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	<id>https://lab.kni.caltech.edu/api.php?action=feedcontributions&amp;feedformat=atom&amp;user=Ykim3</id>
	<title>The KNI Lab at Caltech - User contributions [en]</title>
	<link rel="self" type="application/atom+xml" href="https://lab.kni.caltech.edu/api.php?action=feedcontributions&amp;feedformat=atom&amp;user=Ykim3"/>
	<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/Special:Contributions/Ykim3"/>
	<updated>2026-04-16T21:24:26Z</updated>
	<subtitle>User contributions</subtitle>
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	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3818</id>
		<title>Sirion: SEM &amp; EDS</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3818"/>
		<updated>2026-04-14T03:10:16Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Simulation Software */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Sirion SEM&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Sirion-SEM.jpg&lt;br /&gt;
|ImageTwo = Sirion-SEM.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]&lt;br /&gt;
|RoomLocation = B209 Steele&lt;br /&gt;
|LabPhone = 626-395-1541&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = FEI (now Thermo Fisher)&lt;br /&gt;
|Model = Sirion (aka XL-30)&lt;br /&gt;
|Techniques = SEM,&amp;lt;br&amp;gt;Immersion Lens Imaging&lt;br /&gt;
|RequestTraining = alireza@caltech.edu&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName = SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called &amp;quot;ultra high resolution mode,&amp;quot; UHR). While it is the KNI&#039;s oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]] platform. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.&lt;br /&gt;
===== SEM Applications =====&lt;br /&gt;
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)&lt;br /&gt;
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)&lt;br /&gt;
* Secondary Electron (SE) &amp;amp; Backscattered Electron (BSE) Imaging&lt;br /&gt;
* Everhart-Thornley Detector (ETD) &amp;amp; Through-the-Lens Detector (TLD)&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP &amp;amp; Manuals &amp;amp; SDS]&lt;br /&gt;
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]&lt;br /&gt;
&lt;br /&gt;
===== Video Tutorials =====&lt;br /&gt;
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]&lt;br /&gt;
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])&lt;br /&gt;
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]&lt;br /&gt;
&lt;br /&gt;
===== Graphical Handouts =====&lt;br /&gt;
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]&lt;br /&gt;
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]&lt;br /&gt;
===== Presentations =====&lt;br /&gt;
&lt;br /&gt;
* Masterclasses for Microscopy&lt;br /&gt;
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]&lt;br /&gt;
&lt;br /&gt;
SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements&lt;br /&gt;
*[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]&lt;br /&gt;
&lt;br /&gt;
* Scanning Electron Microscopy: Principles, Techniques &amp;amp; Applications&lt;br /&gt;
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]&lt;br /&gt;
&lt;br /&gt;
===== Calibrate Measurements with NIST Standard =====&lt;br /&gt;
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.&lt;br /&gt;
===== Simulation Software =====&lt;br /&gt;
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.&lt;br /&gt;
* Use the [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner |&lt;br /&gt;
O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&lt;br /&gt;
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide &amp;amp; Data Sheet]&lt;br /&gt;
===== SEM Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved: ~7 nm&lt;br /&gt;
* Voltage Range: 0.2 to 30.0 kV&lt;br /&gt;
* Current Range: &amp;quot;Spotsize&amp;quot; 1 to 7 (approximately 30 pA to 20 nA), with increments of 1&lt;br /&gt;
* Apertures: 30 &amp;amp;mu;m, 40 &amp;amp;mu;m, 50 &amp;amp;mu;m, 100 &amp;amp;mu;m&lt;br /&gt;
* Eucentric Height: 5 mm working distance (WD)&lt;br /&gt;
* Stage Range: ±25 mm X &amp;amp; Y travel, 50 mm Z travel, 0-45&amp;amp;deg; tilt, 360&amp;amp;deg; rotation&lt;br /&gt;
* ETD Grid Bias Range: -150 to 300 V&lt;br /&gt;
* TLD Bias Range: -100 to 150 V&lt;br /&gt;
* Ultimate Vacuum: 3e-6 mbar&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3814</id>
		<title>Sirion: SEM &amp; EDS</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3814"/>
		<updated>2026-04-01T17:51:57Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Sirion SEM&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Sirion-SEM.jpg&lt;br /&gt;
|ImageTwo = Sirion-SEM.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]&lt;br /&gt;
|RoomLocation = B209 Steele&lt;br /&gt;
|LabPhone = 626-395-1541&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = FEI (now Thermo Fisher)&lt;br /&gt;
|Model = Sirion (aka XL-30)&lt;br /&gt;
|Techniques = SEM,&amp;lt;br&amp;gt;Immersion Lens Imaging&lt;br /&gt;
|RequestTraining = alireza@caltech.edu&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName = SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called &amp;quot;ultra high resolution mode,&amp;quot; UHR). While it is the KNI&#039;s oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]] platform. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.&lt;br /&gt;
===== SEM Applications =====&lt;br /&gt;
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)&lt;br /&gt;
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)&lt;br /&gt;
* Secondary Electron (SE) &amp;amp; Backscattered Electron (BSE) Imaging&lt;br /&gt;
* Everhart-Thornley Detector (ETD) &amp;amp; Through-the-Lens Detector (TLD)&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP &amp;amp; Manuals &amp;amp; SDS]&lt;br /&gt;
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]&lt;br /&gt;
&lt;br /&gt;
===== Video Tutorials =====&lt;br /&gt;
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]&lt;br /&gt;
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])&lt;br /&gt;
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]&lt;br /&gt;
&lt;br /&gt;
===== Graphical Handouts =====&lt;br /&gt;
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]&lt;br /&gt;
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]&lt;br /&gt;
===== Presentations =====&lt;br /&gt;
&lt;br /&gt;
* Masterclasses for Microscopy&lt;br /&gt;
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]&lt;br /&gt;
&lt;br /&gt;
SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements&lt;br /&gt;
*[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]&lt;br /&gt;
&lt;br /&gt;
* Scanning Electron Microscopy: Principles, Techniques &amp;amp; Applications&lt;br /&gt;
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]&lt;br /&gt;
&lt;br /&gt;
===== Calibrate Measurements with NIST Standard =====&lt;br /&gt;
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.&lt;br /&gt;
===== Simulation Software =====&lt;br /&gt;
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.&lt;br /&gt;
* Use the [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner |&lt;br /&gt;
O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&lt;br /&gt;
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide &amp;amp; Data Sheet]&lt;br /&gt;
===== SEM Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved: ~7 nm&lt;br /&gt;
* Voltage Range: 0.2 to 30.0 kV&lt;br /&gt;
* Current Range: &amp;quot;Spotsize&amp;quot; 1 to 7 (approximately 30 pA to 20 nA), with increments of 1&lt;br /&gt;
* Apertures: 30 &amp;amp;mu;m, 40 &amp;amp;mu;m, 50 &amp;amp;mu;m, 100 &amp;amp;mu;m&lt;br /&gt;
* Eucentric Height: 5 mm working distance (WD)&lt;br /&gt;
* Stage Range: ±25 mm X &amp;amp; Y travel, 50 mm Z travel, 0-45&amp;amp;deg; tilt, 360&amp;amp;deg; rotation&lt;br /&gt;
* ETD Grid Bias Range: -150 to 300 V&lt;br /&gt;
* TLD Bias Range: -100 to 150 V&lt;br /&gt;
* Ultimate Vacuum: 3e-6 mbar&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3813</id>
		<title>Sirion: SEM &amp; EDS</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3813"/>
		<updated>2026-04-01T17:51:16Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Sirion SEM&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Sirion-SEM.jpg&lt;br /&gt;
|ImageTwo = Sirion-SEM.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]&lt;br /&gt;
|RoomLocation = B209 Steele&lt;br /&gt;
|LabPhone = 626-395-1541&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = FEI (now Thermo Fisher)&lt;br /&gt;
|Model = Sirion (aka XL-30)&lt;br /&gt;
|Techniques = SEM, EDS,&amp;lt;br&amp;gt;Immersion Lens Imaging&lt;br /&gt;
|RequestTraining = alireza@caltech.edu&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName = SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called &amp;quot;ultra high resolution mode,&amp;quot; UHR). While it is the KNI&#039;s oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]] platform. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.&lt;br /&gt;
===== SEM Applications =====&lt;br /&gt;
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)&lt;br /&gt;
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)&lt;br /&gt;
* Secondary Electron (SE) &amp;amp; Backscattered Electron (BSE) Imaging&lt;br /&gt;
* Everhart-Thornley Detector (ETD) &amp;amp; Through-the-Lens Detector (TLD)&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP &amp;amp; Manuals &amp;amp; SDS]&lt;br /&gt;
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]&lt;br /&gt;
&lt;br /&gt;
===== Video Tutorials =====&lt;br /&gt;
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]&lt;br /&gt;
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])&lt;br /&gt;
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]&lt;br /&gt;
&lt;br /&gt;
===== Graphical Handouts =====&lt;br /&gt;
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]&lt;br /&gt;
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]&lt;br /&gt;
===== Presentations =====&lt;br /&gt;
&lt;br /&gt;
* Masterclasses for Microscopy&lt;br /&gt;
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]&lt;br /&gt;
&lt;br /&gt;
SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements&lt;br /&gt;
*[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]&lt;br /&gt;
&lt;br /&gt;
* Scanning Electron Microscopy: Principles, Techniques &amp;amp; Applications&lt;br /&gt;
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]&lt;br /&gt;
&lt;br /&gt;
===== Calibrate Measurements with NIST Standard =====&lt;br /&gt;
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.&lt;br /&gt;
===== Simulation Software =====&lt;br /&gt;
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.&lt;br /&gt;
* Use the [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner |&lt;br /&gt;
O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&lt;br /&gt;
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide &amp;amp; Data Sheet]&lt;br /&gt;
===== SEM Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved: ~7 nm&lt;br /&gt;
* Voltage Range: 0.2 to 30.0 kV&lt;br /&gt;
* Current Range: &amp;quot;Spotsize&amp;quot; 1 to 7 (approximately 30 pA to 20 nA), with increments of 1&lt;br /&gt;
* Apertures: 30 &amp;amp;mu;m, 40 &amp;amp;mu;m, 50 &amp;amp;mu;m, 100 &amp;amp;mu;m&lt;br /&gt;
* Eucentric Height: 5 mm working distance (WD)&lt;br /&gt;
* Stage Range: ±25 mm X &amp;amp; Y travel, 50 mm Z travel, 0-45&amp;amp;deg; tilt, 360&amp;amp;deg; rotation&lt;br /&gt;
* ETD Grid Bias Range: -150 to 300 V&lt;br /&gt;
* TLD Bias Range: -100 to 150 V&lt;br /&gt;
* Ultimate Vacuum: 3e-6 mbar&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3800</id>
		<title>Sirion: SEM &amp; EDS</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3800"/>
		<updated>2026-02-24T18:49:23Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Sirion SEM&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Sirion-SEM.jpg&lt;br /&gt;
|ImageTwo = Sirion-SEM.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]&lt;br /&gt;
|RoomLocation = B209 Steele&lt;br /&gt;
|LabPhone = 626-395-1541&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = FEI (now Thermo Fisher)&lt;br /&gt;
|Model = Sirion (aka XL-30)&lt;br /&gt;
|Techniques = SEM, EDS,&amp;lt;br&amp;gt;Immersion Lens Imaging&lt;br /&gt;
|RequestTraining = alireza@caltech.edu&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName = SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called &amp;quot;ultra high resolution mode,&amp;quot; UHR). While it is the KNI&#039;s oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]] platform. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.&lt;br /&gt;
===== SEM Applications =====&lt;br /&gt;
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)&lt;br /&gt;
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)&lt;br /&gt;
* Secondary Electron (SE) &amp;amp; Backscattered Electron (BSE) Imaging&lt;br /&gt;
* Everhart-Thornley Detector (ETD) &amp;amp; Through-the-Lens Detector (TLD)&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP &amp;amp; Manuals &amp;amp; SDS]&lt;br /&gt;
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]&lt;br /&gt;
&lt;br /&gt;
===== Video Tutorials =====&lt;br /&gt;
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]&lt;br /&gt;
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])&lt;br /&gt;
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]&lt;br /&gt;
&lt;br /&gt;
===== Graphical Handouts =====&lt;br /&gt;
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM &amp;amp; EDS Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]&lt;br /&gt;
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]&lt;br /&gt;
===== Presentations =====&lt;br /&gt;
&lt;br /&gt;
* Masterclasses for Microscopy&lt;br /&gt;
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]&lt;br /&gt;
&lt;br /&gt;
SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements&lt;br /&gt;
*[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]&lt;br /&gt;
&lt;br /&gt;
* Scanning Electron Microscopy: Principles, Techniques &amp;amp; Applications (includes slides on EDS)&lt;br /&gt;
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]&lt;br /&gt;
&lt;br /&gt;
===== Calibrate Measurements with NIST Standard =====&lt;br /&gt;
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.&lt;br /&gt;
===== Simulation Software =====&lt;br /&gt;
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.&lt;br /&gt;
* Use the [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner |&lt;br /&gt;
O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&lt;br /&gt;
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide &amp;amp; Data Sheet]&lt;br /&gt;
===== SEM Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved: ~7 nm&lt;br /&gt;
* Voltage Range: 0.2 to 30.0 kV&lt;br /&gt;
* Current Range: &amp;quot;Spotsize&amp;quot; 1 to 7 (approximately 30 pA to 20 nA), with increments of 1&lt;br /&gt;
* Apertures: 30 &amp;amp;mu;m, 40 &amp;amp;mu;m, 50 &amp;amp;mu;m, 100 &amp;amp;mu;m&lt;br /&gt;
* Eucentric Height: 5 mm working distance (WD)&lt;br /&gt;
* Stage Range: ±25 mm X &amp;amp; Y travel, 50 mm Z travel, 0-45&amp;amp;deg; tilt, 360&amp;amp;deg; rotation&lt;br /&gt;
* ETD Grid Bias Range: -150 to 300 V&lt;br /&gt;
* TLD Bias Range: -100 to 150 V&lt;br /&gt;
* Ultimate Vacuum: 3e-6 mbar&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3799</id>
		<title>Sirion: SEM &amp; EDS</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Sirion:_SEM_%26_EDS&amp;diff=3799"/>
		<updated>2026-02-24T18:49:14Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Sirion SEM&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Sirion-SEM.jpg&lt;br /&gt;
|ImageTwo = Sirion-SEM.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]&lt;br /&gt;
|RoomLocation = B209 Steele&lt;br /&gt;
|LabPhone = 626-395-1541&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = FEI (now Thermo Fisher)&lt;br /&gt;
|Model = Sirion (aka XL-30)&lt;br /&gt;
|Techniques = SEM, EDS,&amp;lt;br&amp;gt;Immersion Lens Imaging&lt;br /&gt;
|RequestTraining = alireza@caltech.edu&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName = SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called &amp;quot;ultra high resolution mode,&amp;quot; UHR). While it is the KNI&#039;s oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]&amp;lt;nowiki/&amp;gt;platform. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.&lt;br /&gt;
===== SEM Applications =====&lt;br /&gt;
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)&lt;br /&gt;
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)&lt;br /&gt;
* Secondary Electron (SE) &amp;amp; Backscattered Electron (BSE) Imaging&lt;br /&gt;
* Everhart-Thornley Detector (ETD) &amp;amp; Through-the-Lens Detector (TLD)&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP &amp;amp; Manuals &amp;amp; SDS]&lt;br /&gt;
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]&lt;br /&gt;
&lt;br /&gt;
===== Video Tutorials =====&lt;br /&gt;
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]&lt;br /&gt;
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])&lt;br /&gt;
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]&lt;br /&gt;
&lt;br /&gt;
===== Graphical Handouts =====&lt;br /&gt;
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM &amp;amp; EDS Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]&lt;br /&gt;
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]&lt;br /&gt;
===== Presentations =====&lt;br /&gt;
&lt;br /&gt;
* Masterclasses for Microscopy&lt;br /&gt;
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]&lt;br /&gt;
&lt;br /&gt;
SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements&lt;br /&gt;
*[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]&lt;br /&gt;
&lt;br /&gt;
* Scanning Electron Microscopy: Principles, Techniques &amp;amp; Applications (includes slides on EDS)&lt;br /&gt;
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]&lt;br /&gt;
&lt;br /&gt;
===== Calibrate Measurements with NIST Standard =====&lt;br /&gt;
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.&lt;br /&gt;
===== Simulation Software =====&lt;br /&gt;
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.&lt;br /&gt;
* Use the [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner |&lt;br /&gt;
O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&lt;br /&gt;
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide &amp;amp; Data Sheet]&lt;br /&gt;
===== SEM Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved: ~7 nm&lt;br /&gt;
* Voltage Range: 0.2 to 30.0 kV&lt;br /&gt;
* Current Range: &amp;quot;Spotsize&amp;quot; 1 to 7 (approximately 30 pA to 20 nA), with increments of 1&lt;br /&gt;
* Apertures: 30 &amp;amp;mu;m, 40 &amp;amp;mu;m, 50 &amp;amp;mu;m, 100 &amp;amp;mu;m&lt;br /&gt;
* Eucentric Height: 5 mm working distance (WD)&lt;br /&gt;
* Stage Range: ±25 mm X &amp;amp; Y travel, 50 mm Z travel, 0-45&amp;amp;deg; tilt, 360&amp;amp;deg; rotation&lt;br /&gt;
* ETD Grid Bias Range: -150 to 300 V&lt;br /&gt;
* TLD Bias Range: -100 to 150 V&lt;br /&gt;
* Ultimate Vacuum: 3e-6 mbar&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3798</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3798"/>
		<updated>2026-02-17T20:31:33Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Profilometer, Carbon Evaporator &amp;amp; Metal Sputter Coater&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
== List of Managed Instruments ==&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS|Sirion: FESEM]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3797</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3797"/>
		<updated>2026-02-17T20:30:37Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Ga-FIB, SEM, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Oxide/Nitride Deposition: Oxford Instruments PlasmaPro System 100 PECVD | Oxide/Nitride Deposition: Oxford Instruments PlasmaPro System 100 PECVD]]&lt;br /&gt;
* [[Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD | Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD]]&lt;br /&gt;
&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: FESEM]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 |Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Nova_600_NanoLab:_SEM,_Ga-FIB,_GIS_%26_Omniprobe&amp;diff=3795</id>
		<title>Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp; Omniprobe</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Nova_600_NanoLab:_SEM,_Ga-FIB,_GIS_%26_Omniprobe&amp;diff=3795"/>
		<updated>2026-01-23T16:16:39Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Stubs for specimen mounting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfobox|&lt;br /&gt;
|InstrumentName = Nova 600&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg&lt;br /&gt;
|ImageTwo = Nova-NanoLab-600.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]&lt;br /&gt;
|RoomLocation = B233B Steele&lt;br /&gt;
|LabPhone = 626-395-1534&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = FEI (now Thermo Fisher)&lt;br /&gt;
|Model = Nova 600 NanoLab&lt;br /&gt;
|Techniques = SEM, Ga-FIB, Omniprobe,&amp;lt;br&amp;gt;Immersion Lens Imaging,&amp;lt;br&amp;gt;GIS, Cross-sectioning,&amp;lt;br&amp;gt;TEM Lamella Sample Prep&lt;br /&gt;
|RequestTraining = alireza@caltech.edu&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName = SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Nova 600 is a &amp;quot;dual-beam&amp;quot; system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.&lt;br /&gt;
===== SEM Applications =====&lt;br /&gt;
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)&lt;br /&gt;
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)&lt;br /&gt;
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) &amp;amp; Through-the-Lens Detector (TLD)&lt;br /&gt;
* Backscattered Electron (BSE) imaging with a TLD&lt;br /&gt;
* Platinum deposition via Gas Injection System (GIS)&lt;br /&gt;
* Automated imaging with RunScript program &amp;amp; AutoScript language&lt;br /&gt;
===== Ga-FIB Applications =====&lt;br /&gt;
* Directly etch patterns into material&lt;br /&gt;
* Cutting &amp;amp; Imaging Cross-Sections&lt;br /&gt;
* TEM Lamella Sample Preparation using an Omniprobe for Liftout&lt;br /&gt;
* Platinum &amp;amp; SiO&amp;lt;sub&amp;gt;x&amp;lt;/sub&amp;gt; deposition via GIS&lt;br /&gt;
* Enhanced etch with XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; via GIS&lt;br /&gt;
* Automated patterning with RunScript program &amp;amp; AutoScript language&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs &amp;amp; Manuals &amp;amp; SDS =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS] &lt;br /&gt;
* [https://caltech.box.com/s/a7rguo6eyf5aq5tpel3bsu2xsg8ko9an Nova NanoLab Operation Manual]&lt;br /&gt;
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]&lt;br /&gt;
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]&lt;br /&gt;
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etch (Technical Note)]&lt;br /&gt;
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]&lt;br /&gt;
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]&lt;br /&gt;
&lt;br /&gt;
===== Video Tutorials =====&lt;br /&gt;
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]&lt;br /&gt;
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])&lt;br /&gt;
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]&lt;br /&gt;
&lt;br /&gt;
===== Graphical Handouts =====&lt;br /&gt;
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM &amp;amp; Ga-FIB Alignments]&lt;br /&gt;
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]&lt;br /&gt;
&lt;br /&gt;
===== Presentations =====&lt;br /&gt;
* Masterclasses for Microscopy&lt;br /&gt;
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]&lt;br /&gt;
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements&lt;br /&gt;
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]&lt;br /&gt;
* Scanning Electron Microscopy (SEM): Principles, Techniques &amp;amp; Applications&lt;br /&gt;
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]&lt;br /&gt;
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques &amp;amp; Applications&lt;br /&gt;
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]&lt;br /&gt;
&lt;br /&gt;
===== Simulation Software =====&lt;br /&gt;
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]&lt;br /&gt;
* [http://www.srim.org/ The Stopping &amp;amp; Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]&lt;br /&gt;
===== Calibrate Measurements with NIST Standard =====&lt;br /&gt;
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.&lt;br /&gt;
* Use the [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner |&lt;br /&gt;
O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&lt;br /&gt;
* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI&#039;s Nova 600)&lt;br /&gt;
===== SEM Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm&lt;br /&gt;
* Voltage Range: 0.2 to 30.0 kV&lt;br /&gt;
* Current Range: ~10 pA to 20 nA&lt;br /&gt;
* Apertures: 10 &amp;amp;mu;m, 15 &amp;amp;mu;m, 20 &amp;amp;mu;m, 30 &amp;amp;mu;m&lt;br /&gt;
* Eucentric Height: ~5.15 mm working distance (WD)&lt;br /&gt;
* Stage Range: ±80 mm X &amp;amp; Y travel, 12 mm Z travel, -12 to 58&amp;amp;deg; tilt, 360&amp;amp;deg; rotation&lt;br /&gt;
* ETD Grid Bias Range: -150 to 300 V&lt;br /&gt;
* TLD Bias Range: -100 to 150 V&lt;br /&gt;
* Ultimate Vacuum: 5e-7 mbar&lt;br /&gt;
===== Ga-FIB Specifications =====&lt;br /&gt;
* Minumum Probe Size Achieved: ~7 nm&lt;br /&gt;
* Minimum Feature Size Etched: ~25 nm&lt;br /&gt;
* Minimum Feature Size Resolved by Imaging: ~10 nm&lt;br /&gt;
* Voltage Range: 5 to 30 kV&lt;br /&gt;
* Current Range: 1 pA to 20 nA&lt;br /&gt;
* Eucentric Height: ~5.15 mm working distance (WD)&lt;br /&gt;
* Stage Tilt to be perpendicular to Ga-FIB: 52&amp;amp;deg;&lt;br /&gt;
* ETD Grid Bias Range: -150 to 300 V&lt;br /&gt;
* TLD Bias Range: -100 to 150 V&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3794</id>
		<title>Guide to Choosing KNI SEMs &amp; FIBs</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3794"/>
		<updated>2026-01-23T16:12:23Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]], [[Sirion: SEM &amp;amp; EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.&lt;br /&gt;
*See the “Functionality of SEMs &amp;amp; FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)&lt;br /&gt;
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI&#039;s Microscopy Lectures] for more details on physical principles, applications, and examples&lt;br /&gt;
&lt;br /&gt;
==Low Magnification Imaging==&lt;br /&gt;
If you only need to take low mag images, e.g. with a 4 &amp;amp;mu;m field of view (FOV) or larger (i.e. if you&#039;re only using “Field Free Mode” aka “Normal Mode&amp;quot;):&lt;br /&gt;
#&#039;&#039;&#039;[[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging&lt;br /&gt;
#&amp;lt;!---&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]&#039;&#039;&#039; or ---&amp;gt;&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]&#039;&#039;&#039; or &#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; You&#039;re generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs&lt;br /&gt;
&lt;br /&gt;
==High Magnification Imaging==&lt;br /&gt;
If you need to take high mag images with less than 4 &amp;amp;mu;m FOV (i.e. if you&#039;re using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; High resolution but limited depth of field e.g. when tilting; Sirion has 1-2 min pump/vent times&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)&lt;br /&gt;
&lt;br /&gt;
==Highest Magnification Imaging== &lt;br /&gt;
If you need to take images with less than 2 &amp;amp;mu;m FOV:&lt;br /&gt;
&amp;lt;!---#&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]:&#039;&#039;&#039; Can image as small as ~800 nm FOV – and features as small as 6 nm – with good clarity; has limited depth of field when in the Immersion Mode; is the cheapest option ---&amp;gt;&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Not quite as good as Nova 200 or Nova 600 at these FOVs&lt;br /&gt;
&lt;br /&gt;
==Gallium Focused Ion Beam Work==&lt;br /&gt;
If you need to use Ga-FIB:&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for cross-sections, TEM sample prep, point &amp;amp; shoot etching tasks, Pt dep, minor automation via scripting&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer  &lt;br /&gt;
&lt;br /&gt;
==Lithography==&lt;br /&gt;
If you want to perform lithography on resist or a hard mask and don&#039;t need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):&lt;br /&gt;
#&#039;&#039;&#039;Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; As small as 15 nm features achievable at 30 kV&lt;br /&gt;
#&#039;&#039;&#039;Helium ion beam lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; As small as 5 nm features achievable at 35 kV (best when used on very thin resist)&lt;br /&gt;
#&#039;&#039;&#039;Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;) that subsequently gets used as an etch mask&lt;br /&gt;
&lt;br /&gt;
==&amp;quot;Functionality of KNI SEMs &amp;amp; FIBs&amp;quot; Table==&lt;br /&gt;
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI&#039;s SEMs and FIBs offer a particular functionality that you need]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3793</id>
		<title>Guide to Choosing KNI SEMs &amp; FIBs</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3793"/>
		<updated>2026-01-23T16:11:58Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta], [Sirion: SEM &amp;amp; EDS | Sirion]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.&lt;br /&gt;
*See the “Functionality of SEMs &amp;amp; FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)&lt;br /&gt;
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI&#039;s Microscopy Lectures] for more details on physical principles, applications, and examples&lt;br /&gt;
&lt;br /&gt;
==Low Magnification Imaging==&lt;br /&gt;
If you only need to take low mag images, e.g. with a 4 &amp;amp;mu;m field of view (FOV) or larger (i.e. if you&#039;re only using “Field Free Mode” aka “Normal Mode&amp;quot;):&lt;br /&gt;
#&#039;&#039;&#039;[[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging&lt;br /&gt;
#&amp;lt;!---&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]&#039;&#039;&#039; or ---&amp;gt;&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]&#039;&#039;&#039; or &#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; You&#039;re generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs&lt;br /&gt;
&lt;br /&gt;
==High Magnification Imaging==&lt;br /&gt;
If you need to take high mag images with less than 4 &amp;amp;mu;m FOV (i.e. if you&#039;re using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; High resolution but limited depth of field e.g. when tilting; Sirion has 1-2 min pump/vent times&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)&lt;br /&gt;
&lt;br /&gt;
==Highest Magnification Imaging== &lt;br /&gt;
If you need to take images with less than 2 &amp;amp;mu;m FOV:&lt;br /&gt;
&amp;lt;!---#&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]:&#039;&#039;&#039; Can image as small as ~800 nm FOV – and features as small as 6 nm – with good clarity; has limited depth of field when in the Immersion Mode; is the cheapest option ---&amp;gt;&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Not quite as good as Nova 200 or Nova 600 at these FOVs&lt;br /&gt;
&lt;br /&gt;
==Gallium Focused Ion Beam Work==&lt;br /&gt;
If you need to use Ga-FIB:&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for cross-sections, TEM sample prep, point &amp;amp; shoot etching tasks, Pt dep, minor automation via scripting&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer  &lt;br /&gt;
&lt;br /&gt;
==Lithography==&lt;br /&gt;
If you want to perform lithography on resist or a hard mask and don&#039;t need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):&lt;br /&gt;
#&#039;&#039;&#039;Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; As small as 15 nm features achievable at 30 kV&lt;br /&gt;
#&#039;&#039;&#039;Helium ion beam lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; As small as 5 nm features achievable at 35 kV (best when used on very thin resist)&lt;br /&gt;
#&#039;&#039;&#039;Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;) that subsequently gets used as an etch mask&lt;br /&gt;
&lt;br /&gt;
==&amp;quot;Functionality of KNI SEMs &amp;amp; FIBs&amp;quot; Table==&lt;br /&gt;
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI&#039;s SEMs and FIBs offer a particular functionality that you need]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3792</id>
		<title>Guide to Choosing KNI SEMs &amp; FIBs</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3792"/>
		<updated>2026-01-23T16:11:32Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs([[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]], [[Sirion: SEM &amp;amp; EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.&lt;br /&gt;
*See the “Functionality of SEMs &amp;amp; FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)&lt;br /&gt;
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI&#039;s Microscopy Lectures] for more details on physical principles, applications, and examples&lt;br /&gt;
&lt;br /&gt;
==Low Magnification Imaging==&lt;br /&gt;
If you only need to take low mag images, e.g. with a 4 &amp;amp;mu;m field of view (FOV) or larger (i.e. if you&#039;re only using “Field Free Mode” aka “Normal Mode&amp;quot;):&lt;br /&gt;
#&#039;&#039;&#039;[[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging&lt;br /&gt;
#&amp;lt;!---&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]&#039;&#039;&#039; or ---&amp;gt;&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]&#039;&#039;&#039; or &#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; You&#039;re generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs&lt;br /&gt;
&lt;br /&gt;
==High Magnification Imaging==&lt;br /&gt;
If you need to take high mag images with less than 4 &amp;amp;mu;m FOV (i.e. if you&#039;re using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; High resolution but limited depth of field e.g. when tilting; Sirion has 1-2 min pump/vent times&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)&lt;br /&gt;
&lt;br /&gt;
==Highest Magnification Imaging== &lt;br /&gt;
If you need to take images with less than 2 &amp;amp;mu;m FOV:&lt;br /&gt;
&amp;lt;!---#&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]:&#039;&#039;&#039; Can image as small as ~800 nm FOV – and features as small as 6 nm – with good clarity; has limited depth of field when in the Immersion Mode; is the cheapest option ---&amp;gt;&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Not quite as good as Nova 200 or Nova 600 at these FOVs&lt;br /&gt;
&lt;br /&gt;
==Gallium Focused Ion Beam Work==&lt;br /&gt;
If you need to use Ga-FIB:&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for cross-sections, TEM sample prep, point &amp;amp; shoot etching tasks, Pt dep, minor automation via scripting&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer  &lt;br /&gt;
&lt;br /&gt;
==Lithography==&lt;br /&gt;
If you want to perform lithography on resist or a hard mask and don&#039;t need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):&lt;br /&gt;
#&#039;&#039;&#039;Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; As small as 15 nm features achievable at 30 kV&lt;br /&gt;
#&#039;&#039;&#039;Helium ion beam lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; As small as 5 nm features achievable at 35 kV (best when used on very thin resist)&lt;br /&gt;
#&#039;&#039;&#039;Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;) that subsequently gets used as an etch mask&lt;br /&gt;
&lt;br /&gt;
==&amp;quot;Functionality of KNI SEMs &amp;amp; FIBs&amp;quot; Table==&lt;br /&gt;
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI&#039;s SEMs and FIBs offer a particular functionality that you need]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3791</id>
		<title>Guide to Choosing KNI SEMs &amp; FIBs</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Guide_to_Choosing_KNI_SEMs_%26_FIBs&amp;diff=3791"/>
		<updated>2026-01-23T16:10:58Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]], [[Sirion: SEM &amp;amp; EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.&lt;br /&gt;
*See the “Functionality of SEMs &amp;amp; FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)&lt;br /&gt;
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI&#039;s Microscopy Lectures] for more details on physical principles, applications, and examples&lt;br /&gt;
&lt;br /&gt;
==Low Magnification Imaging==&lt;br /&gt;
If you only need to take low mag images, e.g. with a 4 &amp;amp;mu;m field of view (FOV) or larger (i.e. if you&#039;re only using “Field Free Mode” aka “Normal Mode&amp;quot;):&lt;br /&gt;
#&#039;&#039;&#039;[[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging&lt;br /&gt;
#&amp;lt;!---&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]&#039;&#039;&#039; or ---&amp;gt;&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]&#039;&#039;&#039; or &#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; You&#039;re generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs&lt;br /&gt;
&lt;br /&gt;
==High Magnification Imaging==&lt;br /&gt;
If you need to take high mag images with less than 4 &amp;amp;mu;m FOV (i.e. if you&#039;re using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; High resolution but limited depth of field e.g. when tilting; Sirion has 1-2 min pump/vent times&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)&lt;br /&gt;
&lt;br /&gt;
==Highest Magnification Imaging== &lt;br /&gt;
If you need to take images with less than 2 &amp;amp;mu;m FOV:&lt;br /&gt;
&amp;lt;!---#&#039;&#039;&#039;[[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200]]:&#039;&#039;&#039; Can image as small as ~800 nm FOV – and features as small as 6 nm – with good clarity; has limited depth of field when in the Immersion Mode; is the cheapest option ---&amp;gt;&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability&lt;br /&gt;
#&#039;&#039;&#039;[[Sirion: SEM &amp;amp; EDS | Sirion]]:&#039;&#039;&#039; Not quite as good as Nova 200 or Nova 600 at these FOVs&lt;br /&gt;
&lt;br /&gt;
==Gallium Focused Ion Beam Work==&lt;br /&gt;
If you need to use Ga-FIB:&lt;br /&gt;
#&#039;&#039;&#039;[[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Nova 600]]:&#039;&#039;&#039; Use for cross-sections, TEM sample prep, point &amp;amp; shoot etching tasks, Pt dep, minor automation via scripting&lt;br /&gt;
#&#039;&#039;&#039;[[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer  &lt;br /&gt;
&lt;br /&gt;
==Lithography==&lt;br /&gt;
If you want to perform lithography on resist or a hard mask and don&#039;t need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):&lt;br /&gt;
#&#039;&#039;&#039;Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta]]:&#039;&#039;&#039; As small as 15 nm features achievable at 30 kV&lt;br /&gt;
#&#039;&#039;&#039;Helium ion beam lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; As small as 5 nm features achievable at 35 kV (best when used on very thin resist)&lt;br /&gt;
#&#039;&#039;&#039;Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab]]:&#039;&#039;&#039; Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;) that subsequently gets used as an etch mask&lt;br /&gt;
&lt;br /&gt;
==&amp;quot;Functionality of KNI SEMs &amp;amp; FIBs&amp;quot; Table==&lt;br /&gt;
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI&#039;s SEMs and FIBs offer a particular functionality that you need]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3781</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3781"/>
		<updated>2026-01-14T17:15:45Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.app.box.com/file/2102569954808 Updated SOP (01/14/2026)]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3780</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3780"/>
		<updated>2026-01-14T17:14:49Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.app.box.com/file/2101406320184 Updated SOP]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3779</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3779"/>
		<updated>2026-01-13T18:19:52Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.app.box.com/file/2101406320184 SOP]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3778</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3778"/>
		<updated>2026-01-12T22:01:14Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.app.box.com/file/2100395303594 SOP]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3777</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3777"/>
		<updated>2026-01-12T22:00:50Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Deposition */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Ga-FIB, SEM, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 |Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3776</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3776"/>
		<updated>2026-01-12T21:21:06Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3775</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3775"/>
		<updated>2026-01-12T21:20:25Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP &amp;amp; Troubleshooting Guide]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3774</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3774"/>
		<updated>2026-01-12T21:19:32Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP &amp;amp; Troubleshooting Guide]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6] page 47&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3773</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3773"/>
		<updated>2026-01-12T21:18:59Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP &amp;amp; Troubleshooting Guide]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6]# page&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3772</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3772"/>
		<updated>2026-01-12T21:18:01Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* SOP &amp;amp; Troubleshooting */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP &amp;amp; Troubleshooting Guide]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3771</id>
		<title>Profilometer: Keyence VK-X3000</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3771"/>
		<updated>2026-01-12T20:36:33Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Resources */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Keyence VK-X3000 Profilometer&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Keyence-VK-X3000-Profilometer.jpg&lt;br /&gt;
|ImageTwo = &lt;br /&gt;
|InstrumentType = [[Equipment_List#Metrology|Metrology]]&lt;br /&gt;
|RoomLocation = B235 Steele&lt;br /&gt;
|LabPhone = 626-395-1539&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Keyence&lt;br /&gt;
|Model = VK-X3000&lt;br /&gt;
|Techniques = Surface Profiling&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Keyence VK-X3000 is a non-contact 3D optical profilometer for surface topography and roughness measurements. It integrates three measurement principles in a single platform: white light interferometry, laser confocal scanning, and focus variation, enabling accurate 3D analysis across a wide range of materials and surface conditions. &lt;br /&gt;
&lt;br /&gt;
The system measures step height, surface roughness, and feature profiles without physically contacting samples, protecting delicate or sensitive materials. It provides fully automated measurements and intuitive analysis software, offering high-resolution, versatile surface characterization for research and fabrication applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Non-contact measurement of surface topography and roughness&lt;br /&gt;
* Step height and feature profile characterization&lt;br /&gt;
* Analysis of delicate or soft materials without physical contact&lt;br /&gt;
* 3D surface mapping for research, micro- and nanoscale structures, and quality control&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs =====&lt;br /&gt;
* Coming soon&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3770</id>
		<title>Profilometer: Keyence VK-X3000</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3770"/>
		<updated>2026-01-12T20:35:06Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Keyence VK-X3000 Profilometer&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Keyence-VK-X3000-Profilometer.jpg&lt;br /&gt;
|ImageTwo = &lt;br /&gt;
|InstrumentType = [[Equipment_List#Metrology|Metrology]]&lt;br /&gt;
|RoomLocation = B235 Steele&lt;br /&gt;
|LabPhone = 626-395-1539&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Keyence&lt;br /&gt;
|Model = VK-X3000&lt;br /&gt;
|Techniques = Surface Profiling&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Keyence VK-X3000 is a non-contact 3D optical profilometer for surface topography and roughness measurements. It integrates three measurement principles in a single platform: white light interferometry, laser confocal scanning, and focus variation, enabling accurate 3D analysis across a wide range of materials and surface conditions. &lt;br /&gt;
&lt;br /&gt;
The system measures step height, surface roughness, and feature profiles without physically contacting samples, protecting delicate or sensitive materials. It provides fully automated measurements and intuitive analysis software, offering high-resolution, versatile surface characterization for research and fabrication applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Non-contact measurement of surface topography and roughness&lt;br /&gt;
* Step height and feature profile characterization&lt;br /&gt;
* Analysis of delicate or soft materials without physical contact&lt;br /&gt;
* 3D surface mapping for research, micro- and nanoscale structures, and quality control&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs =====&lt;br /&gt;
* Coming soon&lt;br /&gt;
//* [https://caltech.box.com/s/j6br8jpkr7ov0k9dwx7wzyzt9f5fj3rt Dektak Operations Manual]//&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3769</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3769"/>
		<updated>2026-01-08T23:32:48Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* List of Managed Instruments */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Profilometer, Carbon Evaporator &amp;amp; Metal Sputter Coater&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
== List of Managed Instruments ==&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS|Sirion: SEM]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3768</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3768"/>
		<updated>2026-01-08T23:32:14Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Profilometer, Carbon Evaporator &amp;amp; Metal Sputter Coater&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
== List of Managed Instruments ==&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3767</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3767"/>
		<updated>2026-01-08T23:31:56Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Profilometer, Carbon Evaporator &amp;amp; Metal Sputter Coater&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
== List of Managed Instruments ==&lt;br /&gt;
==== List of Managed Instruments ====&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=KNI_Staff_Members&amp;diff=3766</id>
		<title>KNI Staff Members</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=KNI_Staff_Members&amp;diff=3766"/>
		<updated>2026-01-08T23:25:30Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{| class=&amp;quot;wikitable&amp;quot; style=&amp;quot;width: 90%;&amp;quot;&lt;br /&gt;
|-&lt;br /&gt;
!scope=&amp;quot;col&amp;quot; style=&amp;quot;text-align:left; width: 15%&amp;quot;| Name&lt;br /&gt;
!scope=&amp;quot;col&amp;quot; style=&amp;quot;text-align:left; width: 16%&amp;quot; | Job Title&lt;br /&gt;
!scope=&amp;quot;col&amp;quot; style=&amp;quot;text-align:left; width: 18%&amp;quot;| Email&lt;br /&gt;
!scope=&amp;quot;col&amp;quot; style=&amp;quot;text-align:left; width: 14%&amp;quot;| Office &amp;amp; Phone&lt;br /&gt;
!scope=&amp;quot;col&amp;quot; style=&amp;quot;text-align:left; width: 20%&amp;quot;| Areas of Responsibility&lt;br /&gt;
!scope=&amp;quot;col&amp;quot; style=&amp;quot;text-align:center;&amp;quot;| Photo&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Guy A. DeRose, PhD&lt;br /&gt;
|JobTitle = Technical Director&amp;lt;br&amp;gt;Member of the Professional Staff&lt;br /&gt;
|CaltechID = derose&lt;br /&gt;
|Office = 126 Steele&lt;br /&gt;
|Phone = 626-395-3423 (office)&amp;lt;br&amp;gt;626-676-8529 (cell)&lt;br /&gt;
|AreasResponsibility = Electron Beam Lithography,&amp;lt;br&amp;gt;Lab Technical Operations&lt;br /&gt;
|Photo = Guy-A-DeRose.jpg&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Tiffany Kimoto&lt;br /&gt;
|JobTitle = Executive Director&lt;br /&gt;
|CaltechID = tkimoto&lt;br /&gt;
|Office = 119A Steele&lt;br /&gt;
|Phone = 626-395-3914 (office)&amp;lt;br&amp;gt;310-291-7977 (cell)&lt;br /&gt;
|AreasResponsibility = Programs, Outreach,&amp;lt;br&amp;gt;Communications,&amp;lt;br&amp;gt;Financial Management&lt;br /&gt;
|Photo = Tiffany-kimoto.jpg&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Nathan S. Lee&lt;br /&gt;
|JobTitle = Laboratory Infrastructure Manager&lt;br /&gt;
|CaltechID = nathslee&lt;br /&gt;
|Office = 124 Steele&lt;br /&gt;
|Phone = 626-395-4075 (office)&amp;lt;br&amp;gt;626-395-4386 (cell)&lt;br /&gt;
|AreasResponsibility = General Infrastructure, Safety, Photolithography&lt;br /&gt;
|Photo = Nathan-lee.png&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Yonghwi Kim&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Office = 303 Steele&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|AreasResponsibility =  Scanning Electron Microscope, Focused Ion Beam (He/Ne/Ga FIB), Atomic Force Microscope, Profilometer, Carbon Evaporator &amp;amp; Metal Sputter Coater&lt;br /&gt;
|Photo = yonghwi-kim.jpg&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Kelly McKenzie&lt;br /&gt;
|JobTitle = Plasma Process Engineer&lt;br /&gt;
|CaltechID = kmmckenz&lt;br /&gt;
|Office = 330 Steele&lt;br /&gt;
|Phone = 626-395-5732 (office)&lt;br /&gt;
|AreasResponsibility = Plasma Etch / Deposition,&amp;lt;br&amp;gt;Tube Furnaces&lt;br /&gt;
|Photo = McKenzie_Kelly_2.jpg&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Alex Wertheim&lt;br /&gt;
|JobTitle = Materials Process Engineer&lt;br /&gt;
|CaltechID = alexw&lt;br /&gt;
|Office = 303 Steele&lt;br /&gt;
|Phone = 626-395-3371 (office)&lt;br /&gt;
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, Carbon Evaporator, RTP&lt;br /&gt;
|Photo = Alex-wertheim.png&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Sydney Garstang&lt;br /&gt;
|JobTitle = Senior Administrative Coordinator&lt;br /&gt;
|CaltechID = sydney&lt;br /&gt;
|Office = 128 Steele&lt;br /&gt;
|Phone = 626-395-3244 (office)&lt;br /&gt;
|AreasResponsibility = Accounts, Billing,&amp;lt;br&amp;gt;Purchase Orders&lt;br /&gt;
|Photo = Sydney-Garstang.jpg&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Benjamin Boone     &lt;br /&gt;
|JobTitle = UG Lab Assistant&lt;br /&gt;
|CaltechID = bboone&lt;br /&gt;
|Office =  &lt;br /&gt;
|Phone =  &lt;br /&gt;
|AreasResponsibility = General Lab Support&lt;br /&gt;
|Photo = &lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = David Castillo     &lt;br /&gt;
|JobTitle = UG Lab Assistant&lt;br /&gt;
|CaltechID = dcastil2&lt;br /&gt;
|Office =  &lt;br /&gt;
|Phone =  &lt;br /&gt;
|AreasResponsibility = General Lab Support&lt;br /&gt;
|Photo = David-castillo.jpg&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Tuyako Khristoforova     &lt;br /&gt;
|JobTitle = UG Lab Assistant&lt;br /&gt;
|CaltechID = tkhristo&lt;br /&gt;
|Office =  &lt;br /&gt;
|Phone =  &lt;br /&gt;
|AreasResponsibility = General Lab Support&lt;br /&gt;
|Photo = tuyako-khristoforova.jpg&lt;br /&gt;
}}&lt;br /&gt;
|-&lt;br /&gt;
{{StaffMemberTableItem|&lt;br /&gt;
|Name = Patama Taweesup     &lt;br /&gt;
|JobTitle = Grants Manager&lt;br /&gt;
|CaltechID = patama&lt;br /&gt;
|Office = 142B Moore&lt;br /&gt;
|Phone = 626-395-8542 (office)&lt;br /&gt;
|AreasResponsibility = Grant Management&lt;br /&gt;
|Photo = Patama-Taweesup.jpg&lt;br /&gt;
}}&lt;br /&gt;
&lt;br /&gt;
|}&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3765</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3765"/>
		<updated>2026-01-08T23:24:02Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Profilometer, Carbon Evaporator &amp;amp; Metal Sputter Coater&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
==== List of Managed Instruments ====&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3764</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3764"/>
		<updated>2026-01-08T23:23:18Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Scanning Probe Microscopes */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Carbon Evaporator &amp;amp; Metal Sputter Coater, Profilometer&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
==== List of Managed Instruments ====&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3763</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3763"/>
		<updated>2026-01-08T23:22:22Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Metrology */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Ga-FIB, SEM, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 |Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3762</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3762"/>
		<updated>2026-01-08T23:20:58Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Metrology */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Ga-FIB, SEM, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 |Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3761</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3761"/>
		<updated>2026-01-08T23:20:22Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Optical Characterization */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Ga-FIB, SEM, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3760</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3760"/>
		<updated>2026-01-08T23:19:55Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Microscopy */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Ga-FIB, SEM, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3759</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3759"/>
		<updated>2026-01-08T23:17:28Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | Ga-FIB, SEM, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3758</id>
		<title>Equipment List</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Equipment_List&amp;diff=3758"/>
		<updated>2026-01-08T23:16:51Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&#039;&#039;&#039;NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:&#039;&#039;&#039; [[FBS Instructions | FBS Instructions]]&lt;br /&gt;
&lt;br /&gt;
== Lithography ==&lt;br /&gt;
===== Electron Beam Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]---&amp;gt;&lt;br /&gt;
===== Ion Beam Lithography =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He &amp;amp; Ne, 1-30 kV Ga)]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Optical Lithography =====&lt;br /&gt;
* [[Contact Mask Aligners: MA6 &amp;amp; MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 &amp;amp; MA6/BA6]]&lt;br /&gt;
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]&lt;br /&gt;
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]&lt;br /&gt;
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]&lt;br /&gt;
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]&lt;br /&gt;
* [[Optical Lithography Resources]]&lt;br /&gt;
&lt;br /&gt;
== Deposition ==&lt;br /&gt;
===== Evaporation =====&lt;br /&gt;
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt &amp;amp; Ti): Kurt J Lesker Labline Electron Beam Evaporator]]&lt;br /&gt;
&amp;lt;!--- * [[CHA: Electron Beam Evaporator | Metals &amp;amp; Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals &amp;amp; Oxides: AJA Orion ATC Series Electron Beam Evaporator]]&lt;br /&gt;
&lt;br /&gt;
===== Sputtering =====&lt;br /&gt;
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]&lt;br /&gt;
&lt;br /&gt;
===== Chemical Vapor Deposition (CVD) =====&lt;br /&gt;
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]&lt;br /&gt;
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]&lt;br /&gt;
===== Dielectric Packaging / Moisture Barrier =====&lt;br /&gt;
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]&lt;br /&gt;
&lt;br /&gt;
== Etching ==&lt;br /&gt;
===== Dry Etching =====&lt;br /&gt;
* [[DRIE: Bosch &amp;amp; Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch &amp;amp; Cryo ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: III-V, Metal &amp;amp; Silicon Etcher | III-V Material, Metal &amp;amp; Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]&lt;br /&gt;
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]&lt;br /&gt;
* [[Dual Chamber RIE: Silicon, III-V Material &amp;amp; Organics Etcher | Silicon, III-V Material &amp;amp; Organics Etcher: Plasma-Therm Dual Chamber RIE]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- &amp;amp; CCP-RIE]]&lt;br /&gt;
* [[XeF2 Etcher for Silicon | XeF&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; Etcher for Silicon]]&lt;br /&gt;
&lt;br /&gt;
===== Wet Etching =====&lt;br /&gt;
* [[Wet Chemistry | Available Wet Etching Techniques]]&lt;br /&gt;
&lt;br /&gt;
== Microscopy ==&lt;br /&gt;
===== KNI Microscopy Policies =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
&lt;br /&gt;
===== Microscopy High Performance PC =====&lt;br /&gt;
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
&amp;lt;!---* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]---&amp;gt;&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, EDS, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
&amp;lt;!---===== Transmission Electron Microscope (TEM) =====---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | TEM, STEM, EDS &amp;amp; HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]---&amp;gt;&lt;br /&gt;
&amp;lt;!---* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
&lt;br /&gt;
===== Optical Characterization =====&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator &amp;amp; Metal Sputter Coater]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Stubs for specimen mounting =====&lt;br /&gt;
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions. &lt;br /&gt;
&amp;lt;!---* [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Wet Chemistry ==&lt;br /&gt;
===== Wet Chemistry Main page=====&lt;br /&gt;
* [[Wet Chemistry | Wet Chemistry page:]] &lt;br /&gt;
- Facilities Procedures &amp;amp; Safety&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Supplied by KNI with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets&lt;br /&gt;
&lt;br /&gt;
- Requesting New Chemicals for use in the KNI cleanroom&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Safety page=====&lt;br /&gt;
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]&lt;br /&gt;
- PPE Overview&lt;br /&gt;
&lt;br /&gt;
-Hazardous Waste Handling and Labeling&lt;br /&gt;
&lt;br /&gt;
-Decanting Chemicals&lt;br /&gt;
&lt;br /&gt;
-Hot Plate Rules&lt;br /&gt;
&lt;br /&gt;
-KNI Buddy System&lt;br /&gt;
&lt;br /&gt;
-Secondary Containment and Other Best Practices.&lt;br /&gt;
&lt;br /&gt;
===== Wet Chemistry Resources page=====&lt;br /&gt;
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]&lt;br /&gt;
- Contains fabrication recipes and procedures.&lt;br /&gt;
&lt;br /&gt;
== Support Tools ==&lt;br /&gt;
===== Equipment Status =====&lt;br /&gt;
&lt;br /&gt;
===== Thermal Processing =====&lt;br /&gt;
* [[Tube Furnaces for Wet &amp;amp; Dry Processing | Tube Furnaces: Tystar Tytan 1 &amp;amp; 2 (Wet &amp;amp; Dry Oxidation and Annealing)]]&lt;br /&gt;
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]&lt;br /&gt;
===== Substrate Processing =====&lt;br /&gt;
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]&lt;br /&gt;
&amp;lt;!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---&amp;gt;&lt;br /&gt;
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]&lt;br /&gt;
===== Device Processing =====&lt;br /&gt;
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
===== Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]&lt;br /&gt;
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]&lt;br /&gt;
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]&lt;br /&gt;
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]&lt;br /&gt;
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
&amp;lt;!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---&amp;gt;&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3757</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3757"/>
		<updated>2026-01-08T23:15:32Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Carbon Evaporator &amp;amp; Metal Sputter Coater, Profilometer&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
==== List of Managed Instruments ====&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3756</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3756"/>
		<updated>2026-01-08T23:14:35Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* Optical Metrology */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Carbon Evaporator &amp;amp; Metal Sputter Coater, Profilometer&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
==== List of Managed Instruments ====&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3755</id>
		<title>Yonghwi Kim</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Yonghwi_Kim&amp;diff=3755"/>
		<updated>2026-01-08T23:13:47Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: /* List of Managed Instruments */&lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;__NOTOC__&lt;br /&gt;
{{StaffMemberInfobox&lt;br /&gt;
|StaffName = Yonghwi Kim&lt;br /&gt;
|StaffPhoto = Yonghwi-kim.jpg&lt;br /&gt;
|JobTitle = Electron and Ion Microscope Manager&lt;br /&gt;
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Carbon Evaporator &amp;amp; Metal Sputter Coater, Profilometer&lt;br /&gt;
|CaltechID = ykim&lt;br /&gt;
|Phone = 626-395-5994 (office)&lt;br /&gt;
|OfficeLocation = 303 Steele&lt;br /&gt;
}}&lt;br /&gt;
== About ==&lt;br /&gt;
===== Role in the KNI =====&lt;br /&gt;
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.&lt;br /&gt;
&lt;br /&gt;
Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.&lt;br /&gt;
&lt;br /&gt;
===== Education =====&lt;br /&gt;
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.&lt;br /&gt;
&lt;br /&gt;
==== List of Managed Instruments ====&lt;br /&gt;
&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | Helium, Neon &amp;amp; Gallium FIB: Zeiss ORION NanoFab]]&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe | SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|SEM, Ga-FIB, GIS &amp;amp; Omniprobe: Thermo Fisher Nova 600 NanoLab]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | SEM, ESEM, Lithography &amp;amp; Probe Station: Thermo Fisher Quanta 200F]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
===== Conductive thin film deposition for high resolution SEM and TEM applications =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator &amp;amp; Metal Sputter Coater: Leica EM ACE600]]&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]&lt;br /&gt;
===== Optical Metrology =====&lt;br /&gt;
* [[Keyence VK-X3000: Profilometer | Profilometer: Keyence VK-X3000]]&lt;br /&gt;
&lt;br /&gt;
== Selected Publications ==&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” &#039;&#039;&#039;&#039;&#039;Nano Letters&#039;&#039;&#039;&#039;&#039;, 2019.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y&#039;&#039;&#039;. et al., &amp;quot;[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions],&amp;quot; &#039;&#039;&#039;&#039;&#039;Applied Physics Letters&#039;&#039;&#039;&#039;&#039;, 2012.&lt;br /&gt;
&lt;br /&gt;
• Gao, R., Kelzenberg M. D., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” &#039;&#039;&#039;&#039;&#039;ACS Photonics&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• Shayegan, K. J., Zhao, B., &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” &#039;&#039;&#039;&#039;&#039;Science Advances&#039;&#039;&#039;&#039;&#039;, 2022.&lt;br /&gt;
&lt;br /&gt;
• &#039;&#039;&#039;Kim, Y.&#039;&#039;&#039; et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” &#039;&#039;&#039;&#039;&#039;U.S. Patent&#039;&#039;&#039;,&#039;&#039; 2024&#039;&#039;.&#039;&#039;--&amp;gt;&lt;br /&gt;
&lt;br /&gt;
&lt;br /&gt;
&amp;lt;!---* [[ Nova 200 NanoLab: SEM &amp;amp; EDS]]---!&amp;gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3754</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3754"/>
		<updated>2026-01-08T23:09:12Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = Leica-EM-ACE600-Coater.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP &amp;amp; Troubleshooting Guide]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://www.manualslib.com/manual/1525180/Leica-Em-Ace600.html?page=43#manual Page 39 of the Operating Manual]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=File:Leica-EM-ACE600-Coater.jpg&amp;diff=3753</id>
		<title>File:Leica-EM-ACE600-Coater.jpg</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=File:Leica-EM-ACE600-Coater.jpg&amp;diff=3753"/>
		<updated>2026-01-08T23:08:32Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3752</id>
		<title>Profilometer: Keyence VK-X3000</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3752"/>
		<updated>2026-01-08T19:02:29Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Keyence VK-X3000 Profilometer&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Keyence-VK-X3000-Profilometer.jpg&lt;br /&gt;
|ImageTwo = &lt;br /&gt;
|InstrumentType = [[Equipment_List#Metrology|Metrology]]&lt;br /&gt;
|RoomLocation = B235 Steele&lt;br /&gt;
|LabPhone = 626-395-1539&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Keyence&lt;br /&gt;
|Model = VK-X3000&lt;br /&gt;
|Techniques = Surface Profiling&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Keyence VK-X3000 is a non-contact 3D optical profilometer for surface topography and roughness measurements. It integrates three measurement principles in a single platform: white light interferometry, laser confocal scanning, and focus variation, enabling accurate 3D analysis across a wide range of materials and surface conditions. &lt;br /&gt;
&lt;br /&gt;
The system measures step height, surface roughness, and feature profiles without physically contacting samples, protecting delicate or sensitive materials. It provides fully automated measurements and intuitive analysis software, offering high-resolution, versatile surface characterization for research and fabrication applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Non-contact measurement of surface topography and roughness&lt;br /&gt;
* Step height and feature profile characterization&lt;br /&gt;
* Analysis of delicate or soft materials without physical contact&lt;br /&gt;
* 3D surface mapping for research, micro- and nanoscale structures, and quality control&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs =====&lt;br /&gt;
* Coming soon&lt;br /&gt;
* [https://caltech.box.com/s/j6br8jpkr7ov0k9dwx7wzyzt9f5fj3rt Dektak Operations Manual]&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3751</id>
		<title>Profilometer: Keyence VK-X3000</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3751"/>
		<updated>2026-01-08T19:02:12Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Keyence VK-X3000 Profilometer&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Keyence-VK-X3000-Profilometer.jpg&lt;br /&gt;
|ImageTwo = &lt;br /&gt;
|InstrumentType = [[Equipment_List#Metrology|Metrology]]&lt;br /&gt;
|RoomLocation = B235 Steele&lt;br /&gt;
|LabPhone = 626-395-1539&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Keyence&lt;br /&gt;
|Model = VK-X3000&lt;br /&gt;
|Techniques = Surface Profiling&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Keyence VK-X3000 is a non-contact 3D optical profilometer for surface topography and roughness measurements. It integrates three measurement principles in a single platform: white light interferometry, laser confocal scanning, and focus variation, enabling accurate 3D analysis across a wide range of materials and surface conditions. &lt;br /&gt;
&lt;br /&gt;
The system measures step height, surface roughness, and feature profiles without physically contacting samples, protecting delicate or sensitive materials. It provides fully automated measurements and intuitive analysis software, offering high-resolution, versatile surface characterization for research and fabrication applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Non-contact measurement of surface topography and roughness&lt;br /&gt;
* Step height and feature profile characterization&lt;br /&gt;
* Analysis of delicate or soft materials without physical contact&lt;br /&gt;
* 3D surface mapping for research, micro- and nanoscale structures, and quality control&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs =====&lt;br /&gt;
* Coming soon[https://caltech.box.com/s/hdic8scc882tkrcjqsbaruqph9jgo75t KNI SOP]&lt;br /&gt;
* [https://caltech.box.com/s/j6br8jpkr7ov0k9dwx7wzyzt9f5fj3rt Dektak Operations Manual]&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3750</id>
		<title>Profilometer: Keyence VK-X3000</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3750"/>
		<updated>2026-01-08T19:00:34Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Keyence VK-X3000 Profilometer&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Keyence-VK-X3000-Profilometer.jpg&lt;br /&gt;
|ImageTwo = &lt;br /&gt;
|InstrumentType = [[Equipment_List#Metrology|Metrology]]&lt;br /&gt;
|RoomLocation = B235 Steele&lt;br /&gt;
|LabPhone = 626-395-1539&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Keyence&lt;br /&gt;
|Model = VK-X3000&lt;br /&gt;
|Techniques = Surface Profiling&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Keyence VK-X3000 is a non-contact 3D optical profilometer for surface topography and roughness measurements. It integrates three measurement principles in a single platform: white light interferometry, laser confocal scanning, and focus variation, enabling accurate 3D analysis across a wide range of materials and surface conditions. &lt;br /&gt;
&lt;br /&gt;
The system measures step height, surface roughness, and feature profiles without physically contacting samples, protecting delicate or sensitive materials. It provides fully automated measurements and intuitive analysis software, offering high-resolution, versatile surface characterization for research and fabrication applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Non-contact measurement of surface topography and roughness&lt;br /&gt;
* Step height and feature profile characterization&lt;br /&gt;
* Analysis of delicate or soft materials without physical contact&lt;br /&gt;
* 3D surface mapping for research, micro- and nanoscale structures, and quality control&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs =====&lt;br /&gt;
* [https://caltech.box.com/s/hdic8scc882tkrcjqsbaruqph9jgo75t KNI SOP]&lt;br /&gt;
* [https://caltech.box.com/s/j6br8jpkr7ov0k9dwx7wzyzt9f5fj3rt Dektak Operations Manual]&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=File:Keyence-VK-X3000-Profilometer.jpg&amp;diff=3749</id>
		<title>File:Keyence-VK-X3000-Profilometer.jpg</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=File:Keyence-VK-X3000-Profilometer.jpg&amp;diff=3749"/>
		<updated>2026-01-08T19:00:11Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=File:Keyence_VK-X3000.jpg&amp;diff=3748</id>
		<title>File:Keyence VK-X3000.jpg</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=File:Keyence_VK-X3000.jpg&amp;diff=3748"/>
		<updated>2026-01-08T18:57:53Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3747</id>
		<title>Profilometer: Keyence VK-X3000</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Profilometer:_Keyence_VK-X3000&amp;diff=3747"/>
		<updated>2026-01-08T18:52:36Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Keyence VK-X3000 Profilometer&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Dektak-3ST-Profilometer.jpg&lt;br /&gt;
|ImageTwo = &lt;br /&gt;
|InstrumentType = [[Equipment_List#Metrology|Metrology]]&lt;br /&gt;
|RoomLocation = B235 Steele&lt;br /&gt;
|LabPhone = 626-395-1539&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Keyence&lt;br /&gt;
|Model = VK-X3000&lt;br /&gt;
|Techniques = Surface Profiling&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The Keyence VK-X3000 is a non-contact 3D optical profilometer for surface topography and roughness measurements. It integrates three measurement principles in a single platform: white light interferometry, laser confocal scanning, and focus variation, enabling accurate 3D analysis across a wide range of materials and surface conditions. &lt;br /&gt;
&lt;br /&gt;
The system measures step height, surface roughness, and feature profiles without physically contacting samples, protecting delicate or sensitive materials. It provides fully automated measurements and intuitive analysis software, offering high-resolution, versatile surface characterization for research and fabrication applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Non-contact measurement of surface topography and roughness&lt;br /&gt;
* Step height and feature profile characterization&lt;br /&gt;
* Analysis of delicate or soft materials without physical contact&lt;br /&gt;
* 3D surface mapping for research, micro- and nanoscale structures, and quality control&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== SOPs =====&lt;br /&gt;
* [https://caltech.box.com/s/hdic8scc882tkrcjqsbaruqph9jgo75t KNI SOP]&lt;br /&gt;
* [https://caltech.box.com/s/j6br8jpkr7ov0k9dwx7wzyzt9f5fj3rt Dektak Operations Manual]&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=ORION_NanoFab:_Helium,_Neon_%26_Gallium_FIB&amp;diff=3743</id>
		<title>ORION NanoFab: Helium, Neon &amp; Gallium FIB</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=ORION_NanoFab:_Helium,_Neon_%26_Gallium_FIB&amp;diff=3743"/>
		<updated>2026-01-06T04:25:45Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfobox|&lt;br /&gt;
|InstrumentName = ORION NanoFab&lt;br /&gt;
|HeaderColor = #F5A81C&lt;br /&gt;
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg&lt;br /&gt;
|ImageTwo = ORION-NanoFab.JPG&lt;br /&gt;
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]&lt;br /&gt;
|RoomLocation = B203D Steele&lt;br /&gt;
|LabPhone = 626-395-1548&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = ZEISS (Carl Zeiss AG)&lt;br /&gt;
|Model = ORION NanoFab&lt;br /&gt;
|Techniques = High-Resolution He Imaging,&amp;lt;br&amp;gt;He/Ne/Ga-FIB Etching,&amp;lt;br&amp;gt;He &amp;amp; Ne Ion Lithography,&amp;lt;br&amp;gt;Charge Compensation&amp;lt;br&amp;gt;(with Electron Flood Gun),&amp;lt;br&amp;gt;Cross-Sectioning&lt;br /&gt;
|RequestTraining = ykim@caltech.edu&lt;br /&gt;
|EmailList = kni-orion&lt;br /&gt;
|EmailListName = ORION&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium &amp;amp; neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54&amp;amp;deg;, as in a more traditional &amp;quot;dual beam&amp;quot; FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.&lt;br /&gt;
&lt;br /&gt;
===== Imaging Applications =====&lt;br /&gt;
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)&lt;br /&gt;
* High depth of field imaging (compared to SEM)&lt;br /&gt;
* Image non-conductive specimens using an electron flood gun for charge compensation&lt;br /&gt;
===== Etching Applications =====&lt;br /&gt;
* Directly etch patterns into material with all three beams – He, Ne &amp;amp; Ga&lt;br /&gt;
* Cutting &amp;amp; Imaging Cross-Sections (using Ga)&lt;br /&gt;
* Final thinning of TEM lamellae (using Ne)&lt;br /&gt;
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning &amp;amp; Visualization Engine (NPVE)&lt;br /&gt;
===== Lithography Applications =====&lt;br /&gt;
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)&lt;br /&gt;
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)&lt;br /&gt;
* Resist patterning on non-conductive specimens&lt;br /&gt;
* Resist Pattering on curved substrates due to high depth of field&lt;br /&gt;
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning &amp;amp; Visualization Engine (NPVE)&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
&lt;br /&gt;
===== SOPs &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]&lt;br /&gt;
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]&lt;br /&gt;
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]&lt;br /&gt;
&lt;br /&gt;
===== Process Recipes =====&lt;br /&gt;
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample. &lt;br /&gt;
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]&lt;br /&gt;
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]&lt;br /&gt;
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]&lt;br /&gt;
&lt;br /&gt;
===== Video Tutorials =====&lt;br /&gt;
The resources are currently being updated. The updated tutorials will be uploaded shortly.&lt;br /&gt;
&lt;br /&gt;
===== Graphical Handouts =====&lt;br /&gt;
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]&lt;br /&gt;
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]&lt;br /&gt;
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]&lt;br /&gt;
===== Presentations =====&lt;br /&gt;
* Helium &amp;amp; Neon Focused Ion Beam Microscopy: Principles, Techniques &amp;amp; Applications&lt;br /&gt;
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]&lt;br /&gt;
* Gallium Focused Ion Beam Microscopy: Principles, Techniques &amp;amp; Applications&lt;br /&gt;
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]&lt;br /&gt;
&lt;br /&gt;
===== Manufacturer Manuals =====&lt;br /&gt;
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]&lt;br /&gt;
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]&lt;br /&gt;
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning &amp;amp; Visualization Engine (NPVE) Operation Manual]&lt;br /&gt;
&lt;br /&gt;
===== Simulation Software =====&lt;br /&gt;
* [http://www.srim.org/ The Stopping &amp;amp; Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]&lt;br /&gt;
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]&lt;br /&gt;
&lt;br /&gt;
===== Calibrate Measurements with NIST Standard =====&lt;br /&gt;
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.&lt;br /&gt;
===== Sample Preparation =====&lt;br /&gt;
* Use the [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner |&lt;br /&gt;
O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating hydrocarbon deposition on your features while imaging them (the ORION&#039;s in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).&lt;br /&gt;
* There is no need to coat non-conductive samples, the ORION NanoFab is equipped with a floodgun which can be used for charge compensation. &lt;br /&gt;
* You can of course still use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).&lt;br /&gt;
&lt;br /&gt;
===== Guide to Choosing KNI SEMs &amp;amp; FIBs =====&lt;br /&gt;
*[[Guide to Choosing KNI SEMs &amp;amp; FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide &amp;amp; Data Sheet]&lt;br /&gt;
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide &amp;amp; Data Sheet]&lt;br /&gt;
&lt;br /&gt;
===== Overall System Specifications =====&lt;br /&gt;
* Eucentric Height: ~9.1 mm working distance (WD)&lt;br /&gt;
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)&lt;br /&gt;
* Stage Range: ±24 mm X &amp;amp; Y travel, 8 mm Z travel, -10 to 58&amp;amp;deg; tilt, 360&amp;amp;deg; rotation&lt;br /&gt;
&amp;lt;!-- ** X, Y, Z and R are all driven by piezoelectrics --&amp;gt;&lt;br /&gt;
* ETD Grid Bias Range: -250 to 250 V&lt;br /&gt;
* Stage Bias Range: -500 to 500 V&lt;br /&gt;
* Ultimate Vacuum: 2e-7 Torr&lt;br /&gt;
&lt;br /&gt;
===== He-FIB Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved with He Imaging: ~3 nm&lt;br /&gt;
* Minumum Probe Size: 0.35 nm&lt;br /&gt;
* Voltage Range: 5 to 40 kV&lt;br /&gt;
* Current Range: 0.1 to 100 pA&lt;br /&gt;
&lt;br /&gt;
===== Ne-FIB Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm&lt;br /&gt;
* Minumum Probe Size: 1.9 nm&lt;br /&gt;
* Voltage Range: 5 to 35 kV&lt;br /&gt;
* Current Range: 0.1 to 50 pA&lt;br /&gt;
&lt;br /&gt;
===== Ga-FIB Specifications =====&lt;br /&gt;
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm&lt;br /&gt;
* Minumum Probe Size: 3 nm&lt;br /&gt;
* Voltage Range: 1 to 30 kV&lt;br /&gt;
* Current Range: 1 pA to 100 nA&lt;br /&gt;
&lt;br /&gt;
===== Electron Flood Gun Specifications =====&lt;br /&gt;
* Probe Diameter: millimeters (can be roughly focused)&lt;br /&gt;
* Voltage Range: 0.025 to 1.0 kV&lt;br /&gt;
* Current: ~1 &amp;amp;mu;A&lt;br /&gt;
* Dwell Time Range: 50 to 10000 &amp;amp;mu;s&lt;br /&gt;
&lt;br /&gt;
===== Raith ELPHY MultiBeam Specifications =====&lt;br /&gt;
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) &amp;amp; Dot Arrays (point dose) of any arbitrary shape&lt;br /&gt;
* Import CAD files as .dxf or .gds files&lt;br /&gt;
* Writing Speed: 20 MHz&lt;br /&gt;
* Digital-to-Analog Converter (DAC): 16-bit&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Focused Ion Beam (FIB) Systems =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;br /&gt;
===== Scanning Electron Microscopes (SEMs) =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM &amp;amp; EDS | Nova 200 NanoLab: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
===== Lithography =====&lt;br /&gt;
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]&lt;br /&gt;
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;br /&gt;
===== Transmission Electron Microscopes =====&lt;br /&gt;
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS &amp;amp; HAADF | Tecnai TF-30: TEM, STEM, EDS &amp;amp; HAADF (50-300 kV)]]&lt;br /&gt;
&amp;lt;!---&lt;br /&gt;
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM &amp;amp; Lithography (40-200 kV)]]&lt;br /&gt;
---&amp;gt;&lt;br /&gt;
&lt;br /&gt;
===== Scanning Probe Microscopes =====&lt;br /&gt;
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]&lt;br /&gt;
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3740</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3740"/>
		<updated>2025-11-17T18:42:10Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
===== Possible Target Materials &amp;amp; Deposition Methods =====&lt;br /&gt;
* Carbon — via evaporation&lt;br /&gt;
* Metal (e.g., Au, Pt, Cr, W) — via sputtering&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP &amp;amp; Troubleshooting Guide]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://www.manualslib.com/manual/1525180/Leica-Em-Ace600.html?page=43#manual Page 39 of the Operating Manual]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
	<entry>
		<id>https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3739</id>
		<title>Carbon Evaporator</title>
		<link rel="alternate" type="text/html" href="https://lab.kni.caltech.edu/index.php?title=Carbon_Evaporator&amp;diff=3739"/>
		<updated>2025-11-17T18:39:27Z</updated>

		<summary type="html">&lt;p&gt;Ykim3: &lt;/p&gt;
&lt;hr /&gt;
&lt;div&gt;{{InstrumentInfoboxOneImage|&lt;br /&gt;
|InstrumentName = Carbon Evaporator &amp;amp; Sputter Coater&lt;br /&gt;
|HeaderColor = #F2682A&lt;br /&gt;
|ImageOne = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg&lt;br /&gt;
|InstrumentType = [[Equipment_List#Deposition|Deposition]],&amp;lt;br&amp;gt;[[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]&lt;br /&gt;
|RoomLocation = B233 Steele&lt;br /&gt;
|LabPhone = 626-395-5885&lt;br /&gt;
|PrimaryStaff = [[Yonghwi Kim]]&lt;br /&gt;
|StaffEmail = ykim@caltech.edu&lt;br /&gt;
|StaffPhone = 626-395-5994&lt;br /&gt;
|Manufacturer = Leica&lt;br /&gt;
|Model = EM ACE600&lt;br /&gt;
|Techniques = Carbon Deposition and Gold Sputtering&lt;br /&gt;
|EmailList = kni-sem-fib&lt;br /&gt;
|EmailListName =  SEM-FIB&lt;br /&gt;
}}&lt;br /&gt;
== Description ==&lt;br /&gt;
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; plasma, for example, with the lab&#039;s[[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.&lt;br /&gt;
&lt;br /&gt;
===== Applications =====&lt;br /&gt;
* Coat a material surface to make a sample conductive for SEM or FIB imaging.&lt;br /&gt;
* Coat resist surface to make a ample conductive for e-beam lithography.&lt;br /&gt;
* Apply carbon to a specimen or device for other fabrication purposes.&lt;br /&gt;
&lt;br /&gt;
== Resources ==&lt;br /&gt;
===== Equipment Data =====&lt;br /&gt;
&lt;br /&gt;
[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]&lt;br /&gt;
&lt;br /&gt;
===== SOP &amp;amp; Troubleshooting =====&lt;br /&gt;
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP &amp;amp; Troubleshooting Guide]&lt;br /&gt;
* The procedure to install a new carbon thread can be found on [https://www.manualslib.com/manual/1525180/Leica-Em-Ace600.html?page=43#manual Page 39 of the Operating Manual]&lt;br /&gt;
** Note: always install as a &amp;quot;double thread,&amp;quot; i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator&#039;s door width is long enough to double over and install.&lt;br /&gt;
&lt;br /&gt;
===== Video =====&lt;br /&gt;
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica&#039;s Product Overview Video]&lt;br /&gt;
&lt;br /&gt;
===== Technical Notes =====&lt;br /&gt;
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]&lt;br /&gt;
===== Manufacturer Manual =====&lt;br /&gt;
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]&lt;br /&gt;
&lt;br /&gt;
== Specifications ==&lt;br /&gt;
===== Manufacturer Specifications =====&lt;br /&gt;
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]&lt;br /&gt;
&lt;br /&gt;
===== Carbon Evaporation Specifications =====&lt;br /&gt;
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)&lt;br /&gt;
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
&amp;lt;br&amp;gt;&lt;br /&gt;
== Related Instrumentation in the KNI ==&lt;br /&gt;
===== Sample Preparation for Microscopy =====&lt;br /&gt;
* [[Tergeo Plus ICP- &amp;amp; CCP-RIE: Oxygen &amp;amp; Argon Plasma Cleaner | Oxygen &amp;amp; Argon Plasma Cleaner (Tergeo Plus ICP- &amp;amp; CCP-RIE) to remove hydrocarbons from surface]]&lt;br /&gt;
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]&lt;br /&gt;
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]&lt;br /&gt;
===== Scanning Electron &amp;amp; Ion Microscopes =====&lt;br /&gt;
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS &amp;amp; Omniprobe]]&lt;br /&gt;
* [[Nova 200 NanoLab: SEM, EDS &amp;amp; WDS | Nova 200 NanoLab: SEM, EDS &amp;amp; WDS]]&lt;br /&gt;
* [[Sirion: SEM &amp;amp; EDS | Sirion: SEM &amp;amp; EDS]]&lt;br /&gt;
* [[Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station | Quanta 200F: SEM, ESEM, Lithography &amp;amp; Probe Station]]&lt;br /&gt;
* [[ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB | ORION NanoFab: Helium, Neon &amp;amp; Gallium FIB]]&lt;/div&gt;</summary>
		<author><name>Ykim3</name></author>
	</entry>
</feed>