The KNI Lab at Caltech - Recent changes [en]

Oxide/Nitride Deposition: Oxford Instruments PlasmaPro System 100 PECVD

Kmmckenz — Wed, 21 Oct 2026 19:37:45 GMT

System Features

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	}}		}}
	== Description ==		== Description ==
	The Plasma-Enhanced Chemical Vapor Deposition (PECVD) system is an Oxford Instruments Plasma Technology ~~Plasmalab~~ System 100 platform that is optimized for ~~amorphous silicon,~~ silicon dioxide, and silicon nitride deposition. The PECVD has a variable temperature stage (RT to 600 °C). This system supports wafer sizes up to 6 inches, and provides PECVD film growth over a wide range of process conditions.		The Plasma-Enhanced Chemical Vapor Deposition (PECVD) system is an Oxford Instruments Plasma Technology PlasmaPro System 100 platform that is optimized for silicon dioxide and silicon nitride deposition. The PECVD has a variable temperature stage (RT to 600 °C). This system supports wafer sizes up to 6 inches, and provides PECVD film growth over a wide range of process conditions.
	===== Applications =====		===== Applications =====
	* Amorphous Silicon Deposition
	* Silicon Dioxide Deposition		* Silicon Dioxide Deposition
	* Silicon Nitride Deposition		* Silicon Nitride Deposition
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	* Si, Si<sub>x</sub>N<sub>y</sub>, SiO<sub>2</sub>, SOI		* Si, Si<sub>x</sub>N<sub>y</sub>, SiO<sub>2</sub>, SOI
	* Hard masks compatible with process temperature		* Hard masks compatible with process temperature
			* Other materials buried in stack
	===== PECVD Gas List =====		===== PECVD Gas List =====
	* 5% SiH<sub>4</sub> in N<sub>2</sub>		* 5% SiH<sub>4</sub> in N<sub>2</sub>
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	* N<sub>2</sub>O		* N<sub>2</sub>O
	* N<sub>2</sub>		* N<sub>2</sub>
	* ~~Mixture of CF<sub>4</sub> and O<sub>2</sub>~~ (~~4:1~~) ~~for Plasma Clean~~		* CF4 (for plasma clean)

	== Resources ==		== Resources ==
	===== SOPs & Troubleshooting =====		===== SOPs & Troubleshooting =====
	* [https://caltech.box.com/s/~~c8qx3ikzjb05x44o4updpqs36ra39ytw~~ KNI SOP]		* [https://caltech.box.com/s/zowed19nz12hdxtfxuep3h936jj36yhs KNI SOP]
	* [https://caltech.box.com/s/0gh89zgxkchj8nkbl1bbrdgvspu31obc Oxfords reservation and use policy]		* [https://caltech.box.com/s/0gh89zgxkchj8nkbl1bbrdgvspu31obc Oxfords reservation and use policy]
	* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]		* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
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	===== Process Documents =====		===== Process Documents =====
	* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 KNI's Amorphous Silicon recipe]
	* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv KNI's 350C SiO2 recipe]		* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv KNI's 350C SiO2 recipe]
	* [https://caltech.box.com/s/0e14n82o7o9yziqmlygkakfcv1lp65iu Process Standards]		* [https://caltech.box.com/s/0e14n82o7o9yziqmlygkakfcv1lp65iu Process Standards]
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	* [https://caltech.box.com/s/tc4j0yr2jazv0rd6ey22ri8jd1asl326 Low Rate SiOx]		* [https://caltech.box.com/s/tc4j0yr2jazv0rd6ey22ri8jd1asl326 Low Rate SiOx]
	* [https://caltech.box.com/s/r3socf5rslp7qs9rb5o7vvpyp12qf0ps Low rate SiNx]		* [https://caltech.box.com/s/r3socf5rslp7qs9rb5o7vvpyp12qf0ps Low rate SiNx]
	* [https://caltech.box.com/s/6acyh95hslt0q711makbllgqjrexpew1 Amorphous Silicon Deposition (Silane/helium)]
	* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]

	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://~~labrunr~~.~~caltech~~.~~edu/machinefiles~~/~~116~~/~~System%20Manual%20for%20Caltech%2094-219848.pdf~~ Oxford PECVD System Manual]		* [https://caltech.box.com/s/ivcayqzwzha33hag4xd64fb42ma0ithk Oxford PECVD System Manual]
			* [https://caltech.box.com/s/r2d8bk8mrtxa2qf0bwamuxn43cpjml4f PTIQ User Manual]
	* [https://caltech.box.com/s/zqfonyv64m2m76mo8b4xn63ljz9ee4i5 Alcatel ADS 602P dry vacuum pump Manual]		* [https://caltech.box.com/s/zqfonyv64m2m76mo8b4xn63ljz9ee4i5 Alcatel ADS 602P dry vacuum pump Manual]

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	* [https://caltech.box.com/s/kvgp7d7zx9gczapf7iun791m234vevod Manufacturer Data Sheet]		* [https://caltech.box.com/s/kvgp7d7zx9gczapf7iun791m234vevod Manufacturer Data Sheet]
	===== System Features =====		===== System Features =====
	* ~~Universal base console~~ that ~~houses~~ the electronic sub systems, control units, pneumatics, and turbomolecular pump		* Process module frame and separate control rack that house the electronic sub systems, control units, pneumatics, and turbomolecular pump
	* ~~PC 2000 Operating~~ system		* PTIQ operating system
	* PECVD process chamber with 160 mm pumping port, view port, and an additional rear port for optical emission end-point-detection		* PECVD process chamber with 160 mm pumping port, view port, and an additional rear port for optical emission end-point-detection
	* Heated upper electrode to prevent condensation of low vapor pressure precursors		* Heated upper electrode to prevent condensation of low vapor pressure precursors

Equipment List

Kmmckenz — Wed, 21 Oct 2026 19:14:26 GMT

Dry Etching

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	* [[ICP-RIE: III-V, Metal & Silicon Etcher \| III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]		* [[ICP-RIE: III-V, Metal & Silicon Etcher \| III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
	* [[ICP-RIE: Dielectric Etcher \| Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]		* [[ICP-RIE: Dielectric Etcher \| Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
			* [[III-V Etcher and Atomic Layer Etching (ALE): Oxford Instruments PlasmaPro 100 Cobra 300 ICP-RIE with ALE]]
	<!---* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher \| Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]--->		<!---* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher \| Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]--->
	* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]		* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]

III-V Etcher and Atomic Layer Etching (ALE): Oxford Instruments PlasmaPro 100 Cobra 300 ICP-RIE with ALE

Kmmckenz — Wed, 21 Oct 2026 19:13:13 GMT

SOPs & Troubleshooting

← Older revision		Revision as of 19:13, 21 October 2026
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	== Resources ==		== Resources ==
	===== SOPs & Troubleshooting =====		===== SOPs & Troubleshooting =====
	* ~~General Use~~ SOP		* [https://caltech.box.com/s/4plzcvkt78lnrn73c9kneopbkemrrrq7 Cobra Etcher SOP]
	* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords reservation and use policy]		* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords reservation and use policy]
	* Etcher toxic gas handling SOP
	* Power Up Oxford ICP-RIE SOP

	===== Process Documents =====		===== Process Documents =====
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	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://caltech.box.com/s/r2d8bk8mrtxa2qf0bwamuxn43cpjml4f PTIQ User Manual]		* [https://caltech.box.com/s/r2d8bk8mrtxa2qf0bwamuxn43cpjml4f PTIQ User Manual]
	* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (<i>login to LabRunr required</i>)
	* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

	== Specifications ==		== Specifications ==

KNI Staff Members

Sydney — Wed, 21 Oct 2026 17:39:57 GMT

Updated Sydney's job title

← Older revision		Revision as of 17:39, 21 October 2026
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	{{StaffMemberTableItem\|		{{StaffMemberTableItem\|
	\|Name = Sydney Garstang		\|Name = Sydney Garstang
	\|JobTitle = Senior ~~Administrative Coordinator~~		\|JobTitle = Senior Administrator
	\|CaltechID = sydney		\|CaltechID = sydney
	\|Office = 128 Steele		\|Office = 128 Steele

Usage Rates

Tkimoto — Tue, 20 Oct 2026 23:32:53 GMT

← Older revision		Revision as of 23:32, 20 October 2026
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	! scope="col" style="text-align:left; background-color:#ffe7d1;" \|Electron Beam Lithography (EBL)		! scope="col" style="text-align:left; background-color:#ffe7d1;" \|Electron Beam Lithography (EBL)
	! scope="col" style="text-align:center; background-color:#FFFFFF;" \|$134/hr		! scope="col" style="text-align:center; background-color:#FFFFFF;" \|$134/hr
			\|-
			! scope="col" style="text-align:left; background-color:#ffd8b4;" \|Heidelberg MLA 150 Maskless Aligner
			! scope="col" style="text-align:left; background-color:#ffe7d1;" \|Maskless Photolithography
			! scope="col" style="text-align:center; background-color:#FFFFFF;" \|$45/hr
	\|-		\|-
	! scope="col" style="text-align:left; background-color:#ffd8b4;" \|FEI Nova 600 Dualbeam Focused Ion Beam		! scope="col" style="text-align:left; background-color:#ffd8b4;" \|FEI Nova 600 Dualbeam Focused Ion Beam

ICP-RIE: III-V, Metal & Silicon Etcher

Kmmckenz — Tue, 20 Oct 2026 00:34:20 GMT

Manufacturer Manuals: changed Labrunr link and reference

← Older revision		Revision as of 00:34, 20 October 2026
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	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
	* [https://~~labrunr~~.~~caltech~~.~~edu/machinefiles~~/~~126~~/~~System%20Manual%20for%20Caltech%2094-219845.pdf~~ Oxford III-V Metal Etcher System Manual] ~~(<i>login to LabRunr required</i>)~~		* [https://caltech.box.com/s/perob7sn0sq0daf8ewtesztaxe0t6rtn Oxford III-V Metal Etcher System Manual]
	* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]		* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

III-V Etcher and Atomic Layer Etching (ALE): Oxford Instruments PlasmaPro 100 Cobra 300 ICP-RIE with ALE

Kmmckenz — Tue, 20 Oct 2026 00:32:20 GMT

Manufacturer Manuals

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	\|InstrumentName = Cobra III-V Etcher with ALE		\|InstrumentName = Cobra III-V Etcher with ALE
	\|HeaderColor = #FFE2B9		\|HeaderColor = #FFE2B9
	\|ImageOne = ~~ICP-RIE_III-V,Metal,Si-Etcher~~.jpg		\|ImageOne = Oxford_Cobra_1.jpg
	\|ImageTwo =		\|ImageTwo =
	\|InstrumentType = [[Equipment_List#Etching\|Etching]]		\|InstrumentType = [[Equipment_List#Etching\|Etching]]
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	===== Manufacturer Manuals =====		===== Manufacturer Manuals =====
			* [https://caltech.box.com/s/r2d8bk8mrtxa2qf0bwamuxn43cpjml4f PTIQ User Manual]
	* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (<i>login to LabRunr required</i>)		* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (<i>login to LabRunr required</i>)
	* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]		* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

	== Specifications ==		== Specifications ==
	~~===== Manufacturer Specifications =====~~
	* [https://caltech.box.com/s/f8f1fx1ffz4ql71suxsvrw0p20b2inp5 Manufacturer Data Sheet]

	===== System Features =====		===== System Features =====
	* Process module frame and separate control rack that house the electronic sub systems, control units, pneumatics, and turbomolecular pump		* Process module frame and separate control rack that house the electronic sub systems, control units, pneumatics, and turbomolecular pump
	* ~~PTiQ~~ operating system		* PTIQ operating system
	* ICP process chamber with 200 mm pumping port, view port and end-point-detection ~~ports for optical emission spectrometer and laser interferometer~~		* ICP process chamber with 200 mm pumping port, view port and end-point-detection port
	* 240 mm Cryo RIE electrode		* 240 mm Cryo RIE electrode
	* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement		* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
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	* [https://lab.kni.caltech.edu/ICP-RIE:_Dielectric_Etcher Oxford Dielectric ICP-RIE]		* [https://lab.kni.caltech.edu/ICP-RIE:_Dielectric_Etcher Oxford Dielectric ICP-RIE]
	* [https://lab.kni.caltech.edu/DRIE:_Bosch_%26_Cryo_ICP-RIE_for_Silicon Oxford DRIE ICP-RIE]		* [https://lab.kni.caltech.edu/DRIE:_Bosch_%26_Cryo_ICP-RIE_for_Silicon Oxford DRIE ICP-RIE]
	* Oxford III-V ICP-RIE		* [[ICP-RIE: III-V, Metal & Silicon Etcher\|Oxford III-V ICP-RIE]]
	* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]		* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]
	* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]		* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]
	* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]		* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]

File:Oxford Cobra 1.jpg

Kmmckenz — Tue, 20 Oct 2026 00:01:02 GMT

Kmmckenz uploaded File:Oxford Cobra 1.jpg Oxford Cobra etcher

New page

== Summary ==
Oxford Cobra etcher

← Older revision		Revision as of 19:14, 21 October 2026
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	* [[ICP-RIE: III-V, Metal & Silicon Etcher \| III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]		* [[ICP-RIE: III-V, Metal & Silicon Etcher \| III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
	* [[ICP-RIE: Dielectric Etcher \| Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]		* [[ICP-RIE: Dielectric Etcher \| Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
			* [[III-V Etcher and Atomic Layer Etching (ALE): Oxford Instruments PlasmaPro 100 Cobra 300 ICP-RIE with ALE]]
	<!---* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher \| Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]--->		<!---* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher \| Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]--->
	* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]		* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]

← Older revision		Revision as of 23:32, 20 October 2026
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	! scope="col" style="text-align:left; background-color:#ffe7d1;" \|Electron Beam Lithography (EBL)		! scope="col" style="text-align:left; background-color:#ffe7d1;" \|Electron Beam Lithography (EBL)
	! scope="col" style="text-align:center; background-color:#FFFFFF;" \|$134/hr		! scope="col" style="text-align:center; background-color:#FFFFFF;" \|$134/hr
			\|-
			! scope="col" style="text-align:left; background-color:#ffd8b4;" \|Heidelberg MLA 150 Maskless Aligner
			! scope="col" style="text-align:left; background-color:#ffe7d1;" \|Maskless Photolithography
			! scope="col" style="text-align:center; background-color:#FFFFFF;" \|$45/hr
	\|-		\|-
	! scope="col" style="text-align:left; background-color:#ffd8b4;" \|FEI Nova 600 Dualbeam Focused Ion Beam		! scope="col" style="text-align:left; background-color:#ffd8b4;" \|FEI Nova 600 Dualbeam Focused Ion Beam