The KNI Lab at Caltech - User contributions [en]

Template:Infobox laboratory

2019-04-14T01:34:49Z

Mhsulliv:

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Equipment List

2019-04-11T23:41:56Z

Mhsulliv: /* Focused Ion Beam (FIB) Systems */

= Lithography =
===== Electron Beam Lithography =====
* Electron Beam Pattern Generator: Raith EBPG 5200 (100 keV)
* Electron Beam Pattern Generator: Raith EBPG 5000+ (100 keV)
* Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 keV)
* Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 keV)
===== Ion Beam Lithography =====
* He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 keV He & Ne, 1-30 keV Ga)
===== Optical Lithography =====
* Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
* i-Line Wafer Stepper: GCA model 6300
* Direct-Write Laser System: Heidelberg Instruments DWL-66
* Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT

= Deposition =
===== Evaporation =====
* Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline
* Metals & Oxides: CHA Industries Mark 40
* Carbon: Leica EM ACE600 Carbon Evaporator
===== Sputtering =====
* Dielectric Sputterer: AJA International ATC Orion 8
* Chalcogenide Sputterer: AJA International ATC Orion 5
===== Chemical Vapor Deposition (CVD) =====
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
===== Dielectric Packaging / Moisture Barrier =====
* Parylene Coater: Para Tech LabTop 3000

= Etching =
===== Dry Etching =====
* Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
* Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
* Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
* Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
* Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
* XeF2 Silicon Etcher
===== Wet Etching =====
* Available Wet Chemistry Techniques

= Microscopy =
===== Focused Ion Beam (FIB) Systems =====
* He/Ne/Ga-FIB: Zeiss ORION NanoFab
* [[Nova_600_NanoLab:_SEM,_Ga-FIB,_Omniprobe|SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600]]

===== Scanning Electron Microscopes (SEMs) =====
* SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200
* SEM/EDS: Thermo Fisher Sirion
* SEM/ESEM: Thermo Fisher Quanta 200F
* SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
===== Transmission Electron Microscopes (TEMs) =====
* TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-300 kV)
* TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)
===== Scanning Probe Microscopes =====
* Atomic Force Microscope (AFM): Bruker Dimension ICON
* Profilometer: Veeco Dektak 3ST
===== Optical Characterization =====
* Spectroscopic Ellipsometry: Woolam M-2000
* Light Microscope: Olympus BX51M with Filmetrics model F40
* Fluorescence Microscope: Olympus IX81

= Support Tools =
===== Thermal Processing =====
* Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
* Rapid Thermal Processing: Modular Process Technology RTP-600S
* Rapid Thermal Annealer: Jipelec Jetfirst 150
===== Substrate Processing =====
* Scriber-Breaker: Dynatex GST-150
* Wafer Bonder: Suss Microtech model SB6L
* Critical Point Dryer: Tousimis Automegasamdri 915B
===== Device Processing =====
* Wedge-Wedge Wire Bonder: Westbond model 7476D-79
* Electrical Probing Station: Cascade Microtech M150

Template:Instrument

2019-04-11T23:36:40Z

Mhsulliv:

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Template:Instrument

2019-04-10T23:32:10Z

Mhsulliv:

2019-04-10T23:12:59Z

Mhsulliv:

Template:Instrument

2019-04-10T23:02:22Z

Mhsulliv:

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Template:Instrument

2019-04-10T23:00:34Z

2019-03-25T23:06:35Z

Mhsulliv:

= Lithography =
===== Electron Beam Lithography =====
* Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
* Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
* Nanometer Pattern Generation System: Quanta 200F SEM with NPGS (1-30 kV)
===== Ion Beam Lithography =====
* He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)
===== Optical Lithography =====
* Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
* i-Line Wafer Stepper: GCA model 6300
* Direct-Write Laser System: Heidelberg Instruments DWL-66
* Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT

= Deposition Equipment =
===== Evaporation =====
* Al, Au, Pt & Ti: Kurt J Lesker Labline
* Metals & Oxides: CHA Industries Mark 40
* Carbon: Leica EM ACE600 Carbon Evaporator
===== Sputtering =====
* Dielectric Sputterer: AJA International ATC Orion 8
* Chalcogenide Sputterer: AJA International ATC Orion 5
===== Plasma- & Thermal-Enhanced Deposition =====
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
* Tube Furnaces: Tystar Tytan (Wet & Dry Oxidation and Annealing)

= Etching Equipment =
===== Dry Reactive-Ion Etching (RIE) =====
* Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
* Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
* Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
* Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
* Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
===== Wet Etching =====
* Wet Chemistry

= Microscopy Instrumentation =
==== Focused Ion Beam (FIB) Systems ====
* He/Ne/Ga-FIB: Zeiss ORION NanoFab
* SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
===== Scanning Electron Microscopes (SEMs) ====
* SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
* SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200
* SEM/EDS: Thermo Fisher Sirion
* SEM/ESEM: Thermo Fisher Quanta 200F
==== Transmission Electron Microscopes (TEMs) ====
* TEM/STEM/EDS/EELS/EFTEM: Thermo Fisher Tecnai TF-20 (80-300 kV)
* TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)
==== Scanning Probe Microscopes ====
* Atomic Force Microscope (AFM): Bruker Dimension ICON
* Profilometer: Veeco Dektak 3ST

= Support Tools =
==== Wafer Processing ====

Equipment List

2019-03-25T21:48:31Z

Mhsulliv:

=Lithography=
===== Electron Beam Lithography =====
* Raith EBPG 5000+ (100 kV)
* Raith EBPG 5200 (100 kV)
* Quanta 200F SEM with NPGS (1-30 kV)

===== Ion Beam Lithography =====
* Zeiss ORION NanoFab (5-40 kV He & Ne, 1-30 kV Ga)

===== Photolithography =====
* Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
* i-Line Wafer Stepper: GCA model 6300
* Direct-Write Laser System: Heidelberg Instruments DWL-66
* Two-Photon Lithography (3D printing): Nanoscribe Photonic Professional GT

= Deposition Equipment =
===== Evaporation =====
* Kurt J Lesker Labline (Al, Au, Pt, Ti)
* CHA Industries Mark 40 (Metals & Oxides)
* Leica EM ACE600 Carbon Evaporator

===== Sputtering =====
* Dielectric Sputterer: AJA International ATC Orion 8
* Chalcogenide Sputterer: AJA International ATC Orion 5

===== Plasma- & Thermal-Enhanced Deposition =====
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 PECVD
* Tube Furnaces: Tystar Tytan (Wet & Dry Oxidation and Annealing)