The KNI Lab at Caltech - User contributions [en]

Wafer Stepper

2026-04-14T18:43:32Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Stepper
|HeaderColor = #FFFFFF
|ImageOne = I-Line-Wafer-Stepper GCA-6300.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-3423
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = GCA
|Model = 6300
|Techniques = Wafer Patterning, Pattern Alignments
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2-, 3-, 4-, 6-, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain +/-0.1 °C temperature control.

Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X- & Y-coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X- & Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.
===== Applications =====
* Step exposure with alignments
* Step exposure without alignments

== Resources ==
=== Specifications ===
* Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
* System is setup for 4 inch wafers and pieces smaller than 100mm.

=== FBS Reservation Rules:===
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== SOPs ===
* [https://caltech.box.com/s/z6q0ovarnkwe1sec645uq8kti44r4jwc GCA 6300 Operation Quick Guide Reference]
* [https://caltech.box.com/s/o634f2xum216ah4lrmxy67nurxbt5iqg GCA 6300 Operation SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
Manufacturer Manuals
* [https://caltech.box.com/s/tq6pr3f9yldpfnr30kcx0jhre85541nz System Operation Manual]
* [https://caltech.box.com/s/87i1mym5d2nxluk4zim4wemf5zbhsm5w Advanced Operation & Utilization Manual]
* [https://caltech.box.com/s/1fzh7r5ceopxyamnss0i3gen7nashnnt Advanced Information Package]
* [https://caltech.box.com/s/h7jdk8uxhfygcuhx0e0a3jsrlp0q4ztq Reticle Handbook]
* [https://caltech.box.com/s/m6wb60586w93z2ys8emz8nhg8e0yxtv3 Baseline Procedure]
* [https://caltech.box.com/s/kqn62mmqrslz8x8bm2t7qqybjqulrosu Acceptance Test Procedures]

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]

== Related Instrumentation in the KNI ==
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Wafer Stepper

2026-04-14T18:43:06Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Stepper
|HeaderColor = #FFFFFF
|ImageOne = I-Line-Wafer-Stepper GCA-6300.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-3423
|PrimaryStaff = [[Guy DeRose]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = GCA
|Model = 6300
|Techniques = Wafer Patterning, Pattern Alignments
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2-, 3-, 4-, 6-, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain +/-0.1 °C temperature control.

Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X- & Y-coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X- & Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.
===== Applications =====
* Step exposure with alignments
* Step exposure without alignments

== Resources ==
=== Specifications ===
* Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
* System is setup for 4 inch wafers and pieces smaller than 100mm.

=== FBS Reservation Rules:===
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== SOPs ===
* [https://caltech.box.com/s/z6q0ovarnkwe1sec645uq8kti44r4jwc GCA 6300 Operation Quick Guide Reference]
* [https://caltech.box.com/s/o634f2xum216ah4lrmxy67nurxbt5iqg GCA 6300 Operation SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
Manufacturer Manuals
* [https://caltech.box.com/s/tq6pr3f9yldpfnr30kcx0jhre85541nz System Operation Manual]
* [https://caltech.box.com/s/87i1mym5d2nxluk4zim4wemf5zbhsm5w Advanced Operation & Utilization Manual]
* [https://caltech.box.com/s/1fzh7r5ceopxyamnss0i3gen7nashnnt Advanced Information Package]
* [https://caltech.box.com/s/h7jdk8uxhfygcuhx0e0a3jsrlp0q4ztq Reticle Handbook]
* [https://caltech.box.com/s/m6wb60586w93z2ys8emz8nhg8e0yxtv3 Baseline Procedure]
* [https://caltech.box.com/s/kqn62mmqrslz8x8bm2t7qqybjqulrosu Acceptance Test Procedures]

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]

== Related Instrumentation in the KNI ==
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Wafer Bonder

2026-04-14T18:36:29Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Wafer Bonder
|HeaderColor = #E6E7E8
|ImageOne = Wafer-Bonder_Suss-SB6L.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Substrate_Processing|Substrate Processing]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-4075
|PrimaryStaff = [[Nathan S. Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-4386
|Manufacturer = Suss Microtec
|Model = SBL6
|Techniques = Pressure/Heat Bonding
|RequestTraining = nathslee@caltech.edu
|EmailList = kni-sb6l
|EmailListName = Wafer Bonder
}}
== Description ==
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
===== Applications =====
* MEMS & Microelectronics Fabrication

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SB6L SOP] - Operating Instructions for the Suss SB6L Wafer Bonder

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/je95chbsbq3u14f3jchch4l79itshtb5 SB6L User Manual] - The SUSS SB6L Wafer Bonder System User Manual
* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.

Wafer Bonder

2026-04-14T18:36:00Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Wafer Bonder
|HeaderColor = #E6E7E8
|ImageOne = Wafer-Bonder_Suss-SB6L.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Substrate_Processing|Substrate Processing]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-4075
|PrimaryStaff = [[Nathan Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-4386
|Manufacturer = Suss Microtec
|Model = SBL6
|Techniques = Pressure/Heat Bonding
|RequestTraining = nathslee@caltech.edu
|EmailList = kni-sb6l
|EmailListName = Wafer Bonder
}}
== Description ==
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
===== Applications =====
* MEMS & Microelectronics Fabrication

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SB6L SOP] - Operating Instructions for the Suss SB6L Wafer Bonder

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/je95chbsbq3u14f3jchch4l79itshtb5 SB6L User Manual] - The SUSS SB6L Wafer Bonder System User Manual
* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.

New Members

2026-04-02T20:20:11Z

Tkimoto: /* Step 1: Submit Your KNI New User Form */

==Joining the KNI Lab==
The KNI Laboratory (KNI Lab) is an open-access facility for Caltech and JPL students and researchers, as well as external academic, government and industry users. Equipment and resource use is billed on a per hour basis. Customers are invoiced monthly for their use. You can find information on our [[Usage_Rates | usage rates here]].

If you have general process questions or technical questions about KNI Lab resources, please email Associate Director of Technical Operations [mailto:derose@caltech.edu Dr. Guy DeRose]. Provide as much detail as possible to ensure an efficient and timely response.

Note: There are additional requirements for external users to join the KNI Lab (see below). Please allow more time for processing.

==Step 1: Submit Your KNI New User Form==
Internal researchers, fill out this online form:
* [https://airtable.com/app2vjzgp8AJpuC3A/pagHxiNohQX8G65DZ/form Caltech / JPL Users]
External researchers, fill out the appropriate form below and email it to [mailto:kni@caltech.edu kni@caltech.edu]. Review the sections below for additional requirements.
* [https://caltech.box.com/s/26w5srmths37kybjaismwwyc70y1qeiz Non-Caltech Academic or Government Users]
* [https://caltech.box.com/s/qkoz644x7f77grfgg9fi3wbc0v7j0ogn Industry / Corporate Users]

==Step 2: Submit Your Process Description Form (if needed)==
After you have submitted your new user form, you may contact [mailto:derose@caltech.edu Guy DeRose] for general process questions. Attach the
[https://caltech.box.com/s/kxkb44hdjhkw8rbj3pl9v6lh29h6b166 KNI Lab New Process Description form] to your email inquiry.

==Step 3: Safety Training==
All new lab users are required to attend the KNI-specific lab safety training, as well as Caltech's Laboratory Safety Orientation which is managed by Caltech's Environmental Health and Safety (EHS) department.

After submitting your new user form, you will receive an email from a KNI staff member with all necessary information to prepare for the KNI-specific safety training session. These sessions are held weekly, every Friday at 1 pm via Zoom.

Caltech's EHS Laboratory Safety Orientation is required if you are using any lab on campus. The training is offered by EHS via Zoom twice a month. If you have not taken EHS Lab Safety Orientation, instructions to register for this training can be found here: [https://www.safety.caltech.edu/root-pages/lab-safety-orientation Caltech's EHS Lab Safety Orientation]

''Note: You may start and complete KNI safety training before completing the EHS safety training. However, you must complete EHS Laboratory Safety Orientation in order to complete your onboarding and gain access to the KNI Lab.''

==Step 4: Setting Up Your Lab User Accounts & Access==
After you complete the mandatory KNI Lab new user safety training, you will receive an email from KNI Administrator Sydney Garstang with further instructions on setting up your KNI Lab user accounts. You will need to coordinate a time to stop by her office and have your ID card scanned so that it is registered in our lab management system. This will allow you to swipe into the KNI Lab's entrance as well as login to the Lab's [https://mh-fbs1.caltech.edu/ tool reservation system (FBS)].

All KNI Lab users are required to join the KNI Lab Slack workspace for timely and important lab updates, as well as FBS, the KNI Lab's user and tool management software system. Be sure to complete your FBS User account activation when you receive the FBS Welcome Email. If you have any trouble logging into our FBS Facility page ("Kavli Nanoscience Institute (KNI"), email kni@caltech.edu.

Read the [https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] for instructions on how to request training, schedule & change tool reservations, setting up your User account, notifications, and billing details.

All KNI Lab users are also signed up to the kni-notice email list.

==Step 5: Tool-Specific Training==
Requests for specific equipment training must be submitted through the [https://mh-fbs1.caltech.edu/ User Activity Dashboard] in FBS. From the User Dashboard, scroll down to find the name of the tool you need to use, click the "Request Training" link, then provide any useful information about why you need training on the specific tool -- also be sure to include your availability for the next two weeks.

After you submit your initial training request, the KNI technical staff member in charge of the tool will receive a notification and will contact you to schedule your first training session. Once a day/time has been agreed upon, you make go directly to the FBS Calendar (scheduler) and initiate an "Assisted Use" reservation. The staff member will receive an email notification and approve the reservation.

To schedule additional (second, third, etc.) training sessions, follow the same procedure: first submit the request from the FBS User Dashboard tool list, and after a day/time is set with the staff member, go to the FBS Calendar to initiate an "Assisted Use" reservation for the agreed-upon day/time.

Refer to our [https://lab.kni.caltech.edu/Equipment_List Equipment List] page for details on all of the resources in the KNI Lab.

''Note: Users are only charged for equipment use time during training sessions. There is no additional fee (i.e. staff time) for training sessions.''

==External Users==
Non-Caltech Academic, Government, and For-profit/Commercial researchers are considered external users.

Additional documents are required to set up an external user's KNI Lab access. Refer to the [https://caltech.box.com/s/urw7mwljz8jxv2d3s036h6kwx2mb8se8 External Lab User Membership Checklist] to ensure timely processing. All documentation must be completed and approved before KNI Lab access is granted.

If you are interested in joining the KNI Lab as an external user, '''please fill out the online [https://airtable.com/app2vjzgp8AJpuC3A/pagHxiNohQX8G65DZ/form New User Form]'''. Have a purchase order and your CV ready to upload.

'''Note''': all external users are required to hold a formal appointment at Caltech. If you do not have one (e.g. Visitor, External Affiliate, VURP, etc.), KNI will arrange an External Affiliate appointment for you. The appointment process is handled by Caltech HR and goes through reviews by Caltech offices, including Research Security and Compliance. Please be aware that the appointment setup and review process may take a few weeks.

If you have any questions, please contact kni@caltech.edu.

==KNI Member Offboarding==
Users who no longer need to use the KNI Lab must send a notification email to [mailto:kni@caltech.edu kni@caltech.edu] and complete the offboarding process before their last day. Please review the [https://caltech.box.com/s/qapv4ytu4uhyszz538rz4k55mvdihyix KNI Member Offboarding SOP]. The SOP lists items such as Stored Items, Chemicals, Stored Data/Files, etc, which should to be addressed before your membership ends.

Usage Rates

2026-04-02T20:19:45Z

Tkimoto: /* Caltech & JPL User Rates */

'''Overview of KNI Lab User Fees''' 
''Rates below are valid beginning October 1, 2025 and are subject to change''

* Fees are incurred on a pay-as-you-go basis (tools are charged by the hour or portion thereof).
* Lab users do '''NOT''' incur lab fees during days or months of non-use.
*Invoices are issued monthly.

'''Note: New users must submit a [[Membership_Forms | New User Form]] and attend general KNI Lab safety training before lab access is granted.'''

==Caltech & JPL User Rates==
Below is a table of ''direct'' hourly rates for lab and equipment use in the KNI Laboratory. Hourly rates are applied to an individual's actual usage in the KNI Lab. Rates do '''not''' include any applicable indirect charges, such as F&A fees. F&A (overhead) will be applied separately based on the customer's PTA type. Rates are valid beginning October 1, 2025 and are subject to change.

{| class="wikitable" style="width: 90%;"
|-
! scope="col" style="text-align:left; width: 40%" |Tool Name
! scope="col" style="text-align:left; width: 40%" |Resource Area
! scope="col" style="text-align:center; width: 20%" |Hourly Rate
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |General Lab
! scope="col" style="text-align:left; background-color:#ffe7d1;" |See details below
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$43/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Raith EBPG 5000+ and 5200 Electron Beam Writers
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Electron Beam Lithography (EBL)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$130/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |FEI Nova 600 Dualbeam Focused Ion Beam
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$75/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Cobra III-V ALE Etch System (available soon)
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD "2" - oxides and nitrides
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford FlexAl ALD/ALE System
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$50/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford III-V Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Dielectric Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford DRIE Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD (legacy) - amorphous Si
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Nanoscribe PPGT
! scope="col" style="text-align:left; background-color:#ffe7d1;" | 2D/3D Print
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$5/hr
|}

'''Academic Discount on General Cleanroom Usage'''

A 50% discount will be applied to the General Cleanroom rate for any cleanroom usage accrued ''after'' 40 hours per calendar month. The discounted hourly rate, $21.50, is only applied to the hours that exceed 40 in a given month.

Example: A user logs 50 hours in the cleanroom during the month of October. Their invoice will be: (40 x $43) + (10 x $21.50) = $1,935

'''General Lab use is counted as time spent in the KNI cleanroom facility. It includes access to the following resources:'''
*Atomic Force Microscope
*Critical Point Dryer
*Electron Beam Evaporators
*Laser Interference Lithography System
*He-Ne-Ga Ion Microscope (Orion Nanofab)
*Mask Aligners
*Parylene Coater
*Profilometer
*Rapid Thermal Processor
*Scanning Electron Microscopes (Quanta, Sirion)
*Scriber Breaker
*Spectroscopic Ellipsometer
*Tube Furnaces (Wet, Dry Oxide + Annealing)
*Wafer Stepper
*Wet Chemistry Room
*Wire Bonder
*XeF2 Silicon Etcher
*Other tools not listed in the table above
*Cleanroom PPE, basic supplies

'''Miscellaneous Rates'''
* Precious Metal (gold, platinum, etc.) usage will be billed the market rate, per gram/A.
* Staff-approved full service work is $100/hr.

==Full-Service Work Requests ==
KNI lab members and non-lab members can submit a request for full-service work performed by KNI technical staff using KNI equipment. The project will incur costs based on the actual usage of equipment (refer to rates above), as well as charges for the following:
{| class="wikitable"
|Fees
|Price
|-
|Technical Staff Effort (hourly)
|$ 100.00
|-
|Equipment Hourly Use Fees (see pricing list above)
|$ varies
|-
|Administrative Fee (per transaction)
|$ 100.00
|}
'''To submit a request for full-service work''', contact the technical staff member in charge of the equipment you are interested in using, or send an email to [mailto:kni@caltech.edu kni@caltech.edu]. Requests will be reviewed and selected based on staff availability, agreement of scope, and turnaround timeline. A PTA must be provided in advance in order for work to begin. KNI offers no guarantees for the end product.

'''Note:''' The rates above are the direct costs. Overhead fees will be applied.

==Overhead/Indirect Cost Rate ==
The KNI Lab charges for Non-Caltech Academic, Government, and Corporate KNI lab members are subject to Caltech's F&A (indirect/"overhead") rate. The F&A rate for fiscal year 2026 is 70%.
Internal (Caltech and JPL) users will also have overhead applied to their charges. The overhead is accounted for in the back end of the internal charging process and the overhead rate is dependent on the PTA used to pay for the KNI Lab fees. If you have questions about this, please discuss with your grants manager.

==External/Corporate Memberships==

The KNI Lab is open to external academic, government, industry, and startup organizations. Rates for industry and startups differ from the posted rates (above) for our internal academic users. All external users will be billed for Caltech's fiscal year overhead rate.

For information on the KNI external lab membership plan, please send an email to [mailto:tkimoto@caltech.edu tkimoto@caltech.edu] with details regarding 1) the number of people looking to join as KNI lab members, 2) equipment needs, 3) anticipated start date, and 4) information about the company. Startup companies may qualify for limited-term reduced rates.

'''Additional paperwork is required, including a Facilities Use Agreement, certificate of liability insurance that meets Caltech requirements, a purchase order, and an External Affiliate appointment.''' This process can take up to a few weeks, and all steps must be completed before an external user is able to start in the KNI Lab.

Usage Rates

2026-04-02T20:18:18Z

Tkimoto: /* Caltech & JPL User Rates */

'''Overview of KNI Lab User Fees''' 
''Rates below are valid beginning October 1, 2025 and are subject to change''

* Fees are incurred on a pay-as-you-go basis (tools are charged by the hour or portion thereof).
* Lab users do '''NOT''' incur lab fees during days or months of non-use.
*Invoices are issued monthly.

'''Note: New users must submit a [[Membership_Forms | New User Form]] and attend general KNI Lab safety training before lab access is granted.'''

==Caltech & JPL User Rates==
Below is a table of ''direct'' hourly rates for lab and equipment use in the KNI Laboratory. Hourly rates are applied to an individual's actual usage in the KNI Lab. Rates do '''not''' include any applicable indirect charges, such as F&A fees. F&A (overhead) will be applied separately based on the customer's PTA type. Rates are valid beginning October 1, 2025 and are subject to change.

{| class="wikitable" style="width: 90%;"
|-
! scope="col" style="text-align:left; width: 40%" |Tool Name
! scope="col" style="text-align:left; width: 40%" |Resource Area
! scope="col" style="text-align:center; width: 20%" |Hourly Rate
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |General Lab
! scope="col" style="text-align:left; background-color:#ffe7d1;" |See details below
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$43/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Raith EBPG 5000+ and 5200 Electron Beam Writers
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Electron Beam Lithography (EBL)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$130/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |FEI Nova 600 Dualbeam Focused Ion Beam
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$75/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Cobra III-V ALE Etch System (available soon)
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD "2" System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford FlexAl ALD/ALE System
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$50/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford III-V Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Dielectric Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford DRIE Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Etch, RIE
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD System (legacy)
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Nanoscribe PPGT
! scope="col" style="text-align:left; background-color:#ffe7d1;" | 2D/3D Print
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$5/hr
|}

'''Academic Discount on General Cleanroom Usage'''

A 50% discount will be applied to the General Cleanroom rate for any cleanroom usage accrued ''after'' 40 hours per calendar month. The discounted hourly rate, $21.50, is only applied to the hours that exceed 40 in a given month.

Example: A user logs 50 hours in the cleanroom during the month of October. Their invoice will be: (40 x $43) + (10 x $21.50) = $1,935

'''General Lab use is counted as time spent in the KNI cleanroom facility. It includes access to the following resources:'''
*Atomic Force Microscope
*Critical Point Dryer
*Electron Beam Evaporators
*Laser Interference Lithography System
*He-Ne-Ga Ion Microscope (Orion Nanofab)
*Mask Aligners
*Parylene Coater
*Profilometer
*Rapid Thermal Processor
*Scanning Electron Microscopes (Quanta, Sirion)
*Scriber Breaker
*Spectroscopic Ellipsometer
*Tube Furnaces (Wet, Dry Oxide + Annealing)
*Wafer Stepper
*Wet Chemistry Room
*Wire Bonder
*XeF2 Silicon Etcher
*Other tools not listed in the table above
*Cleanroom PPE, basic supplies

'''Miscellaneous Rates'''
* Precious Metal (gold, platinum, etc.) usage will be billed the market rate, per gram/A.
* Staff-approved full service work is $100/hr.

==Full-Service Work Requests ==
KNI lab members and non-lab members can submit a request for full-service work performed by KNI technical staff using KNI equipment. The project will incur costs based on the actual usage of equipment (refer to rates above), as well as charges for the following:
{| class="wikitable"
|Fees
|Price
|-
|Technical Staff Effort (hourly)
|$ 100.00
|-
|Equipment Hourly Use Fees (see pricing list above)
|$ varies
|-
|Administrative Fee (per transaction)
|$ 100.00
|}
'''To submit a request for full-service work''', contact the technical staff member in charge of the equipment you are interested in using, or send an email to [mailto:kni@caltech.edu kni@caltech.edu]. Requests will be reviewed and selected based on staff availability, agreement of scope, and turnaround timeline. A PTA must be provided in advance in order for work to begin. KNI offers no guarantees for the end product.

'''Note:''' The rates above are the direct costs. Overhead fees will be applied.

==Overhead/Indirect Cost Rate ==
The KNI Lab charges for Non-Caltech Academic, Government, and Corporate KNI lab members are subject to Caltech's F&A (indirect/"overhead") rate. The F&A rate for fiscal year 2026 is 70%.
Internal (Caltech and JPL) users will also have overhead applied to their charges. The overhead is accounted for in the back end of the internal charging process and the overhead rate is dependent on the PTA used to pay for the KNI Lab fees. If you have questions about this, please discuss with your grants manager.

==External/Corporate Memberships==

The KNI Lab is open to external academic, government, industry, and startup organizations. Rates for industry and startups differ from the posted rates (above) for our internal academic users. All external users will be billed for Caltech's fiscal year overhead rate.

For information on the KNI external lab membership plan, please send an email to [mailto:tkimoto@caltech.edu tkimoto@caltech.edu] with details regarding 1) the number of people looking to join as KNI lab members, 2) equipment needs, 3) anticipated start date, and 4) information about the company. Startup companies may qualify for limited-term reduced rates.

'''Additional paperwork is required, including a Facilities Use Agreement, certificate of liability insurance that meets Caltech requirements, a purchase order, and an External Affiliate appointment.''' This process can take up to a few weeks, and all steps must be completed before an external user is able to start in the KNI Lab.

FBS Instructions

2026-03-25T17:00:52Z

Tkimoto: /* Resources */

== Priority Software® FBS ==

;FBS is a facility management software used for:

:Monitoring Cleanroom Use:
::Members must scan their badge '''EACH''' time when entering or exiting the Cleanroom.
::For Safety and Documenting Cleanroom use.
::''Used for administrative accounting.''

:Monitoring Wet Chemistry Room Use:
::Members must scan their badge '''EACH''' time entering or exiting the Wet Chem Room.
::For Safety and Documenting Wet Chem Room use.
::''No additional charge for using the room.''

:Scheduling Equipment Reservations:
::Members '''qualified''' to run the equipment may schedule an '''unassisted''' run.
::Members qualified to run the tool but would like an '''assisted''' run must put in a '''training request''' before making the '''assisted''' reservation. ''Assisted reservations require the tool manager to be present.''
::'''Non Qualified''' members must request '''Training''' before making any reservations.
::''Used for administrative accounting.''

:Documenting Equipment Use:
::Members must START the reservation or Walk-Up before using the equipment.
::Members must STOP the RUN when finished using the equipment.
::''Used for administrative accounting.''

:Requesting Equipment Training to document all training events:
::Members wanting to be trained must put in a '''training request''' before making any reservations.
::After putting in a training request, the tool manager will confirm a Date and Time before the Training Reservation.
::''Used for administrative accounting.''

===User Web Portal===
FBS allows KNI members to schedule and reserve equipment inside the lab and remotely with a web interface. Users are required to STOP the timer to the tool in order to end their event. Users can STOP and START the timer via the FBS kiosk, desktop, or smartphone web browser.

====[https://mh-fbs1.caltech.edu/Anon/Logon.aspx?ReturnUrl=%2fApps%2fFBS%2f%3ff%3d613&f=613 FBS Reservations] - Click on the link to login to FBS and schedule tool reservations.====
::'''For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. '''
::''Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''
*Check the Wiki tool page for the rules for each tool or [https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b General Reservation Policy].

*If Qualified on the equipment:
#Log into FBS to make an '''unassisted''' reservation.
#If you have been trained and qualified by the tool manager but are unable to make an '''unassisted''' reservation, email the tool manager to request that your access to be enabled.
#If Qualified on the equipment and you would like to make an '''assisted''' reservation, member must first put in a '''training request''' from the User Dashboard. The tool manager will discuss your request and confirm a time and date before you are asked to schedule an '''assisted''' run. Assisted runs require the tool manager to be present when scheduled. If a training request is not made prior to scheduling, the manager may not be notified of the scheduled event.
*If you are '''NOT''' Qualified on the equipment:
#Request training via your User Dashboard.
#Describe the process you want to use on the tool.
#Give your schedule or available times throughout the week.
''The staff manager will schedule a time based on their availability, your availability, and the tool's availability.''

*If unable to login or forgotten password, contact KNI administrator - [mailto:sydney@caltech.edu Sydney Garstang]

====[https://mh-fbs1.caltech.edu/Anon/LiveUsage.aspx?f=613 FBS Live Usage]====
*Live Usage displays members that have scanned into the cleanroom. It also displays systems that are running and who is logged into the tool.

===FBS Kiosks and Door Scanners===
FBS accurately documents lab and tool use time for administration accounting.
* '''Always''' scan into FBS when entering the lab B207.
** If your name does not appear on the FBS door monitor, notify a KNI staff member.
* '''Always''' scan out of FBS when exiting the lab B207. Listen to the door monitor to verify you have logged out of the tools properly.
** If you forgot to STOP your session, contact the tool manager to update the system records so the billing records can be updated. Email the tool manager and include the Date, Start, and Stop time for the tool used.
* START your session from a kiosk or computer before using the tool.
**This will unlock the system for your session and start the billing record. If the system does not unlock after logging into FBS, follow the instruction in the "FBS Troubleshooting Instructions" listed in the Resources section below.
* STOP your session when you are finished.
**This will end your session and lock the system. Your session will be billed for the total time used on the system.
*'''Always''' scan into FBS before entering the Wet Chemistry Room inside the cleanroom.
** If your name does not appear on the Wet Chemical Room door monitor, notify a KNI staff member. It is okay to use the Wet Chemistry Room if your name does not appear on the monitor.
*'''Always''' scan out of FBS when leaving the Wet Chemistry Room.

== Resources ==

===[https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b General Reservation Policy]===
::This is the General Reservation Policy. Check the tool Wiki page for any special reservation rules associated with that piece of equipment.

===[https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] Standard Operation Procedure for Priority Software® FBS===

FBS Instructions

2026-03-25T16:59:50Z

Tkimoto: /* User Web Portal */

== Priority Software® FBS ==

;FBS is a facility management software used for:

:Monitoring Cleanroom Use:
::Members must scan their badge '''EACH''' time when entering or exiting the Cleanroom.
::For Safety and Documenting Cleanroom use.
::''Used for administrative accounting.''

:Monitoring Wet Chemistry Room Use:
::Members must scan their badge '''EACH''' time entering or exiting the Wet Chem Room.
::For Safety and Documenting Wet Chem Room use.
::''No additional charge for using the room.''

:Scheduling Equipment Reservations:
::Members '''qualified''' to run the equipment may schedule an '''unassisted''' run.
::Members qualified to run the tool but would like an '''assisted''' run must put in a '''training request''' before making the '''assisted''' reservation. ''Assisted reservations require the tool manager to be present.''
::'''Non Qualified''' members must request '''Training''' before making any reservations.
::''Used for administrative accounting.''

:Documenting Equipment Use:
::Members must START the reservation or Walk-Up before using the equipment.
::Members must STOP the RUN when finished using the equipment.
::''Used for administrative accounting.''

:Requesting Equipment Training to document all training events:
::Members wanting to be trained must put in a '''training request''' before making any reservations.
::After putting in a training request, the tool manager will confirm a Date and Time before the Training Reservation.
::''Used for administrative accounting.''

===User Web Portal===
FBS allows KNI members to schedule and reserve equipment inside the lab and remotely with a web interface. Users are required to STOP the timer to the tool in order to end their event. Users can STOP and START the timer via the FBS kiosk, desktop, or smartphone web browser.

====[https://mh-fbs1.caltech.edu/Anon/Logon.aspx?ReturnUrl=%2fApps%2fFBS%2f%3ff%3d613&f=613 FBS Reservations] - Click on the link to login to FBS and schedule tool reservations.====
::'''For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. '''
::''Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''
*Check the Wiki tool page for the rules for each tool or [https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b General Reservation Policy].

*If Qualified on the equipment:
#Log into FBS to make an '''unassisted''' reservation.
#If you have been trained and qualified by the tool manager but are unable to make an '''unassisted''' reservation, email the tool manager to request that your access to be enabled.
#If Qualified on the equipment and you would like to make an '''assisted''' reservation, member must first put in a '''training request''' from the User Dashboard. The tool manager will discuss your request and confirm a time and date before you are asked to schedule an '''assisted''' run. Assisted runs require the tool manager to be present when scheduled. If a training request is not made prior to scheduling, the manager may not be notified of the scheduled event.
*If you are '''NOT''' Qualified on the equipment:
#Request training via your User Dashboard.
#Describe the process you want to use on the tool.
#Give your schedule or available times throughout the week.
''The staff manager will schedule a time based on their availability, your availability, and the tool's availability.''

*If unable to login or forgotten password, contact KNI administrator - [mailto:sydney@caltech.edu Sydney Garstang]

====[https://mh-fbs1.caltech.edu/Anon/LiveUsage.aspx?f=613 FBS Live Usage]====
*Live Usage displays members that have scanned into the cleanroom. It also displays systems that are running and who is logged into the tool.

===FBS Kiosks and Door Scanners===
FBS accurately documents lab and tool use time for administration accounting.
* '''Always''' scan into FBS when entering the lab B207.
** If your name does not appear on the FBS door monitor, notify a KNI staff member.
* '''Always''' scan out of FBS when exiting the lab B207. Listen to the door monitor to verify you have logged out of the tools properly.
** If you forgot to STOP your session, contact the tool manager to update the system records so the billing records can be updated. Email the tool manager and include the Date, Start, and Stop time for the tool used.
* START your session from a kiosk or computer before using the tool.
**This will unlock the system for your session and start the billing record. If the system does not unlock after logging into FBS, follow the instruction in the "FBS Troubleshooting Instructions" listed in the Resources section below.
* STOP your session when you are finished.
**This will end your session and lock the system. Your session will be billed for the total time used on the system.
*'''Always''' scan into FBS before entering the Wet Chemistry Room inside the cleanroom.
** If your name does not appear on the Wet Chemical Room door monitor, notify a KNI staff member. It is okay to use the Wet Chemistry Room if your name does not appear on the monitor.
*'''Always''' scan out of FBS when leaving the Wet Chemistry Room.

== Resources ==

===[https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b General Reservation Policy]===
::This is the General Reservation Policy. Check the tool Wiki page for any special reservation rules associated with that piece of equipment.::

===[https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] Standard Operation Procedure for Priority Software® FBS===

FBS Instructions

2026-03-25T16:56:03Z

Tkimoto: /* User Web Portal */

== Priority Software® FBS ==

;FBS is a facility management software used for:

:Monitoring Cleanroom Use:
::Members must scan their badge '''EACH''' time when entering or exiting the Cleanroom.
::For Safety and Documenting Cleanroom use.
::''Used for administrative accounting.''

:Monitoring Wet Chemistry Room Use:
::Members must scan their badge '''EACH''' time entering or exiting the Wet Chem Room.
::For Safety and Documenting Wet Chem Room use.
::''No additional charge for using the room.''

:Scheduling Equipment Reservations:
::Members '''qualified''' to run the equipment may schedule an '''unassisted''' run.
::Members qualified to run the tool but would like an '''assisted''' run must put in a '''training request''' before making the '''assisted''' reservation. ''Assisted reservations require the tool manager to be present.''
::'''Non Qualified''' members must request '''Training''' before making any reservations.
::''Used for administrative accounting.''

:Documenting Equipment Use:
::Members must START the reservation or Walk-Up before using the equipment.
::Members must STOP the RUN when finished using the equipment.
::''Used for administrative accounting.''

:Requesting Equipment Training to document all training events:
::Members wanting to be trained must put in a '''training request''' before making any reservations.
::After putting in a training request, the tool manager will confirm a Date and Time before the Training Reservation.
::''Used for administrative accounting.''

===User Web Portal===
FBS allows KNI members to schedule and reserve equipment inside the lab and remotely with a web interface. Users are required to STOP the timer to the tool in order to end their event. Users can STOP and START the timer via the FBS kiosk or a desktop or smartphone web browser.

====[https://mh-fbs1.caltech.edu/Anon/Logon.aspx?ReturnUrl=%2fApps%2fFBS%2f%3ff%3d613&f=613 FBS Reservations] - Click on the link to login to FBS and schedule tool reservations.====
::'''For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. '''
::''Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''
*Check the Wiki tool page for the rules for each tool or [https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b General Reservation Policy].

*If Qualified on the equipment:
#Log into FBS to make an '''unassisted''' reservation.
#If you have been trained and qualified by the tool manager but are unable to make an '''unassisted''' reservation, email the tool manager to request your access to be enabled.
#If Qualified on the equipment and you would like to make an '''assisted''' reservation, member must first put in a '''training request''' from the User Dashboard. The tool manager will discuss your request and confirm a time and date before you are asked to schedule an '''assisted''' run. Assisted runs require the tool manager to be present when scheduled. If a training request is not made prior to scheduling, the manager may not be notified of the scheduled event.
*If you are '''NOT''' Qualified on the equipment:
#Request training via the User Dashboard.
#Describe the process you want to use on the tool.
#Give your schedule or available times throughout the week.
''The staff manager will need to schedule their availability, your availability and the tools availability when scheduling.''

*If unable to login or forgotten password, contact KNI administrator - [mailto:sydney@caltech.edu Sydney Garstang]

====[https://mh-fbs1.caltech.edu/Anon/LiveUsage.aspx?f=613 FBS Live Usage]====
*Live Usage displays members that have scanned into the cleanroom and wet chemistry room. It also displays systems that are running and who is logged into the tool. ''Often used to locate members and where they may be working inside the cleanroom.''

===FBS Kiosks and Door Scanners===
FBS accurately documents lab and tool use time for administration accounting.
* Always scan into FBS when entering the lab B207.
** If your name does not appear on the FBS door monitor, notify a KNI staff member.
* Always scan out of FBS when exiting the lab B207. Listen to the door monitor to verify you have logged out of the tools properly.
** If you forgot to STOP your session or forgot to START/STOP your session, contact the tool manager to update the system records so the billing records can be updated. Email the tool manager and include the Date, Start, and Stop time for the tool used.
* START your session before using the tool.
**This will unlock the system for your session and start the billing record. If the system does not unlock after logging into FBS, follow the instruction in the "FBS Troubleshooting Instructions" listed in the Resources section below.
* STOP your session when you are finished.
**This will end your session and lock the system. Your session will be billed for the total time used on the system.
*Always scan into FBS before entering the Wet Chemistry Room inside the cleanroom.
** If your name does not appear on the Wet Chemical Room door monitor, notify a KNI staff member. It is okay to use the Wet Chemistry Room if your name does not appear on the monitor.
*Always scan out of FBS when leaving the Wet Chemistry Room.

== Resources ==

===[https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b General Reservation Policy]===
::This is the General Reservation Policy. Check the tool Wiki page for any special reservation rules associated with that piece of equipment.::

===[https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] Standard Operation Procedure for Priority Software® FBS===

Usage Rates

2026-03-20T20:48:25Z

Tkimoto: /* Caltech & JPL User Rates */

'''Overview of KNI Lab User Fees''' 
''Rates below are valid beginning October 1, 2025 and are subject to change''

* Fees are incurred on a pay-as-you-go basis (tools are charged by the hour or portion thereof).
* Lab users do '''NOT''' incur lab fees during days or months of non-use.
*Invoices are issued monthly.

'''Note: New users must submit a [[Membership_Forms | New User Form]] and attend general KNI Lab safety training before lab access is granted.'''

==Caltech & JPL User Rates==
Below is a table of ''direct'' hourly rates for lab and equipment use in the KNI Laboratory. Hourly rates are applied to an individual's actual usage in the KNI Lab. Rates do '''not''' include any applicable indirect charges, such as F&A fees. F&A (overhead) will be applied separately based on the customer's PTA type. Rates are valid beginning October 1, 2025 and are subject to change.

{| class="wikitable" style="width: 90%;"
|-
! scope="col" style="text-align:left; width: 40%" |Tool Name
! scope="col" style="text-align:left; width: 40%" |Resource Area
! scope="col" style="text-align:center; width: 20%" |Hourly Rate
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |General Lab
! scope="col" style="text-align:left; background-color:#ffe7d1;" |See details below
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$43/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Raith EBPG 5000+ and 5200 Electron Beam Writers
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Electron Beam Lithography (EBL)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$130/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |FEI Nova 600 Dualbeam Focused Ion Beam
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$75/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Cobra III-V ALE Etch System (available soon)
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD "2" System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford FlexAl ALD/ALE System
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$50/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford III-V Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Dielectric Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford DRIE Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD System (legacy)
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Nanoscribe PPGT
! scope="col" style="text-align:left; background-color:#ffe7d1;" | 2D/3D Print
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$5/hr
|}

'''Academic Discount on General Cleanroom Usage'''

A 50% discount will be applied to the General Cleanroom rate for any cleanroom usage accrued ''after'' 40 hours per calendar month. The discounted hourly rate, $21.50, is only applied to the hours that exceed 40 in a given month.

Example: A user logs 50 hours in the cleanroom during the month of October. Their invoice will be: (40 x $43) + (10 x $21.50) = $1,935

'''General Lab use is counted as time in the KNI cleanroom facility. It includes access to:'''
*Atomic Force Microscope
*Critical Point Dryer
*Electron Beam Evaporators
*Laser Interference Lithography System
*He-Ne-Ga Ion Microscope (Orion Nanofab)
*Mask Aligners
*Parylene Coater
*Profilometer
*Rapid Thermal Processor
*Scanning Electron Microscopes (Quanta, Sirion)
*Scriber Breaker
*Spectroscopic Ellipsometer
*Tube Furnaces (Wet, Dry Oxide + Annealing)
*Wafer Stepper
*Wet Chemistry Room/general supplies
*Wire Bonder
*XeF2 Silicon Etcher
*Other tools not listed in the table above

'''Miscellaneous Rates'''
* Precious Metal (gold, platinum, etc.) usage will be billed the market rate, per gram.Staff-approved full service work is $100/hr.

==Full-Service Work Requests ==
KNI lab members and non-lab members can submit a request for full-service work performed by KNI technical staff using KNI equipment. The project will incur costs based on the actual usage of equipment (refer to rates above), as well as charges for the following:
{| class="wikitable"
|Fees
|Price
|-
|Technical Staff Effort (hourly)
|$ 100.00
|-
|Equipment Hourly Use Fees (see pricing list above)
|$ varies
|-
|Administrative Fee (per transaction)
|$ 100.00
|}
'''To submit a request for full-service work''', contact the technical staff member in charge of the equipment you are interested in using, or send an email to [mailto:kni@caltech.edu kni@caltech.edu]. Requests will be reviewed and selected based on staff availability, agreement of scope, and turnaround timeline. A PTA must be provided in advance in order for work to begin. KNI offers no guarantees for the end product.

'''Note:''' The rates above are the direct costs. Overhead fees will be applied.

==Overhead/Indirect Cost Rate ==
The KNI Lab charges for Non-Caltech Academic, Government, and Corporate KNI lab members are subject to Caltech's F&A (indirect/"overhead") rate. The F&A rate for fiscal year 2026 is 70%.
Internal (Caltech and JPL) users will also have overhead applied to their charges. The overhead is accounted for in the back end of the internal charging process and the overhead rate is dependent on the PTA used to pay for the KNI Lab fees. If you have questions about this, please discuss with your grants manager.

==External/Corporate Memberships==

The KNI Lab is open to external academic, government, industry, and startup organizations. Rates for industry and startups differ from the posted rates (above) for our internal academic users. All external users will be billed for Caltech's fiscal year overhead rate.

For information on the KNI external lab membership plan, please send an email to [mailto:tkimoto@caltech.edu tkimoto@caltech.edu] with details regarding 1) the number of people looking to join as KNI lab members, 2) equipment needs, 3) anticipated start date, and 4) information about the company. Startup companies may qualify for limited-term reduced rates.

'''Additional paperwork is required, including a Facilities Use Agreement, certificate of liability insurance that meets Caltech requirements, a purchase order, and an External Affiliate appointment.''' This process can take up to a few weeks, and all steps must be completed before an external user is able to start in the KNI Lab.

New Members

2026-02-24T23:46:46Z

Tkimoto: /* External Users */

==Joining the KNI Lab==
The KNI Laboratory (KNI Lab) is an open-access facility for Caltech and JPL students and researchers, as well as external academic, government and industry users. Equipment and resource use is billed on a per hour basis. Customers are invoiced monthly for their use. You can find information on our [[Usage_Rates | usage rates here]].

If you have general process questions or technical questions about KNI Lab resources, please email Associate Director of Technical Operations [mailto:derose@caltech.edu Dr. Guy DeRose]. Provide as much detail as possible to ensure an efficient and timely response.

Note: There are additional requirements for external users to join the KNI Lab (see below). Please allow more time for processing.

==Step 1: Submit Your KNI New User Form==
Internal researchers, fill out this online form:
* [https://airtable.com/app2vjzgp8AJpuC3A/pagHxiNohQX8G65DZ/form Caltech / JPL Users]
External researchers, fill out the appropriate form below and email it to [mailto:kni@caltech.edu kni@caltech.edu]. Read the sections below for additional requirements.
* [https://caltech.box.com/s/26w5srmths37kybjaismwwyc70y1qeiz Non-Caltech Academic or Government Users]
* [https://caltech.box.com/s/qkoz644x7f77grfgg9fi3wbc0v7j0ogn Industry / Corporate Users]

==Step 2: Submit Your Process Description Form (if needed)==
After you have submitted your new user form, you may contact [mailto:derose@caltech.edu Guy DeRose] for general process questions. Attach the
[https://caltech.box.com/s/kxkb44hdjhkw8rbj3pl9v6lh29h6b166 KNI Lab New Process Description form] to your email inquiry.

==Step 3: Safety Training==
All new lab users are required to attend the KNI-specific lab safety training, as well as Caltech's Laboratory Safety Orientation which is managed by Caltech's Environmental Health and Safety (EHS) department.

After submitting your new user form, you will receive an email from a KNI staff member with all necessary information to prepare for the KNI-specific safety training session. These sessions are held weekly, every Friday at 1 pm via Zoom.

Caltech's EHS Laboratory Safety Orientation is required if you are using any lab on campus. The training is offered by EHS via Zoom twice a month. If you have not taken EHS Lab Safety Orientation, instructions to register for this training can be found here: [https://www.safety.caltech.edu/root-pages/lab-safety-orientation Caltech's EHS Lab Safety Orientation]

''Note: You may start and complete KNI safety training before completing the EHS safety training. However, you must complete EHS Laboratory Safety Orientation in order to complete your onboarding and gain access to the KNI Lab.''

==Step 4: Setting Up Your Lab User Accounts & Access==
After you complete the mandatory KNI Lab new user safety training, you will receive an email from KNI Administrator Sydney Garstang with further instructions on setting up your KNI Lab user accounts. You will need to coordinate a time to stop by her office and have your ID card scanned so that it is registered in our lab management system. This will allow you to swipe into the KNI Lab's entrance as well as login to the Lab's [https://mh-fbs1.caltech.edu/ tool reservation system (FBS)].

All KNI Lab users are required to join the KNI Lab Slack workspace for timely and important lab updates, as well as FBS, the KNI Lab's user and tool management software system. Be sure to complete your FBS User account activation when you receive the FBS Welcome Email. If you have any trouble logging into our FBS Facility page ("Kavli Nanoscience Institute (KNI"), email kni@caltech.edu.

Read the [https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] for instructions on how to request training, schedule & change tool reservations, setting up your User account, notifications, and billing details.

All KNI Lab users are also signed up to the kni-notice email list.

==Step 5: Tool-Specific Training==
Requests for specific equipment training must be submitted through the [https://mh-fbs1.caltech.edu/ User Activity Dashboard] in FBS. From the User Dashboard, scroll down to find the name of the tool you need to use, click the "Request Training" link, then provide any useful information about why you need training on the specific tool -- also be sure to include your availability for the next two weeks.

After you submit your initial training request, the KNI technical staff member in charge of the tool will receive a notification and will contact you to schedule your first training session. Once a day/time has been agreed upon, you make go directly to the FBS Calendar (scheduler) and initiate an "Assisted Use" reservation. The staff member will receive an email notification and approve the reservation.

To schedule additional (second, third, etc.) training sessions, follow the same procedure: first submit the request from the FBS User Dashboard tool list, and after a day/time is set with the staff member, go to the FBS Calendar to initiate an "Assisted Use" reservation for the agreed-upon day/time.

Refer to our [https://lab.kni.caltech.edu/Equipment_List Equipment List] page for details on all of the resources in the KNI Lab.

''Note: Users are only charged for equipment use time during training sessions. There is no additional fee (i.e. staff time) for training sessions.''

==External Users==
Non-Caltech Academic, Government, and For-profit/Commercial researchers are considered external users.

Additional documents are required to set up an external user's KNI Lab access. Refer to the [https://caltech.box.com/s/urw7mwljz8jxv2d3s036h6kwx2mb8se8 External Lab User Membership Checklist] to ensure timely processing. All documentation must be completed and approved before KNI Lab access is granted.

If you are interested in joining the KNI Lab as an external user, '''please fill out the online [https://airtable.com/app2vjzgp8AJpuC3A/pagHxiNohQX8G65DZ/form New User Form]'''. Have a purchase order and your CV ready to upload.

'''Note''': all external users are required to hold a formal appointment at Caltech. If you do not have one (e.g. Visitor, External Affiliate, VURP, etc.), KNI will arrange an External Affiliate appointment for you. The appointment process is handled by Caltech HR and goes through reviews by Caltech offices, including Research Security and Compliance. Please be aware that the appointment setup and review process may take a few weeks.

If you have any questions, please contact kni@caltech.edu.

==KNI Member Offboarding==
Users who no longer need to use the KNI Lab must send a notification email to [mailto:kni@caltech.edu kni@caltech.edu] and complete the offboarding process before their last day. Please review the [https://caltech.box.com/s/qapv4ytu4uhyszz538rz4k55mvdihyix KNI Member Offboarding SOP]. The SOP lists items such as Stored Items, Chemicals, Stored Data/Files, etc, which should to be addressed before your membership ends.

Rapid Thermal Processor/archivelist

2026-01-22T22:28:48Z

Tkimoto: Changed redirect target from Archive 1 to Rapid Thermal Processor

#REDIRECT [[Rapid Thermal Processor]]

Membership Forms

2026-01-22T22:28:19Z

Tkimoto: Changed redirect target from New User Forms to New Members

#REDIRECT [[New Members]]

Equipment List

2026-01-22T22:21:04Z

Tkimoto: /* Chemical Vapor Deposition (CVD) */

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Ga-FIB, SEM, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Sputter Coater]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Oxide/Nitride Deposition: Oxford Instruments PlasmaPro System 100 PECVD | Oxide/Nitride Deposition: Oxford Instruments PlasmaPro System 100 PECVD]]
* [[Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD | Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD]]

===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====

* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]




===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Metal Sputter Coater]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]


===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.


== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]

* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Profilometer: Keyence VK-X3000 |Optical Profilometer: Keyence VK-X3000]]
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====

* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Oxide/Nitride Deposition: Oxford Instruments PlasmaPro System 100 PECVD

2026-01-22T22:20:20Z

Tkimoto: Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = PECVD |HeaderColor = #F2682A |ImageOne = PECVD_Oxford-System-100.jpg |ImageTwo = |InstrumentType = Deposition |RoomLocation = B235 Steele |LabPhone = 626-395-1532 |PrimaryStaff = Kelly McKenzie |StaffEmail = kmmckenz@caltech.edu |StaffPhone = 626-395-5732 |Manufacturer = Oxford Instruments |Model = PlasmaPro System 100 |Techniques = Amorphous Silicon Deposition, Silicon Dioxide Depositio..."

{{InstrumentInfoboxOneImage|
|InstrumentName = PECVD
|HeaderColor = #F2682A
|ImageOne = PECVD_Oxford-System-100.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Model = PlasmaPro System 100
|Techniques = Amorphous Silicon Deposition, Silicon Dioxide Deposition, Silicon Nitride Deposition
|EmailList = kni-oxfordpecvd
|EmailListName = Oxford PECVD
}}
== Description ==
The Plasma-Enhanced Chemical Vapor Deposition (PECVD) system is an Oxford Instruments Plasma Technology Plasmalab System 100 platform that is optimized for amorphous silicon, silicon dioxide, and silicon nitride deposition. The PECVD has a variable temperature stage (RT to 600 °C). This system supports wafer sizes up to 6 inches, and provides PECVD film growth over a wide range of process conditions.
===== Applications =====
* Amorphous Silicon Deposition
* Silicon Dioxide Deposition
* Silicon Nitride Deposition
===== Allowed material in PECVD System =====
* Si, SixNy, SiO2, SOI
* Hard masks compatible with process temperature
===== PECVD Gas List =====
* 5% SiH4 in N2
* 5% SiH4 in Ar
* NH3
* N2O
* N2
* Mixture of CF4 and O2 (4:1) for Plasma Clean

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/c8qx3ikzjb05x44o4updpqs36ra39ytw KNI SOP]
* [https://caltech.box.com/s/0gh89zgxkchj8nkbl1bbrdgvspu31obc Oxfords reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 KNI's Amorphous Silicon recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv KNI's 350C SiO2 recipe]
* [https://caltech.box.com/s/0e14n82o7o9yziqmlygkakfcv1lp65iu Process Standards]
* [https://caltech.box.com/s/6b2ivuuguflqjaqby5werlcslmmudryf High rate SiOx]
* [https://caltech.box.com/s/vi6vb1nz8thm3sflt5ncoyhi62tomi82 High rate SiNx]
* [https://caltech.box.com/s/tc4j0yr2jazv0rd6ey22ri8jd1asl326 Low Rate SiOx]
* [https://caltech.box.com/s/r3socf5rslp7qs9rb5o7vvpyp12qf0ps Low rate SiNx]
* [https://caltech.box.com/s/6acyh95hslt0q711makbllgqjrexpew1 Amorphous Silicon Deposition (Silane/helium)]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/116/System%20Manual%20for%20Caltech%2094-219848.pdf Oxford PECVD System Manual]
* [https://caltech.box.com/s/zqfonyv64m2m76mo8b4xn63ljz9ee4i5 Alcatel ADS 602P dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/kvgp7d7zx9gczapf7iun791m234vevod Manufacturer Data Sheet]
===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* PECVD process chamber with 160 mm pumping port, view port, and an additional rear port for optical emission end-point-detection
* Heated upper electrode to prevent condensation of low vapor pressure precursors
* PECVD 205 mm electrically heated (700 °C) lower electrode with central wafer lift mechanism
* Parameter ramping software
* 5 Torr capacitance manometer for process control, and penning for base pressure measurement
* Process chamber pumping with 63 mm branch to APC, and isolation valve; chamber base pressure turbo, backed by a refurbished dry pump with roots
* Twelve line gas pod with two non-toxic and three toxic digital mass-flow-controlled gas lines and cleaning gas
* Chamber Gas ring, with split gas manifold
* Liquid vapor delivery system
* Single-wafer automatic insertion load lock with soft pump option
===== System Specifications =====
* Chamber wall heating 80 °C
* 30/300 W RF generator close-coupled to the upper electrode through an automatic matching unit; the generator is configured to operate in a low-power mode (0-30 W) for higher accuracy during low-rate deposition processes
* 600 W solid-state 50-460 kHz LF generator

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

FlexAL II: Atomic Layer Deposition (ALD)

2026-01-22T22:18:29Z

Tkimoto: /* Chemical Vapor Deposition */

{{InstrumentInfoboxOneImage|
|InstrumentName = Atomic Layer Deposition (ALD)
|HeaderColor = #F2682A
|ImageOne = FlexAL-II-ALD.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Techniques = Atomic Layer Deposition of Oxides and Nitrides
|EmailList = kni-ald
|EmailListName = Oxford FlexAl ALD
|Model = FlexAL II
}}
== Description ==
The Atomic Layer Deposition (ALD) system is an Oxford Instruments Plasma Technology FlexAL II platform that is designed to grow thin films one atomic layer at a time under very precise deposition conditions. It is configured with a 240 mm diameter resistance-heated, RF-biased aluminum electrode with temperature control to 600 °C, and substrate sizes up to 6 inches (150 mm), with optional configuration for 8 inches (200 mm). There is an inductively-coupled plasma (ICP) source for plasma-enhanced ALD, as well as the more traditional thermal processes, with six precursor gases to grow a variety of high-purity oxides and nitrides.

Some film examples by KNI lab members include thermally-grown conductive TiO2 as protective coatings for semiconducting photoanodes in water-splitting cells, thermal and plasma-assisted Al2O3 and HfO2 as gate dielectrics in 2D transition metal dichalcogenide materials, as well as NbN and TiN deposition.

===== Applications =====
* Aluminum oxide and nitride deposition
* Silicon dioxide and nitride deposition
* Titanium oxide and nitride deposition
* Hafnium oxide deposition
* Niobium oxide and nitride deposition
* Deposition of other films can be made available upon request

===== Allowed material in ALD System =====
* Si, SixNy, SiO2, SOI
* Hard masks compatible with process temperature

===== ALD Gas List (links to SDS) =====
* [https://caltech.box.com/s/4ydr6ju2pbvulef7e0vzlb8i58nijkrg SF6]
* [https://caltech.box.com/s/s3oi147iafil7ruil2dwgw5kxn9je2a5 N2]
* [https://caltech.box.com/s/sar0sdkzrjyvzh63gww199558297rzaj O2]
* [https://caltech.box.com/s/f08m19vgz2sir41vzqdkql4wcpcsc7nz O3]
* [https://caltech.box.com/s/g4r8qnbmn4gfdly1knni5rhnubpuq0zv NH3]
* [https://caltech.box.com/s/f6080rhdsuu8mblne62c02oapl7319cg H2]
* [https://caltech.box.com/s/djtj0j1671dvo6to8x0t56g2b8ekvmrz Ar]

===== ALD Precursor List (Links to SDS) =====
* [https://caltech.box.com/s/hff83jq4x96new2sgczzvwgacy7tsl0e TMA (aluminum)]
* [https://caltech.box.com/s/pkjuqifvnzle2eanykhvhe4m8hu6qgye TDMAT (titanium)]
* [https://caltech.box.com/s/jurskhuqjxhpnmtl5iwfmgpj8d3apmy3 BTBAS (silicon)]
* BDEAS (silicon) (SDS coming soon)
* [https://caltech.box.com/s/6zdhb6n1yr78wgy9mtjzqkljo75vxb75 TDMAH (hafnium)]
* [https://caltech.box.com/s/pznx6n00avfmmp47h3esqkkc7hsrw04d TBTDEN (niobium)]
* Others upon request

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select ALD from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/97mn2fyncejg6d4uo5lwtyl98w8n9gd2 KNI ALD SOP]
* [https://caltech.box.com/s/0gh89zgxkchj8nkbl1bbrdgvspu31obc Oxfords reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents (login to LabRunr required)=====
* [https://labrunr.caltech.edu/machinefiles/154/Oxford%20Instruments%20ALD%20Materials%20Example%20Guide%20-%202017-10-25.pdf Oxford Instruments ALD Materials Example Guide]
* [https://labrunr.caltech.edu/machinefiles/154/OxfordInstruments%20ALD%20-%20gases%20and%20precursors.pdf Oxford Instruments ALD gases and precursors]
* [https://labrunr.caltech.edu/machinefiles/154/CalTech_Process_Visit_Report_Final.pdf Oxford Instruments ALD Process Acceptance report]
* [https://labrunr.caltech.edu/machinefiles/154/process%20infor%20for%20Caltech_v2.pdf Oxford Instruments ALD Process Information guidance]
* [https://labrunr.caltech.edu/machinefiles/154/ALD%20Bias%20Control%20Oxford%20Instruments.pdf Oxford Instruments ALD Bias Control]

===== Process Resources =====
* [https://caltech.box.com/s/rw25s9zzka0adhgclxr9ppxpoyduanx7 Aluminum Nitride (AlN)]
* [https://caltech.box.com/s/o0lmo99pz3p4cjihmytmvqbvmq5pr1yg Aluminum Oxide (Al2O3)]
* [https://caltech.box.com/s/gvmfu3np83ehfwub7ebuuajyia52thv0 Hafnium Oxide (HfO2)]
* [https://caltech.box.com/s/h7x9a3i8uj55hbahpam9fzni967fjnkp Silicon Nitride (Si3N4)]
* [https://caltech.box.com/s/zaloyrsabapa5b7pvnjxglsgfjeux1zx Titanium Nitride (TiN)]
* [https://caltech.box.com/s/knpefm73sdjsnd7zmo78mr6h273eyx2n Titanium Oxide (TiO2)]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/154/FlexAL_II_IDS_EN_10.pdf Oxford FlexAL ALD System manual] (login to LabRunr)
* [https://caltech.box.com/s/tgypp7gvwxtk8um4pmybietd29fj7htj Adixen 4 Series Multistage Roots dry pumps brochure]
* [https://caltech.box.com/s/eubo1b949weunxvwkti50jhi7nuh7mgb NovaSafe exhaust abatement system manual]
* [https://labrunr.caltech.edu/machinefiles/154/OzoneDel_MAN_EN_1A.PDF Oxford Ozone Delivery module manual] (login to LabRunr)
* [https://caltech.box.com/s/8n7k2wiwqzxlpt32uaj2rwvf7maqu9xl Oxford FlexAl system drawings] (login to LabRunr)

== Specifications ==
===== System Features =====
* FlexAL ALD Process Module
* The chamber is electrically heated to 150 °C
* Two ports at 70° angle from normal for ellipsometry and an additional port for analytical equipment such as RGA
* Precursor Multi-Bubbler Cabinet 6 Way
* Standard Gas Pod externally mounted (8 lines max)
* 4 each Standard gasline and MFC for non-toxic gases
* 3 each By-passed gasline and MFC for toxic gases
* Ozone delivery system for ALD with up to 22% w/w ozone concentration
* Chamber turbo pump Pfeiffer/Adixen ATH500M, ISO200 pipework, APC & heated backing valve kit
* Chamber process pump Pfeiffer/Adixen A604H kit
* FlexAL compact single wafer load lock kit
* Load Lock dry pump kit
* PC & 19" monitor
===== System Specifications =====
* ICP 65 plasma source with 600 W 13.56 MHz RF Generator & AMU
* ALD 600 °C biasable Inconel electrode
* Heated 250 mTorr high resolution temperature compensated capacitance manometer
* ALD 100 mm pumping pipework plus 100 mm fast APC
* Process Acceptance criteria for thermal and plasma Al2O3 and TiO2

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD|Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD]]

Equipment List

2026-01-22T22:18:03Z

Tkimoto: /* Deposition */

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Ga-FIB, SEM, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Sputter Coater]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD | Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD]]

===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====

* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]




===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Metal Sputter Coater]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]


===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.


== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]

* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Profilometer: Keyence VK-X3000 |Optical Profilometer: Keyence VK-X3000]]
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====

* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2026-01-22T22:17:41Z

Tkimoto: /* Chemical Vapor Deposition (CVD) */

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Ga-FIB, SEM, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Sputter Coater]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]

===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====

* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]




===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Profilometer: Keyence VK-X3000 | Optical Profilometer: Keyence VK-X3000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Metal Sputter Coater]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]


===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.


== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]

* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Profilometer: Keyence VK-X3000 |Optical Profilometer: Keyence VK-X3000]]
* [[Dektak 3ST: Profilometer | Stylus Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====

* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Plasma-Enhanced Chemical Vapor Deposition (PECVD)

2026-01-22T22:16:39Z

Tkimoto: Tkimoto moved page Plasma-Enhanced Chemical Vapor Deposition (PECVD) to Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD: adding new PECVD system to wiki

#REDIRECT [[Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD]]

Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD

2026-01-22T22:16:39Z

Tkimoto: Tkimoto moved page Plasma-Enhanced Chemical Vapor Deposition (PECVD) to Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD: adding new PECVD system to wiki

{{InstrumentInfoboxOneImage|
|InstrumentName = PECVD
|HeaderColor = #F2682A
|ImageOne = PECVD_Oxford-System-100.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Model = Plasmalab System 100
|Techniques = Amorphous Silicon Deposition, Silicon Dioxide Deposition, Silicon Nitride Deposition
|EmailList = kni-oxfordpecvd
|EmailListName = Oxford PECVD
}}
== Description ==
The Plasma-Enhanced Chemical Vapor Deposition (PECVD) system is an Oxford Instruments Plasma Technology Plasmalab System 100 platform that is optimized for amorphous silicon, silicon dioxide, and silicon nitride deposition. The PECVD has a variable temperature stage (RT to 600 °C). This system supports wafer sizes up to 6 inches, and provides PECVD film growth over a wide range of process conditions.
===== Applications =====
* Amorphous Silicon Deposition
* Silicon Dioxide Deposition
* Silicon Nitride Deposition
===== Allowed material in PECVD System =====
* Si, SixNy, SiO2, SOI
* Hard masks compatible with process temperature
===== PECVD Gas List =====
* 5% SiH4 in N2
* 5% SiH4 in Ar
* NH3
* N2O
* N2
* Mixture of CF4 and O2 (4:1) for Plasma Clean

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/c8qx3ikzjb05x44o4updpqs36ra39ytw KNI SOP]
* [https://caltech.box.com/s/0gh89zgxkchj8nkbl1bbrdgvspu31obc Oxfords reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 KNI's Amorphous Silicon recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv KNI's 350C SiO2 recipe]
* [https://caltech.box.com/s/0e14n82o7o9yziqmlygkakfcv1lp65iu Process Standards]
* [https://caltech.box.com/s/6b2ivuuguflqjaqby5werlcslmmudryf High rate SiOx]
* [https://caltech.box.com/s/vi6vb1nz8thm3sflt5ncoyhi62tomi82 High rate SiNx]
* [https://caltech.box.com/s/tc4j0yr2jazv0rd6ey22ri8jd1asl326 Low Rate SiOx]
* [https://caltech.box.com/s/r3socf5rslp7qs9rb5o7vvpyp12qf0ps Low rate SiNx]
* [https://caltech.box.com/s/6acyh95hslt0q711makbllgqjrexpew1 Amorphous Silicon Deposition (Silane/helium)]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/116/System%20Manual%20for%20Caltech%2094-219848.pdf Oxford PECVD System Manual]
* [https://caltech.box.com/s/zqfonyv64m2m76mo8b4xn63ljz9ee4i5 Alcatel ADS 602P dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/kvgp7d7zx9gczapf7iun791m234vevod Manufacturer Data Sheet]
===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* PECVD process chamber with 160 mm pumping port, view port, and an additional rear port for optical emission end-point-detection
* Heated upper electrode to prevent condensation of low vapor pressure precursors
* PECVD 205 mm electrically heated (700 °C) lower electrode with central wafer lift mechanism
* Parameter ramping software
* 5 Torr capacitance manometer for process control, and penning for base pressure measurement
* Process chamber pumping with 63 mm branch to APC, and isolation valve; chamber base pressure turbo, backed by a refurbished dry pump with roots
* Twelve line gas pod with two non-toxic and three toxic digital mass-flow-controlled gas lines and cleaning gas
* Chamber Gas ring, with split gas manifold
* Liquid vapor delivery system
* Single-wafer automatic insertion load lock with soft pump option
===== System Specifications =====
* Chamber wall heating 80 °C
* 30/300 W RF generator close-coupled to the upper electrode through an automatic matching unit; the generator is configured to operate in a low-power mode (0-30 W) for higher accuracy during low-rate deposition processes
* 600 W solid-state 50-460 kHz LF generator

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Equipment List

2026-01-07T23:13:59Z

Tkimoto: /* Metrology */

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Metal Sputter Coater]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====

* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]




===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Metal Sputter Coater]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]


===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.


== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]

* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Profilometer: Keyence VK-X3000 | Profilometer: Keyence VK-X3000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====

* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2026-01-07T23:12:51Z

Tkimoto:

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Metal Sputter Coater]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====

* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]




===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Conductive thin film deposition: Leica EM ACE600 Carbon Evaporator & Metal Sputter Coater]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]


===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.


== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]

* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Keyence VK-X3000: Profilometer | Profilometer: Keyence VK-X3000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====

* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Profilometer: Keyence VK-X3000

2026-01-07T23:12:02Z

Tkimoto: Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = Keyence VK-X3000 Profilometer |HeaderColor = #F5A81C |ImageOne = Dektak-3ST-Profilometer.jpg |ImageTwo = |InstrumentType = Metrology |RoomLocation = B235 Steele |LabPhone = 626-395-1539 |PrimaryStaff = Yonghwi Kim |StaffEmail = ykim@caltech.edu |StaffPhone = 626-395-5994 |Manufacturer = Keyence |Model = VK-X3000 |Techniques = Surface Profiling }} == Description == The Keyence VK-X3000 profil..."

{{InstrumentInfoboxOneImage|
|InstrumentName = Keyence VK-X3000 Profilometer
|HeaderColor = #F5A81C
|ImageOne = Dektak-3ST-Profilometer.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Metrology|Metrology]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Keyence
|Model = VK-X3000
|Techniques = Surface Profiling
}}
== Description ==
The Keyence VK-X3000 profilometer is a stylus-type surface profiler. It is equipped with a camera for locating the region of interest, manual sample manipulation & tilt correction, and profile analysis software. It can be used to get a rough idea of the topography of features by scanning a single line across the surface. Features as small as 100 nm in height can be determined with some approximation.

===== Applications =====
* Surface Profiling

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/hdic8scc882tkrcjqsbaruqph9jgo75t KNI SOP]
* [https://caltech.box.com/s/j6br8jpkr7ov0k9dwx7wzyzt9f5fj3rt Dektak Operations Manual]
 
 

== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Usage Rates

2025-11-11T20:11:49Z

Tkimoto: /* Caltech & JPL User Rates */

'''Overview of KNI Lab User Fees''' 
''Rates below are valid beginning October 1, 2025 and are subject to change''

* Fees are incurred on a pay-as-you-go basis (tools are charged by the hour or portion thereof).
* Lab users do '''NOT''' incur lab fees during days or months of non-use.
*Invoices are issued monthly.

'''Note: New users must submit a [[Membership_Forms | New User Form]] and attend general KNI Lab safety training before lab access is granted.'''

==Caltech & JPL User Rates==
Below is a table of ''direct'' hourly rates for lab and equipment use in the KNI Laboratory. Hourly rates are applied to an individual's actual usage in the KNI Lab. Rates do '''not''' include any applicable indirect charges, such as F&A fees. F&A (overhead) will be applied separately based on the customer's PTA type. Rates are valid beginning October 1, 2025 and are subject to change.

{| class="wikitable" style="width: 90%;"
|-
! scope="col" style="text-align:left; width: 40%" |Tool Name
! scope="col" style="text-align:left; width: 40%" |Resource Area
! scope="col" style="text-align:center; width: 20%" |Hourly Rate
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |General Lab
! scope="col" style="text-align:left; background-color:#ffe7d1;" |See details below
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$43/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Raith EBPG 5000+ and 5200 Electron Beam Writers
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Electron Beam Lithography (EBL)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$130/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |FEI Nova 600 Dualbeam Focused Ion Beam
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$75/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Cobra III-V ALE Etch System (TBA)
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD "2" System (TBA)
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford FlexAl ALD/ALE System
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$50/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford III-V Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Dielectric Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford DRIE Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD System (legacy)
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Nanoscribe PPGT
! scope="col" style="text-align:left; background-color:#ffe7d1;" | 2D/3D Print
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$5/hr
|}

'''Academic Discount on General Cleanroom Usage'''

A 50% discount will be applied to the General Cleanroom rate for any cleanroom usage accrued ''after'' 40 hours per calendar month. The discounted hourly rate, $21.50, is only applied to the hours that exceed 40 in a given month.

Example: A user logs 50 hours in the cleanroom during the month of October. Their invoice will be: (40 x $43) + (10 x $21.50) = $1,935

'''General Lab use is counted as time in the KNI cleanroom facility. It includes access to:'''
*Atomic Force Microscope
*Critical Point Dryer
*Electron Beam Evaporators
*Laser Interference Lithography System
*He-Ne-Ga Ion Microscope (Orion Nanofab)
*Mask Aligners
*Parylene Coater
*Profilometer
*Rapid Thermal Processor
*Scanning Electron Microscopes (Quanta, Sirion)
*Scriber Breaker
*Spectroscopic Ellipsometer
*Tube Furnaces (Wet, Dry Oxide + Annealing)
*Wafer Stepper
*Wet Chemistry Room/general supplies
*Wire Bonder
*XeF2 Silicon Etcher
*Other tools not listed in the table above

'''Miscellaneous Rates'''
* Precious Metal (gold, platinum, etc.) usage will be billed the market rate, per gram.Staff-approved full service work is $100/hr.

==Full-Service Work Requests ==
KNI lab members and non-lab members can submit a request for full-service work performed by KNI technical staff using KNI equipment. The project will incur costs based on the actual usage of equipment (refer to rates above), as well as charges for the following:
{| class="wikitable"
|Fees
|Price
|-
|Technical Staff Effort (hourly)
|$ 100.00
|-
|Equipment Hourly Use Fees (see pricing list above)
|$ varies
|-
|Administrative Fee (per transaction)
|$ 100.00
|}
'''To submit a request for full-service work''', contact the technical staff member in charge of the equipment you are interested in using, or send an email to [mailto:kni@caltech.edu kni@caltech.edu]. Requests will be reviewed and selected based on staff availability, agreement of scope, and turnaround timeline. A PTA must be provided in advance in order for work to begin. KNI offers no guarantees for the end product.

'''Note:''' The rates above are the direct costs. Overhead fees will be applied.

==Overhead/Indirect Cost Rate ==
The KNI Lab charges for Non-Caltech Academic, Government, and Corporate KNI lab members are subject to Caltech's F&A (indirect/"overhead") rate. The F&A rate for fiscal year 2026 is 70%.
Internal (Caltech and JPL) users will also have overhead applied to their charges. The overhead is accounted for in the back end of the internal charging process and the overhead rate is dependent on the PTA used to pay for the KNI Lab fees. If you have questions about this, please discuss with your grants manager.

==External/Corporate Memberships==

The KNI Lab is open to external academic, government, industry, and startup organizations. Rates for industry and startups differ from the posted rates (above) for our internal academic users. All external users will be billed for Caltech's fiscal year overhead rate.

For information on the KNI external lab membership plan, please send an email to [mailto:tkimoto@caltech.edu tkimoto@caltech.edu] with details regarding 1) the number of people looking to join as KNI lab members, 2) equipment needs, 3) anticipated start date, and 4) information about the company. Startup companies may qualify for limited-term reduced rates.

'''Additional paperwork is required, including a Facilities Use Agreement, certificate of liability insurance that meets Caltech requirements, a purchase order, and an External Affiliate appointment.''' This process can take up to a few weeks, and all steps must be completed before an external user is able to start in the KNI Lab.

Usage Rates

2025-10-24T16:20:09Z

Tkimoto:

'''Overview of KNI Lab User Fees''' 
''Rates below are valid beginning October 1, 2025 and are subject to change''

* Fees are incurred on a pay-as-you-go basis (tools are charged by the hour or portion thereof).
* Lab users do '''NOT''' incur lab fees during days or months of non-use.
*Invoices are issued monthly.

'''Note: New users must submit a [[Membership_Forms | New User Form]] and attend general KNI Lab safety training before lab access is granted.'''

==Caltech & JPL User Rates==
Below is a table of ''direct'' hourly rates for lab and equipment use in the KNI Laboratory. Hourly rates are applied to an individual's actual usage in the KNI Lab. Rates do '''not''' include any applicable indirect charges, such as F&A fees. F&A (overhead) will be applied separately based on the customer's PTA type. Rates are valid beginning October 1, 2025 and are subject to change.

{| class="wikitable" style="width: 90%;"
|-
! scope="col" style="text-align:left; width: 40%" |Tool Name
! scope="col" style="text-align:left; width: 40%" |Resource Area
! scope="col" style="text-align:center; width: 20%" |Hourly Rate
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |General Lab
! scope="col" style="text-align:left; background-color:#ffe7d1;" |See details below
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$43/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Raith EBPG 5000+ and 5200 Electron Beam Writers
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Electron Beam Lithography (EBL)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$130/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |FEI Nova 600 Dualbeam Focused Ion Beam
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$75/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Cobra III-V ALE Etch System (TBA)
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD "2" System (TBA)
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$60/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford FlexAl ALD/ALE System
! scope="col" style="text-align:left; background-color:#ffe7d1;" |Deposition, Chemical Vapor
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford III-V Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford Dielectric Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford DRIE Etch System
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Oxford PECVD System (legacy)
! scope="col" style="text-align:left; background-color:#ffe7d1;" | Microscopy, Focused Ion Beam (FIB)
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$40/hr
|-
! scope="col" style="text-align:left; background-color:#ffd8b4;" |Nanoscribe PPGT
! scope="col" style="text-align:left; background-color:#ffe7d1;" | 2D/3D Print
! scope="col" style="text-align:center; background-color:#FFFFFF;" |$5/hr
|}

'''Academic Discount on General Cleanroom Usage'''

A 50% discount will be applied to the General Cleanroom rate for any cleanroom usage accrued ''after'' 40 hours per calendar month. The discounted hourly rate, $21.50, is only applied to the hours that exceed 40 in a given month.

Example: A user logs 50 hours in the cleanroom during the month of October. Their invoice will be: (40 x $43) + (10 x $21.50) = $1,935

'''General Lab use is counted as time in the KNI cleanroom facility. It includes access to:'''
*Atomic Force Microscope
*Critical Point Dryer
*Electron Beam Evaporators
*Laser Interference Lithography System
*He-Ne-Ga Ion Microscope (Orion Nanofab)
*Mask Aligners
*Parylene Coater
*Profilometer
*Rapid Thermal Processor
*Scanning Electron Microscopes (Quanta, Sirion)
*Scriber Breaker
*Spectroscopic Ellipsometer
*Tube Furnaces (Wet, Dry Oxide + Annealing)
*Wafer Stepper
*Wet Chemistry Room/general supplies
*Wire Bonder
*XeF2 Silicon Etcher
*Other tools not listed in the table above

'''Miscellaneous Rates'''
* Precious Metal (gold, platinum, etc.) usage will be billed the market rate, per gram.Staff-approved full service work is $100/hr.

==Full-Service Work Requests ==
KNI lab members and non-lab members can submit a request for full-service work performed by KNI technical staff using KNI equipment. The project will incur costs based on the actual usage of equipment (refer to rates above), as well as charges for the following:
{| class="wikitable"
|Fees
|Price
|-
|Technical Staff Effort (hourly)
|$ 100.00
|-
|Equipment Hourly Use Fees (see pricing list above)
|$ varies
|-
|Administrative Fee (per transaction)
|$ 100.00
|}
'''To submit a request for full-service work''', contact the technical staff member in charge of the equipment you are interested in using, or send an email to [mailto:kni@caltech.edu kni@caltech.edu]. Requests will be reviewed and selected based on staff availability, agreement of scope, and turnaround timeline. A PTA must be provided in advance in order for work to begin. KNI offers no guarantees for the end product.

'''Note:''' The rates above are the direct costs. Overhead fees will be applied.

==Overhead/Indirect Cost Rate ==
The KNI Lab charges for Non-Caltech Academic, Government, and Corporate KNI lab members are subject to Caltech's F&A (indirect/"overhead") rate. The F&A rate for fiscal year 2026 is 70%.
Internal (Caltech and JPL) users will also have overhead applied to their charges. The overhead is accounted for in the back end of the internal charging process and the overhead rate is dependent on the PTA used to pay for the KNI Lab fees. If you have questions about this, please discuss with your grants manager.

==External/Corporate Memberships==

The KNI Lab is open to external academic, government, industry, and startup organizations. Rates for industry and startups differ from the posted rates (above) for our internal academic users. All external users will be billed for Caltech's fiscal year overhead rate.

For information on the KNI external lab membership plan, please send an email to [mailto:tkimoto@caltech.edu tkimoto@caltech.edu] with details regarding 1) the number of people looking to join as KNI lab members, 2) equipment needs, 3) anticipated start date, and 4) information about the company. Startup companies may qualify for limited-term reduced rates.

'''Additional paperwork is required, including a Facilities Use Agreement, certificate of liability insurance that meets Caltech requirements, a purchase order, and an External Affiliate appointment.''' This process can take up to a few weeks, and all steps must be completed before an external user is able to start in the KNI Lab.

Carbon Evaporator

2025-10-21T23:35:26Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Carbon Evaporator
|HeaderColor = #F2682A
|ImageOne = EM-ACE600-Carbon-Evaporator.jpg
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg
|InstrumentType = [[Equipment_List#Deposition|Deposition]], [[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5885
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Leica
|Model = EM ACE600
|Techniques = Carbon Deposition and Gold Sputtering
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin (e.g. 2-10 nm), conductive layer of carbon on the surface can help. This carbon evaporator produces amorphous, conductive films, the morphology of which is not detectable in an SEM or FIB image. After imaging is complete, the carbon can be gently removed with an O2 plasma using, for example, the lab's [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]].
===== Applications =====
* Coat material surface to make sample conductive for use in an SEM or FIB
* Coat resist surface to make sample conductive for use with e-beam lithography
* Apply carbon to a specimen or device for any other fabrication use

== Resources ==
===== Equipment Data =====

[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]

===== SOP & Troubleshooting =====
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP & Troubleshooting Guide]
* The procedure to install a new carbon thread can be found on [https://www.manualslib.com/manual/1525180/Leica-Em-Ace600.html?page=43#manual Page 39 of the Operating Manual]
** Note: always install as a "double thread," i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator's door width is long enough to double over and install.

===== Video =====
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica's Product Overview Video]

===== Technical Notes =====
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]
===== Manufacturer Manual =====
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]

===== Carbon Evaporation Specifications =====
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want
 
 
== Related Instrumentation in the KNI ==
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

ORION NanoFab: Helium, Neon & Gallium FIB

2025-10-21T23:34:33Z

Tkimoto:

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = alireza@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating hydrocarbon deposition on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).
* There is no need to coat non-conductive samples, the ORION NanoFab is equipped with a floodgun which can be used for charge compensation.
* You can of course still use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2025-10-21T23:34:18Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====

* Masterclasses for Microscopy
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]

SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
*[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]

* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar

Guide to Choosing KNI SEMs & FIBs

2025-10-21T23:33:58Z

Tkimoto: /* High Magnification Imaging */

*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]], [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]], [[Sirion: SEM & EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.
*See the “Functionality of SEMs & FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI's Microscopy Lectures] for more details on physical principles, applications, and examples

==Low Magnification Imaging==
If you only need to take low mag images, e.g. with a 4 μm field of view (FOV) or larger (i.e. if you're only using “Field Free Mode” aka “Normal Mode"):
#'''[[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging
#'''[[Sirion: SEM & EDS | Sirion]]:''' Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]''' or '''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' You're generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs

==High Magnification Imaging==
If you need to take high mag images with less than 4 μm FOV (i.e. if you're using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):
#'''[[Sirion: SEM & EDS | Sirion]]:''' High resolution but limited depth of field e.g. when tilting; Sirion has 1-2 min pump/vent times
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)

==Highest Magnification Imaging==
If you need to take images with less than 2 μm FOV:

#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability
#'''[[Sirion: SEM & EDS | Sirion]]:''' Not quite as good as Nova 200 or Nova 600 at these FOVs

==Gallium Focused Ion Beam Work==
If you need to use Ga-FIB:
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for cross-sections, TEM sample prep, point & shoot etching tasks, Pt dep, minor automation via scripting
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer

==Lithography==
If you want to perform lithography on resist or a hard mask and don't need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):
#'''Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' As small as 15 nm features achievable at 30 kV
#'''Helium ion beam lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' As small as 5 nm features achievable at 35 kV (best when used on very thin resist)
#'''Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al2O3) that subsequently gets used as an etch mask

=="Functionality of KNI SEMs & FIBs" Table==
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI's SEMs and FIBs offer a particular functionality that you need]]

Guide to Choosing KNI SEMs & FIBs

2025-10-21T23:33:41Z

Tkimoto: /* High Magnification Imaging */

*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]], [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]], [[Sirion: SEM & EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.
*See the “Functionality of SEMs & FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI's Microscopy Lectures] for more details on physical principles, applications, and examples

==Low Magnification Imaging==
If you only need to take low mag images, e.g. with a 4 μm field of view (FOV) or larger (i.e. if you're only using “Field Free Mode” aka “Normal Mode"):
#'''[[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging
#'''[[Sirion: SEM & EDS | Sirion]]:''' Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]''' or '''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' You're generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs

==High Magnification Imaging==
If you need to take high mag images with less than 4 μm FOV (i.e. if you're using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):
#'''[[Sirion: SEM & EDS | Sirion]]:''' High resolution but limited depth of field e.g. when tilting; Nova 200 has 3-4 min pump/vent times and Sirion has 1-2 min pump/vent times
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)

==Highest Magnification Imaging==
If you need to take images with less than 2 μm FOV:

#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability
#'''[[Sirion: SEM & EDS | Sirion]]:''' Not quite as good as Nova 200 or Nova 600 at these FOVs

==Gallium Focused Ion Beam Work==
If you need to use Ga-FIB:
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for cross-sections, TEM sample prep, point & shoot etching tasks, Pt dep, minor automation via scripting
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer

==Lithography==
If you want to perform lithography on resist or a hard mask and don't need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):
#'''Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' As small as 15 nm features achievable at 30 kV
#'''Helium ion beam lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' As small as 5 nm features achievable at 35 kV (best when used on very thin resist)
#'''Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al2O3) that subsequently gets used as an etch mask

=="Functionality of KNI SEMs & FIBs" Table==
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI's SEMs and FIBs offer a particular functionality that you need]]

Guide to Choosing KNI SEMs & FIBs

2025-10-21T23:33:28Z

Tkimoto: /* Low Magnification Imaging */

*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]], [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]], [[Sirion: SEM & EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.
*See the “Functionality of SEMs & FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI's Microscopy Lectures] for more details on physical principles, applications, and examples

==Low Magnification Imaging==
If you only need to take low mag images, e.g. with a 4 μm field of view (FOV) or larger (i.e. if you're only using “Field Free Mode” aka “Normal Mode"):
#'''[[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging
#'''[[Sirion: SEM & EDS | Sirion]]:''' Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]''' or '''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' You're generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs

==High Magnification Imaging==
If you need to take high mag images with less than 4 μm FOV (i.e. if you're using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):
#'''[[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]]''' or '''[[Sirion: SEM & EDS | Sirion]]:''' High resolution but limited depth of field e.g. when tilting; Nova 200 has 3-4 min pump/vent times and Sirion has 1-2 min pump/vent times
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)

==Highest Magnification Imaging==
If you need to take images with less than 2 μm FOV:

#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability
#'''[[Sirion: SEM & EDS | Sirion]]:''' Not quite as good as Nova 200 or Nova 600 at these FOVs

==Gallium Focused Ion Beam Work==
If you need to use Ga-FIB:
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for cross-sections, TEM sample prep, point & shoot etching tasks, Pt dep, minor automation via scripting
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer

==Lithography==
If you want to perform lithography on resist or a hard mask and don't need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):
#'''Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' As small as 15 nm features achievable at 30 kV
#'''Helium ion beam lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' As small as 5 nm features achievable at 35 kV (best when used on very thin resist)
#'''Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al2O3) that subsequently gets used as an etch mask

=="Functionality of KNI SEMs & FIBs" Table==
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI's SEMs and FIBs offer a particular functionality that you need]]

Guide to Choosing KNI SEMs & FIBs

2025-10-21T23:33:08Z

Tkimoto:

*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]], [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]], [[Sirion: SEM & EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:ykim@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.
*See the “Functionality of SEMs & FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI's Microscopy Lectures] for more details on physical principles, applications, and examples

==Low Magnification Imaging==
If you only need to take low mag images, e.g. with a 4 μm field of view (FOV) or larger (i.e. if you're only using “Field Free Mode” aka “Normal Mode"):
#'''[[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging
#'''[[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]]''' or '''[[Sirion: SEM & EDS | Sirion]]:''' Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]''' or '''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' You're generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs

==High Magnification Imaging==
If you need to take high mag images with less than 4 μm FOV (i.e. if you're using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):
#'''[[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]]''' or '''[[Sirion: SEM & EDS | Sirion]]:''' High resolution but limited depth of field e.g. when tilting; Nova 200 has 3-4 min pump/vent times and Sirion has 1-2 min pump/vent times
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)

==Highest Magnification Imaging==
If you need to take images with less than 2 μm FOV:

#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability
#'''[[Sirion: SEM & EDS | Sirion]]:''' Not quite as good as Nova 200 or Nova 600 at these FOVs

==Gallium Focused Ion Beam Work==
If you need to use Ga-FIB:
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for cross-sections, TEM sample prep, point & shoot etching tasks, Pt dep, minor automation via scripting
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer

==Lithography==
If you want to perform lithography on resist or a hard mask and don't need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):
#'''Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' As small as 15 nm features achievable at 30 kV
#'''Helium ion beam lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' As small as 5 nm features achievable at 35 kV (best when used on very thin resist)
#'''Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al2O3) that subsequently gets used as an etch mask

=="Functionality of KNI SEMs & FIBs" Table==
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI's SEMs and FIBs offer a particular functionality that you need]]

Dimension Icon: Atomic Force Microscope (AFM)

2025-10-21T23:32:22Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = alexw@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/HIaTe0Bb5xs Part 1: Setting up an Experiment & Aligning the Scanner]
* [https://youtu.be/Oq8djKI8gHM Part 2: Navigating to Sample & Explanation of Scanning Parameters]
* [https://youtu.be/1lEmg0p_uaw Part 3: Basics of Scanning & Using Analysis Software]
* [https://youtu.be/0SYBS5gQTM0 Extras: Probe & Scanner Mounting]

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help calibrate the microscope and to troubleshoot problems related to scanning and the probe]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference (VGRP-15M):''' Features are 6x6 μm wide, on a 10 μm pitch, and etched 180 nm deep into SiO2. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that while it does not necessarily do a good job of predicting the behavior of scans that look at features on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights), if this 180 nm calibration is within an error of less than 1%, then you can be generally confident in your small-scale scans. Consider using – or devising – a 2D material standard as a check on your own 2D material scans to be assured of accuracy.
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Equipment List

2025-10-21T23:31:59Z

Tkimoto:

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====

* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]


===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]

* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====

* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Nova 200 NanoLab: SEM & EDS

2025-10-21T23:31:15Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/4f1hqp83pwc1v1k5qke6xi68i28fjvz8 Nova200 and EDS SOP, Manuals, SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f .pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 .pptx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar

Quanta 200F: SEM, ESEM, Lithography & Probe Station

2025-10-21T23:30:46Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Quanta 200F
|HeaderColor = #F5A81C
|ImageOne = Quanta-200F-SEM.jpg
|ImageTwo = Quanta-200F-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Quanta 200F
|Techniques = SEM, ESEM, E-beam Lithography, Electrical 4-Point Probe Station, Hot Stage, Cold Stage
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Quanta 200F is a field emission gun (FEG) scanning electron microscope (SEM) that can also be operated in environmental (ESEM) mode, where a higher chamber pressure (0.1 to 27 mbar) allows for the imaging of e.g. biological samples without lysing cells. While the Quanta does not have an immersion lens for ultra-high-resolution imaging, as all other KNI SEMs do, this actually allows the Quanta's non-immersion objective lens to be optimally placed for "field-free imaging," making it the KNI's highest resolution SEM when operating outside of Immersion Mode. The Quanta is also equipped with an e-beam lithography system, a four-point electrical probing station, and a Hot/Cold Stage attachment. Its small chamber allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for the Quanta below.
===== SEM Applications =====
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD)
* Backscattered Electron (BSE) imaging with a solid-state Backscattered Electron Detector (BSED)
* ESEM Mode for imaging biological samples using Large Field Detector (LFD) & Gaseous Secondary Electron Detector (GSED)
* ESEM Mode for imaging highly non-conductive samples using LFD & GSED (the water vapor environment wicks away charge from sample); 500 μm clip-on aperture (to the bottom of the SEM column) is available for use in ESEM Mode to improve resolution
===== Other Applications =====
* E-beam lithography with the Nanometer Pattern Generating System (NPGS) software
* Hot & Cold Stage for observing a sample from -185 to 240 °C
* Four-Point Electrical Probe Station for ''in situ'' electrical measurements

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/1yqfsg1cl6x9w9414bsqiqxcp4cl2bub Short Version] | [https://caltech.box.com/s/qwjhdb252dq8lk5ap5up829pvd3g1fvo Long Version])
* E-beam Lithography SOPs ([https://caltech.box.com/s/n5ft2s02i92698vy3m1w6tp60s2o407s Short Version] | [https://caltech.box.com/s/pt78znsx8dj01t7fuwdknzq0uzvy3ueg Long Version])
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned Patterning Steps with NPGS] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide]
* [https://caltech.box.com/s/xa6da8tjz4u5yksi9ozhvg1l1f6v357a Review Paper on secondary electron contrast in low-vacuum and ESEM of dielectrics]
* [https://caltech.box.com/s/n91a9brnyg5ntg48ztkzn95knl63i9ed Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on ESEM, Lithography, Probe Station, Hot & Cold Stage)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/urxbsk9wrruxcnj345c3rjb37dc48k64 Quanta 200F SEM Operation Manual]
* [https://caltech.box.com/s/ijtjy0dzm7kwiidm0v87jlw8t9azi0xr Mailbox Prober Operation Manual]
* [https://caltech.box.com/s/07oq9u320tfds4iktjzlr62n8l1rh95r Gatan C1002 Cold Stage Users Manual]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== SEM & ESEM Specifications =====
* Minimum Feature Size Resolved in SEM Mode: ~15 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spot Size" 1 to 7 (approximately 30 pA to 20 nA), with increments of 0.1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 10 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -150 to 70° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* Ultimate Vacuum: 3e-7 mbar
* ESEM Mode Pressure Range: 0.1 to 27.0 mbar (water vapor is used as chamber gas)
* Minimum Feature Size Resolved in ESEM Mode: ~10 nm

===== Lithography with NPGS Specifications =====
* Minimum Feature Produced: ~17 nm diameter dots & ~20 nm wide lines (via liftoff of 10 nm Ti on Si)
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Writing Speed: 5 MHz
* Digital-to-Analog Converter (DAC): 16-bit
* Keithley 487 Picoammeter / Voltage Source is available for measuring beam current
===== Probe Station Specifications =====
* Probe Station Manufacturer: Kammrath & Weiss
* Parameter Analyzer: HP4145B Available [https://caltech.box.com/s/xumvbal8rmyggb3h87hk0g5s8b957hqg (Manual)], or bring your own
* Keithley 487 Picoammeter / Voltage Source is available as a function generator
* Probe station connectors rated up to 42 V, measure up to mA of current
===== Hot & Cold Stage Specifications =====
* Temperature Range: -185 to 240° C
* Stage is cooled by air that is itself cooled by flowing it through a liquid nitrogen heat exchanger
* Stage is heated by a resistive heating element
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscope =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2025-10-17T20:14:38Z

Tkimoto:

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Yonghwi Kim]]
|StaffEmail = ykim@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/a7rguo6eyf5aq5tpel3bsu2xsg8ko9an Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Masterclasses for Microscopy
** [https://caltech.box.com/s/piz9rl1owlpxhjtakcxrbr81pj0r3f6x Pptx Slides]
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V

Equipment List

2025-10-16T03:15:32Z

Tkimoto:

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]


===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]

* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====

* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Scriber-Breaker

2025-10-16T03:11:49Z

Tkimoto:

{{InstrumentInfoboxOneImage|
|InstrumentName = Scriber-Breaker
|HeaderColor = #E6E7E8
|ImageOne = Dynatex-GST-150_Scriber-Breaker.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Substrate_Processing|Substrate Processing]]
|RoomLocation = B213 Steele
|LabPhone = 626-395-1537
|PrimaryStaff = [[Nathan S. Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Dynatex
|Model = GST-150
|Techniques = Wafer & Chip Scribing, Scribe Breaking
|EmailList = kni-scriber
|EmailListName = Scriber
}}
== Description ==
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
===== Applications =====
* Scribing and/or breaking wafers

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/f02g7mjwi4asprd2ekiiotq6c09gp2bc Dynatex GST-150 - Operation SOP and Troubleshooting Guide]
* [https://caltech.box.com/s/6sv7l95xxx8927f19sv04vcycx2p8yhq Dynatex GST-150 - Operation Quick Reference Guide]
* [https://caltech.box.com/s/4yd6vvov0fk759pzh2e5dihcuipbeptc Dynatex GST-150 - Tool Change SOP - STAFF or Qualified Personel Only]

===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GST-150 Manual]
* [https://caltech.box.com/s/2hbk1r4847wru8tqayxjkw0soejpvx0k Scribe & Break Theory for GST-150]

== Specifications ==
===== Specifications =====
* Accommodated Sizes: up to 6" wafers
* Acceptable Materials: InP, GaAs, or Silicon substrates.

Yonghwi Kim

2025-10-14T23:39:49Z

Tkimoto: /* Scanning Electron Microscopes (SEMs) */

__NOTOC__
{{StaffMemberInfobox
|StaffName = Yonghwi Kim
|StaffPhoto = Yonghwi-kim.jpg
|JobTitle = Electron and Ion Microscope Manager
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (Helium/Neon/Gallium FIB), Atomic Force Microscope, Profilometer
|CaltechID = ykim
|Phone = 626-395-5994 (office)
|OfficeLocation = 303 Steele
}}
== About ==
===== Role in the KNI =====
Yonghwi Kim is the Electron and Ion Microscope Manager at the Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He oversees the daily operation of the Quanta scanning electron microscope (SEM) with environmental mode (ESEM), Sirion field emission SEM, Nova 600 focused ion beam (FIB), Zeiss ORION NanoFab Helium/Neon/Gallium FIB, atomic force microscope, and profilometer. In this role, he trains researchers in equipment operation and provides technical support to enable impactful scientific discoveries.

Yonghwi joined Caltech in 2013 as a Ph.D. student in Electrical Engineering, conducting his doctoral research in Prof. Harry A. Atwater’s group on electrically reconfigurable nanophotonic devices based on phase-transition materials. After completing his Ph.D., he pursued postdoctoral research at NTT Research while serving as a Visiting Associate at Caltech, where he advanced nanofabrication methods for nonlinear optical waveguides in the KNI cleanroom. He returned to Caltech in 2025 to continue his technical career as the Electron and Ion Microscope Manager at the KNI.

===== Education =====
Yonghwi received his Ph.D. and M.S. degrees in Electrical Engineering from Caltech under the supervision of Prof. Harry A. Atwater. Prior to that, he earned his B.S. and M.S. degrees in Electrical and Electronic Engineering from Yonsei University in Seoul, South Korea, advised by Prof. Donghyun Kim.

== List of Managed Instruments ==

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Sirion: SEM & EDS]]
<!---* [[ Nova 200 NanoLab: SEM & EDS]]---!>

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

== Selected Publications ==
• '''Kim, Y.''' et al., “[https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01246 Phase Modulation with Electrically Tunable Vanadium Dioxide Phase-Change Metasurfaces],” '''''Nano Letters''''', 2019.

• '''Kim, Y'''. et al., "[https://pubs.aip.org/aip/apl/article-abstract/101/23/233701/1077838/Nanogap-based-dielectric-specific-colocalization?redirectedFrom=fulltext Nanogap-based dielectric-specific colocalization for highly sensitive surface plasmon resonance detection of biotin-streptavidin interactions]," '''''Applied Physics Letters''''', 2012.

• Gao, R., Kelzenberg M. D., '''Kim, Y.''' et al., “[https://pubs.acs.org/doi/10.1021/acsphotonics.1c02022 Optical characterization of silicon nitride metagrating-based lightsails for self-stabilization],” '''''ACS Photonics''''', 2022.

• Shayegan, K. J., Zhao, B., '''Kim, Y.''' et al., “[https://www.science.org/doi/10.1126/sciadv.abm4308 Nonreciprocal infrared absorption via resonant magneto-optical coupling to InAs],” '''''Science Advances''''', 2022.

• '''Kim, Y.''' et al., “[https://www.osti.gov/biblio/1998419 Electrically Tunable Metasurfaces Incorporating A Phase Change Material],” '''''U.S. Patent''','' 2024''.''

Alex Wertheim

2025-10-14T23:39:12Z

Tkimoto:

__NOTOC__
{{StaffMemberInfobox
|StaffName = Alex Wertheim
|StaffPhoto = Alex-wertheim.png
|JobTitle = Materials Process Engineer
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, RTP, Carbon Evaporator
|CaltechID = alexw
|Phone = 626-395-3371 (office)
|OfficeLocation = 130 Steele
|Email = alexw@caltech.edu
}}
== About ==
===== Role in the KNI =====
Alex is the Materials & Process Engineer for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. Alex's background is mostly in reactive physical vapor deposition (PVD) processes, crystal growth mechanisms, opto-electronic property characterization, and the complex vacuum technologies that enable advanced materials synthesis. In addition to managing, maintaining, operating, teaching equipment usage, and offering fabrication advice, he spends partial time engaging in research collaborations with groups at Caltech.

His research interests include: Bio-sensors, neural probes, wireless implants, bio-compatible/bio-inspired materials and systems.

===== Education =====
Alex received his M.S. in Materials Science & Engineering from Arizona State University, and a B.S. in Physics from the State University of New York at New Paltz.

== List of Managed Instruments ==
===== Deposition =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

===== Etching =====
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Lithography =====
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

===== Support Tools =====
* [[Carbon Evaporator | Carbon Evaporator]]
* [[Rapid Thermal Processor | Rapid Thermal Processor]]

KNI Staff Members

2025-10-14T23:38:57Z

Tkimoto:

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Technical Director Member of the Professional Staff
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Executive Director
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-kimoto.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Laboratory Infrastructure Manager
|CaltechID = nathslee
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-395-4386 (cell)
|AreasResponsibility = General Infrastructure, Safety, Photolithography
|Photo = Nathan-lee.png
}}
|-
{{StaffMemberTableItem|
|Name = Yonghwi Kim
|JobTitle = Electron and Ion Microscope Manager
|CaltechID = ykim
|Office = 303 Steele
|Phone = 626-395-5994 (office)
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (He/Ne/Ga FIB), Atomic Force Microscope, Profilometer
|Photo = yonghwi-kim.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Kelly McKenzie
|JobTitle = Plasma Process Engineer
|CaltechID = kmmckenz
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Plasma Etch / Deposition, Tube Furnaces
|Photo = McKenzie_Kelly_2.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 303 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, Carbon Evaporator, RTP
|Photo = Alex-wertheim.png
}}
|-
{{StaffMemberTableItem|
|Name = Sydney Garstang
|JobTitle = Senior Administrative Coordinator
|CaltechID = sydney
|Office = 128 Steele
|Phone = 626-395-3244 (office)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Sydney-Garstang.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Benjamin Boone
|JobTitle = UG Lab Assistant
|CaltechID = bboone
|Office =
|Phone =
|AreasResponsibility = General Lab Support
|Photo =
}}
|-
{{StaffMemberTableItem|
|Name = David Castillo
|JobTitle = UG Lab Assistant
|CaltechID = dcastil2
|Office =
|Phone =
|AreasResponsibility = General Lab Support
|Photo = David-castillo.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Tuyako Khristoforova
|JobTitle = UG Lab Assistant
|CaltechID = tkhristo
|Office =
|Phone =
|AreasResponsibility = General Lab Support
|Photo = tuyako-khristoforova.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}

Equipment List

2025-10-14T23:38:15Z

Tkimoto:

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
<!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---!>

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
<!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---!>
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====
<!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---!>
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Alex Wertheim

2025-10-14T23:35:41Z

Tkimoto:

__NOTOC__
{{StaffMemberInfobox
|StaffName = Alex Wertheim
|StaffPhoto = Alex-wertheim.png
|JobTitle = Materials Process Engineer
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, Carbon Evaporator
|CaltechID = alexw
|Phone = 626-395-3371 (office)
|OfficeLocation = 130 Steele
|Email = alexw@caltech.edu
}}
== About ==
===== Role in the KNI =====
Alex is the Materials & Process Engineer for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. Alex's background is mostly in reactive physical vapor deposition (PVD) processes, crystal growth mechanisms, opto-electronic property characterization, and the complex vacuum technologies that enable advanced materials synthesis. In addition to managing, maintaining, operating, teaching equipment usage, and offering fabrication advice, he spends partial time engaging in research collaborations with groups at Caltech.

His research interests include: Bio-sensors, neural probes, wireless implants, bio-compatible/bio-inspired materials and systems.

===== Education =====
Alex received his M.S. in Materials Science & Engineering from Arizona State University, and a B.S. in Physics from the State University of New York at New Paltz.

== List of Managed Instruments ==
===== Deposition =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

===== Etching =====
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Lithography =====
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

===== Support Tools =====
* [[Carbon Evaporator | Carbon Evaporator]]
* [[Rapid Thermal Processor | Rapid Thermal Processor]]

Alex Wertheim

2025-10-14T23:16:34Z

Tkimoto:

__NOTOC__
{{StaffMemberInfobox
|StaffName = Alex Wertheim
|StaffPhoto = Alex-wertheim.png
|JobTitle = Materials Process Engineer
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, Carbon Evaporator
|CaltechID = alexw
|Phone = 626-395-3371 (office)
|OfficeLocation = 130 Steele
|Email = alexw@caltech.edu
}}
== About ==
===== Role in the KNI =====
Alex is the Materials & Process Engineer for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. Alex's background is mostly in reactive physical vapor deposition (PVD) processes, crystal growth mechanisms, opto-electronic property characterization, and the complex vacuum technologies that enable advanced materials synthesis. In addition to managing, maintaining, operating, teaching equipment usage, and offering fabrication advice, he spends partial time engaging in research collaborations with groups at Caltech.

His research interests include: Bio-sensors, neural probes, wireless implants, bio-compatible/bio-inspired materials and systems.

===== Education =====
Alex received his M.S. in Materials Science & Engineering from Arizona State University, and a B.S. in Physics from the State University of New York at New Paltz.

== List of Managed Instruments ==
===== Deposition =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

===== Etching =====
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Lithography =====
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

===== Support Tools =====
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Carbon Evaporator | Carbon Evaporator]]

Alex Wertheim

2025-10-14T23:14:57Z

Tkimoto:

__NOTOC__
{{StaffMemberInfobox
|StaffName = Alex Wertheim
|StaffPhoto = Alex-wertheim.png
|JobTitle = Materials Process Engineer
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, Carbon Evaporator
|CaltechID = alexw
|Phone = 626-395-3371 (office)
|OfficeLocation = 130 Steele
|Email = alexw@caltech.edu
}}
== About ==
===== Role in the KNI =====
Alex is the Materials & Process Engineer for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. Alex's background is mostly in reactive physical vapor deposition (PVD) processes, crystal growth mechanisms, opto-electronic property characterization, and the complex vacuum technologies that enable advanced materials synthesis. In addition to managing, maintaining, operating, teaching equipment usage, and offering fabrication advice, he spends partial time engaging in research collaborations with groups at Caltech.

His research interests include: Bio-sensors, neural probes, wireless implants, bio-compatible/bio-inspired materials and systems.

===== Education =====
Alex received his M.S. in Materials Science & Engineering from Arizona State University, and a B.S. in Physics from the State University of New York at New Paltz.

== List of Managed Instruments ==
===== Deposition =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

===== Etching =====
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Lithography =====
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

===== Support Tools =====
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]

Alex Wertheim

2025-10-14T23:13:57Z

Tkimoto:

__NOTOC__
{{StaffMemberInfobox
|StaffName = Alex Wertheim
|StaffPhoto = Alex-wertheim.png
|JobTitle = Materials Process Engineer
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, Carbon Evaporator
|CaltechID = alexw
|Phone = 626-395-3371 (office)
|OfficeLocation = 130 Steele
|Email = alexw@caltech.edu
}}
== About ==
===== Role in the KNI =====
Alex is the Materials & Process Engineer for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. Alex's background is mostly in reactive physical vapor deposition (PVD) processes, crystal growth mechanisms, opto-electronic property characterization, and the complex vacuum technologies that enable advanced materials synthesis. In addition to managing, maintaining, operating, teaching equipment usage, and offering fabrication advice, he spends partial time engaging in research collaborations with groups at Caltech.

His research interests include: Bio-sensors, neural probes, wireless implants, bio-compatible/bio-inspired materials and systems.

===== Education =====
Alex received his M.S. in Materials Science & Engineering from Arizona State University, and a B.S. in Physics from the State University of New York at New Paltz.

== List of Managed Instruments ==
===== Deposition =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

===== Etching =====
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Lithography =====
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

===== Support Tools =====
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]

Alex Wertheim

2025-10-14T23:12:50Z

Tkimoto:

__NOTOC__
{{StaffMemberInfobox
|StaffName = Alex Wertheim
|StaffPhoto = Alex-wertheim.png
|JobTitle = Materials Process Engineer
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|CaltechID = alexw
|Phone = 626-395-3371 (office)
|OfficeLocation = 130 Steele
|Email = alexw@caltech.edu
}}
== About ==
===== Role in the KNI =====
Alex is the Materials & Process Engineer for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. Alex's background is mostly in reactive physical vapor deposition (PVD) processes, crystal growth mechanisms, opto-electronic property characterization, and the complex vacuum technologies that enable advanced materials synthesis. In addition to managing, maintaining, operating, teaching equipment usage, and offering fabrication advice, he spends partial time engaging in research collaborations with groups at Caltech.

His research interests include: Bio-sensors, neural probes, wireless implants, bio-compatible/bio-inspired materials and systems.

===== Education =====
Alex received his M.S. in Materials Science & Engineering from Arizona State University, and a B.S. in Physics from the State University of New York at New Paltz.

== List of Managed Instruments ==
===== Deposition =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

===== Etching =====
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Lithography =====
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

===== Support Tools =====
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]

KNI Staff Members

2025-10-14T23:12:37Z

Tkimoto:

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Technical Director Member of the Professional Staff
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Executive Director
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-kimoto.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Laboratory Infrastructure Manager
|CaltechID = nathslee
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-395-4386 (cell)
|AreasResponsibility = General Infrastructure, Safety, Photolithography
|Photo = Nathan-lee.png
}}
|-
{{StaffMemberTableItem|
|Name = Yonghwi Kim
|JobTitle = Electron and Ion Microscope Manager
|CaltechID = ykim
|Office = 303 Steele
|Phone = 626-395-5994 (office)
|AreasResponsibility = Scanning Electron Microscope, Focused Ion Beam (He/Ne/Ga FIB), Atomic Force Microscope, Profilometer
|Photo = yonghwi-kim.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Kelly McKenzie
|JobTitle = Plasma Process Engineer
|CaltechID = kmmckenz
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Plasma Etch / Deposition, Tube Furnaces
|Photo = McKenzie_Kelly_2.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 303 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry, Carbon Evaporator
|Photo = Alex-wertheim.png
}}
|-
{{StaffMemberTableItem|
|Name = Sydney Garstang
|JobTitle = Senior Administrative Coordinator
|CaltechID = sydney
|Office = 128 Steele
|Phone = 626-395-3244 (office)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Sydney-Garstang.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Benjamin Boone
|JobTitle = UG Lab Assistant
|CaltechID = bboone
|Office =
|Phone =
|AreasResponsibility = General Lab Support
|Photo =
}}
|-
{{StaffMemberTableItem|
|Name = David Castillo
|JobTitle = UG Lab Assistant
|CaltechID = dcastil2
|Office =
|Phone =
|AreasResponsibility = General Lab Support
|Photo = David-castillo.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Tuyako Khristoforova
|JobTitle = UG Lab Assistant
|CaltechID = tkhristo
|Office =
|Phone =
|AreasResponsibility = General Lab Support
|Photo = tuyako-khristoforova.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}