====		===== SOPs =====
	* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SOP]		* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SB6L SOP] - Operating Instructions for the Suss SB6L Wafer Bonder

	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual		* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual
	* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.		* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.

Bertm: /* Manufacturer Manuals */

2023-08-21T20:59:37Z

Manufacturer Manuals

← Older revision		Revision as of 20:59, 21 August 2023
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	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]		* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual
			* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.

Derose at 21:05, 12 May 2023

2023-05-12T21:05:58Z

← Older revision		Revision as of 21:05, 12 May 2023
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	\|RoomLocation = B217 Steele		\|RoomLocation = B217 Steele
	\|LabPhone = 626-395-1539		\|LabPhone = 626-395-1539
	\|PrimaryStaff = [[~~Alex Wertheim~~]]		\|PrimaryStaff = [[Alireza Ghaffari]]
	\|StaffEmail = ~~alexw~~@caltech.edu		\|StaffEmail = alireza@caltech.edu
	\|StaffPhone = 626-395-~~3371~~		\|StaffPhone = 626-395-3984
	\|Manufacturer = Suss Microtec		\|Manufacturer = Suss Microtec
	\|Model = SBL6		\|Model = SBL6
	\|Techniques = Pressure/Heat Bonding		\|Techniques = Pressure/Heat Bonding
	\|RequestTraining = ~~alexw~~@caltech.edu		\|RequestTraining = alireza@caltech.edu
	\|EmailList = kni-sb6l		\|EmailList = kni-sb6l
	\|EmailListName = Wafer Bonder		\|EmailListName = Wafer Bonder

Alexw at 22:06, 28 May 2019

2019-05-28T22:06:22Z

← Older revision		Revision as of 22:06, 28 May 2019
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	== Resources ==		== Resources ==
	===== SOPs ~~& Troubleshooting~~ =====		===== SOPs =====
	* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 ~~General~~ SOP ~~& Troubleshooting~~]		* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SOP]

	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]		* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]

	~~== Specifications ==~~
	~~===== Notable Specifications =====~~
	* (COMING SOON)

Matthew at 22:02, 27 May 2019

2019-05-27T22:02:22Z

← Older revision		Revision as of 22:02, 27 May 2019
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	{{InstrumentInfoboxOneImage\|		{{InstrumentInfoboxOneImage\|
	\|InstrumentName = ~~Suss Microtec SB6L~~ Wafer Bonder		\|InstrumentName = Wafer Bonder
	\|HeaderColor = #E6E7E8		\|HeaderColor = #E6E7E8
	\|ImageOne = Wafer-Bonder_Suss-SB6L.jpg		\|ImageOne = Wafer-Bonder_Suss-SB6L.jpg
	\|ImageTwo =		\|ImageTwo =
	\|InstrumentType = [[Equipment_List#Support Tools\|~~Support Tools~~]]		\|InstrumentType = [[Equipment_List#Support_Tools\|Support Tools]],<br>[[Equipment_List#Substrate_Processing\|Substrate Processing]]
	\|RoomLocation =		\|RoomLocation = B217 Steele
	\|LabPhone = 626-395-1539		\|LabPhone = 626-395-1539
	\|PrimaryStaff = [[Alex Wertheim]]		\|PrimaryStaff = [[Alex Wertheim]]
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	\|Manufacturer = Suss Microtec		\|Manufacturer = Suss Microtec
	\|Model = SBL6		\|Model = SBL6
	\|Techniques = Pressure/Heat ~~bonding~~		\|Techniques = Pressure/Heat Bonding
	\|RequestTraining = alexw@caltech.edu		\|RequestTraining = alexw@caltech.edu
	\|EmailList = kni-sb6l		\|EmailList = kni-sb6l
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	}}		}}
	== Description ==		== Description ==
	The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.		The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
	===== Applications =====		===== Applications =====
	* MEMS & Microelectronics ~~fabrication~~		* MEMS & Microelectronics Fabrication

	== Resources ==		== Resources ==

Bertm: /* SOPs & Troubleshooting */

2019-05-23T20:46:10Z

SOPs & Troubleshooting

← Older revision		Revision as of 20:46, 23 May 2019
Line 24:		Line 24:
	== Resources ==		== Resources ==
	===== SOPs & Troubleshooting =====		===== SOPs & Troubleshooting =====
	* [https://caltech.box.com/s/~~BROKEN~~ General SOP & Troubleshooting ~~(COMING SOON)~~]		* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 General SOP & Troubleshooting]

	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]		* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]

Bertm: /* Manufacturer Manuals */

2019-05-23T20:44:40Z

Manufacturer Manuals

← Older revision		Revision as of 20:44, 23 May 2019
Line 26:		Line 26:
	* [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)]		* [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)]
	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://caltech.box.com/s/~~BROKEN~~ Manual ~~(COMING SOON)~~]		* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]

	== Specifications ==		== Specifications ==
	===== Notable Specifications =====		===== Notable Specifications =====
	* (COMING SOON)		* (COMING SOON)