The KNI Lab at Caltech - User contributions [en]

Lab Rules & Safety

2025-12-08T20:17:20Z

Sydney: Updated email address for KNI Safety Officer to Nathan Lee's (nathslee@caltech.edu).

*Completed form may be emailed to the [mailto:nathslee@caltech.edu KNI Safety Officer] or printed out and left on the inside of the lab entrance door in B207.{| class="wikitable" style="width: 75%;"
=KNI Cleanroom Lab Rules and Safety Documents=
<blockquote>
'''All KNI members must follow the general SOPs, tool reservation policies, and cleanroom procedures.
::To protect the safety of all lab users and staff, repeated violations to these policies will result in revocation of lab access.'''
:::This is an example of what could happen with a minor offense.
:::*1st offense will be a verbal warning.
:::*2nd offense will be an e-mail warning with the PI or supervisor copied in the e-mail.
:::*3rd offense will be a revocation of lab access until the offense is discussed with the PI or Supervisor.
'''Caltech's Laboratory Safety Orientation through the Environmental Health and Safety (EHS) department is required if you are using a lab on campus. The training is offered via Zoom twice a month. If you have not taken EHS Lab Safety Orientation, instructions to register for this training can be found at:'''
*[https://www.safety.caltech.edu/root-pages/lab-safety-orientation Caltech's EHS Lab Safety Orientation]- You may start and complete KNI safety training before completing the EHS safety training. You must complete EHS Laboratory Safety Orientation before being allowed to use the KNI cleanroom.
</blockquote>
=== KNI User Handbook and Operation Procedures===
*[https://caltech.box.com/s/tmqnu5x7ms6onfln2klzowazyrkvhqrh KNI User Handbook and Operation Procedures]- Provides a broad overview of the information needed specific to the KNI Cleanroom.
=== KNI Safety Manual ===
* [https://caltech.box.com/s/sr5tv327p38njqajufclg57u5w7r018s KNI Safety Manual] - Provides a broad overview of information for Referenced Documents, Safety Requirements, and Chemical Safety Information.
===KNI Workplace Specific Safety Training===
* [https://caltech.box.com/s/aqhblyh9zdegaiv4j72ohkvkhypys0mx KNI Workplace Specific Safety Training presentation] - Provides an overview of Safety Procedures specific to the KNI cleanroom.
===KNI Emergency Procedures===
* [https://caltech.box.com/s/32soejgjqog61l4bs67cqrrejzxav6es KNI Emergency Procedures presentation] - Provides an overview of Emergency Procedures specific to the KNI cleanroom.
===KNI Buddy System===
* [https://lab.kni.caltech.edu/Wet_Chemistry_Safety#Buddy_System KNI Buddy System SOP]- Link to Wet Chemistry Safety page with description of buddy system and link to SOP.
::1. The laboratory is open to qualified users both day and night, weekdays and weekends. Certain instruments and procedures may, however, be restricted to the normal work day, or only allowed in the presence of a staff member. In general, a“buddy” is another knowledgeable user within the facility who can and will watch out for you in case of trouble. Laboratory “buddies” must of necessity communicate with each other to be effective. The use of chemicals in particular is restricted to the buddy system after normal hours, i.e. all time outside 8 a.m.-5 p.m. normal workdays.

::2. A buddy is also required anytime a gas cylinder is change. You must first be qualified to change a gas cylinder by a staff member.

===KNI Cleanroom Hours===
* Lab members are allowed to use the KNI 24 hours per day, 7 days per week.
**Use both card scanners when entering the gowning room B207. One scanner will log you into LabRunr and the second will unlock B207 door.
***If you forgot your badge contact a KNI staff member to unlock B207 and allow entrance. DO NOT SCAN YOUR BADGE FOR MEMBERS THAT DO NOT HAVE A BADGE TO ENTER B207.
***If your badge does not work for LabRunr, notify a KNI staff member. It is okay to use the cleanroom.
***If your badge does not unlock B207 or the Steele building entrance doors, contact Guy DeRose.
** KNI Lab Occupancy Limit: Maximum 41 people allowed in the lab at any given time.
**No food or drinks are allowed in the cleanroom. This includes the gowning room B207.

:::''Food or drinks may be stored outside the lab entrance on the wire rack.'' 
* [https://caltech.box.com/s/v4ztcv86rrvle0luvoc02eqb10jo1dp3 KNI Lab Entry and Exit SOP] - SOP for entering the sub-basement, gowning, de-gowning, and leaving the sub-basement.
* [https://caltech.box.com/s/n3kyhalo3dzzq789a1jq1opx067ltk8a KNI Lab Entry Video] - Video showing proper way to put on the cleanroom attire.
* [https://caltech.box.com/s/9lagfno1jygz50ero736ghdww4tm1q4s KNI Lab Exit Video] - Video showing proper way to take off and hang the cleanroom attire.
===KNI Lab Visitor Policy===
*KNI visitors may be hosted by KNI members.
#Each member may host up to 4 visits per quarter
#Fill and Sign the [https://caltech.box.com/s/jsd88cg6i1kjqds62pjoss3tcvj1wdv1 KNI Visitor Record form].
*Completed form may be emailed to the [mailto:nathslee@caltech.edu KNI Safety Officer] or printed out and left on the inside of the lab entrance door in B207.
<blockquote>
#VISITOR RULES: (Notify visitors of the dress code prior to visit)
##Visitor must be properly attired to visit the lab: '''Long pants, closed-toe shoes, and at least short-sleeved shirt are required.'''
##Visitor must wear the cleanroom garments correctly.
##Visitor HOURS: 8:00 a.m. and 5:00 p.m. Monday – Friday. (unless approved prior to visit)
##Visit may not exceed 2 hours in length. (unless approved prior to visit)
##Visitor may not operate any equipment, participate in training, or handle any chemicals.
##Host shall instruct visitor in the location and use of emergency exits and safety stations.
##Visitor shall remain with Host AT ALL TIMES DURING THE VISIT.
===KNI Equipment Training===
:: Contact the tool manager listed on the equipment Wiki page through your [https://mh-fbs1.caltech.edu/ FBS User Activity Dashboard].
:: '''Note: You will be setup with an FBS account after you complete the [https://lab.kni.caltech.edu/New_Members New KNI Lab User sign-up process].'''
:: Review the [https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] for instructions on tool training requests and scheduling.
*The tool manager will need a description of your process and any information about your samples.
*Provide your availability over the next two weeks for training so the tool manager can schedule training.
*Training for lab members will be in-person and may also include hybrid remote (Slack / Zoom). Bluetooth headphones are provided and are stored in B233.
*The KNI technical staff members will operate on five days per week in-lab schedule unless there are schedule conflicts. Staff will either be working in their offices or telecommuting. Some delay in response to equipment requests is to be expected.
* Once you are qualified by a staff member you will be able to reserve the system through FBS.
*[https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b KNI Equipment Scheduling Policy] - This is the General Reservation Policy. Check the TOOL Wiki page for any special reservation rules associated with that piece of equipment.

==KNI Safety Data Sheets (SDS)==
===[[Provided_Chemicals | Chemicals Provided by the KNI with typical SDS]]===
===[[Safety Data Sheets (SDS) | Approved Chemicals: Allowed to be used in the KNI with typical SDS (chemical not provided by the KNI)]]===
=== [https://www.chemicalsafety.com/sds-search Search for Safety Data Sheets (SDS)] - New Chemical Search (Web Search)===

= Caltech Safety Documents =
===Caltech Chemical Hygiene Plan===
* [https://safety.caltech.edu/documents/13874/Chemical_Hygiene_Plan.pdf Caltech Chemical Hygiene Plan] - Provides a broad overview of the information needed for safely working with hazardous chemicals in the laboratory.
===Caltech Hazardous Waste Management Guide===
* [https://safety.caltech.edu/documents/16478/Hazardous_Waste_Management_Guide.pdf Caltech Hazardous Waste Management Guide] - Provides a broad overview of information on Hazardous Waste determination, handling and disposal requirements, etc.
===Caltech Personal Protective Equipment===
* [https://safety.caltech.edu/root-pages/personal-protective-equipment Caltech Personal Protective Equipment] - Appropriate Personal Protective Equipment (PPE) must match the task hazards and equipment is prescribed when hazards cannot be eliminated by administrative or engineering controls.
= California Nanosafety Consortium of Higher Education =
===Nanotoolkit===
* [https://safety.caltech.edu/documents/14132/Nanomaterials_Toolkit.pdf Nanotoolkit: Working Safely with Engineered Nanomaterials in Academic Research Settings]
= KNI Safety Presentations =
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Cleanroom Safety Review 2016]
* [https://caltech.box.com/s/lnkuj3x4xfn7343i7lf4m5gtl9vmwyvr KNI Cleanroom Safety Review 2018]
* [https://caltech.box.com/s/20ycg3j0s0575j0rk9ejewlmlpynh69t KNI Cleanroom Safety Review 2019]
* [https://caltech.box.com/s/l59x34gl5zn71fjnkrvvuszy5pl3ppcy KNI Cleanroom Safety Review 2022]


|}

Lab Rules & Safety

2025-12-08T20:16:29Z

Sydney: Updated email address for KNI Safety Officer to Nathan Lee's (nathslee@caltech.edu).

*Completed form may be emailed to the [mailto:nathslee@caltech.edu KNI Safety Officer] or printed out and left on the inside of the lab entrance door in B207.{| class="wikitable" style="width: 75%;"
=KNI Cleanroom Lab Rules and Safety Documents=
<blockquote>
'''All KNI members must follow the general SOPs, tool reservation policies, and cleanroom procedures.
::To protect the safety of all lab users and staff, repeated violations to these policies will result in revocation of lab access.'''
:::This is an example of what could happen with a minor offense.
:::*1st offense will be a verbal warning.
:::*2nd offense will be an e-mail warning with the PI or supervisor copied in the e-mail.
:::*3rd offense will be a revocation of lab access until the offense is discussed with the PI or Supervisor.
'''Caltech's Laboratory Safety Orientation through the Environmental Health and Safety (EHS) department is required if you are using a lab on campus. The training is offered via Zoom twice a month. If you have not taken EHS Lab Safety Orientation, instructions to register for this training can be found at:'''
*[https://www.safety.caltech.edu/root-pages/lab-safety-orientation Caltech's EHS Lab Safety Orientation]- You may start and complete KNI safety training before completing the EHS safety training. You must complete EHS Laboratory Safety Orientation before being allowed to use the KNI cleanroom.
</blockquote>
=== KNI User Handbook and Operation Procedures===
*[https://caltech.box.com/s/tmqnu5x7ms6onfln2klzowazyrkvhqrh KNI User Handbook and Operation Procedures]- Provides a broad overview of the information needed specific to the KNI Cleanroom.
=== KNI Safety Manual ===
* [https://caltech.box.com/s/sr5tv327p38njqajufclg57u5w7r018s KNI Safety Manual] - Provides a broad overview of information for Referenced Documents, Safety Requirements, and Chemical Safety Information.
===KNI Workplace Specific Safety Training===
* [https://caltech.box.com/s/aqhblyh9zdegaiv4j72ohkvkhypys0mx KNI Workplace Specific Safety Training presentation] - Provides an overview of Safety Procedures specific to the KNI cleanroom.
===KNI Emergency Procedures===
* [https://caltech.box.com/s/32soejgjqog61l4bs67cqrrejzxav6es KNI Emergency Procedures presentation] - Provides an overview of Emergency Procedures specific to the KNI cleanroom.
===KNI Buddy System===
* [https://lab.kni.caltech.edu/Wet_Chemistry_Safety#Buddy_System KNI Buddy System SOP]- Link to Wet Chemistry Safety page with description of buddy system and link to SOP.
::1. The laboratory is open to qualified users both day and night, weekdays and weekends. Certain instruments and procedures may, however, be restricted to the normal work day, or only allowed in the presence of a staff member. In general, a“buddy” is another knowledgeable user within the facility who can and will watch out for you in case of trouble. Laboratory “buddies” must of necessity communicate with each other to be effective. The use of chemicals in particular is restricted to the buddy system after normal hours, i.e. all time outside 8 a.m.-5 p.m. normal workdays.

::2. A buddy is also required anytime a gas cylinder is change. You must first be qualified to change a gas cylinder by a staff member.

===KNI Cleanroom Hours===
* Lab members are allowed to use the KNI 24 hours per day, 7 days per week.
**Use both card scanners when entering the gowning room B207. One scanner will log you into LabRunr and the second will unlock B207 door.
***If you forgot your badge contact a KNI staff member to unlock B207 and allow entrance. DO NOT SCAN YOUR BADGE FOR MEMBERS THAT DO NOT HAVE A BADGE TO ENTER B207.
***If your badge does not work for LabRunr, notify a KNI staff member. It is okay to use the cleanroom.
***If your badge does not unlock B207 or the Steele building entrance doors, contact Guy DeRose.
** KNI Lab Occupancy Limit: Maximum 41 people allowed in the lab at any given time.
**No food or drinks are allowed in the cleanroom. This includes the gowning room B207.

:::''Food or drinks may be stored outside the lab entrance on the wire rack.'' 
* [https://caltech.box.com/s/v4ztcv86rrvle0luvoc02eqb10jo1dp3 KNI Lab Entry and Exit SOP] - SOP for entering the sub-basement, gowning, de-gowning, and leaving the sub-basement.
* [https://caltech.box.com/s/n3kyhalo3dzzq789a1jq1opx067ltk8a KNI Lab Entry Video] - Video showing proper way to put on the cleanroom attire.
* [https://caltech.box.com/s/9lagfno1jygz50ero736ghdww4tm1q4s KNI Lab Exit Video] - Video showing proper way to take off and hang the cleanroom attire.
===KNI Lab Visitor Policy===
*KNI visitors may be hosted by KNI members.
#Each member may host up to 4 visits per quarter
#Fill and Sign the [https://caltech.box.com/s/jsd88cg6i1kjqds62pjoss3tcvj1wdv1 KNI Visitor Record form].
*Completed form may be emailed to the [mailto:bertm@caltech.edu KNI Safety Officer] or printed out and left on the inside of the lab entrance door in B207.
<blockquote>
#VISITOR RULES: (Notify visitors of the dress code prior to visit)
##Visitor must be properly attired to visit the lab: '''Long pants, closed-toe shoes, and at least short-sleeved shirt are required.'''
##Visitor must wear the cleanroom garments correctly.
##Visitor HOURS: 8:00 a.m. and 5:00 p.m. Monday – Friday. (unless approved prior to visit)
##Visit may not exceed 2 hours in length. (unless approved prior to visit)
##Visitor may not operate any equipment, participate in training, or handle any chemicals.
##Host shall instruct visitor in the location and use of emergency exits and safety stations.
##Visitor shall remain with Host AT ALL TIMES DURING THE VISIT.
===KNI Equipment Training===
:: Contact the tool manager listed on the equipment Wiki page through your [https://mh-fbs1.caltech.edu/ FBS User Activity Dashboard].
:: '''Note: You will be setup with an FBS account after you complete the [https://lab.kni.caltech.edu/New_Members New KNI Lab User sign-up process].'''
:: Review the [https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] for instructions on tool training requests and scheduling.
*The tool manager will need a description of your process and any information about your samples.
*Provide your availability over the next two weeks for training so the tool manager can schedule training.
*Training for lab members will be in-person and may also include hybrid remote (Slack / Zoom). Bluetooth headphones are provided and are stored in B233.
*The KNI technical staff members will operate on five days per week in-lab schedule unless there are schedule conflicts. Staff will either be working in their offices or telecommuting. Some delay in response to equipment requests is to be expected.
* Once you are qualified by a staff member you will be able to reserve the system through FBS.
*[https://caltech.box.com/s/r154cwy4xi1dfte7m1rr6zpey54ru28b KNI Equipment Scheduling Policy] - This is the General Reservation Policy. Check the TOOL Wiki page for any special reservation rules associated with that piece of equipment.

==KNI Safety Data Sheets (SDS)==
===[[Provided_Chemicals | Chemicals Provided by the KNI with typical SDS]]===
===[[Safety Data Sheets (SDS) | Approved Chemicals: Allowed to be used in the KNI with typical SDS (chemical not provided by the KNI)]]===
=== [https://www.chemicalsafety.com/sds-search Search for Safety Data Sheets (SDS)] - New Chemical Search (Web Search)===

= Caltech Safety Documents =
===Caltech Chemical Hygiene Plan===
* [https://safety.caltech.edu/documents/13874/Chemical_Hygiene_Plan.pdf Caltech Chemical Hygiene Plan] - Provides a broad overview of the information needed for safely working with hazardous chemicals in the laboratory.
===Caltech Hazardous Waste Management Guide===
* [https://safety.caltech.edu/documents/16478/Hazardous_Waste_Management_Guide.pdf Caltech Hazardous Waste Management Guide] - Provides a broad overview of information on Hazardous Waste determination, handling and disposal requirements, etc.
===Caltech Personal Protective Equipment===
* [https://safety.caltech.edu/root-pages/personal-protective-equipment Caltech Personal Protective Equipment] - Appropriate Personal Protective Equipment (PPE) must match the task hazards and equipment is prescribed when hazards cannot be eliminated by administrative or engineering controls.
= California Nanosafety Consortium of Higher Education =
===Nanotoolkit===
* [https://safety.caltech.edu/documents/14132/Nanomaterials_Toolkit.pdf Nanotoolkit: Working Safely with Engineered Nanomaterials in Academic Research Settings]
= KNI Safety Presentations =
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Cleanroom Safety Review 2016]
* [https://caltech.box.com/s/lnkuj3x4xfn7343i7lf4m5gtl9vmwyvr KNI Cleanroom Safety Review 2018]
* [https://caltech.box.com/s/20ycg3j0s0575j0rk9ejewlmlpynh69t KNI Cleanroom Safety Review 2019]
* [https://caltech.box.com/s/l59x34gl5zn71fjnkrvvuszy5pl3ppcy KNI Cleanroom Safety Review 2022]


|}

New Members

2025-07-31T21:18:07Z

Sydney: /* Step 1: Submit Your KNI New User Form */

==Joining the KNI Lab==
The KNI Laboratory (KNI Lab) is an open-access facility for Caltech and JPL students and researchers, as well as external academic, government and industry users. Equipment and resource use is billed on a per hour basis. Customers are invoiced monthly for their use. You can find information on our [[Usage_Rates | usage rates here]].

If you have general process questions or technical questions about KNI Lab resources, please email Associate Director of Technical Operations [mailto:derose@caltech.edu Dr. Guy DeRose]. Provide as much detail as possible to ensure an efficient and timely response.

Note: There are additional requirements for external users to join the KNI Lab (see below). Please allow more time for processing.

==Step 1: Submit Your KNI New User Form==
Send your completed form to [mailto:kni@caltech.edu kni@caltech.edu]
* [https://airtable.com/app2vjzgp8AJpuC3A/pagHxiNohQX8G65DZ/form Caltech / JPL Users]
* [https://caltech.box.com/s/26w5srmths37kybjaismwwyc70y1qeiz Non-Caltech Academic or Government Users]
* [https://caltech.box.com/s/qkoz644x7f77grfgg9fi3wbc0v7j0ogn Industry / Corporate Users]

==Step 2: Submit Your Process Description Form (if needed)==
After you have submitted your new user form, you may contact [mailto:derose@caltech.edu Guy DeRose] for general process questions. Attach the
[https://caltech.box.com/s/kxkb44hdjhkw8rbj3pl9v6lh29h6b166 KNI Lab New Process Description form] to your email inquiry.

==Step 3: Safety Training==
All new lab users are required to attend the KNI-specific lab safety training, as well as Caltech's Laboratory Safety Orientation which is managed by Caltech's Environmental Health and Safety (EHS) department.

After submitting your new user form, you will receive an email from a KNI staff member with all necessary information to prepare for the KNI-specific safety training session. These sessions are held weekly, every Friday at 1 pm via Zoom.

Caltech's EHS Laboratory Safety Orientation is required if you are using any lab on campus. The training is offered by EHS via Zoom twice a month. If you have not taken EHS Lab Safety Orientation, instructions to register for this training can be found here: [https://www.safety.caltech.edu/root-pages/lab-safety-orientation Caltech's EHS Lab Safety Orientation]

''Note: You may start and complete KNI safety training before completing the EHS safety training. However, you must complete EHS Laboratory Safety Orientation in order to complete your onboarding and gain access to the KNI Lab.''

==Step 4: Setting Up Your Lab User Accounts & Access==
After you complete safety training, you will receive an email from KNI Administrator Sydney Garstang with further instructions on setting up your KNI Lab user accounts. You will need to coordinate a time to stop by her office and have your ID card scanned so that it is registered in our lab management system. This will allow you to swipe into the KNI Lab's entrance as well as login to the Lab's [https://mh-fbs1.caltech.edu/ tool reservation system (FBS)].

All KNI Lab users are required to join the KNI Lab Slack workspace for timely and important lab updates, as well as FBS, the KNI Lab's user and tool management software system. Be sure to complete your FBS User account activation when you receive the FBS Welcome Email. If you have any trouble logging into our FBS Facility page ("Kavli Nanoscience Institute (KNI"), email kni@caltech.edu.

Read the [https://caltech.box.com/s/vzxxbvgcgh5pijrf77bqga0bv8mzubad FBS User SOP] for instructions on how to request training, schedule & change tool reservations, setting up your User account, notifications, and billing details.

All KNI Lab users are also signed up to the kni-notice email list.

==Step 5: Tool-Specific Training==
Requests for specific equipment training must be submitted through the [https://mh-fbs1.caltech.edu/ User Activity Dashboard] in FBS. From the User Dashboard, scroll down to find the name of the tool you need to use, click the "Request Training" link, then provide any useful information about why you need training on the specific tool -- also be sure to include your availability for the next two weeks.

After you submit your initial training request, the KNI technical staff member in charge of the tool will receive a notification and will contact you to schedule your first training session. Once a day/time has been agreed upon, you make go directly to the FBS Calendar (scheduler) and initiate an "Assisted Use" reservation. The staff member will receive an email notification and approve the reservation.

To schedule additional (second, third, etc.) training sessions, follow the same procedure: first submit the request from the FBS User Dashboard tool list, and after a day/time is set with the staff member, go to the FBS Calendar to initiate an "Assisted Use" reservation for the agreed-upon day/time.

Refer to our [https://lab.kni.caltech.edu/Equipment_List Equipment List] page for details on all of the resources in the KNI Lab.

''Note: Users are only charged for equipment use time during training sessions. There is no additional fee (i.e. staff time) for training sessions.''

==External Users==
Non-Caltech Academic/Government and Industry/Corporate members are considered external users. There are additional requirements to set up an external user's KNI lab access:
* Facilities Use Agreement (FUA)
* Proof of Liability Insurance (COI)
* Purchase Order (PO)
* External Affiliate appointment (see note below)

If you are interested in joining the KNI Lab as an external user, please send the New User Form, Process Sheet and any other relevant details/timelines to [mailto:kni@caltech.edu kni@caltech.edu]. We will provide information on usage terms and external user rates, along with the required documentation for setting up a lab membership.

*Refer to the [https://caltech.box.com/s/urw7mwljz8jxv2d3s036h6kwx2mb8se8 External Lab User Membership Checklist] to ensure timely processing. '''All documentation must be completed and approved before lab membership is granted.'''

*Note: all external users are required to hold a formal appointment at Caltech. If you do not have one (e.g. Visitor, External Affiliate, VURP, etc.), KNI will arrange an External Affiliate appointment for you. This must be approved by our academic division office and is processed through Caltech HR.

==KNI Member Offboarding==
Users who no longer need to use the KNI Lab must send a notification email to [mailto:kni@caltech.edu kni@caltech.edu] and complete the offboarding process before their last day. Please review the [https://caltech.box.com/s/qapv4ytu4uhyszz538rz4k55mvdihyix KNI Member Offboarding SOP]. The SOP lists items such as Stored Items, Chemicals, Stored Data/Files, etc, which should to be addressed before your membership ends.

Lab Phone List

2025-07-10T16:31:16Z

Sydney: Changing Nathan Lee's cell back to 626-395-4386 per Guy

__NOTOC__
== Caltech Emergency Number ==
{| class="wikitable" style="width: 45%;"
|-
!scope="col" style="text-align:left; width: 40%"| Do NOT call 911 on campus
!scope="col" style="text-align:center; width: 30%" | Campus Extension
!scope="col" style="text-align:center; width: 30%"| Dial from Off-Campus
|-
!scope="col" style="text-align:left; background-color:#FFE2B9;"| Emergency / Security
!scope="col" style="text-align:center; background-color:#FFE2B9;" | x5000
!scope="col" style="text-align:center; background-color:#FFE2B9;"| 626-395-5000
|-
|}

== Other General Numbers ==
{| class="wikitable" style="width: 45%;"
|-
!scope="col" style="text-align:left; width: 40%"|
!scope="col" style="text-align:center; width: 30%" | Campus Extension
!scope="col" style="text-align:center; width: 30%"| Dial from Off-Campus
|-
! scope="row" style="text-align:left;"| KNI Lab-Wide General Number
| style="text-align:center;" | x1539
| style="text-align:center;"| 626-395-1539
|-
! scope="row" style="text-align:left;"| Security Non-Emergency (card issues off-hours)
| style="text-align:center;" | x4701
| style="text-align:center;"| 626-395-4701
|-
! scope="row" style="text-align:left;"| Chemical Waste Pickup
| style="text-align:center;" | x6727
| style="text-align:center;"| 626-395-6727
|-
! scope="row" style="text-align:left;"| Facilities Help Desk
| style="text-align:center;" | x4717
| style="text-align:center;"| 626-395-4717
|-
! scope="row" style="text-align:left;"| Liquid Nitrogen Dewars
| style="text-align:center;" | x4891
| style="text-align:center;"| 626-395-4891
|-
! scope="row" style="text-align:left;"| Shipping & Receiving
| style="text-align:center;" | x4893
| style="text-align:center;"| 626-395-4893
|-
|}

== Call the Lab ==
{| class="wikitable" style="width: 58%;"
|-
!scope="col" style="text-align:left; width: 31%"| Room Name
!scope="col" style="text-align:center; width: 23.3%"| Campus Extension
!scope="col" style="text-align:center; width: 23.3%"| Dial from Off-Campus
!scope="col" style="text-align:left;" | Room Number
{{LabPhoneTableItem|
|RoomName = Access to Cleanroom
|RoomNumber = B207 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = AFM
|RoomNumber = B203B Steele
|PhoneNumber = x1545
|DialFromOffCampus = 626-395-1545
}}
{{LabPhoneTableItem|
|RoomName = Corridor Passthrough
|RoomNumber = B207CO Steele
|PhoneNumber = x5434
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Cryo STM
|RoomNumber = B203A Steele
|PhoneNumber = x1540
|DialFromOffCampus = 626-395-1540
}}
{{LabPhoneTableItem|
|RoomName = Deposition Bay
|RoomNumber = B235C Steele
|PhoneNumber = x1532
|DialFromOffCampus = 626-395-1532
}}
{{LabPhoneTableItem|
|RoomName = Deposition Chase
|RoomNumber = B235B Steele
|PhoneNumber = x5422
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = DI Water
|RoomNumber = B205 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = EBPG Lab
|RoomNumber = B225C Steele B233B Steele
|PhoneNumber = x1531, x1540 or x5885
|DialFromOffCampus = 626-395-1531 -1540 or -5885
}}
{{LabPhoneTableItem|
|RoomName = EBPG Prep
|RoomNumber = B225D Steele
|PhoneNumber = x5885
|DialFromOffCampus = 626-395-5885
}}
{{LabPhoneTableItem|
|RoomName = Elevator Passthrough
|RoomNumber = B224EL Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Etching Bay
|RoomNumber = B235 Steele
|PhoneNumber = x1532
|DialFromOffCampus = 626-395-1532
}}
{{LabPhoneTableItem|
|RoomName = Etching Chase
|RoomNumber = B235A Steele
|PhoneNumber = x1533
|DialFromOffCampus = 626-395-1533
}}
{{LabPhoneTableItem|
|RoomName = Gown Storage
|RoomNumber = B124 Steele
|PhoneNumber = x5938
|DialFromOffCampus = 626-395-5938
}}
{{LabPhoneTableItem|
|RoomName = Gowning Room
|RoomNumber = B207 Steele
|PhoneNumber = x1539
|DialFromOffCampus = 626-395-1539
}}
{{LabPhoneTableItem|
|RoomName = Metrology / Scriber-Breaker
|RoomNumber = B213 Steele
|PhoneNumber = x1537
|DialFromOffCampus = 626-395-1537
}}
{{LabPhoneTableItem|
|RoomName = Nova 200 SEM/EDS
|RoomNumber = B203 Steele
|PhoneNumber = x1542
|DialFromOffCampus = 626-395-1542
}}
{{LabPhoneTableItem|
|RoomName = Nova 600 SEM/Ga-FIB
|RoomNumber = B233B Steele
|PhoneNumber = x1534
|DialFromOffCampus = 626-395-1534
}}
{{LabPhoneTableItem|
|RoomName = ORION He/Ne/Ga-FIB
|RoomNumber = B203D Steele
|PhoneNumber = x1548
|DialFromOffCampus = 626-395-1548
}}
{{LabPhoneTableItem|
|RoomName = Photolith North / MA6
|RoomNumber = B217 Steele
|PhoneNumber = x1535
|DialFromOffCampus = 626-395-1535
}}
{{LabPhoneTableItem|
|RoomName = Photolith South / Bonder
|RoomNumber = B217 Steele
|PhoneNumber = x1536
|DialFromOffCampus = 626-395-1536
}}
{{LabPhoneTableItem|
|RoomName = Quanta SEM
|RoomNumber =B233 Steele
|PhoneNumber = x5429 or x5885
|DialFromOffCampus = 626-395-5885
}}
{{LabPhoneTableItem|
|RoomName = Sirion SEM/EDS
|RoomNumber = B209 Steele
|PhoneNumber = x1541
|DialFromOffCampus = 626-395-1541
}}
{{LabPhoneTableItem|
|RoomName = Sirion Service Chase
|RoomNumber = B203ME Steele
|PhoneNumber = x5435
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = South Lab
|RoomNumber = B203 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Stepper
|RoomNumber = B217 Steele
|PhoneNumber = x5432
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Laser Interference Lithography Room
|RoomNumber = B203C Steele
|PhoneNumber = x1543
|DialFromOffCampus = 626-395-1543
}}
{{LabPhoneTableItem|
|RoomName = Tecnai TF-30 TEM
|RoomNumber = B242F Keck
|PhoneNumber = x8908
|DialFromOffCampus = 626-395-8908
}}
{{LabPhoneTableItem|
|RoomName = Video Room
|RoomNumber = B222A Steele
|PhoneNumber = x5434
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Wet Chemistry Room
|RoomNumber = B211 Steele
|PhoneNumber = x1538
|DialFromOffCampus = 626-395-1538
}}
|}

== Call the Staff ==
{| class="wikitable" style="width: 85%;"
|-
!scope="col" style="text-align:left; width: 21.2%"| KNI Staff Member
!scope="col" style="text-align:center; width: 15.9%"| Campus Extension
!scope="col" style="text-align:center; width: 15.9%"| Dial from Off-Campus
!scope="col" style="text-align:left; width: 15.3%" | Office Number
!scope="col" style="text-align:left;"| Email
!scope="col" style="text-align:left; width: 13%"| Cell
{{StaffPhoneTableItem|
|StaffName = [[Guy A. DeRose, PhD | DeRose, Guy]]
|StaffOfficeNumber = 126 Steele
|StaffOfficePhone = 3423
|CaltechID = derose
|StaffCellNumber = 626-676-8529
}}
{{StaffPhoneTableItem|
|StaffName = [[Tiffany Kimoto | Kimoto, Tiffany]]
|StaffOfficeNumber = 117 Steele
|StaffOfficePhone = 3914
|CaltechID = tkimoto
|StaffCellNumber = 310-291-7977
}}
{{StaffPhoneTableItem|
|StaffName = [[Sydney Garstang | Garstang, Sydney]]
|StaffOfficeNumber = 128 Steele
|StaffOfficePhone = 3244
|CaltechID = sydney
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Alireza Ghaffari | Ghaffari, Alireza]]
|StaffOfficeNumber = 176 Watson
|StaffOfficePhone = 3984
|CaltechID = ghaffari
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Nathan S. Lee | Lee, Nathan]]
|StaffOfficeNumber = 124 Steele
|StaffOfficePhone = 4075
|CaltechID = nathslee
|StaffCellNumber =626-395-4386
}}
|-
|-
|-
{{StaffPhoneTableItem|
|StaffName = [[Kelly McKenzie | McKenzie, Kelly]]
|StaffOfficeNumber = 330 Steele
|StaffOfficePhone = 5732
|CaltechID = kmmckenz
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Alex Wertheim | Wertheim, Alex]]
|StaffOfficeNumber = 303 Steele
|StaffOfficePhone = 3371
|CaltechID = alexw
|StaffCellNumber =
}}
|}

KNI Staff Members

2025-07-10T16:30:47Z

Sydney: Changing Nathan Lee's cell back to 626-395-4386 per Guy

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Associate Director of Technical Operations Member of the Professional Staff
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Executive Director
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-Kimoto.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Sydney Garstang
|JobTitle = Senior Administrative Coordinator
|CaltechID = sydney
|Office = 128 Steele
|Phone = 626-395-3244 (office)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Sydney-Garstang.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Alireza Ghaffari
|JobTitle = KNI Laboratory Staff Member of the Professional Staff
|CaltechID = alireza
|Office = 176 Watson
|Phone = 626-395-3984 (office) 
|AreasResponsibility = Foundry, AFM, photolithography, support tools
|Photo = alireza-ghaffari.png
}}
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Laboratory Infrastructure Manager
|CaltechID = nathslee
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-395-4386 (cell)
|AreasResponsibility = General infrastructure, safety
|Photo = Nathan-S-Lee.jpg
}}
|-
|-
|-
|-
{{StaffMemberTableItem|
|Name = Kelly McKenzie
|JobTitle = Plasma Process Engineer
|CaltechID = kmmckenz
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Plasma etch / deposition, Tube furnaces
|Photo = McKenzie_Kelly_2.jpg
}}
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 303 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|Photo = Alex-Wertheim.jpg
}}
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}

KNI Staff Members

2025-07-10T16:23:25Z

Sydney: Updated Nathan Lee's cell number and removed Sydney's fax number (no fax in the office anymore)

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Associate Director of Technical Operations Member of the Professional Staff
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Executive Director
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-Kimoto.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Sydney Garstang
|JobTitle = Senior Administrative Coordinator
|CaltechID = sydney
|Office = 128 Steele
|Phone = 626-395-3244 (office)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Sydney-Garstang.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Alireza Ghaffari
|JobTitle = KNI Laboratory Staff Member of the Professional Staff
|CaltechID = alireza
|Office = 176 Watson
|Phone = 626-395-3984 (office) 
|AreasResponsibility = Foundry, AFM, photolithography, support tools
|Photo = alireza-ghaffari.png
}}
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Laboratory Infrastructure Manager
|CaltechID = nathslee
|Office = 124 Steele
|Phone = 626-395-4075 (office) 714-853-5487 (cell)
|AreasResponsibility = General infrastructure, safety
|Photo = Nathan-S-Lee.jpg
}}
|-
|-
|-
{{StaffMemberTableItem|
|Name = Kelly McKenzie
|JobTitle = Plasma Process Engineer
|CaltechID = kmmckenz
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Plasma etch / deposition, Tube furnaces
|Photo = McKenzie_Kelly_2.jpg
}}
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 303 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|Photo = Alex-Wertheim.jpg
}}
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}

Lab Phone List

2025-07-10T16:22:14Z

Sydney: Updated Nathan Lee's cell number

__NOTOC__
== Caltech Emergency Number ==
{| class="wikitable" style="width: 45%;"
|-
!scope="col" style="text-align:left; width: 40%"| Do NOT call 911 on campus
!scope="col" style="text-align:center; width: 30%" | Campus Extension
!scope="col" style="text-align:center; width: 30%"| Dial from Off-Campus
|-
!scope="col" style="text-align:left; background-color:#FFE2B9;"| Emergency / Security
!scope="col" style="text-align:center; background-color:#FFE2B9;" | x5000
!scope="col" style="text-align:center; background-color:#FFE2B9;"| 626-395-5000
|-
|}

== Other General Numbers ==
{| class="wikitable" style="width: 45%;"
|-
!scope="col" style="text-align:left; width: 40%"|
!scope="col" style="text-align:center; width: 30%" | Campus Extension
!scope="col" style="text-align:center; width: 30%"| Dial from Off-Campus
|-
! scope="row" style="text-align:left;"| KNI Lab-Wide General Number
| style="text-align:center;" | x1539
| style="text-align:center;"| 626-395-1539
|-
! scope="row" style="text-align:left;"| Security Non-Emergency (card issues off-hours)
| style="text-align:center;" | x4701
| style="text-align:center;"| 626-395-4701
|-
! scope="row" style="text-align:left;"| Chemical Waste Pickup
| style="text-align:center;" | x6727
| style="text-align:center;"| 626-395-6727
|-
! scope="row" style="text-align:left;"| Facilities Help Desk
| style="text-align:center;" | x4717
| style="text-align:center;"| 626-395-4717
|-
! scope="row" style="text-align:left;"| Liquid Nitrogen Dewars
| style="text-align:center;" | x4891
| style="text-align:center;"| 626-395-4891
|-
! scope="row" style="text-align:left;"| Shipping & Receiving
| style="text-align:center;" | x4893
| style="text-align:center;"| 626-395-4893
|-
|}

== Call the Lab ==
{| class="wikitable" style="width: 58%;"
|-
!scope="col" style="text-align:left; width: 31%"| Room Name
!scope="col" style="text-align:center; width: 23.3%"| Campus Extension
!scope="col" style="text-align:center; width: 23.3%"| Dial from Off-Campus
!scope="col" style="text-align:left;" | Room Number
{{LabPhoneTableItem|
|RoomName = Access to Cleanroom
|RoomNumber = B207 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = AFM
|RoomNumber = B203B Steele
|PhoneNumber = x1545
|DialFromOffCampus = 626-395-1545
}}
{{LabPhoneTableItem|
|RoomName = Corridor Passthrough
|RoomNumber = B207CO Steele
|PhoneNumber = x5434
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Cryo STM
|RoomNumber = B203A Steele
|PhoneNumber = x1540
|DialFromOffCampus = 626-395-1540
}}
{{LabPhoneTableItem|
|RoomName = Deposition Bay
|RoomNumber = B235C Steele
|PhoneNumber = x1532
|DialFromOffCampus = 626-395-1532
}}
{{LabPhoneTableItem|
|RoomName = Deposition Chase
|RoomNumber = B235B Steele
|PhoneNumber = x5422
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = DI Water
|RoomNumber = B205 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = EBPG Lab
|RoomNumber = B225C Steele B233B Steele
|PhoneNumber = x1531, x1540 or x5885
|DialFromOffCampus = 626-395-1531 -1540 or -5885
}}
{{LabPhoneTableItem|
|RoomName = EBPG Prep
|RoomNumber = B225D Steele
|PhoneNumber = x5885
|DialFromOffCampus = 626-395-5885
}}
{{LabPhoneTableItem|
|RoomName = Elevator Passthrough
|RoomNumber = B224EL Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Etching Bay
|RoomNumber = B235 Steele
|PhoneNumber = x1532
|DialFromOffCampus = 626-395-1532
}}
{{LabPhoneTableItem|
|RoomName = Etching Chase
|RoomNumber = B235A Steele
|PhoneNumber = x1533
|DialFromOffCampus = 626-395-1533
}}
{{LabPhoneTableItem|
|RoomName = Gown Storage
|RoomNumber = B124 Steele
|PhoneNumber = x5938
|DialFromOffCampus = 626-395-5938
}}
{{LabPhoneTableItem|
|RoomName = Gowning Room
|RoomNumber = B207 Steele
|PhoneNumber = x1539
|DialFromOffCampus = 626-395-1539
}}
{{LabPhoneTableItem|
|RoomName = Metrology / Scriber-Breaker
|RoomNumber = B213 Steele
|PhoneNumber = x1537
|DialFromOffCampus = 626-395-1537
}}
{{LabPhoneTableItem|
|RoomName = Nova 200 SEM/EDS
|RoomNumber = B203 Steele
|PhoneNumber = x1542
|DialFromOffCampus = 626-395-1542
}}
{{LabPhoneTableItem|
|RoomName = Nova 600 SEM/Ga-FIB
|RoomNumber = B233B Steele
|PhoneNumber = x1534
|DialFromOffCampus = 626-395-1534
}}
{{LabPhoneTableItem|
|RoomName = ORION He/Ne/Ga-FIB
|RoomNumber = B203D Steele
|PhoneNumber = x1548
|DialFromOffCampus = 626-395-1548
}}
{{LabPhoneTableItem|
|RoomName = Photolith North / MA6
|RoomNumber = B217 Steele
|PhoneNumber = x1535
|DialFromOffCampus = 626-395-1535
}}
{{LabPhoneTableItem|
|RoomName = Photolith South / Bonder
|RoomNumber = B217 Steele
|PhoneNumber = x1536
|DialFromOffCampus = 626-395-1536
}}
{{LabPhoneTableItem|
|RoomName = Quanta SEM
|RoomNumber =B233 Steele
|PhoneNumber = x5429 or x5885
|DialFromOffCampus = 626-395-5885
}}
{{LabPhoneTableItem|
|RoomName = Sirion SEM/EDS
|RoomNumber = B209 Steele
|PhoneNumber = x1541
|DialFromOffCampus = 626-395-1541
}}
{{LabPhoneTableItem|
|RoomName = Sirion Service Chase
|RoomNumber = B203ME Steele
|PhoneNumber = x5435
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = South Lab
|RoomNumber = B203 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Stepper
|RoomNumber = B217 Steele
|PhoneNumber = x5432
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Laser Interference Lithography Room
|RoomNumber = B203C Steele
|PhoneNumber = x1543
|DialFromOffCampus = 626-395-1543
}}
{{LabPhoneTableItem|
|RoomName = Tecnai TF-30 TEM
|RoomNumber = B242F Keck
|PhoneNumber = x8908
|DialFromOffCampus = 626-395-8908
}}
{{LabPhoneTableItem|
|RoomName = Video Room
|RoomNumber = B222A Steele
|PhoneNumber = x5434
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Wet Chemistry Room
|RoomNumber = B211 Steele
|PhoneNumber = x1538
|DialFromOffCampus = 626-395-1538
}}
|}

== Call the Staff ==
{| class="wikitable" style="width: 85%;"
|-
!scope="col" style="text-align:left; width: 21.2%"| KNI Staff Member
!scope="col" style="text-align:center; width: 15.9%"| Campus Extension
!scope="col" style="text-align:center; width: 15.9%"| Dial from Off-Campus
!scope="col" style="text-align:left; width: 15.3%" | Office Number
!scope="col" style="text-align:left;"| Email
!scope="col" style="text-align:left; width: 13%"| Cell
{{StaffPhoneTableItem|
|StaffName = [[Guy A. DeRose, PhD | DeRose, Guy]]
|StaffOfficeNumber = 126 Steele
|StaffOfficePhone = 3423
|CaltechID = derose
|StaffCellNumber = 626-676-8529
}}
{{StaffPhoneTableItem|
|StaffName = [[Tiffany Kimoto | Kimoto, Tiffany]]
|StaffOfficeNumber = 117 Steele
|StaffOfficePhone = 3914
|CaltechID = tkimoto
|StaffCellNumber = 310-291-7977
}}
{{StaffPhoneTableItem|
|StaffName = [[Sydney Garstang | Garstang, Sydney]]
|StaffOfficeNumber = 128 Steele
|StaffOfficePhone = 3244
|CaltechID = sydney
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Alireza Ghaffari | Ghaffari, Alireza]]
|StaffOfficeNumber = 176 Watson
|StaffOfficePhone = 3984
|CaltechID = ghaffari
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Nathan S. Lee | Lee, Nathan]]
|StaffOfficeNumber = 124 Steele
|StaffOfficePhone = 4075
|CaltechID = nathslee
|StaffCellNumber =714-853-5487
}}
|-
|-
{{StaffPhoneTableItem|
|StaffName = [[Kelly McKenzie | McKenzie, Kelly]]
|StaffOfficeNumber = 330 Steele
|StaffOfficePhone = 5732
|CaltechID = kmmckenz
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Alex Wertheim | Wertheim, Alex]]
|StaffOfficeNumber = 303 Steele
|StaffOfficePhone = 3371
|CaltechID = alexw
|StaffCellNumber =
}}
|}

The Kavli Nanoscience Institute Laboratory at Caltech

2025-07-02T19:36:54Z

Sydney: Updated Director of KNI to Andrei Faraon -- 7/2/25 Sydney G.

{{infobox laboratory
|name = The Kavli Nanoscience Institute (KNI)
|image = KNI-Caltech-Cleanroom.jpg
|caption = ''A look inside the KNI Laboratory cleanroom''
|motto = Advancing multidisciplinary research in nanoscience
|research_field = Electronics, Photonics,Quantum Matter & Technology,Medical & Biological Engineering,and Sustainability
|operating_agency= [https://en.wikipedia.org/wiki/California_Institute_of_Technology California Institute of Technology]
|location = Pasadena, CaliforniaUnited States
|address = Steele Laboratory[https://www.caltech.edu/map/campus/harry-g-steele-laboratory-of-electrical-sciences Campus Building #81]
|established = 2003
|directors = [https://faraon.caltech.edu/ Andrei Faraon]
|staff = Eight
|users = 120+
|website = http://kni.caltech.edu/
}}
'''[https://lab.kni.caltech.edu/index.php/Covid-19 COVID-19 INFORMATION].'''

== About the KNI ==
The Kavli Nanoscience Institute (KNI) Laboratory, located at the California Institute of Technology, spans 10,000 ft2 across two facilities, primary among them the 7,500 ft2 controlled-environment cleanroom in the Steele Building sub-basement, where the majority of lithography, deposition, etching, microscopy, and supporting instrumentation is located. Managed by full-time technical staff and available for use by researchers at Caltech and other academic, government and industrial institutions, the KNI Laboratory is equipped for — and dedicated to — exploring the limits of nanofabrication.

== Available Resources ==
This lab site contains resources that are meant to maximize our users' ability to be safe, informed, productive KNI lab members. We also welcome non-KNI members to learn about our lab and make use of any resources provided on this site.
* '''Sidebar:''' See the left-hand sidebar for general information, links to equipment categories, and other resources
* '''[[Equipment List]]:''' Find resources for any given instrument (e.g. SOPs, troubleshooting, presentations, manuals, videos, specifications)
* '''[https://mh-fbs1.caltech.edu/Anon/Logon.aspx Equipment Reservations]:''' Go to the KNI's FBS Reservations site to make reservations to use the equipment
* '''[https://caltech.box.com/s/fd1zf5fanzimlpuopwmtai6vqqh5dv8s KNI Document Library]:''' Find resources grouped by instrument type
* '''[https://www.youtube.com/channel/UCWbGhTKjT6wv7T4sZ23E7WQ KNI YouTube Channel]:''' Video tutorials, which are also linked to from individual instrument pages
* '''[https://kni.caltech.edu The KNI Website]:''' Official information on KNI programs, research, publications, and news
* '''[Mailto:derose@caltech.edu SUGGESTION BOX]:''' Please send all SUGGESTIONS to help improve the KNI Lab to Guy DeRose.

== Equipment Updates ==
To receive staff & user updates on individual instruments (or groups of instruments), go to [[Email Lists]] and subscribe to all relevant lists.

== Contacting the KNI ==
For general or specific inquiries, go to [[KNI Staff Members]] and use the information there to contact the appropriate individual(s).

== New KNI Users ==
To become a KNI lab user, see the information and forms provided on [[New User Forms]].


==KNI User Offboarding==
* [https://caltech.box.com/s/qapv4ytu4uhyszz538rz4k55mvdihyix KNI Member Offboarding SOP]

The Offboarding SOP must be completed when ending your KNI Lab membership. It lists items such as Labrunr, Stored Items, Chemicals, Stored Data/Files, etc, which should to be addressed before your membership ends.

__NOTOC__

Lab Phone List

2024-09-24T23:39:34Z

Sydney: /* Call the Staff */

__NOTOC__
== Caltech Emergency Number ==
{| class="wikitable" style="width: 45%;"
|-
!scope="col" style="text-align:left; width: 40%"| Do NOT call 911 on campus
!scope="col" style="text-align:center; width: 30%" | Campus Extension
!scope="col" style="text-align:center; width: 30%"| Dial from Off-Campus
|-
!scope="col" style="text-align:left; background-color:#FFE2B9;"| Emergency / Security
!scope="col" style="text-align:center; background-color:#FFE2B9;" | x5000
!scope="col" style="text-align:center; background-color:#FFE2B9;"| 626-395-5000
|-
|}

== Other General Numbers ==
{| class="wikitable" style="width: 45%;"
|-
!scope="col" style="text-align:left; width: 40%"|
!scope="col" style="text-align:center; width: 30%" | Campus Extension
!scope="col" style="text-align:center; width: 30%"| Dial from Off-Campus
|-
! scope="row" style="text-align:left;"| KNI Lab-Wide General Number
| style="text-align:center;" | x1539
| style="text-align:center;"| 626-395-1539
|-
! scope="row" style="text-align:left;"| Security Non-Emergency (card issues off-hours)
| style="text-align:center;" | x4701
| style="text-align:center;"| 626-395-4701
|-
! scope="row" style="text-align:left;"| Chemical Waste Pickup
| style="text-align:center;" | x6727
| style="text-align:center;"| 626-395-6727
|-
! scope="row" style="text-align:left;"| Facilities Help Desk
| style="text-align:center;" | x4717
| style="text-align:center;"| 626-395-4717
|-
! scope="row" style="text-align:left;"| Liquid Nitrogen Dewars
| style="text-align:center;" | x4891
| style="text-align:center;"| 626-395-4891
|-
! scope="row" style="text-align:left;"| Shipping & Receiving
| style="text-align:center;" | x4893
| style="text-align:center;"| 626-395-4893
|-
|}

== Call the Lab ==
{| class="wikitable" style="width: 58%;"
|-
!scope="col" style="text-align:left; width: 31%"| Room Name
!scope="col" style="text-align:center; width: 23.3%"| Campus Extension
!scope="col" style="text-align:center; width: 23.3%"| Dial from Off-Campus
!scope="col" style="text-align:left;" | Room Number
{{LabPhoneTableItem|
|RoomName = Access to Cleanroom
|RoomNumber = B207 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = AFM
|RoomNumber = B203B Steele
|PhoneNumber = x1545
|DialFromOffCampus = 626-395-1545
}}
{{LabPhoneTableItem|
|RoomName = Corridor Passthrough
|RoomNumber = B207CO Steele
|PhoneNumber = x5434
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Cryo STM
|RoomNumber = B203A Steele
|PhoneNumber = x1540
|DialFromOffCampus = 626-395-1540
}}
{{LabPhoneTableItem|
|RoomName = Deposition Bay
|RoomNumber = B235C Steele
|PhoneNumber = x1532
|DialFromOffCampus = 626-395-1532
}}
{{LabPhoneTableItem|
|RoomName = Deposition Chase
|RoomNumber = B235B Steele
|PhoneNumber = x5422
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = DI Water
|RoomNumber = B205 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = EBPG Lab
|RoomNumber = B225C Steele B233B Steele
|PhoneNumber = x1531, x1540 or x5885
|DialFromOffCampus = 626-395-1531 -1540 or -5885
}}
{{LabPhoneTableItem|
|RoomName = EBPG Prep
|RoomNumber = B225D Steele
|PhoneNumber = x5885
|DialFromOffCampus = 626-395-5885
}}
{{LabPhoneTableItem|
|RoomName = Elevator Passthrough
|RoomNumber = B224EL Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Etching Bay
|RoomNumber = B235 Steele
|PhoneNumber = x1532
|DialFromOffCampus = 626-395-1532
}}
{{LabPhoneTableItem|
|RoomName = Etching Chase
|RoomNumber = B235A Steele
|PhoneNumber = x1533
|DialFromOffCampus = 626-395-1533
}}
{{LabPhoneTableItem|
|RoomName = Gown Storage
|RoomNumber = B124 Steele
|PhoneNumber = x5938
|DialFromOffCampus = 626-395-5938
}}
{{LabPhoneTableItem|
|RoomName = Gowning Room
|RoomNumber = B207 Steele
|PhoneNumber = x1539
|DialFromOffCampus = 626-395-1539
}}
{{LabPhoneTableItem|
|RoomName = Metrology / Scriber-Breaker
|RoomNumber = B213 Steele
|PhoneNumber = x1537
|DialFromOffCampus = 626-395-1537
}}
{{LabPhoneTableItem|
|RoomName = Nova 200 SEM/EDS
|RoomNumber = B203 Steele
|PhoneNumber = x1542
|DialFromOffCampus = 626-395-1542
}}
{{LabPhoneTableItem|
|RoomName = Nova 600 SEM/Ga-FIB
|RoomNumber = B233B Steele
|PhoneNumber = x1534
|DialFromOffCampus = 626-395-1534
}}
{{LabPhoneTableItem|
|RoomName = ORION He/Ne/Ga-FIB
|RoomNumber = B203D Steele
|PhoneNumber = x1548
|DialFromOffCampus = 626-395-1548
}}
{{LabPhoneTableItem|
|RoomName = Photolith North / MA6
|RoomNumber = B217 Steele
|PhoneNumber = x1535
|DialFromOffCampus = 626-395-1535
}}
{{LabPhoneTableItem|
|RoomName = Photolith South / Bonder
|RoomNumber = B217 Steele
|PhoneNumber = x1536
|DialFromOffCampus = 626-395-1536
}}
{{LabPhoneTableItem|
|RoomName = Quanta SEM
|RoomNumber =B233 Steele
|PhoneNumber = x5429 or x5885
|DialFromOffCampus = 626-395-5885
}}
{{LabPhoneTableItem|
|RoomName = Sirion SEM/EDS
|RoomNumber = B209 Steele
|PhoneNumber = x1541
|DialFromOffCampus = 626-395-1541
}}
{{LabPhoneTableItem|
|RoomName = Sirion Service Chase
|RoomNumber = B203ME Steele
|PhoneNumber = x5435
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = South Lab
|RoomNumber = B203 Steele
|PhoneNumber = x5127
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Stepper
|RoomNumber = B217 Steele
|PhoneNumber = x5432
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Laser Interference Lithography Room
|RoomNumber = B203C Steele
|PhoneNumber = x1543
|DialFromOffCampus = 626-395-1543
}}
{{LabPhoneTableItem|
|RoomName = Tecnai TF-30 TEM
|RoomNumber = B242F Keck
|PhoneNumber = x8908
|DialFromOffCampus = 626-395-8908
}}
{{LabPhoneTableItem|
|RoomName = Video Room
|RoomNumber = B222A Steele
|PhoneNumber = x5434
|DialFromOffCampus = Not Available
}}
{{LabPhoneTableItem|
|RoomName = Wet Chemistry Room
|RoomNumber = B211 Steele
|PhoneNumber = x1538
|DialFromOffCampus = 626-395-1538
}}
|}

== Call the Staff ==
{| class="wikitable" style="width: 85%;"
|-
!scope="col" style="text-align:left; width: 21.2%"| KNI Staff Member
!scope="col" style="text-align:center; width: 15.9%"| Campus Extension
!scope="col" style="text-align:center; width: 15.9%"| Dial from Off-Campus
!scope="col" style="text-align:left; width: 15.3%" | Office Number
!scope="col" style="text-align:left;"| Email
!scope="col" style="text-align:left; width: 13%"| Cell
{{StaffPhoneTableItem|
|StaffName = [[Guy A. DeRose, PhD | DeRose, Guy]]
|StaffOfficeNumber = 126 Steele
|StaffOfficePhone = 3423
|CaltechID = derose
|StaffCellNumber = 626-676-8529
}}
{{StaffPhoneTableItem|
|StaffName = [[Tiffany Kimoto | Kimoto, Tiffany]]
|StaffOfficeNumber = 117 Steele
|StaffOfficePhone = 3914
|CaltechID = tkimoto
|StaffCellNumber = 310-291-7977
}}
{{StaffPhoneTableItem|
|StaffName = [[Sydney Garstang | Garstang, Sydney]]
|StaffOfficeNumber = 128 Steele
|StaffOfficePhone = 3244
|CaltechID = sydney
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Alireza Ghaffari | Ghaffari, Alireza]]
|StaffOfficeNumber = 176 Watson
|StaffOfficePhone = 3984
|CaltechID = ghaffari
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Nathan S. Lee | Lee, Nathan]]
|StaffOfficeNumber = 124 Steele
|StaffOfficePhone = 4075
|CaltechID = nathslee
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Kelly McKenzie | McKenzie, Kelly]]
|StaffOfficeNumber = 330 Steele
|StaffOfficePhone = 5732
|CaltechID = kmmckenz
|StaffCellNumber =
}}
{{StaffPhoneTableItem|
|StaffName = [[Alex Wertheim | Wertheim, Alex]]
|StaffOfficeNumber = 303 Steele
|StaffOfficePhone = 3371
|CaltechID = alexw
|StaffCellNumber =
}}

Sydney Garstang

2024-04-26T23:56:12Z

Sydney: Created page with "__NOTOC__ {{StaffMemberInfobox |StaffName = Sydney Garstang |StaffPhoto = Sydney-Garstang.jpg |JobTitle = Senior Administrative Coordinator |AreasResponsibility = Accounts, Billing, Purchase Orders |CaltechID = sydney |Phone = 626-395-3244 (office) 626-744-9908 (Fax) |OfficeLocation = 128 Steele }} == About == ===== Role in the KNI ===== Sydney Garstang is the Senior Administrative Coordinator for The Kavli Nanoscience Institute at the California Institute of Techn..."

__NOTOC__
{{StaffMemberInfobox
|StaffName = Sydney Garstang
|StaffPhoto = Sydney-Garstang.jpg
|JobTitle = Senior Administrative Coordinator
|AreasResponsibility = Accounts, Billing, Purchase Orders
|CaltechID = sydney
|Phone = 626-395-3244 (office) 626-744-9908 (Fax)
|OfficeLocation = 128 Steele
}}
== About ==
===== Role in the KNI =====
Sydney Garstang is the Senior Administrative Coordinator for The Kavli Nanoscience Institute at the California Institute of Technology. In her role she assists with billing, membership accounts, and supply purchases.

Sydney has worked at Caltech since 2000. She began as a cashier in the Bookstore, then served in a series of roles for the Computing and Mathematical Sciences Department before joining KNI in 2024.

===== Education =====
Sydney received her B.S. in Business and Management from the University of Redlands.

KNI Staff Members

2024-04-26T23:55:48Z

Sydney:

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Associate Director of Technical Operations Member of the Professional Staff
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Executive Director
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 626-744-9908 (fax) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-Kimoto.jpg
}}
{{StaffMemberTableItem|
|Name = Sydney Garstang
|JobTitle = Senior Administrative Coordinator
|CaltechID = sydney
|Office = 128 Steele
|Phone = 626-395-3244 (office) 626-744-9908 (fax)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Sydney-Garstang.jpg
}}
{{StaffMemberTableItem|
|Name = Alireza Ghaffari
|JobTitle = KNI Laboratory Staff Member of the Professional Staff
|CaltechID = alireza
|Office = 176 Watson
|Phone = 626-395-3984 (office) 
|AreasResponsibility = Foundry, AFM, photolithography, support tools
|Photo = Coming Soon
}}
{{StaffMemberTableItem|
|Name = Kelly McKenzie
|JobTitle = Plasma Process Engineer
|CaltechID = kmmckenz
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Plasma etch / deposition, Tube furnaces
|Photo = McKenzie_Kelly_2.jpg
}}
{{StaffMemberTableItem|
|Name = Bert Mendoza
|JobTitle = Laboratory Coordinator
|CaltechID = bertm
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-491-2970 (cell)
|AreasResponsibility = Lab Safety & Coordination, Wet Chemistry, Photolithography
|Photo = Bert-Mendoza.jpg
}}
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 303 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|Photo = Alex-Wertheim.jpg
}}
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}

User:Sydney

2024-04-26T23:55:34Z

File:Sydney-Garstang.jpg

2024-04-26T23:49:23Z

Sydney:

Information on the 3D reconstruction PC

2024-04-15T23:26:07Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfobox|
|InstrumentName = Microscopy High Performance PC
|HeaderColor = #F5A81C
|ImageOne = MicroscopePC.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B2 242 Keck
|LabPhone = 626-395-1548
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Digital Storm
|Model = ORION NanoFab
|Techniques = 3D reconstruction, Offline processing of microscope data, Simulations for Microscopy
|RequestTraining = awolff@caltech.edu
|Slack = #high-performance-pc

}}
== Description ==
The Microscopy High Performance PC

===== Available Microscopy Programs =====
* Digital Micrograph
* Fiji / ImageJ shortcut is located on the desktop
* Dragonfly is located on the desktop
* WinCasino V2
* WinCasino V3
* SRIM
* pyPENELOPE

===== Other Available Programs =====
* Rhino7
* RhinoGrasshopper
* LycheeSlicer
* DeScribe
* Comsol Multiphysics 5.5

===== Applications =====
* Monte Carlo Simulations of electron- and ion solid interactions
* 3D reconstruction of microscopy data (FIB/SEM, TEM)
* Image post processing
* TEM data analysis
===== PC Configuration =====
* Processor: Intel Core i9-10900X (10-Core) (Boost Up to 4.5 GHz)
* Motherboard: MSI X299 PRO (Intel X299 Chipset) (Up to 4x PCI-E Devices)
* System Memory: 128GB DDR4 3200MHz Digital Storm Performance
* Power Supply: 850W Digital Storm Performance Series (Modular) (80Plus Gold)
* Storage Set 1: 1x SSD M.2 (2TB Samsung 970 EVO PLUS) (NVM Express)
* Storage Set 2: 1x Storage (2TB Seagate / Toshiba / Hitachi)
* Internet Access: High Speed Network Port (Supports High-Speed Cable/ DSL / Network Connections)
* Graphics Card(s): 1x NVIDIA RTX A4000 16GB (Professional Workstation)(Outputs: 4 x DisplayPort 1.4a)
* Sound Card: Integrated Motherboard Audio
* Extreme Cooling: H20: Stage 2: Digital Storm Vortex Liquid CPU Cooler(Dual Fan) (Fully Sealed + No Maintenance)
* Cable Management: Premium Cable Management (Strategically Routedand Organized for Airflow)
* Chassis Fans: Standard Factory Chassis Fans
* Boost Processor: Stage 1: Overclock CPU - Up to 4.5GHz via Intel Turbo
* Boost Max Technology 3.0
* Windows OS: Microsoft Windows 10 Professional (64-Bit)
* Virus Protection: Windows Defender Antivirus (Built-in to Windows)
* Surge Shield: APC 1500VA Uninterrupted Power and

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/6az94atn4i3dnd64oafyzet6t5c750k3 SOP Microscopy High Performance PC]
* [https://caltech.box.com/s/35frs7vq8ve3al73d8uyt4rq8w22ae7e SOP 3D Reconstruction via ORS Dragonfly]

Labline: Electron Beam Evaporator

2024-04-15T23:24:37Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Model = Labline
|Techniques = E-beam Evaporation, Ion-Assisted Deposition (IAD),Ion Milling
|EmailList = kni-labline
|EmailListName = Labline
}}
== Description ==
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

===== Applications =====
* Metal deposition (Ti, Pt, Au, Al)
* Lift-off
* Non-selective etch
* Ion-assisted deposition (simultaneous etching & deposition)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)
* Accepts up to 1x 150mm wafer or smaller wafers/pieces

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ICP-RIE: Dielectric Etcher

2024-04-15T23:23:08Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Etcher
|HeaderColor = #FFE2B9
|ImageOne = ICP-RIE_Dielectric-Material-Etcher_.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Techniques = Dielectric Material Etching
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The Dielectric inductively-coupled plasma reactive-ion etcher (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for silicon etching. This system is configured for silicon etching with "pseudoBosch" C4F8 and SF6 gases, and cryogenic silicon etch with SF6 and O2. The silicon ICP-RIE has a variable temperature stage (-150 to 400 °C). This system supports wafer sizes up to 6 inches, and provides accurate deep etching capabilities for silicon and "silicon-like" samples only.
===== Applications =====
* Cryogenic etch of silicon
* pseudo-Bosch of silicon
===== Allowed material in Dielectric Etch System =====
* Si, SixNy, Ge
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3 hard masks
* No metals

===== Dielectric Etcher Gas List =====
* SF6
* C4F8
* O2
* Ar
* N2
* N2O
* NH3

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords reservation and use policy]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Process Standards]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Silicon Nitride etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/124/System%20Manual%20for%20Caltech%2094-219846_a.pdf Oxford Plasmalab System 100 Dielectric Etcher Manual] (login to LabRunr required)
* [https://caltech.box.com/s/juzfel0sy2fv6y3d1zcul8lc3z6ipha4 Edwards Pyrophoric Conditioning System Manual]
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/85mj9roas98jtwee9d22hk0wk9un54fl Manufacturer System Configuration]
===== System Features =====
* Universal base console which houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software (Not Bosch)
* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200mm variable gate valve for chamber isolation and process pressure control
* Twelve line gas pod with 7 non-toxic and 3 toxic digital mass-flow-controlled gas lines
* Chamber Gas ring, with split gas manifold
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option
===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -140 to 400 °C
* ICP 380 mm remote high-density plasma source with 5 kW RF generator and automatic matching unit close-coupled to the source.
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling

== Related Tools ==
* [https://lab.kni.caltech.edu/ICP-RIE:_III-V,_Metal_%26_Silicon_Etcher Oxford III-V ICP-RIE]
* [https://lab.kni.caltech.edu/DRIE:_Bosch_%26_Cryo_ICP-RIE_for_Silicon Oxford DRIE ICP-RIE]
* [https://lab.kni.caltech.edu/Dual_Chamber_RIE:_Silicon,_III-V_Material_%26_Organics_Etcher Plasma-Therm RIE]
* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]
* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]
* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]

ORION NanoFab: Helium, Neon & Gallium FIB

2024-04-15T23:09:10Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = alireza@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating hydrocarbon deposition on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).
* There is no need to coat non-conductive samples, the ORION NanoFab is equipped with a floodgun which can be used for charge compensation.
* You can of course still use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Quanta 200F: SEM, ESEM, Lithography & Probe Station

2024-04-15T23:08:50Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Quanta 200F
|HeaderColor = #F5A81C
|ImageOne = Quanta-200F-SEM.jpg
|ImageTwo = Quanta-200F-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Quanta 200F
|Techniques = SEM, ESEM, E-beam Lithography, Electrical 4-Point Probe Station, Hot Stage, Cold Stage
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Quanta 200F is a field emission gun (FEG) scanning electron microscope (SEM) that can also be operated in environmental (ESEM) mode, where a higher chamber pressure (0.1 to 27 mbar) allows for the imaging of e.g. biological samples without lysing cells. While the Quanta does not have an immersion lens for ultra-high-resolution imaging, as all other KNI SEMs do, this actually allows the Quanta's non-immersion objective lens to be optimally placed for "field-free imaging," making it the KNI's highest resolution SEM when operating outside of Immersion Mode. The Quanta is also equipped with an e-beam lithography system, a four-point electrical probing station, and a Hot/Cold Stage attachment. Its small chamber allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for the Quanta below.
===== SEM Applications =====
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD)
* Backscattered Electron (BSE) imaging with a solid-state Backscattered Electron Detector (BSED)
* ESEM Mode for imaging biological samples using Large Field Detector (LFD) & Gaseous Secondary Electron Detector (GSED)
* ESEM Mode for imaging highly non-conductive samples using LFD & GSED (the water vapor environment wicks away charge from sample); 500 μm clip-on aperture (to the bottom of the SEM column) is available for use in ESEM Mode to improve resolution
===== Other Applications =====
* E-beam lithography with the Nanometer Pattern Generating System (NPGS) software
* Hot & Cold Stage for observing a sample from -185 to 240 °C
* Four-Point Electrical Probe Station for ''in situ'' electrical measurements

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/1yqfsg1cl6x9w9414bsqiqxcp4cl2bub Short Version] | [https://caltech.box.com/s/qwjhdb252dq8lk5ap5up829pvd3g1fvo Long Version])
* E-beam Lithography SOPs ([https://caltech.box.com/s/n5ft2s02i92698vy3m1w6tp60s2o407s Short Version] | [https://caltech.box.com/s/pt78znsx8dj01t7fuwdknzq0uzvy3ueg Long Version])
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned Patterning Steps with NPGS] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide]
* [https://caltech.box.com/s/xa6da8tjz4u5yksi9ozhvg1l1f6v357a Review Paper on secondary electron contrast in low-vacuum and ESEM of dielectrics]
* [https://caltech.box.com/s/n91a9brnyg5ntg48ztkzn95knl63i9ed Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on ESEM, Lithography, Probe Station, Hot & Cold Stage)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/urxbsk9wrruxcnj345c3rjb37dc48k64 Quanta 200F SEM Operation Manual]
* [https://caltech.box.com/s/ijtjy0dzm7kwiidm0v87jlw8t9azi0xr Mailbox Prober Operation Manual]
* [https://caltech.box.com/s/07oq9u320tfds4iktjzlr62n8l1rh95r Gatan C1002 Cold Stage Users Manual]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== SEM & ESEM Specifications =====
* Minimum Feature Size Resolved in SEM Mode: ~15 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spot Size" 1 to 7 (approximately 30 pA to 20 nA), with increments of 0.1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 10 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -150 to 70° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* Ultimate Vacuum: 3e-7 mbar
* ESEM Mode Pressure Range: 0.1 to 27.0 mbar (water vapor is used as chamber gas)
* Minimum Feature Size Resolved in ESEM Mode: ~10 nm

===== Lithography with NPGS Specifications =====
* Minimum Feature Produced: ~17 nm diameter dots & ~20 nm wide lines (via liftoff of 10 nm Ti on Si)
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Writing Speed: 5 MHz
* Digital-to-Analog Converter (DAC): 16-bit
* Keithley 487 Picoammeter / Voltage Source is available for measuring beam current
===== Probe Station Specifications =====
* Probe Station Manufacturer: Kammrath & Weiss
* Parameter Analyzer: HP4145B Available [https://caltech.box.com/s/xumvbal8rmyggb3h87hk0g5s8b957hqg (Manual)], or bring your own
* Keithley 487 Picoammeter / Voltage Source is available as a function generator
* Probe station connectors rated up to 42 V, measure up to mA of current
===== Hot & Cold Stage Specifications =====
* Temperature Range: -185 to 240° C
* Stage is cooled by air that is itself cooled by flowing it through a liquid nitrogen heat exchanger
* Stage is heated by a resistive heating element
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscope =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Equipment List

2024-04-15T23:08:31Z

Sydney: Adjusted text to refer to FBS instead of LabRunr

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE FBS - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2024-04-15T23:07:58Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V

Nova 200 NanoLab: SEM & EDS

2024-04-15T23:07:36Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/4f1hqp83pwc1v1k5qke6xi68i28fjvz8 Nova200 and EDS SOP, Manuals, SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f .pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 .pptx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar

ATC Orion 8: Dielectric Sputter System

2024-04-15T23:06:51Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Dielectric-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC, pulsed DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion dielectric sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load lock that allows for automatic sample transfer. There are eight magnetron guns, seven 2" guns, and one 3" gun. A total of two RF and three DC power supplies can be used on any of the eight guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. One of the DC guns is a pulsed DC supply. Uniformity across a 6" wafer is <5% variation for the 2" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to five materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during process, allowing oxides and nitrides to be formed from pure metal targets. The pulsed DC supply is ideally suited for such reactive processes where a dielectric material is synthesized. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate. This can be used as a surface cleaner, etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Metal and dielectric deposition
* Surface cleaning & in-situ plasma etch
* Ion-Assisted Deposition

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/hhgq1sg92wttazsllqsv5yaj2yvo2tfj KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/6q6vh9resic35esnczpipwse1b2nlnrc Reference/supplemental Materials]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]
* [https://caltech.box.com/s/33nf5yz3iuebm3fkhn303rhul1hpiwie Material Deposition Overview - Indium-Tin Oxide]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

===== Current Target Status =====
The following link will take you to a document which displays the current target configuration. This is updated after each time targets are rearranged.
* [https://caltech.box.com/s/zvvx785imo20hzngib5e1ck1uoipe6w6 Current target configuration]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-9 to 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with automatic sample transfer
* Substrate holder accepts 150 mm and 100 mm wafers, as well as small chips affixed via pressure clips
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Eight Magnetron sputter guns
** Seven confocally-oriented 2" guns (faces substrate at angle)
** One centrally-located 3" gun (directly faces substrate)
* Power Supplies:
** Three RF Supplies
*** One 100 W supply for substrate plasma generation
*** One 600 W
*** One 300 W, equipped with 3-position switch router which enables sequential switching between 3 connected magnetrons
** Two 1500 W DC
** One 2000 W pulsed DC
*** Equipped with a two-position switch router that enables sequential switching between two connected magnetrons
*** Frequency range: 1-100 kHz
*** This unit is ideal for reactively sputtering dielectrics from metal targets

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF

2024-04-15T23:06:32Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-30
|HeaderColor = #F5A81C
|ImageOne = Mouse-Footpad-Peripheral-Nerve-Fiber-3D-Tomography_Mark-S-Ladinksy.jpg
|ImageTwo = Tecnai-TF30.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B242F Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Guy DeRose]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-30
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = derose@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
[[Image:TF-30-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-30 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-30 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 50 to 300 kV. Operating at 300 kV, the TF-30  has analytical options such as EELS and EFTEM. The TF-30 is also equipped with a high-angle annular dark field (HAADF) detector for use in STEM mode, and an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode). The Serial EM program allows for automated collection of images at variable tilt angles for performing tomography. See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a High-Angle Annular Dark Field (HAADF) detector
* Energy Dispersive Spectroscopy (EDS) with an Oxford INCA system
* Automatically capture tilt series of images for tomographic imaging

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SOPs ([https://caltech.box.com/s/v7oih7yv8yxai5ybkg8znplc54xc99if Long Version] | [https://caltech.box.com/s/uq2x3x6jfbrwm7sll3zfvb4h4naip7rj Short, Conceptual Version])
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/b5h0v6s2ethshh2fs5o4eqwf7pe8sdwc Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]

===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM/Ga-FIB system]] (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools

===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/e2mw7hh44g2hbcui5m3hnnqnlyunb8lf TF-30 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 F30 Family
* Voltage Range: 50-300 kV
* Point resolution: 0.20 nm
* Line resolution: 0.10 nm
* STEM resolution: 0.17 nm
* Information limit: 0.14 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±40°
* Max alpha-tilt angle with tomography holder: ±80°
* Maximum diffraction angle: ±12°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscope =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]

===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

ATC Orion 8: Chalcogenide Sputter System

2024-04-15T23:06:14Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Chalcogenide Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Chalcogenide-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion chalcogenide sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load-lock for fast sample transfer. There are five magnetron guns, three 2" guns and two 3" guns. A total of three RF and one DC power supplies can be used on any of the five guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. Uniformity across a 6" wafer is <5% variation for the 2" guns and <1.5% for the 3" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to four materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during processing, allowing oxides and nitrides to be formed from pure metal targets. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate; this can be used as a surface cleaner & etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Deposition of metals, dielectrics, and other special elements
** For reactive synthesis of dielectric materials, the [[ATC Orion 8: Dielectric Sputter System | Orion 8 dielectric sputter system]] is better suited
** For sputtering materials such as Te, Bi, Se, and Sb
*** Cr, Mn, Ni, and Fe are excluded from this chamber
* Surface cleaning & in-situ plasma etch

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/nqpy11vmb3g2feo6km3qcpje52u181wc KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
** The chalcogenide and dielectric systems are extremely similar; Please see the SOP for some differences
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

== Specifications ==
===== Hardware Specifications =====
* Ultimate Base Pressure: 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with manual sample transfer system
* Substrate holder accepts 150 mm samples and smaller
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Five Magnetron sputter guns
** Three confocally-oriented 3" guns (faces substrate at angle)
** Two confocally-oriented 2" guns (faces substrate at angle)
* Power Supplies:
** Four RF Supplies
*** One 100 W supply for substrate bias
*** One 600 W
*** Two 300 W
** One 1500 W DC Supply
*** Equipped with 2two-position switch router that enables sequential switching between two connected magnetrons

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Sirion: SEM & EDS

2024-04-15T23:05:46Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar

Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD

2024-04-15T23:05:21Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = PECVD
|HeaderColor = #F2682A
|ImageOne = PECVD_Oxford-System-100.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Model = Plasmalab System 100
|Techniques = Amorphous Silicon Deposition, Silicon Dioxide Deposition, Silicon Nitride Deposition
|EmailList = kni-oxfordpecvd
|EmailListName = Oxford PECVD
}}
== Description ==
The Plasma-Enhanced Chemical Vapor Deposition (PECVD) system is an Oxford Instruments Plasma Technology Plasmalab System 100 platform that is optimized for amorphous silicon, silicon dioxide, and silicon nitride deposition. The PECVD has a variable temperature stage (RT to 600 °C). This system supports wafer sizes up to 6 inches, and provides PECVD film growth over a wide range of process conditions.
===== Applications =====
* Amorphous Silicon Deposition
* Silicon Dioxide Deposition
* Silicon Nitride Deposition
===== Allowed material in PECVD System =====
* Si, SixNy, SiO2, SOI
* Hard masks compatible with process temperature
===== PECVD Gas List =====
* 5% SiH4 in N2
* 5% SiH4 in Ar
* NH3
* N2O
* N2
* Mixture of CF4 and O2 (4:1) for Plasma Clean

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/c8qx3ikzjb05x44o4updpqs36ra39ytw KNI SOP]
* [https://caltech.box.com/s/0gh89zgxkchj8nkbl1bbrdgvspu31obc Oxfords reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 KNI's Amorphous Silicon recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv KNI's 350C SiO2 recipe]
* [https://caltech.box.com/s/0e14n82o7o9yziqmlygkakfcv1lp65iu Process Standards]
* [https://caltech.box.com/s/6b2ivuuguflqjaqby5werlcslmmudryf High rate SiOx]
* [https://caltech.box.com/s/vi6vb1nz8thm3sflt5ncoyhi62tomi82 High rate SiNx]
* [https://caltech.box.com/s/tc4j0yr2jazv0rd6ey22ri8jd1asl326 Low Rate SiOx]
* [https://caltech.box.com/s/r3socf5rslp7qs9rb5o7vvpyp12qf0ps Low rate SiNx]
* [https://caltech.box.com/s/6acyh95hslt0q711makbllgqjrexpew1 Amorphous Silicon Deposition (Silane/helium)]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/116/System%20Manual%20for%20Caltech%2094-219848.pdf Oxford PECVD System Manual]
* [https://caltech.box.com/s/zqfonyv64m2m76mo8b4xn63ljz9ee4i5 Alcatel ADS 602P dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/kvgp7d7zx9gczapf7iun791m234vevod Manufacturer Data Sheet]
===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* PECVD process chamber with 160 mm pumping port, view port, and an additional rear port for optical emission end-point-detection
* Heated upper electrode to prevent condensation of low vapor pressure precursors
* PECVD 205 mm electrically heated (700 °C) lower electrode with central wafer lift mechanism
* Parameter ramping software
* 5 Torr capacitance manometer for process control, and penning for base pressure measurement
* Process chamber pumping with 63 mm branch to APC, and isolation valve; chamber base pressure turbo, backed by a refurbished dry pump with roots
* Twelve line gas pod with two non-toxic and three toxic digital mass-flow-controlled gas lines and cleaning gas
* Chamber Gas ring, with split gas manifold
* Liquid vapor delivery system
* Single-wafer automatic insertion load lock with soft pump option
===== System Specifications =====
* Chamber wall heating 80 °C
* 30/300 W RF generator close-coupled to the upper electrode through an automatic matching unit; the generator is configured to operate in a low-power mode (0-30 W) for higher accuracy during low-rate deposition processes
* 600 W solid-state 50-460 kHz LF generator

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Nanoscribe PPGT: Microscale 3D Printer

2024-04-15T23:04:33Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfobox|
|InstrumentName = Photonic Professional GT
|HeaderColor = #FFFFFF
|ImageOne = Geodesic-Domes_Xiaoxing-Xia.jpg
|ImageTwo = Nanoscribe-PPGT.jpg
|InstrumentType = [[Equipment_List#Photolithography|Photolithography]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Nanoscribe
|Model = PPGT
|Techniques = Two-Photon Lithography (Optical 3D printing)
|RequestTraining = alexw@caltech.edu
|EmailList = kni-nanoscribe
|EmailListName = Nanoscribe
}}
== Description ==
The Nanoscribe Photonic Professional GT (PPGT) is a high-precision microscale 3D printer that utilizes two-photon polymerization of various photoresists. The PPGT uses its own scripting environment to control a wide variety of writing parameters and to define points and paths to be written in the chosen resist. While many resists can theoretically be used, Nanoscribe has its own specially-formulated resins optimized for their two-photon lithography system. Writing at different length scales and resolutions can be optimized by choosing the appropriate resin. The software also includes slicing capability so that CAD files in STL format can be converted to a tool path much like what is found in common FDM 3D printers. Writing can be performed across areas as large as 100 mm x 100 mm, with features approximately as small as 200 nm x 500 nm, and can be viewed in real time during the writing process.

===== Applications =====
* Micro/mesoscale Optical 3D Printing
* Maskless 2D Lithography

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/poquw902yg9epv65pibqpat7zzoq7htq KNI SOP]

===== Scheduling Policy =====
* [https://caltech.box.com/s/tzu3ugpyh793s5itqb2ci0yd07ezbul9 Scheduling Policy]

== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Optical Lithography Resources]]

AJA Orion ATC Series Electron Beam Evaporator

2024-04-15T23:03:16Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/zygxa14nklirrtd6aw0fjdvqlggdyjh6 Standard Operating Procedures (SOP)]
* [linkgoeshere Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [linkgoeshere General System Operation]
* [linkgoeshere In-Situ Crucible Exchange]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Dual Chamber RIE: Silicon, III-V Material & Organics Etcher

2024-04-15T23:02:41Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Dual Chamber RIE
|HeaderColor = #FFE2B9
|ImageOne = Dual-Chamber-RIE_Plasma-Therm-SLR.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Plasma-Therm
|Model = SLR 720
|Techniques = Silicon and compound semiconductor Reactive Ion Etching
|EmailList = kni-plasmatherm
|EmailListName = Plasmatherm RIE
}}
== Description ==
The Plasma-Therm SLR 720 is a dual-chamber reactive ion etching (RIE) system with a load-lock. It is designated for etching silicon semiconductors with a traditional RIE process.
===== Applications =====
* Silicon Etching
* Organic Material Etching

===== Allowed Material in RIE =====
* Si, SixNy, SiO2, Ge
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3 hard masks
* Buried/backside metal ok if never exposed (not an etch stop)

===== RIE Gas List =====
* SF6
* CHF3
* CF4
* O2
* Ar
* He
* H2

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/jsskat7yic4p7td31941dxuj97ja6er5 KNI SOP]
* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords and RIE reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]

===== Process Documents =====
* [https://caltech.box.com/s/3n21r2o30u476ppnxfp657o3zbs9f0on Process Standards]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]

===== Manufacturer Manuals =====
* In progress

== Specifications ==
===== Manufacturer Specifications =====
* In progress
===== System Features =====
* In progress
===== System Specifications =====
* In progress

== Related Tools ==
* [https://lab.kni.caltech.edu/ICP-RIE:_III-V,_Metal_%26_Silicon_Etcher Oxford III-V ICP-RIE]
* [https://lab.kni.caltech.edu/ICP-RIE:_Dielectric_Etcher Oxford Dielectric ICP-RIE]
* [https://lab.kni.caltech.edu/DRIE:_Bosch_%26_Cryo_ICP-RIE_for_Silicon Oxford DRIE ICP-RIE]
* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]
* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]
* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]

ICP-RIE: III-V, Metal & Silicon Etcher

2024-04-15T23:02:17Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = III-V, Metal & Si Etcher
|HeaderColor = #FFE2B9
|ImageOne = ICP-RIE_III-V,Metal,Si-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Techniques = pseudo-Bosch & Cryogenic Si Etch Compound Semiconductor Etching
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The III-V, Metal & Silicon inductively-coupled plasma reactive-ion etcher (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for the etching of compound semiconductors, metals, and silicon. In addition to a wide range of gases for etching a variety of III-V materials and metals, this system is configured for highly-selective ICP-RIE of silicon via the pseudo-Bosch process, allowing silicon etching with SF6 and C4F8 gases as well as cryogenic silicon etching with SF6 and O2 over a temperature range of -140 to 300 °C. This system supports wafer sizes up to 6 inches.
===== Applications =====
* InP grating etch
* GaAs photonics device etch
* pseudo-Bosch of silicon
* Metals etch
* Cryogenic etch of silicon (available upon request)
===== Allowed Material in Etcher =====
* Etch materials: Si, SixNy, SiO2, Ge, InP, GaAs, Al, Mo, Nb, W, Ti
* Masks: PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3, Cr hard masks
* Other: Metal in etch stack (not exposed to plasma)
===== Etching Gas List =====
* SF6
* C4F8
* O2
* Ar
* Cl2
* SiCl4
* CH4
* H2
* HBr

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/nondj2ore8rg61tpur6hj4a3hvj8j9s5 Process Standards]
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen (KNI Recipe)]
* [https://caltech.box.com/s/wybxe3urco5s6bqw5getfu7p0amxq7wx AlGaN/GaN Etch with Photoresist Mask]
* [https://caltech.box.com/s/q3sq9cwkp5dicigkj6gkvohuqtf5ivwx InP Etch]
* [https://caltech.box.com/s/4e22q4i3e5cpgjyrykf7r4bm0m0pob59 InP/ InGaAsP Laser Facet ICP Etching]
* [https://caltech.box.com/s/borba8iuvxi9qj2pe8g0vj5vo7xpta0d GaAs Via Hole Etch]
* [https://caltech.box.com/s/x0mm9bsvwc17ev3vx5ks759mwa36tpxm Selective GaAs Etch]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Silicon Nitride etch]
* [https://caltech.box.com/s/4e6rskkmv1sgu9ipgfnrzeq0cguo1gc0 Hard Mask Oxide Etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/40kaaqur8ohyg55uq2pv3jqrzlgi98ts Comparison of Pseudo-Bosch ICP-RIE Etch of SiO2-SiNx]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (login to LabRunr required)
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/f8f1fx1ffz4ql71suxsvrw0p20b2inp5 Manufacturer Data Sheet]

===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software (Not Bosch)
* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Twelve line gas pod with three non-toxic and six toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option

===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -140 to 400 °C
* ICP 380 mm remote high-density plasma source with 5 kW RF generator and automatic matching unit close-coupled to the source
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling

== Related Tools ==
* [https://lab.kni.caltech.edu/ICP-RIE:_Dielectric_Etcher Oxford Dielectric ICP-RIE]
* [https://lab.kni.caltech.edu/DRIE:_Bosch_%26_Cryo_ICP-RIE_for_Silicon Oxford DRIE ICP-RIE]
* [https://lab.kni.caltech.edu/Dual_Chamber_RIE:_Silicon,_III-V_Material_%26_Organics_Etcher Plasma-Therm RIE]
* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]
* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]
* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]

EBPG 5000+: 100 kV Electron Beam Lithography

2024-04-15T23:01:16Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/4t687ozlf79m1t8yg1bb51z5mhdblrk6 EBPG 5000+ Airlock Operations video (Caltech-only access)]
* [https://caltech.box.com/s/o3vnlrldejttsanvrviqwdllkir7f5oo EBPG 5000+ Sample Mounting video (Caltech-only access)]
* [https://caltech.box.com/s/5q7a4m1e2wzbdg40iflqahtdd5yxg69n EBPG 5000+ Sample Unmounting video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/s2p10a6r3ds8h8al8bejjv2yvkuc7pez EBPG 5000+ Holder 5 adapter plate SOP]
* [https://caltech.box.com/s/ec5aeg0nx53mvze0zsg1dp25q0iq48ou EBPG 5000+ Holder 8 SOP]
* [https://caltech.box.com/s/bz8i2tvwklzgh1u6cval5n72kui3wuk3 EBPG 5000+ Raith screwdriver SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/ojrq79u8p5xnhck8p5gi9fskl4nzsj3b Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/1ge5czbz4b1pbfz2wrzbjmynnktdc0ci EBPG 5000+ Troubleshooting Loader errors]
* [https://caltech.box.com/s/qfy0tyiwynl06b7i2zuxe7rfdd9gec7k EBPG 5000+ Reattach alignment microscope coupling spring video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/t300bkjjyfq2bn7uw2nlfujqfsbpf1ui BEAMER Tutorial – Fracturing circles and angled features]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]


===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2024-04-15T23:00:53Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV). 
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training Materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/i2q9ow1pkkidt1z7st0czvazobpxours EBPG 5200 sample mounting training video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/1vul3cyoudr1k3e8zoctne3oyt4irx3y EBPG 5200 Holder 200 SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/rwhke2ck8539d3p9pfhgvu3f62uasfhq EBPG Holder Fixture handling SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/3lt47igh9wcza5ck9nl3i4ansn1jy4q7 EBPG 5200 troubleshooting loader issues training video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video (Caltech-only access)]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

DRIE: Bosch & Cryo ICP-RIE for Silicon

2024-04-15T23:00:18Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfobox|
|InstrumentName = DRIE
|HeaderColor = #FFE2B9
|ImageOne = Silicon-Microcones_Paul-A-Kempler.jpg
|ImageTwo = DRIE_Bosch-and-Cryo_ICP–RIE_.jpg
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Techniques = Bosch & Cryogenic Etch of Silicon
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The MEMS / Bosch / Cryo inductively-coupled plasma reactive-ion etch (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for silicon etching. This system is configured for deep reactive-ion etching (DRIE) via the Bosch process, allowing silicon etching with SF6 and C4F8 gases. Close-coupled gas pods are included in this system for fast Bosch switching.
The silicon ICP-RIE has a variable temperature stage (-150 to 300 °C) to permit cryogenic etching of silicon with SF6 and O2 if needed. This system supports wafer sizes up to 6 inches and provides accurate deep etching capabilities for silicon only.
===== Applications =====
* Deep silicon etch using Bosch process
* Cryogenic etch of silicon
* pseudo-Bosch etch of silicon
===== Allowed material in DRIE =====
* Si, SixNy, Ge
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3 hard masks
* Buried/backside metal ok if never exposed (not an etch stop)

===== DRIE Gas List =====
* SF6
* C4F8
* O2
* Ar
* N2

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords reservation and use policy]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/3n21r2o30u476ppnxfp657o3zbs9f0on Process Standards]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/c622brbs1udx5hqc744jvdd7wtf2mw32 Bosch Si Etch]
* [https://caltech.box.com/s/v92jrijz2iijzzlnyrbzbolov7zvo3w0 High-Rate Bosch Si Etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ekzldcen8pjhok0qbpdy796xvs3icae4 Isotropic Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/125/LabRunr%20System%20Manual%20for%20Caltech%2094-219846.pdf Oxford Plasmalab System 100 DRIE Manual] (login to LabRunr required)
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/85mj9roas98jtwee9d22hk0wk9un54fl Manufacturer System Configuration]
===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software
* 100 mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Close-coupled gas pod to ICP for two digital non-toxic mass-flow-controlled gas lines (SF6, and C4F8)
* Six line gas pod with three non-toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option
* Single user license for Anisotropic Silicon Etch Process (Bosch)
===== System Specifications =====
* Chamber wall heating: 80 °C
* Cryo table range: -150 to 400 °C
* ICP 380 mm remote high-density plasma source with 8 kW RF generator and automatic matching unit close-coupled to the source
* Substrate bias control by 30 / 300W RIE source
* Helium back-side wafer cooling

== Related Tools ==
* [https://lab.kni.caltech.edu/ICP-RIE:_III-V,_Metal_%26_Silicon_Etcher Oxford III-V ICP-RIE]
* [https://lab.kni.caltech.edu/ICP-RIE:_Dielectric_Etcher Oxford Dielectric ICP-RIE]
* [https://lab.kni.caltech.edu/Dual_Chamber_RIE:_Silicon,_III-V_Material_%26_Organics_Etcher Plasma-Therm RIE]
* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]
* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]
* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]

Tube Furnaces for Wet & Dry Processing

2024-04-15T22:59:33Z

Sydney: Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Tystar Tytan Tube Furnaces 1 & 2
|HeaderColor = #E6E7E8
|ImageOne = Tystar-Tytan-Tube-Furnaces.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Thermal_Processing|Thermal Processing]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Tystar Corporation
|Model = Tytan Horizontal Diffusion Furnace
|Techniques = Oxidation, Annealing
|EmailList = kni-tystar
|EmailListName = Tystar
}}
== Description ==
The system is designed for processing up to one-hundred, 150 mm (6") silicon or sapphire wafers per tube and can accommodate smaller sample sizes also. Tube 1 is designated for wet & dry oxidation using a flask evaporator. Tube 2 is designated for dry oxidation and annealing.
===== Applications =====
* Dry & Wet oxidation
* Annealing
===== Allowed Materials =====
* Silicon, SiNx, or sapphire that is completely free of metal or organic contamination
** Recommended to have undergone a standard RCA clean or similar beforehand
* No other sample material allowed
* No metal or organic contamination
** Wafers must not have been contacted by metal tweezers, etc. without appropriate cleaning to remove metal contamination

===== Gas List =====
* Nitrogen
* Oxygen
* Water Vapor (Tube 1)
== Resources ==

===== Tystar Oxidation Recipe =====
* [https://caltech.box.com/s/nqiiqwlhip4dcult2mtuvvdlxw0gv086 Wet Oxidation 1000C ]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/yrvj5tar3r2e2ldq9orm2bh5mlkavw05 KNI SOP ]

Contact Mask Aligners: MA6 & MA6/BA6

2024-04-15T22:59:02Z

Sydney: Adjusted text to refer to FBS instead of LabRunr, and removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Suss Contact Mask Aligner MA6/BA6
|HeaderColor = #FFFFFF
|ImageOne = Mask-Aligner_Suss-MicroTec-MA6-BA6.jpg
|ImageTwo = Instrument-Image.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1535
|PrimaryStaff = Bert Mendoza
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Suss MicroTec
|Model = MA6 & MA6/BA6
|Techniques = Frontside Alignment, Backside Alignment,Flood exposure
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
[[Image:Mask-Aligner_Suss-MicroTec-MA6.jpg|thumb|upright=1.12|Suss MicroTec model MA6 Mask Aligner (model MA6/BA6 is shown at the top of the infobox)]]
The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography). The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.
==== Suss1 MA6/BA6 Applications ====
* Front Side Flood Exposure (no mask)
* Front Side Alignment & Exposure
* Back Side Alignment with Front Side Exposure

==== Suss2 MA6 Applications ====
* Front Side Alignment & Exposure
* Back Side Alignment with Front Side Exposure

== Resources ==
=== Manufacturer Specifications ===
* Whole wafers 2” up to 6” can be loaded.
* Samples pieces up to 6”x6” square can be loaded.
* Samples up to 6mm thick can be loaded..
* Exposure Resolution:
::Soft Contact Mode = 1 - 2 um
::Hard Contact Mode = 1 um
::Soft Vacuum Contact Mode = 1 - 0.5 um
::Vacuum Contact Mode = 0.4 - 0.5 um
''' Suss 1 Exposure Settings '''
* Channel 1 is 365nm wavelength at 15 mW/cm2.
* Channel 2 is 405nm wavelength at 25 mW/cm2.
''' Suss 2 Exposure Settings '''
* Channel 1 is 365nm wavelength at 10 mW/cm2.
* Channel 2 is 405nm wavelength at 15 mW/cm2.

=== SOPs & Troubleshooting ===
* [https://caltech.box.com/s/gkhncvqe25uccym7cs5aj0n00krbmnw1 General SOP & Troubleshooting]
* [https://caltech.box.com/s/bbk4f9vi6jerhi9fcqoqa78n5npkwxkr Lamp Change SOP]
* [https://caltech.box.com/s/mj01k4mxgsxbnctv3fayzaje1ph4bfop Lamp Re-Ignition SOP]
* [https://caltech.box.com/s/xq40xbslhezrn4dyrblsgxrojd21lb8g Suss 1 Lamp Re-Ignition Video]
* [https://caltech.box.com/s/f5f4z86p8v9i43nvs7ntbgkzrog44jpm Suss 2 Lamp Re-Ignition Video]
Manufacturer Manuals
* [https://caltech.box.com/s/81h0w7viflquujpc960x76os52oinv1f Suss MA6/BA6 System Manual]
* [https://caltech.box.com/s/0bdk31f09vxui62c096lhaiguzgkc1cu Suss MA6/BA6 Brochure]
* [https://caltech.box.com/s/fxyqt4fkpb6x1c0li2l84wjose5x0wke Lamp Power Supply Manual]
* [https://caltech.box.com/s/e1b5co1cb4hwbu21ala3cnqt888tma7f Alignment Mark Suggestion Document]

==== FBS Reservation Rules:====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner Cleaning SOP]
* [https://caltech.box.com/s/evjv6kciuamgl42moa8vug60dpc0gimp Laurell Spinner - Spinning Resist Video]

=== Process Recipes ===
* [https://lab.kni.caltech.edu/index.php/Process_Recipe_Library#Optical_Lithography Optical Lithography Photoresist Recipes]

== Related Instrumentation in the KNI ==
=== Optical Lithography ===
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
=== Electron Beam Lithography ===
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
=== Ion Beam Lithography ===
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Wafer Stepper

2024-04-15T22:58:30Z

Sydney: Adjusted text to refer to FBS instead of LabRunr, and removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = Stepper
|HeaderColor = #FFFFFF
|ImageOne = I-Line-Wafer-Stepper GCA-6300.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1536
|PrimaryStaff = [[Bert Mendoza]]
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = GCA
|Model = 6300
|Techniques = Wafer Patterning, Pattern Alignments
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2-, 3-, 4-, 6-, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain +/-0.1 °C temperature control.

Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X- & Y-coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X- & Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.
===== Applications =====
* Step exposure with alignments
* Step exposure without alignments

== Resources ==
=== Specifications ===
* Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
* System is setup for 4 inch wafers and pieces smaller than 100mm.

=== FBS Reservation Rules:===
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== SOPs ===
* [https://caltech.box.com/s/z6q0ovarnkwe1sec645uq8kti44r4jwc GCA 6300 Operation Quick Guide Reference]
* [https://caltech.box.com/s/o634f2xum216ah4lrmxy67nurxbt5iqg GCA 6300 Operation SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
Manufacturer Manuals
* [https://caltech.box.com/s/tq6pr3f9yldpfnr30kcx0jhre85541nz System Operation Manual]
* [https://caltech.box.com/s/87i1mym5d2nxluk4zim4wemf5zbhsm5w Advanced Operation & Utilization Manual]
* [https://caltech.box.com/s/1fzh7r5ceopxyamnss0i3gen7nashnnt Advanced Information Package]
* [https://caltech.box.com/s/h7jdk8uxhfygcuhx0e0a3jsrlp0q4ztq Reticle Handbook]
* [https://caltech.box.com/s/m6wb60586w93z2ys8emz8nhg8e0yxtv3 Baseline Procedure]
* [https://caltech.box.com/s/kqn62mmqrslz8x8bm2t7qqybjqulrosu Acceptance Test Procedures]

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]

== Related Instrumentation in the KNI ==
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Wafer Stepper

2024-04-15T22:57:24Z

Sydney: Adjusted text to refer to FBS instead of LabRunr

{{InstrumentInfoboxOneImage|
|InstrumentName = Stepper
|HeaderColor = #FFFFFF
|ImageOne = I-Line-Wafer-Stepper GCA-6300.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1536
|PrimaryStaff = [[Bert Mendoza]]
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = GCA
|Model = 6300
|Techniques = Wafer Patterning, Pattern Alignments
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2-, 3-, 4-, 6-, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain +/-0.1 °C temperature control.

Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X- & Y-coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X- & Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.
===== Applications =====
* Step exposure with alignments
* Step exposure without alignments

== Resources ==
=== Specifications ===
* Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
* System is setup for 4 inch wafers and pieces smaller than 100mm.

=== FBS Reservation Rules:===
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== SOPs ===
* [https://caltech.box.com/s/z6q0ovarnkwe1sec645uq8kti44r4jwc GCA 6300 Operation Quick Guide Reference]
* [https://caltech.box.com/s/o634f2xum216ah4lrmxy67nurxbt5iqg GCA 6300 Operation SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
Manufacturer Manuals
* [https://caltech.box.com/s/tq6pr3f9yldpfnr30kcx0jhre85541nz System Operation Manual]
* [https://caltech.box.com/s/87i1mym5d2nxluk4zim4wemf5zbhsm5w Advanced Operation & Utilization Manual]
* [https://caltech.box.com/s/1fzh7r5ceopxyamnss0i3gen7nashnnt Advanced Information Package]
* [https://caltech.box.com/s/h7jdk8uxhfygcuhx0e0a3jsrlp0q4ztq Reticle Handbook]
* [https://caltech.box.com/s/m6wb60586w93z2ys8emz8nhg8e0yxtv3 Baseline Procedure]
* [https://caltech.box.com/s/kqn62mmqrslz8x8bm2t7qqybjqulrosu Acceptance Test Procedures]

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Stepper from the dropdown menu)

== Related Instrumentation in the KNI ==
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

CNI-PV 2.1: Nano Imprint Lithography

2024-04-15T22:57:00Z

Sydney: Adjusted text to refer to FBS instead of LabRunr

{{instrument|{{PAGENAME}}
|InstrumentName = NIL Technology CNI-PV 2.1 Nano Imprint Lithography System
|HeaderColor = #F5A81C
|ImageResearch = NILT_Imprint_process.png
|ImageInstrument = CNI_NILT_wiki.jpeg
|InstrumentType = Lithography
|RoomLocation = B217 Steele
|LabPhone = 626-395-1536
|PrimaryStaff = Bert Mendoza
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = NIL Technology
|Techniques = Thermal and UV Nanoimprint Lithography
|RequestTraining = mailto: bertm@caltech.edu
|EmailListName = kni-photolith
|EmailList = kni-photolith@caltech.edu
}}
== Description ==
The NIL Technology CNI-PV 2.1 Nano Imprint Lithography System is a lithography tool that is used to enable nanoscale printing by thermal or UV exposure of photoresist with an imprint stamp. Vacuum in the imprint chamber is enabled down to 1 micron, and thermal imprint of up to 240°C is available. The system is compatible with UV-cured resists, and has an integral UV light source for those processes. It allows up to 200 mm diameter substrates with UV, or up to 150x150 mm substrates with thermal processing.
===== Operational Applications =====
* Thermal Nano Imprint Lithography
* UV Nano Imprint Lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/b18bwz6vibzsz08hnhior52vcep8cww4 CNI v2.1 PV Edition description]
===== General SOPs =====
* [https://caltech.box.com/s/3hxilag7uca8wurqkscar8jbtbzmczf3 NILT - Operation SOP]

===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

===== Training Materials =====
*
===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/8tv6lvwmwbecgwd9qayq73mbdje4klmk NanoImprint Resists flyer]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
===== Advanced Troubleshooting SOPs =====
*
===== Data Preparation Resources =====
*
===== Lithography Process Information =====
* [https://youtu.be/YzzHchJZaCw Hot Embossing Demo from NILT (YouTube - external)]
===== Manufacturer Manuals =====
*

== Specifications ==
* Thermal NanoImprint: Up to 240°C with 150x150 mm substrate
* UV NanoImprint up to 200 mm wafers
 
 

== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

XeF2 Etcher for Silicon

2024-04-15T22:56:28Z

Sydney: Adjusted text to refer to FBS instead of LabRunr, and removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg

{{InstrumentInfoboxOneImage|
|InstrumentName = XeF2 Silicon Etcher
|HeaderColor = #FFE2B9
|ImageOne = XeF2-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = N/A
|Model = N/A
|Techniques = Selective dry Si etching
|RequestTraining = alireza@caltech.edu
|EmailList = kni-XeF2
|EmailListName = XeF2
}}
== Description ==
The XeF2 etcher flows pressure- and time-controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices.

===== Applications =====
* Very high selectivity dry Si etching
* MEMS fabrication

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/2zf5dwmdjyjxptvoscxkxe6yt57vr85v KNI SOP]

DWL-66: Direct-Write Laser System

2024-04-15T22:55:21Z

Sydney: Adjusted text to refer to FBS instead of LabRunr, and removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS

{{InstrumentInfoboxOneImage|
|InstrumentName = DWL-66 Direct-Write Laser System
|HeaderColor = #FFFFFF
|ImageOne = Heidelberg-DWL-66.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1536
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Heidelberg Instruments
|Model = DWL-66
|Techniques = Direct Patterning, Pattern Alignment,Wafer and Mask Patterning
|EmailList = kni-dwl66
|EmailListName = DWL66
}}
== Description ==
The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi (dots per inch) is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.
===== Applications =====
* Direct Writing
* Grayscale Writing

== Resources ==

===== SOPs =====
* [https://caltech.box.com/s/y86tagq2ajxt16wnj5bmqwupas1f1bs7 Operation SOP]
====== FBS Reservation Rules:======
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

===== Optical Lithography Resources =====
* [[Optical Lithography Resources | Optical Lithography Resources Page]]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/kvh2lwhzq6gzd12a43a5nr1xv0hrwb8p User Guide, Part 1]
* [https://caltech.box.com/s/zp79iucikn6jn6dn245aiq1zrsk2p3pb User Guide, Part 2]

== Specifications ==
* Exposure: 442 nm wavelength HeCd laser

== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

Wedge-Wedge Wire Bonder

2024-04-15T22:53:43Z

Sydney: Adjusted text to refer to FBS instead of LabRunr

{{InstrumentInfoboxOneImage|
|InstrumentName = Wire Bonder
|HeaderColor = #E6E7E8
|ImageOne = Wedge-Wedge-Wire-Bonder_Westbond-7476D-79.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Device_Processing|Device Processing]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Bert Mendoza]]
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = WestBond
|Model = 7476D-79
|Techniques = Wire Bonding
|EmailList = kni-wirebonder
|EmailListName = WestBond Wire Bonder
}}
== Description ==
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
===== Applications =====
* Bonding aluminum wire to a metal bond pads.
* Aluminum wire thickness currently being used is 0.001 inch.

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/x5q9oxso8k1rn03d12iyqdr3egytg1br WestBond - General SOP]
* [https://caltech.box.com/s/rx72y31eba3tnn36mq5ewwcdwpsgxmfe WestBond - Tool Change SOP]
* [https://caltech.box.com/s/l8y5e4etpes7v7vpih57w043dzvean7r WestBond - Changing the wire spool]-This presentation also give guidance on THREADING THE WIRE.

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 WestBond 7476D Wire Bonder Manual]
* [https://caltech.box.com/s/7yfera0l0q9hpc5i4rcmameuu6h3yszs WestBond K1200D Temperature Controller Manual]
===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 See - WestBond 7476D Wire Bonder Manual]
* Recommended Bond Pad Requirements:
::1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.
:::Bonding will be difficult and little room for error.
::2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).
::3. Minimum Pad Thickness - 150nm Gold (thicker is better).
::4. Suggested Pad Thickness - 250nm Gold.

Critical Point Dryer

2024-04-15T22:53:10Z

Sydney: Adjusted text to refer to FBS instead of LabRunr

{{InstrumentInfobox|
|InstrumentName = Critical Point Dryer
|HeaderColor = #E6E7E8
|ImageOne = Diamond-Lattice_Eleftheria-Roumeli.jpg
|ImageTwo = TA-915B-Critical-Point-Dryer.jpg
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Substrate_Processing|Substrate Processing]]
|RoomLocation = B211 Steele
|LabPhone = 626-395-1538
|PrimaryStaff = [[Bert Mendoza]]
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Tousimis
|Model = 915B
|Techniques = Critical Point Drying
|EmailList = kni-cpd
|EmailListName = CPD
}}
== Description ==
For the preparation of nano-electromechanical structures as well as for the preparation of biological specimens, we operate a critical point dryer that prevents surface tension damage in nanostructures when removing them from etching or sample preparation solutions. Critical point drying is also a very common technique for the preparation of cell and bacteria samples before imaging with an electron microscope.
===== Applications =====
* Prepare biological specimens for e.g. microscopy
* Protect 3D-printed structures from surface tension damage in post-lithography processing

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/5hx3yl02u6yqxygs5af5gak34rok7hvk Tousimis 915B - SOP & Troubleshooting]
===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

===== Manufacturer Manual =====
* [https://caltech.box.com/s/hkk7dboewyp9dr32i7f0fww6yaspcd3h Tousimis Automegasamdri 915B Manual]

===== Manufacturer Website =====
* [https://tousimis.com/ Tousimis.com] - Main page.
* [https://tousimis.com/critical_point_dryers/EM_sample_holders.html Tousimis.com] - Tousimis page for general sample holders.
*Tousimis can also fabricate special holders upon request.

* [https://tousimis.com/critical_point_dryers/wafer_holders.html Tousimis.com] - Tousimis page for wafer and chip holders.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/hkk7dboewyp9dr32i7f0fww6yaspcd3h Tousimis Automegasamdri 915B Manual]

===== Notable Specifications =====
* Accommodated Sizes: Pieces & wafers up to 6"

Scriber-Breaker

2024-04-15T22:52:32Z

Sydney: Adjusted text to refer to FBS instead of LabRunr

{{InstrumentInfoboxOneImage|
|InstrumentName = Scriber-Breaker
|HeaderColor = #E6E7E8
|ImageOne = Dynatex-GST-150_Scriber-Breaker.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Substrate_Processing|Substrate Processing]]
|RoomLocation = B213 Steele
|LabPhone = 626-395-1537
|PrimaryStaff = [[Bert Mendoza]]
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Dynatex
|Model = GST-150
|Techniques = Wafer & Chip Scribing, Scribe Breaking
|EmailList = kni-scriber
|EmailListName = Scriber
}}
== Description ==
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
===== Applications =====
* Scribing and/or breaking wafers

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/f02g7mjwi4asprd2ekiiotq6c09gp2bc Dynatex GST-150 - Operation SOP and Troubleshooting Guide]
* [https://caltech.box.com/s/6sv7l95xxx8927f19sv04vcycx2p8yhq Dynatex GST-150 - Operation Quick Reference Guide]
* [https://caltech.box.com/s/4yd6vvov0fk759pzh2e5dihcuipbeptc Dynatex GST-150 - Tool Change SOP - STAFF or Qualified Personel Only]

===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GST-150 Manual]
* [https://caltech.box.com/s/2hbk1r4847wru8tqayxjkw0soejpvx0k Scribe & Break Theory for GST-150]

== Specifications ==
===== Specifications =====
* Accommodated Sizes: up to 6" wafers
* Acceptable Materials: InP, GaAs, or Silicon substrates.

The Kavli Nanoscience Institute Laboratory at Caltech

2024-04-15T22:45:54Z

Sydney:

{{infobox laboratory
|name = The Kavli Nanoscience Institute (KNI)
|image = KNI-Caltech-Cleanroom.jpg
|caption = ''A look inside the KNI Laboratory cleanroom''
|motto = Advancing multidisciplinary research in nanoscience
|research_field = Electronics, Photonics,Quantum Matter & Technology,Medical & Biological Engineering,and Sustainability
|operating_agency= [https://en.wikipedia.org/wiki/California_Institute_of_Technology California Institute of Technology]
|location = Pasadena, CaliforniaUnited States
|address = Steele Laboratory[https://www.caltech.edu/documents/9/Caltech_Map.pdf Campus Building #81]
|established = 2003
|directors = [http://jrgreer.caltech.edu/ Julia R. Greer]
|staff = Eight
|users = 120+
|website = http://kni.caltech.edu/
}}
'''[https://lab.kni.caltech.edu/index.php/Covid-19 COVID-19 INFORMATION].'''

== About the KNI ==
The Kavli Nanoscience Institute (KNI) Laboratory, located at the California Institute of Technology, spans 10,000 ft2 across two facilities, primary among them the 7,500 ft2 controlled-environment cleanroom in the Steele Building sub-basement, where the majority of lithography, deposition, etching, microscopy, and supporting instrumentation is located. Managed by full-time technical staff and available for use by researchers at Caltech and other academic, government and industrial institutions, the KNI Laboratory is equipped for — and dedicated to — exploring the limits of nanofabrication.

== Available Resources ==
This lab site contains resources that are meant to maximize our users' ability to be safe, informed, productive KNI lab members. We also welcome non-KNI members to learn about our lab and make use of any resources provided on this site.
* '''Sidebar:''' See the left-hand sidebar for general information, links to equipment categories, and other resources
* '''[[Equipment List]]:''' Find resources for any given instrument (e.g. SOPs, troubleshooting, presentations, manuals, videos, specifications)
* '''[https://mh-fbs1.caltech.edu/Anon/Logon.aspx Equipment Reservations]:''' Go to the KNI's FBS Reservations site to make reservations to use the equipment
* '''[https://caltech.box.com/s/fd1zf5fanzimlpuopwmtai6vqqh5dv8s KNI Document Library]:''' Find resources grouped by instrument type
* '''[https://www.youtube.com/channel/UCWbGhTKjT6wv7T4sZ23E7WQ KNI YouTube Channel]:''' Video tutorials, which are also linked to from individual instrument pages
* '''[https://kni.caltech.edu The KNI Website]:''' Official information on KNI programs, research, publications, and news
* '''[Mailto:derose@caltech.edu SUGGESTION BOX]:''' Please send all SUGGESTIONS to help improve the KNI Lab to Guy DeRose.

== Equipment Updates ==
To receive staff & user updates on individual instruments (or groups of instruments), go to [[Email Lists]] and subscribe to all relevant lists.

== Contacting the KNI ==
For general or specific inquiries, go to [[KNI Staff Members]] and use the information there to contact the appropriate individual(s).

== New KNI Users ==
To become a KNI lab user, see the information and forms provided on [[New User Forms]].


==KNI User Offboarding==
* [https://caltech.box.com/s/qapv4ytu4uhyszz538rz4k55mvdihyix KNI Member Offboarding SOP]

The Offboarding SOP must be completed when ending your KNI Lab membership. It lists items such as Labrunr, Stored Items, Chemicals, Stored Data/Files, etc, which should to be addressed before your membership ends.

__NOTOC__