The KNI Lab at Caltech - User contributions [en]

Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner

2020-09-14T08:38:21Z

Matthew: /* SOP */

{{InstrumentInfoboxOneImage|
|InstrumentName = Tergeo Plus Plasma Cleaner
|HeaderColor = #FFE2B9
|ImageOne = Tergeo-Plus-O2-Ar-Plasma-Cleaner.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Etching]], [[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = PIE Scientific
|Model = Tergeo Plus
|Techniques = Plasma Cleaning, Direct Mode (ICP), Remote Mode (CCP)
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Tergeo Plus is an easy-to-use, versatile plasma cleaner that can operate in a number of different modes using a range of gases. Currently, only oxygen and argon gases are hooked up to the instrument, which are suitable for many sample cleaning and resist ashing (i.e. resist removal) applications, though a third gas connection exists if there is a need to use another gas (e.g. hydrogen for plasma cleaning with a reducing environment). This cleaner can be operated in Direct Mode (aka Immersion Mode), which involves striking an inductively-coupled plasma (ICP) directly in the sample chamber, or Remote Mode (aka Indirect Mode), which involves striking a capacitively-coupled plasma (CCP) in a remote chamber. The Remote Mode is the more gentle cleaning mode because it only allows neutral species to make their way into the chamber and participate in cleaning by means of chemical reaction (e.g. oxygen radicals react with surface hydrocarbons to create volatile species like CO and CO2 that can then be removed via the vacuum). Low power modes can also be achieved in either Direct or Remote Mode by varying the pulsing ratio. See below for the full list of resources related to this instrument.
===== Applications =====
* Remove hydrocarbons from SEM/FIB samples to prevent "black box" effect from happening while imaging (use O2 or O2/Ar plasma)
* Remove residual resist from developed lithography processes, aka "descumming" of the substrate surface (use O2 or O2/Ar plasma)
* Sputter away small amounts of surface materials (use high-power Ar plasma)
* Activate the surface of PDMS polymer to make it adhesive to e.g. glass slides, for use in microfluidic device fabrication (use O2 plasma)
* Running a hydrogen plasma has not yet been tried but could theoretically clean e.g. graphene without oxidizing it (O2 plasma would)
* Any other process that requires the non-directional removal of material by reactive-ion plasma

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/y0oiacrryzcrxv6so2p6d4zpysvj48cf Etching Pass-down equipment information]
[[Image:Tergeo-Plus-Plasma-Cleaner–Parameters-Overview-Graphic.jpg|thumb|top|upright=1.35|An overview of the available modes and parameter ranges]]
===== SOP & Troubleshooting =====
* [https://caltech.box.com/s/0dkpffpstz2y1mmnywa4br9er07irvsv SOP & Troubleshooting Document]

===== Graphical Handouts =====
* [https://caltech.box.com/s/ics22ljdscnz5zcdct351iw10os97u01 Graphical Handout] (see it also pictured at right)
===== Video =====
* [https://www.youtube.com/watch?v=UNrwtm6puLs PIE Scientific's Product Overview Video]
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Operating Manual]
* [https://caltech.box.com/s/flz7maaqq1k80pdacpqqd9yaps63agjp Quick Start Guide]
===== Note on Cleaning for SEM & FIB Samples =====
[[Image:Black-Box-Effect.jpg|thumb|top|upright=1.00|An example fo the "black box effect" that one tries to avoid by plasma cleaning the sample before SEM or FIB imaging. It is caused by scanning a beam over an area that is covered by copious amounts of hydrocarbons.]]
* During SEM or FIB imaging, the local specimen area will heat up due to added energy from the beam. If there is organic matter on the surface from a previous process (e.g. solvent treatment) or from simply being exposed to the ambient environment, the heat causes hydrocarbons to evolve from the surface, whereupon they become a precursor gas for an electron-beam- or ion-beam-aided, chemical-vapor-deposition of carbon back onto the surface, now in a denser form. This carburization of the surface often results in a “black box” appearing in areas where the beam was highly concentrated, e.g. where a reduced area window was used for a focusing step (carbon has a low yield of secondary electrons, SEs, and thus the carbon area appears darker). Note that the carburization process happens more quickly at lower e-beam accelerating voltages because the chemical vapor deposition is dependent on the presence of SEs, which are emitted in higher quantities at low voltage. Cleaning a specimen with an O2 and/or Ar plasma (or H2 if a reducing environment is necessary to prevent oxidation) will remove the hydrocarbons and prevent this process from happening to a noticeable degree while imaging.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Manufacturer Data Sheet]

===== Mode 1 Specifications =====
* Power Range: 1 to 150 W
* Pulsing Duty Ratio Range (N/255): 1 to 255, where
** Example: With 10 W power, if N=25 then the average power as a function of pulsing would be [10 W * (25/255) = 0.98 W, on average]
* Gas Flow Rates: 0.1 to 100.0 sccm
* Ultimate Vacuum: < 30 mTorr
 
 
== Related Instrumentation in the KNI ==
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

ORION NanoFab: Helium, Neon & Gallium FIB

2020-07-21T16:42:54Z

Matthew: /* Video Tutorials */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = derose@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/ls0irl1ocme9pmqili2vxurgqo7050d9 SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild & Trimer Formation Guide]
* [https://caltech.box.com/s/s0zbkyct23o0fxmzpzhrymaz1g82s68d Troubleshooting Guide]

===== Process Recipes =====
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
* [https://youtu.be/tWhyT3Rq_k8 Getting Started] | [https://youtu.be/lxFGaZSvgP0 Introduction to GFIS Parameters (He- & Ne-FIB)]
* [https://youtu.be/nxjpI7CUdOc GFIS Alignments (He- & Ne-FIB)]
* [https://youtu.be/r4jcT6HuApk Using the Electron Flood Gun for Charge Compensation]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there] (recorded for SEM, same principles apply here)
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]) (recorded on SEM/Ga-FIB)
* Preparing a Trimer ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL 7-Part Playlist] | [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Written Guide])
* [https://youtu.be/L4ipEtoQC9c How to Remove Adatoms and Recover Your Trimer]

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/2f5semkplrho29lgugdjigroh0jip97h Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM & FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Guide to Choosing KNI SEMs & FIBs

2020-06-08T09:44:01Z

Matthew:

*This guide will help you choose the best scanning electron microscopes (SEMs) and focused ion beam systems (FIBs) for your work. SEMs ([[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]], [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]], [[Sirion: SEM & EDS | Sirion]]) are ~33% cheaper per hour than FIBs ([[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]], [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]); see [[Usage Rates | usage rate details]]. Once you know how to use one microscope, it is easy to learn the others, so please [mailto:derose@caltech.edu request training]. We want you to be efficient with your cleanroom expenses and we want to be efficient, as a group, in terms of allocating microscopy resources to the right kinds of work.
*See the “Functionality of SEMs & FIBs” table below for application specifics associated with each microscope (e.g. EDS, Probe Station, Omniprobe, etc.)
*See the [https://caltech.box.com/s/cs0wj4dn89am3fof8ox0vqetaad8ylg8 KNI's Microscopy Lectures] for more details on physical principles, applications, and examples

==Low Magnification Imaging==
If you only need to take low mag images, e.g. with a 4 μm field of view (FOV) or larger (i.e. if you're only using “Field Free Mode” aka “Normal Mode"):
#'''[[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' Optimal objective lens placement yields best field-free imaging; quick chamber pump/vent times (1-2 mins); backscattered electron detector )BSED) for best Z-contrast imaging
#'''[[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]]''' or '''[[Sirion: SEM & EDS | Sirion]]:''' Both have an immersion lens, which means the field-free objective lens is not optimally placed for low mag imaging, though still works fine; these SEMs provide the benefit of being able to switch to immersion mode for higher resolution if/when needed
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]''' or '''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' You're generally advised to leave FIBs for FIB-related work and/or the highest-resolution imaging; more expensive than SEMs

==High Magnification Imaging==
If you need to take high mag images with less than 4 μm FOV (i.e. if you're using “Immersion Mode” aka “Ultra High Resolution (UHR) Mode”):
#'''[[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]]''' or '''[[Sirion: SEM & EDS | Sirion]]:''' High resolution but limited depth of field e.g. when tilting; Nova 200 has 3-4 min pump/vent times and Sirion has 1-2 min pump/vent times
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Maintains great depth of field at high resolution with He imaging; 2 min sample transfer times via load lock
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for high-resolution imaging if also incorporating FIB (e.g. if imaging cross-sections), same pump/vent times as Nova 200 (3-4 mins)

==Highest Magnification Imaging==
If you need to take images with less than 2 μm FOV:
#'''[[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200]]:''' Can image as small as ~800 nm FOV – and features as small as 6 nm – with good clarity; has limited depth of field when in the Immersion Mode; is the cheapest option
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Can image as small as ~300 nm FOV – and features as small as 3 – with good clarity; maintains depth of field at smallest FOVs; more expensive than Nova 200
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Works as well as the Nova 200 at these FOVs, but is more expensive to use because it has Ga-FIB capability
#'''[[Sirion: SEM & EDS | Sirion]]:''' Not quite as good as Nova 200 or Nova 600 at these FOVs

==Gallium Focused Ion Beam Work==
If you need to use Ga-FIB:
#'''[[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]]:''' Use for cross-sections, TEM sample prep, point & shoot etching tasks, Pt dep, minor automation via scripting
#'''[[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Use for major automation (via Raith ELPHY MultiBeam software), cross-sectioning without Pt protection layer

==Lithography==
If you want to perform lithography on resist or a hard mask and don't need extremely accurate stitching across write fields (for accurate stitching, use [[Equipment_List#Lithography | EBPGs]]):
#'''Electron beam lithography on [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta]]:''' As small as 15 nm features achievable at 30 kV
#'''Helium ion beam lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' As small as 5 nm features achievable at 35 kV (best when used on very thin resist)
#'''Ga-, Ne-, and He-FIB Hard Mask Lithography on [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]]:''' Directly pattern a hard mask (e.g. [[FlexAL II: Atomic Layer Deposition (ALD) | ALD]] Al2O3) that subsequently gets used as an etch mask

=="Functionality of KNI SEMs & FIBs" Table==
[[File:KNI-SEM-and-FIB-Functionality-Table.png|thumb|left|1000px|Consult this table to determine which of the KNI's SEMs and FIBs offer a particular functionality that you need]]

New Members

2020-05-25T22:13:04Z

Matthew: /* Next Steps */

In order to establish your KNI lab membership, please fill out the relevant form below and submit to [mailto:tkimoto@caltech.edu Tiffany Kimoto] (tkimoto@caltech.edu), then follow the next steps below. External users will be required to submit additional paperwork. You can find information on our [[Usage_Rates | usage rates here]].

==KNI Information & Billing Forms==
* [https://caltech.box.com/s/9o7pof5o6y83xlskkne6ufqcvviduesa Caltech members]
* [https://caltech.box.com/s/wd6qedw3zu1sbt0mbvv8lai67t1d3leg Caltech SURF/WAVE students]
* [https://caltech.box.com/s/lwrmn1mrmxuqmiauhgdx73gvowgz4m43 JPL members]
* [https://caltech.box.com/s/26w5srmths37kybjaismwwyc70y1qeiz Non-Caltech Academic or Government members]
* [https://caltech.box.com/s/qsn1os31wne2nfmu3oyz2ywqmymhv3n2 Industry/corporate members]

==External Users==
Non-Caltech Academic/Government and Industry/Corporate members are considered external users. There are additional requirements to set up an external user's KNI lab membership:
* Facilities Use Agreement (FUA)
* Proof of Liability Insurance (COI)
* Purchase Order (PO)

Please contact Tiffany Kimoto [mailto:tkimoto@caltech.edu (tkimoto@caltech.edu)] for full instructions and the required paperwork for setting up your external lab membership.

==Next Steps==
'''For all users:''' Once paperwork has been submitted, please contact Associate Director of Technical Operations Guy DeRose [mailto:derose@caltech.edu (derose@caltech.edu)], and Lab Coordinator and Safety Officer Bert Mendoza [mailto:bertm@caltech.edu (bertm@caltech.edu)], to schedule New Member Orientation and Chemical Handling training. Training will take about 3 hours total, including the in-lab Chemical Handling portion. Training is offered the 1st and 3rd Wednesday of each month, starting at 9am and ending at 12pm.

NOTE: If you will be using the '''Tecnai TF-30 TEM only''', you can bypass the general safety training requirement and contact Guy DeRose [mailto:derose@caltech.edu (derose@caltech.edu)] directly to schedule instrument training.

Matthew S. Hunt, PhD

2020-03-27T00:35:06Z

Matthew: /* Video Demonstrations */

__NOTOC__
{{StaffMemberInfobox
|StaffName = Matthew S. Hunt, PhD
|StaffPhoto = Matthew-S-Hunt.jpg
|JobTitle = Assistant Director of Staff Research & Lead Microscopist
|AreasResponsibility = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]], Staff Research Projects
|CaltechID = matthew.hunt
|Phone = 626-395-5994 (office) 203-470-0861 (cell)
|OfficeLocation = 303 Steele
}}
== About ==
===== Role in the KNI =====
Matthew Hunt is the Assistant Director of Staff Research and Lead Microscopist for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He directs research projects that are carried out by KNI technical staff, in collaboration with Caltech & non-Caltech PIs and student researchers, with the purpose of creating new nanofabrication techniques using the KNI's leading edge instrumentation. He leads the scientific side of the [https://kni.caltech.edu/surf-the-wave KNI SURF-the-WAVE Fellowships Program], which offers summer fellowships to non-Caltech undergraduate researchers, and also leads the [https://kni.caltech.edu/programs/resident-experts Lab Resident Expert Program], which provides top lab users an opportunity to give back to the lab in the form of process recipe development and new ideas for general lab improvement. Matt also manages – and teaches users how to operate – the KNI's suite of microscopy equipment: transmission electron microscopes, scanning electron microscopes, focused ion beam systems, an atomic force microscope, and related sample preparation equipment.

Matt joined the KNI in 2014 after completing his PhD related to the high temperature oxidation of turbine engine materials, through which he developed expertise in a number of electron, ion and x-ray microscopy techniques. His research interests lie in the development of new lithography and microscopy techniques that utilize various beam species (e.g. helium ions, neon ions, gallium ions, electrons) and the application thereof to the kinds of novel materials and devices that are important to users of the KNI.

===== Education =====
Matt received his Ph.D. and M.S. in Materials Science & Engineering from the University of California, Irvine and a B.S. in Chemical Engineering from the University of Notre Dame.

== Lecture Materials ==
[[Image:SEM-FEG Ga-FIB-LMIS and He,Ne-FIB-GFIS Sources.png|thumb|top|upright=1.25|A slide from the microscopy presentations showing schematics of three emission sources – a field emission gun (FEG) for an SEM, a liquid metal ion source (LMIS) for a Ga-FIB, and a gas field ion source (GFIS) for a He- & Ne-FIB]]
===== Microscopy Presentations =====
* [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Scanning Electron Microscopy: Principles, Techniques & Applications] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]
* [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]

===== Video Demonstrations =====
* SEM & Ga-FIB Alignments ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOmXs6r-6kayl6ncR4lKPJAr Playlist])
* SEM & Ga-FIB Techniques ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnhm1ei1YtK-uIhT1UgKP4f Playlist])
* Cutting & Imaging Cross-Sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist])
* TEM Lamella Sample Preparation with SEM/Ga-FIB ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist])
* Helium & Neon Ion Microscopy Alignments & Techniques ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOl80BSOR7I6yVP5fzzX0lws Playlist])
* Preparing a gas field ion source (GFIS) trimer for He- & Ne-FIB ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL Playlist])
* Introduction to AFM ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkKijCVBCfpfpR8Jyw02q17 Playlist])

== Selected Publications ==
===== Articles =====
[[Image:Plasma-Etched-Pattern-Transfer-of-Sub-10-nm-Structures Fig 4a-c.jpg|thumb|upright=1.25|Figure 4a-c from "Plasma-Etched Pattern Transfer of Sub-10 nm Structures Using a Metal–Organic Resist and Helium Ion Beam Lithography," depicting 5.4 nm wide lines of resist, spaced 17 nm apart, written with 35 keV helium ions on silicon, shown before etch in (a) plan view and (b) tilted view, then (c) after etch in titled view. All images were captured using 30 keV helium ion microscopy. As of publication in 2019, these represent the smallest features ever reactive-ion-etched into silicon, setting a new record for one of the world’s foremost nanofabrication benchmarks. https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01911]]
* Scott M. Lewis, '''Matthew S. Hunt''', Guy A. DeRose, Hayden R. Alty, Jarvis Li, Alex Wertheim, Lucia De Rose, Grigore A. Timco, Axel Scherer, Stephen G. Yeates, and Richard E. P. Winpenny, "Plasma-Etched Pattern Transfer of Sub-10 nm Structures Using a Metal–Organic Resist and Helium Ion Beam Lithography," ''ACS Nano Letters'' 2019, available online: https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01911.
* Scott M. Lewis, Guy A. DeRose, '''Matthew S. Hunt''', Hayden Alty, Alex Wertheim, Jarvis Li, Trevor Fowler, Axel Scherer, Stepen G. Yeates, Richard E. P. Winpenny ''et al'', "Design and Implementation of the Next Generation Electron Beam Resists for the Production of EUVL Photomasks," ''Photomask Technology'' 2018, p 24. https://doi.org/10.1117/12.2501808.
* Scott M. Lewis, Antonio Fernandez, Guy A. DeRose, '''Matthew S. Hunt''', Axel Scherer, Stephen G. Yeates, Richard E. P. Winpenny ''et al'', "Use of Supramolecular Assemblies as Lithographic Resists," ''Angew. Chem. Int. Ed.'' 2017, 56 (24), 6749–6752. https://doi.org/10.1002/anie.201700224.
* '''Matthew (Sullivan) Hunt''', Daniel R. Mumm, "Transient stage oxidation of MCrAlY bond coat alloys in high temperature, high water vapor content environments," ''Surface and Coatings Technology'' 2014, Vol 258, 963-972. https://doi.org/10.1016/j.surfcoat.2014.07.048
* '''Matthew (Sullivan) Hunt''', Daniel R. Mumm, "Vapor-Phase-Mediated Phenomena Associated with High Temperature, High Water Content Oxidation of MCrAlX Bond Coats," ''Oxidation of Metals'' 2014, Vol 82. 1. https://doi.org/10.1007/s11085-014-9473-8

===== Conference Presentations =====
* [https://caltech.box.com/s/162octh05yaf9zkr4rmuf9wnimb6nk7x "Plasma-Etched Pattern Transfer of Sub-10 nm Structures Using a Metal–Organic Resist and Helium Ion Beam Lithography,"] '''Matthew S. Hunt''', Guy A. DeRose, Hayden R. Alty, Alex Wertheim, Nathan S. Lee, Stephen G. Yeates, Richard E. P. Winpenny, Axel Scherer, and Scott M. Lewis. Presented at the EIPBN Conference in Minneapolis, MN on July 31, 2019.
* [https://caltech.box.com/s/4oedg1bzg8i4wt1fh34r5tkzska0a26u "Helium and Neon Focused Ion Beam Hard Mask Lithography on Atomic Layer Deposition Films,"] '''Matthew S. Hunt''', Joshua Yang, Steven Wood, Nathan S. Lee, and Oskar J. Painter. Presented at the AVS Conference in Long Beach, CA on October 25, 2018.

== List of Managed Instruments ==
===== Microscopy & Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab]]
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)]]
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension ICON]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]

===== Support Tools for Microscopy =====
* [[Carbon Evaporator | Carbon Deposition: Leica EM ACE600 Carbon Evaporator]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

== Personal ==
Note that Matt changed his name from Matthew Hunt Sullivan to Matthew Sullivan Hunt in 2016 after getting married (and while working at Caltech).

Matthew S. Hunt, PhD

2020-03-27T00:29:59Z

Matthew: /* Microscopy Presentations */

__NOTOC__
{{StaffMemberInfobox
|StaffName = Matthew S. Hunt, PhD
|StaffPhoto = Matthew-S-Hunt.jpg
|JobTitle = Assistant Director of Staff Research & Lead Microscopist
|AreasResponsibility = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]], Staff Research Projects
|CaltechID = matthew.hunt
|Phone = 626-395-5994 (office) 203-470-0861 (cell)
|OfficeLocation = 303 Steele
}}
== About ==
===== Role in the KNI =====
Matthew Hunt is the Assistant Director of Staff Research and Lead Microscopist for The Kavli Nanoscience Institute (KNI) at the California Institute of Technology. He directs research projects that are carried out by KNI technical staff, in collaboration with Caltech & non-Caltech PIs and student researchers, with the purpose of creating new nanofabrication techniques using the KNI's leading edge instrumentation. He leads the scientific side of the [https://kni.caltech.edu/surf-the-wave KNI SURF-the-WAVE Fellowships Program], which offers summer fellowships to non-Caltech undergraduate researchers, and also leads the [https://kni.caltech.edu/programs/resident-experts Lab Resident Expert Program], which provides top lab users an opportunity to give back to the lab in the form of process recipe development and new ideas for general lab improvement. Matt also manages – and teaches users how to operate – the KNI's suite of microscopy equipment: transmission electron microscopes, scanning electron microscopes, focused ion beam systems, an atomic force microscope, and related sample preparation equipment.

Matt joined the KNI in 2014 after completing his PhD related to the high temperature oxidation of turbine engine materials, through which he developed expertise in a number of electron, ion and x-ray microscopy techniques. His research interests lie in the development of new lithography and microscopy techniques that utilize various beam species (e.g. helium ions, neon ions, gallium ions, electrons) and the application thereof to the kinds of novel materials and devices that are important to users of the KNI.

===== Education =====
Matt received his Ph.D. and M.S. in Materials Science & Engineering from the University of California, Irvine and a B.S. in Chemical Engineering from the University of Notre Dame.

== Lecture Materials ==
[[Image:SEM-FEG Ga-FIB-LMIS and He,Ne-FIB-GFIS Sources.png|thumb|top|upright=1.25|A slide from the microscopy presentations showing schematics of three emission sources – a field emission gun (FEG) for an SEM, a liquid metal ion source (LMIS) for a Ga-FIB, and a gas field ion source (GFIS) for a He- & Ne-FIB]]
===== Microscopy Presentations =====
* [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Scanning Electron Microscopy: Principles, Techniques & Applications] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]
* [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]

===== Video Demonstrations =====
* SEM & Ga-FIB Alignments ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOmXs6r-6kayl6ncR4lKPJAr Playlist])
* SEM & Ga-FIB Techniques ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnhm1ei1YtK-uIhT1UgKP4f Playlist])
* Cutting & Imaging Cross-Sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist])
* TEM Lamella Sample Preparation with SEM/Ga-FIB ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist])
* Helium & Neon Ion Microscopy Alignments & Techniques ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOl80BSOR7I6yVP5fzzX0lws Playlist])
* Preparing a gas field ion source (GFIS) trimer for He- & Ne-FIB ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL Playlist])

== Selected Publications ==
===== Articles =====
[[Image:Plasma-Etched-Pattern-Transfer-of-Sub-10-nm-Structures Fig 4a-c.jpg|thumb|upright=1.25|Figure 4a-c from "Plasma-Etched Pattern Transfer of Sub-10 nm Structures Using a Metal–Organic Resist and Helium Ion Beam Lithography," depicting 5.4 nm wide lines of resist, spaced 17 nm apart, written with 35 keV helium ions on silicon, shown before etch in (a) plan view and (b) tilted view, then (c) after etch in titled view. All images were captured using 30 keV helium ion microscopy. As of publication in 2019, these represent the smallest features ever reactive-ion-etched into silicon, setting a new record for one of the world’s foremost nanofabrication benchmarks. https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01911]]
* Scott M. Lewis, '''Matthew S. Hunt''', Guy A. DeRose, Hayden R. Alty, Jarvis Li, Alex Wertheim, Lucia De Rose, Grigore A. Timco, Axel Scherer, Stephen G. Yeates, and Richard E. P. Winpenny, "Plasma-Etched Pattern Transfer of Sub-10 nm Structures Using a Metal–Organic Resist and Helium Ion Beam Lithography," ''ACS Nano Letters'' 2019, available online: https://pubs.acs.org/doi/10.1021/acs.nanolett.9b01911.
* Scott M. Lewis, Guy A. DeRose, '''Matthew S. Hunt''', Hayden Alty, Alex Wertheim, Jarvis Li, Trevor Fowler, Axel Scherer, Stepen G. Yeates, Richard E. P. Winpenny ''et al'', "Design and Implementation of the Next Generation Electron Beam Resists for the Production of EUVL Photomasks," ''Photomask Technology'' 2018, p 24. https://doi.org/10.1117/12.2501808.
* Scott M. Lewis, Antonio Fernandez, Guy A. DeRose, '''Matthew S. Hunt''', Axel Scherer, Stephen G. Yeates, Richard E. P. Winpenny ''et al'', "Use of Supramolecular Assemblies as Lithographic Resists," ''Angew. Chem. Int. Ed.'' 2017, 56 (24), 6749–6752. https://doi.org/10.1002/anie.201700224.
* '''Matthew (Sullivan) Hunt''', Daniel R. Mumm, "Transient stage oxidation of MCrAlY bond coat alloys in high temperature, high water vapor content environments," ''Surface and Coatings Technology'' 2014, Vol 258, 963-972. https://doi.org/10.1016/j.surfcoat.2014.07.048
* '''Matthew (Sullivan) Hunt''', Daniel R. Mumm, "Vapor-Phase-Mediated Phenomena Associated with High Temperature, High Water Content Oxidation of MCrAlX Bond Coats," ''Oxidation of Metals'' 2014, Vol 82. 1. https://doi.org/10.1007/s11085-014-9473-8

===== Conference Presentations =====
* [https://caltech.box.com/s/162octh05yaf9zkr4rmuf9wnimb6nk7x "Plasma-Etched Pattern Transfer of Sub-10 nm Structures Using a Metal–Organic Resist and Helium Ion Beam Lithography,"] '''Matthew S. Hunt''', Guy A. DeRose, Hayden R. Alty, Alex Wertheim, Nathan S. Lee, Stephen G. Yeates, Richard E. P. Winpenny, Axel Scherer, and Scott M. Lewis. Presented at the EIPBN Conference in Minneapolis, MN on July 31, 2019.
* [https://caltech.box.com/s/4oedg1bzg8i4wt1fh34r5tkzska0a26u "Helium and Neon Focused Ion Beam Hard Mask Lithography on Atomic Layer Deposition Films,"] '''Matthew S. Hunt''', Joshua Yang, Steven Wood, Nathan S. Lee, and Oskar J. Painter. Presented at the AVS Conference in Long Beach, CA on October 25, 2018.

== List of Managed Instruments ==
===== Microscopy & Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab]]
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)]]
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension ICON]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]

===== Support Tools for Microscopy =====
* [[Carbon Evaporator | Carbon Deposition: Leica EM ACE600 Carbon Evaporator]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

== Personal ==
Note that Matt changed his name from Matthew Hunt Sullivan to Matthew Sullivan Hunt in 2016 after getting married (and while working at Caltech).

Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner

2020-03-24T23:13:39Z

Matthew:

{{InstrumentInfoboxOneImage|
|InstrumentName = Tergeo Plus Plasma Cleaner
|HeaderColor = #FFE2B9
|ImageOne = Tergeo-Plus-O2-Ar-Plasma-Cleaner.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Etching]], [[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = PIE Scientific
|Model = Tergeo Plus
|Techniques = Plasma Cleaning, Direct Mode (ICP), Remote Mode (CCP)
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Tergeo Plus is an easy-to-use, versatile plasma cleaner that can operate in a number of different modes using a range of gases. Currently, only oxygen and argon gases are hooked up to the instrument, which are suitable for many sample cleaning and resist ashing (i.e. resist removal) applications, though a third gas connection exists if there is a need to use another gas (e.g. hydrogen for plasma cleaning with a reducing environment). This cleaner can be operated in Direct Mode (aka Immersion Mode), which involves striking an inductively-coupled plasma (ICP) directly in the sample chamber, or Remote Mode (aka Indirect Mode), which involves striking a capacitively-coupled plasma (CCP) in a remote chamber. The Remote Mode is the more gentle cleaning mode because it only allows neutral species to make their way into the chamber and participate in cleaning by means of chemical reaction (e.g. oxygen radicals react with surface hydrocarbons to create volatile species like CO and CO2 that can then be removed via the vacuum). Low power modes can also be achieved in either Direct or Remote Mode by varying the pulsing ratio. See below for the full list of resources related to this instrument.
===== Applications =====
* Remove hydrocarbons from SEM/FIB samples to prevent "black box" effect from happening while imaging (use O2 or O2/Ar plasma)
* Remove residual resist from developed lithography processes, aka "descumming" of the substrate surface (use O2 or O2/Ar plasma)
* Sputter away small amounts of surface materials (use high-power Ar plasma)
* Activate the surface of PDMS polymer to make it adhesive to e.g. glass slides, for use in microfluidic device fabrication (use O2 plasma)
* Running a hydrogen plasma has not yet been tried but could theoretically clean e.g. graphene without oxidizing it (O2 plasma would)
* Any other process that requires the non-directional removal of material by reactive-ion plasma

== Resources ==
[[Image:Tergeo-Plus-Plasma-Cleaner–Parameters-Overview-Graphic.jpg|thumb|top|upright=1.35|An overview of the available modes and parameter ranges]]
===== SOP =====
* [https://caltech.box.com/s/0dkpffpstz2y1mmnywa4br9er07irvsv SOP]
===== Graphical Handouts =====
* [https://caltech.box.com/s/ics22ljdscnz5zcdct351iw10os97u01 Graphical Handout] (see it also pictured at right)
===== Video =====
* [https://www.youtube.com/watch?v=UNrwtm6puLs PIE Scientific's Product Overview Video]
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Operating Manual]
* [https://caltech.box.com/s/flz7maaqq1k80pdacpqqd9yaps63agjp Quick Start Guide]
===== Note on Cleaning for SEM & FIB Samples =====
[[Image:Black-Box-Effect.jpg|thumb|top|upright=1.00|An example fo the "black box effect" that one tries to avoid by plasma cleaning the sample before SEM or FIB imaging. It is caused by scanning a beam over an area that is covered by copious amounts of hydrocarbons.]]
* During SEM or FIB imaging, the local specimen area will heat up due to added energy from the beam. If there is organic matter on the surface from a previous process (e.g. solvent treatment) or from simply being exposed to the ambient environment, the heat causes hydrocarbons to evolve from the surface, whereupon they become a precursor gas for an electron-beam- or ion-beam-aided, chemical-vapor-deposition of carbon back onto the surface, now in a denser form. This carburization of the surface often results in a “black box” appearing in areas where the beam was highly concentrated, e.g. where a reduced area window was used for a focusing step (carbon has a low yield of secondary electrons, SEs, and thus the carbon area appears darker). Note that the carburization process happens more quickly at lower e-beam accelerating voltages because the chemical vapor deposition is dependent on the presence of SEs, which are emitted in higher quantities at low voltage. Cleaning a specimen with an O2 and/or Ar plasma (or H2 if a reducing environment is necessary to prevent oxidation) will remove the hydrocarbons and prevent this process from happening to a noticeable degree while imaging.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Manufacturer Data Sheet]

===== Mode 1 Specifications =====
* Power Range: 1 to 150 W
* Pulsing Duty Ratio Range (N/255): 1 to 255, where
** Example: With 10 W power, if N=25 then the average power as a function of pulsing would be [10 W * (25/255) = 0.98 W, on average]
* Gas Flow Rates: 0.1 to 100.0 sccm
* Ultimate Vacuum: < 30 mTorr
 
 
== Related Instrumentation in the KNI ==
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

KNI Staff Members

2020-03-23T07:57:47Z

Matthew:

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Associate Director of Technical Operations
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Associate Director of Business Operations
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 626-744-9908 (fax) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-Kimoto.jpg
}}
{{StaffMemberTableItem|
|Name = Bert Mendoza
|JobTitle = Laboratory Coordinator
|CaltechID = bertm
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-491-2970 (cell)
|AreasResponsibility = Lab Safety & Coordination, Wet Chemistry, Photolithography
|Photo = Bert-Mendoza.jpg
}}
{{StaffMemberTableItem|
|Name = Jennifer Palmer
|JobTitle = Administrative Lead
|CaltechID = jpalmer
|Office = 128 Steele
|Phone = 626-395-3244 (office) 626-744-9908 (fax)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Jennifer-Palmer.jpg
}}
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Plasma Process Engineer
|CaltechID = nathslee
|Office = 319 Steele
|Phone = 626-395-1319 (office)
|AreasResponsibility = Reactive Ion Etching, Plasma-Enhanced CVD
|Photo = Nathan-S-Lee.jpg
}}
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 130 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|Photo = Alex-Wertheim.jpg
}}
{{StaffMemberTableItem|
|Name = Nick Chacon
|JobTitle = Laboratory Technical Staff
|CaltechID = nchacon
|Office = 303 Steele
|Phone = 626-395-5594 (office) 951-570-8458 (cell)
|AreasResponsibility = General Lab Support
|Photo = Nick-chacon.jpg
}}
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}

ICP-RIE: III-V, Metal & Silicon Etcher

2020-02-17T04:43:43Z

Matthew: /* Process Documents */

{{InstrumentInfoboxOneImage|
|InstrumentName = III-V, Metal & Si Etcher
|HeaderColor = #FFE2B9
|ImageOne = ICP-RIE_III-V,Metal,Si-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Nathan S. Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-1319
|Manufacturer = Oxford Instruments
|Techniques = pseudo-Bosch & Cryogenic Si Etch Compound Semiconductor Etching
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The III-V, Metal & Silicon inductively-coupled plasma reactive-ion etcher (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for the etching of compound semiconductors, metals, and silicon. In addition to a wide range of gases for etching a variety of III-V materials and metals, this system is configured for highly-selective ICP-RIE of silicon via the pseudo-Bosch process, allowing silicon etching with SF6 and C4F8 gases as well as cryogenic silicon etching with SF6 and O2 over a temperature range of -140 to 300 °C. This system supports wafer sizes up to 6 inches.
===== Applications =====
* InP grating etch
* GaAs photonics device etch
* pseudo-Bosch of silicon
* Metals etch
* Cryogenic etch of silicon (available upon request)
===== Allowed Material in Etcher =====
* Si, SixNy, SiO2, Ge, InP, GaAs, Al, Mo, Nb, W, Ti
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3, Cr hard masks
* Metal in etch stack
===== Etching Gas List =====
* SF6
* C4F8
* O2
* Ar
* Cl2
* SiCl4
* CH4
* H2
* HBr

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/nondj2ore8rg61tpur6hj4a3hvj8j9s5 Process Standards]
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen (KNI Recipe)]
* [https://caltech.box.com/s/wybxe3urco5s6bqw5getfu7p0amxq7wx AlGaN/GaN Etch with Photoresist Mask]
* [https://caltech.box.com/s/q3sq9cwkp5dicigkj6gkvohuqtf5ivwx InP Etch]
* [https://caltech.box.com/s/4e22q4i3e5cpgjyrykf7r4bm0m0pob59 InP/ InGaAsP Laser Facet ICP Etching]
* [https://caltech.box.com/s/borba8iuvxi9qj2pe8g0vj5vo7xpta0d GaAs Via Hole Etch]
* [https://caltech.box.com/s/x0mm9bsvwc17ev3vx5ks759mwa36tpxm Selective GaAs Etch]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Silicon Nitride etch]
* [https://caltech.box.com/s/4e6rskkmv1sgu9ipgfnrzeq0cguo1gc0 Hard Mask Oxide Etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (login to LabRunr required)
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/f8f1fx1ffz4ql71suxsvrw0p20b2inp5 Manufacturer Data Sheet]

===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software (Not Bosch)
* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Twelve line gas pod with three non-toxic and six toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option

===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -140 to 400 °C
* ICP 380 mm remote high-density plasma source with 5 kW RF generator and automatic matching unit close-coupled to the source
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling

Process Recipe Library

2020-02-17T04:43:14Z

Matthew: /* Dry Etching */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
** [https://caltech.box.com/s/lhaweqbefmep8n79u4nvynsv0cjctuc1 Process Recipe for TEM Lamella prep for Thin Films on Si Substrates]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

ICP-RIE: III-V, Metal & Silicon Etcher

2020-02-17T04:41:54Z

Matthew: /* Process Documents */

{{InstrumentInfoboxOneImage|
|InstrumentName = III-V, Metal & Si Etcher
|HeaderColor = #FFE2B9
|ImageOne = ICP-RIE_III-V,Metal,Si-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Nathan S. Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-1319
|Manufacturer = Oxford Instruments
|Techniques = pseudo-Bosch & Cryogenic Si Etch Compound Semiconductor Etching
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The III-V, Metal & Silicon inductively-coupled plasma reactive-ion etcher (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for the etching of compound semiconductors, metals, and silicon. In addition to a wide range of gases for etching a variety of III-V materials and metals, this system is configured for highly-selective ICP-RIE of silicon via the pseudo-Bosch process, allowing silicon etching with SF6 and C4F8 gases as well as cryogenic silicon etching with SF6 and O2 over a temperature range of -140 to 300 °C. This system supports wafer sizes up to 6 inches.
===== Applications =====
* InP grating etch
* GaAs photonics device etch
* pseudo-Bosch of silicon
* Metals etch
* Cryogenic etch of silicon (available upon request)
===== Allowed Material in Etcher =====
* Si, SixNy, SiO2, Ge, InP, GaAs, Al, Mo, Nb, W, Ti
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3, Cr hard masks
* Metal in etch stack
===== Etching Gas List =====
* SF6
* C4F8
* O2
* Ar
* Cl2
* SiCl4
* CH4
* H2
* HBr

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/nondj2ore8rg61tpur6hj4a3hvj8j9s5 Process Standards]
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch with Chlorine, Methane & Hydrogen (KNI Recipe)]
* [https://caltech.box.com/s/wybxe3urco5s6bqw5getfu7p0amxq7wx AlGaN/GaN Etch with Photoresist Mask]
* [https://caltech.box.com/s/q3sq9cwkp5dicigkj6gkvohuqtf5ivwx InP Etch]
* [https://caltech.box.com/s/4e22q4i3e5cpgjyrykf7r4bm0m0pob59 InP/ InGaAsP Laser Facet ICP Etching]
* [https://caltech.box.com/s/borba8iuvxi9qj2pe8g0vj5vo7xpta0d GaAs Via Hole Etch]
* [https://caltech.box.com/s/x0mm9bsvwc17ev3vx5ks759mwa36tpxm Selective GaAs Etch]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Silicon Nitride etch]
* [https://caltech.box.com/s/4e6rskkmv1sgu9ipgfnrzeq0cguo1gc0 Hard Mask Oxide Etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (login to LabRunr required)
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/f8f1fx1ffz4ql71suxsvrw0p20b2inp5 Manufacturer Data Sheet]

===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software (Not Bosch)
* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Twelve line gas pod with three non-toxic and six toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option

===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -140 to 400 °C
* ICP 380 mm remote high-density plasma source with 5 kW RF generator and automatic matching unit close-coupled to the source
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling

Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF

2020-02-17T04:30:49Z

Matthew: /* Sample Preparation */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-30
|HeaderColor = #F5A81C
|ImageOne = Mouse-Footpad-Peripheral-Nerve-Fiber-3D-Tomography_Mark-S-Ladinksy.jpg
|ImageTwo = Tecnai-TF30.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B242F Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-30
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
[[Image:TF-30-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-30 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-30 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 50 to 300 kV. Operation at 300 kV makes this the KNI's highest resolution TEM (see also the 200 kV [[Tecnai_TF-20:_200_kV_TEM,_STEM,_EDS,_EELS,_EFTEM_%26_Lithography | Tecnai TF-20]], which has more analytical options such as EELS and EFTEM). The TF-30 is also equipped with a high-angle annular dark field (HAADF) detector for use in STEM mode, and an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode). The Serial EM program allows for automated collection of images at variable tilt angles for performing tomography. See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a High-Angle Annular Dark Field (HAADF) detector
* Energy Dispersive Spectroscopy (EDS) with an Oxford INCA system
* Automatically capture tilt series of images for tomographic imaging

== Resources ==
===== SOPs & Troubleshooting =====
* SOPs ([https://caltech.box.com/s/v7oih7yv8yxai5ybkg8znplc54xc99if Long Version] | [https://caltech.box.com/s/uq2x3x6jfbrwm7sll3zfvb4h4naip7rj Short, Conceptual Version])
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/b5h0v6s2ethshh2fs5o4eqwf7pe8sdwc Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]

===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM/Ga-FIB system]] (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools

===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/e2mw7hh44g2hbcui5m3hnnqnlyunb8lf TF-30 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 F30 Family
* Voltage Range: 50-300 kV
* Point resolution: 0.20 nm
* Line resolution: 0.10 nm
* STEM resolution: 0.17 nm
* Information limit: 0.14 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±40°
* Max alpha-tilt angle with tomography holder: ±80°
* Maximum diffraction angle: ±12°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography

2020-02-17T04:30:13Z

Matthew: /* Sample Preparation */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-20
|HeaderColor = #F5A81C
|ImageOne = 10-fold-Rotation-Axis-Quasicrystal_Jinping-Hu.jpg
|ImageTwo = Tecnai-TF20.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203C Steele
|LabPhone = 626-395-1543
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-20
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-tf20
|EmailListName = TF-20
}}
== Description ==
[[Image:TF-20-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-20 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-20 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 40 to 200 kV. The TF-20 is equipped with bright field, dark field, and secondary electron detectors for use in STEM mode, an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode), electron energy loss spectroscopy (EELS) & energy-filtered TEM (EFTEM), and a nanometer pattern generating system (NPGS) for performing lithography. Note that the KNI also has a 300 kV TEM, the [[Tecnai_TF-30:_300_kV_TEM,_STEM,_EDS_%26_HAADF | Tecnai TF-30]], which achieves higher resolution (albeit with fewer analytical options). See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a BF, DF & Secondary Electron (SE) detector
* Energy Dispersive Spectroscopy (EDS) with an EDAX Genesis system
* Electron Energy Loss Spectroscopy (EELS) & Energy-Filtered TEM (EFTEM)
* E-beam lithography with Nanometer Pattern Generating System (NPGS) software

== Resources ==
===== SOPs & Troubleshooting =====
* SOPs ([https://caltech.box.com/s/edhsxq6h88iw0r8gkwn3jjj9lic86h1r Long Version] | [https://caltech.box.com/s/3yevso6s3sqeo6vmizeeityb2p53pcg6 Short, Conceptual Version])
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/gtoi3purzlgw5po7tu71nxwmk4uepdjh Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]
===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM/Ga-FIB system]] (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools

===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/eefl2jz6x1srmj4zx5165iwp217tbmzk TF-20 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 20 Family
* Voltage Range: 80-300 kV
* Point resolution: 0.27 nm
* Line resolution: 0.144 nm
* STEM resolution: 1.0 nm
* Information limit: 0.18 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±50°
* Maximum diffraction angle: ±10°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography

2020-02-17T04:27:41Z

Matthew: /* Sample Preparation */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-20
|HeaderColor = #F5A81C
|ImageOne = 10-fold-Rotation-Axis-Quasicrystal_Jinping-Hu.jpg
|ImageTwo = Tecnai-TF20.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203C Steele
|LabPhone = 626-395-1543
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-20
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-tf20
|EmailListName = TF-20
}}
== Description ==
[[Image:TF-20-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-20 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-20 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 40 to 200 kV. The TF-20 is equipped with bright field, dark field, and secondary electron detectors for use in STEM mode, an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode), electron energy loss spectroscopy (EELS) & energy-filtered TEM (EFTEM), and a nanometer pattern generating system (NPGS) for performing lithography. Note that the KNI also has a 300 kV TEM, the [[Tecnai_TF-30:_300_kV_TEM,_STEM,_EDS_%26_HAADF | Tecnai TF-30]], which achieves higher resolution (albeit with fewer analytical options). See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a BF, DF & Secondary Electron (SE) detector
* Energy Dispersive Spectroscopy (EDS) with an EDAX Genesis system
* Electron Energy Loss Spectroscopy (EELS) & Energy-Filtered TEM (EFTEM)
* E-beam lithography with Nanometer Pattern Generating System (NPGS) software

== Resources ==
===== SOPs & Troubleshooting =====
* SOPs ([https://caltech.box.com/s/edhsxq6h88iw0r8gkwn3jjj9lic86h1r Long Version] | [https://caltech.box.com/s/3yevso6s3sqeo6vmizeeityb2p53pcg6 Short, Conceptual Version])
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/gtoi3purzlgw5po7tu71nxwmk4uepdjh Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]
===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an [https://lab.kni.caltech.edu/index.php/Nova_600_NanoLab:_SEM,_Ga-FIB,_GIS_%26_Omniprobe SEM/Ga-FIB system] (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools

===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/eefl2jz6x1srmj4zx5165iwp217tbmzk TF-20 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 20 Family
* Voltage Range: 80-300 kV
* Point resolution: 0.27 nm
* Line resolution: 0.144 nm
* STEM resolution: 1.0 nm
* Information limit: 0.18 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±50°
* Maximum diffraction angle: ±10°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF

2020-02-17T04:25:12Z

Matthew: /* Sample Preparation */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-30
|HeaderColor = #F5A81C
|ImageOne = Mouse-Footpad-Peripheral-Nerve-Fiber-3D-Tomography_Mark-S-Ladinksy.jpg
|ImageTwo = Tecnai-TF30.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B242F Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-30
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
[[Image:TF-30-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-30 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-30 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 50 to 300 kV. Operation at 300 kV makes this the KNI's highest resolution TEM (see also the 200 kV [[Tecnai_TF-20:_200_kV_TEM,_STEM,_EDS,_EELS,_EFTEM_%26_Lithography | Tecnai TF-20]], which has more analytical options such as EELS and EFTEM). The TF-30 is also equipped with a high-angle annular dark field (HAADF) detector for use in STEM mode, and an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode). The Serial EM program allows for automated collection of images at variable tilt angles for performing tomography. See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a High-Angle Annular Dark Field (HAADF) detector
* Energy Dispersive Spectroscopy (EDS) with an Oxford INCA system
* Automatically capture tilt series of images for tomographic imaging

== Resources ==
===== SOPs & Troubleshooting =====
* SOPs ([https://caltech.box.com/s/v7oih7yv8yxai5ybkg8znplc54xc99if Long Version] | [https://caltech.box.com/s/uq2x3x6jfbrwm7sll3zfvb4h4naip7rj Short, Conceptual Version])
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/b5h0v6s2ethshh2fs5o4eqwf7pe8sdwc Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]

===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an [https://lab.kni.caltech.edu/index.php/Nova_600_NanoLab:_SEM,_Ga-FIB,_GIS_%26_Omniprobe SEM/Ga-FIB system] (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools

===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/e2mw7hh44g2hbcui5m3hnnqnlyunb8lf TF-30 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 F30 Family
* Voltage Range: 50-300 kV
* Point resolution: 0.20 nm
* Line resolution: 0.10 nm
* STEM resolution: 0.17 nm
* Information limit: 0.14 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±40°
* Max alpha-tilt angle with tomography holder: ±80°
* Maximum diffraction angle: ±12°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Process Recipe Library

2020-02-17T04:21:08Z

Matthew: /* Focused Ion Beam (FIB) Systems */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
** [https://caltech.box.com/s/lhaweqbefmep8n79u4nvynsv0cjctuc1 Process Recipe for TEM Lamella prep for Thin Films on Si Substrates]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2020-02-17T04:20:28Z

Matthew: /* Resources */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== SOPs & Troubleshooting =====
* SEM SOPs ([https://caltech.box.com/s/4yv8f5att77k3zq1rm6p0mqhkd8quslh Short Version] | [https://caltech.box.com/s/xwjdudqdl793gkc5kl71zez5nnc5y2xb Long Version])
* Ga-FIB SOPs ([https://caltech.box.com/s/8uch8ygjmesmjtdfy65xth47izib0prg Short Version] | [https://caltech.box.com/s/grg6j3rob7c4ciblom1tdshklq62oxqp Long Version])
* TEM Lamella Sample Preparation SOPs ([https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Short Version] | [https://caltech.box.com/s/pgioaribs7oj8r7g5nncmjjee2uyez2d Long Version])
** [https://caltech.box.com/s/lhaweqbefmep8n79u4nvynsv0cjctuc1 Process Recipe for TEM Lamella prep for Thin Films on Si Substrates]
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-Sections SOP]
* [https://caltech.box.com/s/sz9pai0icsntnef6me23veiwtwdui0gm Troubleshooting Guide]
===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/V0d5fog_tcg Introduction to Using a Ga-FIB]
* TEM Lamella Sample Prep ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist])
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist])
* [https://youtu.be/67RdSeJcaGs Milling Non-Conductive Samples using Charge Compensation]
* [https://youtu.be/XNgYe8ZDJvo Perfecting Ga-FIB Alignments]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS & WDS Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/b95pg59k003i9vn8y9elzem0tnxqg3fb Gas Injection Systems – Beam Chemistries Presentation]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/n0abqy5z1e9a8hbyf38qybxu86sqz3vb Scripting – AutoScript Language Manual (year 2005 Technical Note: less complete, still useful)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM/FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2020-02-17T01:34:03Z

Matthew: /* Resources */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/ls0irl1ocme9pmqili2vxurgqo7050d9 SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild & Trimer Formation Guide]
* [https://caltech.box.com/s/s0zbkyct23o0fxmzpzhrymaz1g82s68d Troubleshooting Guide]

===== Process Recipes =====
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
* [https://youtu.be/tWhyT3Rq_k8 Getting Started] | [https://youtu.be/lxFGaZSvgP0 Introduction to GFIS Parameters (He- & Ne-FIB)]
* [https://youtu.be/nxjpI7CUdOc GFIS Alignments (He- & Ne-FIB)]
* [https://youtu.be/r4jcT6HuApk Using the Electron Flood Gun for Charge Compensation]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there] (recorded for SEM, same principles apply here)
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]) (recorded on SEM/Ga-FIB)
* Preparing a Trimer ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL 7-Part Playlist] | [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Written Guide])

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/BROKEN Zeiss ORION NanoFab Operation Manual]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM & FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2020-02-17T01:30:02Z

Matthew: /* SOPs & Troubleshooting */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/ls0irl1ocme9pmqili2vxurgqo7050d9 SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild & Trimer Formation Guide]
* [https://caltech.box.com/s/s0zbkyct23o0fxmzpzhrymaz1g82s68d Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/tWhyT3Rq_k8 Getting Started] | [https://youtu.be/lxFGaZSvgP0 Introduction to GFIS Parameters (He- & Ne-FIB)]
* [https://youtu.be/nxjpI7CUdOc GFIS Alignments (He- & Ne-FIB)]
* [https://youtu.be/r4jcT6HuApk Using the Electron Flood Gun for Charge Compensation]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there] (recorded for SEM, same principles apply here)
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]) (recorded on SEM/Ga-FIB)
* Preparing a Trimer ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL 7-Part Playlist] | [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Written Guide])

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/BROKEN Zeiss ORION NanoFab Operation Manual]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM & FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Process Recipe Library

2020-02-17T01:28:04Z

Matthew: /* Lithography Process Recipes */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Process Recipe Library

2020-02-17T01:27:21Z

Matthew: /* Microscopy Process Recipes */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Recipe]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Recipe]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Process Recipe Library

2020-02-17T01:26:47Z

Matthew: /* Lithography Process Recipes */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Recipe]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Recipe]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Process Recipe Library

2020-02-17T00:22:21Z

Matthew: /* Transmission Electron Microscopes (TEMs) */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Recipe]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF

2020-02-17T00:21:30Z

Matthew: /* SOPs & Troubleshooting */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-30
|HeaderColor = #F5A81C
|ImageOne = Mouse-Footpad-Peripheral-Nerve-Fiber-3D-Tomography_Mark-S-Ladinksy.jpg
|ImageTwo = Tecnai-TF30.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B242F Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-30
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
[[Image:TF-30-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-30 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-30 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 50 to 300 kV. Operation at 300 kV makes this the KNI's highest resolution TEM (see also the 200 kV [[Tecnai_TF-20:_200_kV_TEM,_STEM,_EDS,_EELS,_EFTEM_%26_Lithography | Tecnai TF-20]], which has more analytical options such as EELS and EFTEM). The TF-30 is also equipped with a high-angle annular dark field (HAADF) detector for use in STEM mode, and an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode). The Serial EM program allows for automated collection of images at variable tilt angles for performing tomography. See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a High-Angle Annular Dark Field (HAADF) detector
* Energy Dispersive Spectroscopy (EDS) with an Oxford INCA system
* Automatically capture tilt series of images for tomographic imaging

== Resources ==
===== SOPs & Troubleshooting =====
* SOPs ([https://caltech.box.com/s/v7oih7yv8yxai5ybkg8znplc54xc99if Long Version] | [https://caltech.box.com/s/uq2x3x6jfbrwm7sll3zfvb4h4naip7rj Short, Conceptual Version])
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/b5h0v6s2ethshh2fs5o4eqwf7pe8sdwc Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]

===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an SEM/Ga-FIB system (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools
===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/e2mw7hh44g2hbcui5m3hnnqnlyunb8lf TF-30 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 F30 Family
* Voltage Range: 50-300 kV
* Point resolution: 0.20 nm
* Line resolution: 0.10 nm
* STEM resolution: 0.17 nm
* Information limit: 0.14 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±40°
* Max alpha-tilt angle with tomography holder: ±80°
* Maximum diffraction angle: ±12°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography

2020-02-17T00:20:47Z

Matthew: /* SOPs & Troubleshooting */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-20
|HeaderColor = #F5A81C
|ImageOne = 10-fold-Rotation-Axis-Quasicrystal_Jinping-Hu.jpg
|ImageTwo = Tecnai-TF20.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203C Steele
|LabPhone = 626-395-1543
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-20
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-tf20
|EmailListName = TF-20
}}
== Description ==
[[Image:TF-20-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-20 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-20 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 40 to 200 kV. The TF-20 is equipped with bright field, dark field, and secondary electron detectors for use in STEM mode, an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode), electron energy loss spectroscopy (EELS) & energy-filtered TEM (EFTEM), and a nanometer pattern generating system (NPGS) for performing lithography. Note that the KNI also has a 300 kV TEM, the [[Tecnai_TF-30:_300_kV_TEM,_STEM,_EDS_%26_HAADF | Tecnai TF-30]], which achieves higher resolution (albeit with fewer analytical options). See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a BF, DF & Secondary Electron (SE) detector
* Energy Dispersive Spectroscopy (EDS) with an EDAX Genesis system
* Electron Energy Loss Spectroscopy (EELS) & Energy-Filtered TEM (EFTEM)
* E-beam lithography with Nanometer Pattern Generating System (NPGS) software

== Resources ==
===== SOPs & Troubleshooting =====
* SOPs ([https://caltech.box.com/s/edhsxq6h88iw0r8gkwn3jjj9lic86h1r Long Version] | [https://caltech.box.com/s/3yevso6s3sqeo6vmizeeityb2p53pcg6 Short, Conceptual Version])
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/gtoi3purzlgw5po7tu71nxwmk4uepdjh Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]
===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an SEM/Ga-FIB system (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools
===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/eefl2jz6x1srmj4zx5165iwp217tbmzk TF-20 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 20 Family
* Voltage Range: 80-300 kV
* Point resolution: 0.27 nm
* Line resolution: 0.144 nm
* STEM resolution: 1.0 nm
* Information limit: 0.18 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±50°
* Maximum diffraction angle: ±10°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF

2020-02-17T00:20:10Z

Matthew: /* SOPs & Troubleshooting */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-30
|HeaderColor = #F5A81C
|ImageOne = Mouse-Footpad-Peripheral-Nerve-Fiber-3D-Tomography_Mark-S-Ladinksy.jpg
|ImageTwo = Tecnai-TF30.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B242F Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-30
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
[[Image:TF-30-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-30 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-30 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 50 to 300 kV. Operation at 300 kV makes this the KNI's highest resolution TEM (see also the 200 kV [[Tecnai_TF-20:_200_kV_TEM,_STEM,_EDS,_EELS,_EFTEM_%26_Lithography | Tecnai TF-20]], which has more analytical options such as EELS and EFTEM). The TF-30 is also equipped with a high-angle annular dark field (HAADF) detector for use in STEM mode, and an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode). The Serial EM program allows for automated collection of images at variable tilt angles for performing tomography. See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a High-Angle Annular Dark Field (HAADF) detector
* Energy Dispersive Spectroscopy (EDS) with an Oxford INCA system
* Automatically capture tilt series of images for tomographic imaging

== Resources ==
===== SOPs & Troubleshooting =====
* SOPs ([https://caltech.box.com/s/v7oih7yv8yxai5ybkg8znplc54xc99if Long Version] | [https://caltech.box.com/s/uq2x3x6jfbrwm7sll3zfvb4h4naip7rj Short, Conceptual Version])
* [https://caltech.box.com/s/b5h0v6s2ethshh2fs5o4eqwf7pe8sdwc Troubleshooting Guide]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]

===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an SEM/Ga-FIB system (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools
===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/e2mw7hh44g2hbcui5m3hnnqnlyunb8lf TF-30 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 F30 Family
* Voltage Range: 50-300 kV
* Point resolution: 0.20 nm
* Line resolution: 0.10 nm
* STEM resolution: 0.17 nm
* Information limit: 0.14 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±40°
* Max alpha-tilt angle with tomography holder: ±80°
* Maximum diffraction angle: ±12°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Presentations

2020-02-14T03:36:02Z

Matthew: /* Microscopy Presentations */

== Safety Presentations ==
===== KNI Lectures =====
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2019]
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2016]

== Deposition Presentations ==
===== KNI Lectures =====
* Sputtering: [https://youtu.be/y7JbzNZwZvs Intro to Sputtering] | [https://youtu.be/MlxUnwviBiI Dielectric Sputter System Training]
* Evaporation: [https://youtu.be/4K75m4V0Lq4 CHA Mk40 E-beam Evaporator Training] | [https://youtu.be/jq5M7fkgpfM KJLC Labline E-beam Evaporator Training]

===== Manufacturer Lectures =====
* Kurt J. Lesker Company: [https://caltech.box.com/s/rc2pfgyrfesythq64oy0u31o6xex3ada Intro to Vacuum Technology and Vacuum System Design] | [https://caltech.box.com/s/w93a4ygcl4lfb6hdmqvlpxchk9jbd7jr Intro to Physical Vapor Deposition and Thin Film growth]

== Microscopy Presentations ==
===== KNI Lectures =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]
* Helium & Neon Focused Ion Beam (He- & Ne-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
===== KNI Video Tutorials =====
* SEM: [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic Alignments]
* Astigmatism Correction: [https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://www.youtube.com/watch?v=V0d5fog_tcg Ga-FIB Operation Basics]
* TEM Lamella Sample Prep: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist]
* Cutting & Imaging Cross-sections with Ga-FIB: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]
* Miscellaneous SEM & Ga-FIB Techniques: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnhm1ei1YtK-uIhT1UgKP4f Playlist]
* He/Ne-FIB Techniques: [https://www.youtube.com/watch?v=tWhyT3Rq_k8&list=PL7Lb5X_YIzOl80BSOR7I6yVP5fzzX0lws Playlist]
* He/Ne-FIB Source Rebuild & Alignment: [https://www.youtube.com/watch?v=PJXiQJxdLME&list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL Playlist]
* AFM Operation Basics: [https://www.youtube.com/watch?v=HIaTe0Bb5xs&list=PL7Lb5X_YIzOkKijCVBCfpfpR8Jyw02q17 Playlist]
===== Manufacturer Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Quantitative NanoMechanics (QNM)]

== Ellipsometry Presentations ==
===== KNI Video Tutorials =====
* [https://youtu.be/M4jGUP-883U Data Fitting, Part 1: Fitting Basics for Transparent Films]
* [https://youtu.be/54w-i0R4SMA Data Fitting, Part 2: Transparent Polymers]
* [https://youtu.be/l6-uTJ-V3EU Data Fitting, Part 3: Absorbing Films via B-Spline]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2020-02-14T03:25:02Z

Matthew: /* Presentations */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== SOPs & Troubleshooting =====
* SEM SOPs ([https://caltech.box.com/s/4yv8f5att77k3zq1rm6p0mqhkd8quslh Short Version] | [https://caltech.box.com/s/xwjdudqdl793gkc5kl71zez5nnc5y2xb Long Version])
* Ga-FIB SOPs ([https://caltech.box.com/s/8uch8ygjmesmjtdfy65xth47izib0prg Short Version] | [https://caltech.box.com/s/grg6j3rob7c4ciblom1tdshklq62oxqp Long Version])
* TEM Lamella Sample Preparation SOPs ([https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Short Version] | [https://caltech.box.com/s/pgioaribs7oj8r7g5nncmjjee2uyez2d Long Version])
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-Sections SOP]
* [https://caltech.box.com/s/sz9pai0icsntnef6me23veiwtwdui0gm Troubleshooting Guide]
===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/V0d5fog_tcg Introduction to Using a Ga-FIB]
* TEM Lamella Sample Prep ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist])
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist])
* [https://youtu.be/67RdSeJcaGs Milling Non-Conductive Samples using Charge Compensation]
* [https://youtu.be/XNgYe8ZDJvo Perfecting Ga-FIB Alignments]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS & WDS Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/b95pg59k003i9vn8y9elzem0tnxqg3fb Gas Injection Systems – Beam Chemistries Presentation]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/n0abqy5z1e9a8hbyf38qybxu86sqz3vb Scripting – AutoScript Language Manual (year 2005 Technical Note: less complete, still useful)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM/FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Quanta 200F: SEM, ESEM, Lithography & Probe Station

2020-02-14T03:23:41Z

Matthew: /* Presentations */

{{InstrumentInfoboxOneImage|
|InstrumentName = Quanta 200F
|HeaderColor = #F5A81C
|ImageOne = Quanta-200F-SEM.jpg
|ImageTwo = Quanta-200F-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Quanta 200F
|Techniques = SEM, ESEM, E-beam Lithography, Electrical 4-Point Probe Station, Hot Stage, Cold Stage
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Quanta 200F is a field emission gun (FEG) scanning electron microscope (SEM) that can also be operated in environmental (ESEM) mode, where a higher chamber pressure (0.1 to 27 mbar) allows for the imaging of e.g. biological samples without lysing cells. While the Quanta does not have an immersion lens for ultra-high-resolution imaging, as all other KNI SEMs do, this actually allows the Quanta's non-immersion objective lens to be optimally placed for "field-free imaging," making it the KNI's highest resolution SEM when operating outside of Immersion Mode. The Quanta is also equipped with an e-beam lithography system, a four-point electrical probing station, and a Hot/Cold Stage attachment. Its small chamber allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for the Quanta below.
===== SEM Applications =====
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD)
* Backscattered Electron (BSE) imaging with a solid-state Backscattered Electron Detector (BSED)
* ESEM Mode for imaging biological samples using Large Field Detector (LFD) & Gaseous Secondary Electron Detector (GSED)
* ESEM Mode for imaging highly non-conductive samples using LFD & GSED (the water vapor environment wicks away charge from sample); 500 μm clip-on aperture (to the bottom of the SEM column) is available for use in ESEM Mode to improve resolution
===== Other Applications =====
* E-beam lithography with the Nanometer Pattern Generating System (NPGS) software
* Hot & Cold Stage for observing a sample from -185 to 240 °C
* Four-Point Electrical Probe Station for ''in situ'' electrical measurements

== Resources ==
===== SOPs & Troubleshooting =====
* SEM SOPs ([https://caltech.box.com/s/1yqfsg1cl6x9w9414bsqiqxcp4cl2bub Short Version] | [https://caltech.box.com/s/qwjhdb252dq8lk5ap5up829pvd3g1fvo Long Version])
* E-beam Lithography SOPs ([https://caltech.box.com/s/n5ft2s02i92698vy3m1w6tp60s2o407s Short Version] | [https://caltech.box.com/s/pt78znsx8dj01t7fuwdknzq0uzvy3ueg Long Version])
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned Patterning Steps with NPGS] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide]
* [https://caltech.box.com/s/n91a9brnyg5ntg48ztkzn95knl63i9ed Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on ESEM, Lithography, Probe Station, Hot & Cold Stage)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/urxbsk9wrruxcnj345c3rjb37dc48k64 Quanta 200F SEM Operation Manual]
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== SEM & ESEM Specifications =====
* Minimum Feature Size Resolved in SEM Mode: ~15 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spot Size" 1 to 7 (approximately 30 pA to 20 nA), with increments of 0.1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 10 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -150 to 70° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* Ultimate Vacuum: 3e-7 mbar
* ESEM Mode Pressure Range: 0.1 to 27.0 mbar (water vapor is used as chamber gas)
* Minimum Feature Size Resolved in ESEM Mode: ~10 nm

===== Lithography with NPGS Specifications =====
* Minimum Feature Produced: ~17 nm diameter dots & ~20 nm wide lines (via liftoff of 10 nm Ti on Si)
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Writing Speed: 5 MHz
* Digital-to-Analog Converter (DAC): 16-bit
* Keithley 487 Picoammeter / Voltage Source is available for measuring beam current
===== Probe Station Specifications =====
* Probe Station Manufacturer: Kammrath & Weiss
* Parameter Analyzer: HP4145B Available [https://caltech.box.com/s/xumvbal8rmyggb3h87hk0g5s8b957hqg (Manual)], or bring your own
* Keithley 487 Picoammeter / Voltage Source is available as a function generator
* Probe station connectors rated up to 42 V, measure up to mA of current
===== Hot & Cold Stage Specifications =====
* Temperature Range: -185 to 240° C
* Stage is cooled by air that is itself cooled by flowing it through a liquid nitrogen heat exchanger
* Stage is heated by a resistive heating element
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2020-02-14T03:22:30Z

Matthew: /* Presentations */

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR) and an energy dispersive spectroscopy (EDS) detector for compositional analysis. While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* EDX Mode Imaging (reduces background signal on EDS spectra)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
===== EDS Applications =====
* Spectrum acquisition for quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== SOPs & Troubleshooting =====
* SEM SOPs ([https://caltech.box.com/s/rontehfysbmcyia4448wi31g8gbhepz9 Short Version] | [https://caltech.box.com/s/llpi6ct5wvw6c2tnh81zu32autbi2doy Long Version])
* EDS SOPs ([https://caltech.box.com/s/ltcra2dk47k5s8r5mqotbad3i2e6r3lk Short Version] | [https://caltech.box.com/s/kukccwu1m8ekfjo6jds4jupvzwsjs3z1 Long Version])
* [https://caltech.box.com/s/u4c7ep9wyxb3tvcp0o38tczf0o8vpffi Troubleshooting Guide]
===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS Operation Manual]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 200 NanoLab: SEM & EDS

2020-02-14T03:21:33Z

Matthew: /* Presentations */

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS, WDS, Immersion Lens Imaging
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and both energy dispersive spectroscopy (EDS) and wavelength dispersive spectroscopy (WDS) detectors for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS & WDS Applications =====
* Spectrum acquisition for quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== SOPs & Troubleshooting =====
* SEM SOPs ([https://caltech.box.com/s/4yv8f5att77k3zq1rm6p0mqhkd8quslh Short Version] | [https://caltech.box.com/s/xwjdudqdl793gkc5kl71zez5nnc5y2xb Long Version])
* EDS SOPs ([https://caltech.box.com/s/52uckmx1silq90vq918gziohjtbqzyh5 Short Version] | [https://caltech.box.com/s/kukccwu1m8ekfjo6jds4jupvzwsjs3z1 Long Version])
* [https://caltech.box.com/s/sz9pai0icsntnef6me23veiwtwdui0gm Troubleshooting Guide]
===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/b95pg59k003i9vn8y9elzem0tnxqg3fb Gas Injection Systems – Beam Chemistries Presentation]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/n0abqy5z1e9a8hbyf38qybxu86sqz3vb Scripting – AutoScript Language Manual (year 2005 Technical Note: less complete, still useful)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2020-02-14T03:21:03Z

Matthew: /* Presentations */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== SOPs & Troubleshooting =====
* SEM SOPs ([https://caltech.box.com/s/4yv8f5att77k3zq1rm6p0mqhkd8quslh Short Version] | [https://caltech.box.com/s/xwjdudqdl793gkc5kl71zez5nnc5y2xb Long Version])
* Ga-FIB SOPs ([https://caltech.box.com/s/8uch8ygjmesmjtdfy65xth47izib0prg Short Version] | [https://caltech.box.com/s/grg6j3rob7c4ciblom1tdshklq62oxqp Long Version])
* TEM Lamella Sample Preparation SOPs ([https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Short Version] | [https://caltech.box.com/s/pgioaribs7oj8r7g5nncmjjee2uyez2d Long Version])
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-Sections SOP]
* [https://caltech.box.com/s/sz9pai0icsntnef6me23veiwtwdui0gm Troubleshooting Guide]
===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/V0d5fog_tcg Introduction to Using a Ga-FIB]
* TEM Lamella Sample Prep ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist])
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist])
* [https://youtu.be/67RdSeJcaGs Milling Non-Conductive Samples using Charge Compensation]
* [https://youtu.be/XNgYe8ZDJvo Perfecting Ga-FIB Alignments]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS & WDS Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/b95pg59k003i9vn8y9elzem0tnxqg3fb Gas Injection Systems – Beam Chemistries Presentation]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/n0abqy5z1e9a8hbyf38qybxu86sqz3vb Scripting – AutoScript Language Manual (year 2005 Technical Note: less complete, still useful)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM/FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2020-02-14T03:18:45Z

Matthew: /* Presentations */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/ls0irl1ocme9pmqili2vxurgqo7050d9 SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]
* [https://caltech.box.com/s/s0zbkyct23o0fxmzpzhrymaz1g82s68d Troubleshooting Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild & Trimer Formation Guide]

===== Video Tutorials =====
* [https://youtu.be/tWhyT3Rq_k8 Getting Started] | [https://youtu.be/lxFGaZSvgP0 Introduction to GFIS Parameters (He- & Ne-FIB)]
* [https://youtu.be/nxjpI7CUdOc GFIS Alignments (He- & Ne-FIB)]
* [https://youtu.be/r4jcT6HuApk Using the Electron Flood Gun for Charge Compensation]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there] (recorded for SEM, same principles apply here)
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]) (recorded on SEM/Ga-FIB)
* Preparing a Trimer ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL 7-Part Playlist] | [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Written Guide])

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/BROKEN Zeiss ORION NanoFab Operation Manual]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM & FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Dimension Icon: Atomic Force Microscope (AFM)

2020-02-13T10:43:45Z

Matthew: /* Video Tutorials */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/HIaTe0Bb5xs Part 1: Setting up an Experiment & Aligning the Scanner]
* [https://youtu.be/Oq8djKI8gHM Part 2: Navigating to Sample & Explanation of Scanning Parameters]
* [https://youtu.be/1lEmg0p_uaw Part 3: Basics of Scanning & Using Analysis Software]

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help calibrate the microscope and to troubleshoot problems related to scanning and the probe]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference (VGRP-15M):''' Features are 6x6 μm wide, on a 10 μm pitch, and etched 180 nm deep into SiO2. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that while it does not necessarily do a good job of predicting the behavior of scans that look at features on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights), if this 180 nm calibration is within an error of less than 1%, then you can be generally confident in your small-scale scans. Consider using – or devising – a 2D material standard as a check on your own 2D material scans to be assured of accuracy.
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Dimension Icon: Atomic Force Microscope (AFM)

2020-02-13T10:43:15Z

Matthew: /* Video Tutorials */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/HIaTe0Bb5xs Setting up an Experiment & Aligning the Scanner]
* [https://youtu.be/Oq8djKI8gHM Navigating to Sample & Explanation of Scanning Parameters]
* [https://youtu.be/1lEmg0p_uaw Basics of Scanning & Using Analysis Software]

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help calibrate the microscope and to troubleshoot problems related to scanning and the probe]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference (VGRP-15M):''' Features are 6x6 μm wide, on a 10 μm pitch, and etched 180 nm deep into SiO2. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that while it does not necessarily do a good job of predicting the behavior of scans that look at features on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights), if this 180 nm calibration is within an error of less than 1%, then you can be generally confident in your small-scale scans. Consider using – or devising – a 2D material standard as a check on your own 2D material scans to be assured of accuracy.
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Dimension Icon: Atomic Force Microscope (AFM)

2020-02-11T04:56:31Z

Matthew:

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Bruker%20Training/Bruker%20MP4/Scanasyst_PFT.mp4 Basics of ScanAsyst & PeakForce Tapping Mode] (video by Bruker)
* [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Bruker%20Training/Bruker%20MP4/DI_Probe%20Load%20&%20Laser%20Align.mp4 Aligning the Laser] (video by Bruker)

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help calibrate the microscope and to troubleshoot problems related to scanning and the probe]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference (VGRP-15M):''' Features are 6x6 μm wide, on a 10 μm pitch, and etched 180 nm deep into SiO2. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that while it does not necessarily do a good job of predicting the behavior of scans that look at features on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights), if this 180 nm calibration is within an error of less than 1%, then you can be generally confident in your small-scale scans. Consider using – or devising – a 2D material standard as a check on your own 2D material scans to be assured of accuracy.
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Dimension Icon: Atomic Force Microscope (AFM)

2020-02-11T04:55:02Z

Matthew: /* Using Standard Samples */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Bruker%20Training/Bruker%20MP4/Scanasyst_PFT.mp4 Basics of ScanAsyst & PeakForce Tapping Mode] (video by Bruker)
* [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Bruker%20Training/Bruker%20MP4/DI_Probe%20Load%20&%20Laser%20Align.mp4 Aligning the Laser] (video by Bruker)

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help troubleshoot scanning and probe problems]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference (VGRP-15M):''' Features are 6x6 μm wide, on a 10 μm pitch, and etched 180 nm deep into SiO2. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that while it does not necessarily do a good job of predicting the behavior of scans that look at features on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights), if this 180 nm calibration is within an error of less than 1%, then you can be generally confident in your small-scale scans. Consider using – or devising – a 2D material standard as a check on your own 2D material scans to be assured of accuracy.
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Process Recipe Library

2020-02-07T06:51:16Z

Matthew: /* Chemical Vapor Deposition (CVD) */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Recipe]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Process Recipe Library

2020-02-07T06:50:34Z

Matthew: /* Optical Lithography */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Recipe]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD 350C SiO2 recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Process Recipe Library

2020-02-07T06:49:27Z

Matthew: /* Electron Beam Lithography */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Recipe]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD 350C SiO2 recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Dimension Icon: Atomic Force Microscope (AFM)

2020-02-02T00:45:23Z

Matthew:

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Bruker%20Training/Bruker%20MP4/Scanasyst_PFT.mp4 Basics of ScanAsyst & PeakForce Tapping Mode] (video by Bruker)
* [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Bruker%20Training/Bruker%20MP4/DI_Probe%20Load%20&%20Laser%20Align.mp4 Aligning the Laser] (video by Bruker)

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help troubleshoot scanning and probe problems]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference:''' Features are 10x10 μm wide, 180 nm deep. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that it does not necessarily do a good job predicting the behavior of scans that look at roughness on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights).
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Process Recipe Library

2020-01-30T07:54:12Z

Matthew: /* Scanning Electron Microscopes (SEMs) */

Process Recipe Library

2020-01-30T07:53:54Z

Matthew: /* Electron Beam Lithography */

Quanta 200F: SEM, ESEM, Lithography & Probe Station

2020-01-30T07:52:36Z

Matthew: /* SOPs & Troubleshooting */

{{InstrumentInfoboxOneImage|
|InstrumentName = Quanta 200F
|HeaderColor = #F5A81C
|ImageOne = Quanta-200F-SEM.jpg
|ImageTwo = Quanta-200F-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Matthew S. Hunt, PhD]]
|StaffEmail = matthew.hunt@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Quanta 200F
|Techniques = SEM, ESEM, E-beam Lithography, Electrical 4-Point Probe Station, Hot Stage, Cold Stage
|RequestTraining = matthew.hunt@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Quanta 200F is a field emission gun (FEG) scanning electron microscope (SEM) that can also be operated in environmental (ESEM) mode, where a higher chamber pressure (0.1 to 27 mbar) allows for the imaging of e.g. biological samples without lysing cells. While the Quanta does not have an immersion lens for ultra-high-resolution imaging, as all other KNI SEMs do, this actually allows the Quanta's non-immersion objective lens to be optimally placed for "field-free imaging," making it the KNI's highest resolution SEM when operating outside of Immersion Mode. The Quanta is also equipped with an e-beam lithography system, a four-point electrical probing station, and a Hot/Cold Stage attachment. Its small chamber allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for the Quanta below.
===== SEM Applications =====
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD)
* Backscattered Electron (BSE) imaging with a solid-state Backscattered Electron Detector (BSED)
* ESEM Mode for imaging biological samples using Large Field Detector (LFD) & Gaseous Secondary Electron Detector (GSED)
* ESEM Mode for imaging highly non-conductive samples using LFD & GSED (the water vapor environment wicks away charge from sample); 500 μm clip-on aperture (to the bottom of the SEM column) is available for use in ESEM Mode to improve resolution
===== Other Applications =====
* E-beam lithography with the Nanometer Pattern Generating System (NPGS) software
* Hot & Cold Stage for observing a sample from -185 to 240 °C
* Four-Point Electrical Probe Station for ''in situ'' electrical measurements

== Resources ==
===== SOPs & Troubleshooting =====
* SEM SOPs ([https://caltech.box.com/s/1yqfsg1cl6x9w9414bsqiqxcp4cl2bub Short Version] | [https://caltech.box.com/s/qwjhdb252dq8lk5ap5up829pvd3g1fvo Long Version])
* E-beam Lithography SOPs ([https://caltech.box.com/s/n5ft2s02i92698vy3m1w6tp60s2o407s Short Version] | [https://caltech.box.com/s/pt78znsx8dj01t7fuwdknzq0uzvy3ueg Long Version])
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned Patterning Steps with NPGS] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide]
* [https://caltech.box.com/s/n91a9brnyg5ntg48ztkzn95knl63i9ed Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Scanning Electron Microscopy: Principles, Techniques & Applications] (includes slides on ESEM, Lithography, Probe Station, Hot & Cold Stage)
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/urxbsk9wrruxcnj345c3rjb37dc48k64 Quanta 200F SEM Operation Manual]
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== SEM & ESEM Specifications =====
* Minimum Feature Size Resolved in SEM Mode: ~15 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spot Size" 1 to 7 (approximately 30 pA to 20 nA), with increments of 0.1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 10 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -150 to 70° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* Ultimate Vacuum: 3e-7 mbar
* ESEM Mode Pressure Range: 0.1 to 27.0 mbar (water vapor is used as chamber gas)
* Minimum Feature Size Resolved in ESEM Mode: ~10 nm

===== Lithography with NPGS Specifications =====
* Minimum Feature Produced: ~17 nm diameter dots & ~20 nm wide lines (via liftoff of 10 nm Ti on Si)
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Writing Speed: 5 MHz
* Digital-to-Analog Converter (DAC): 16-bit
* Keithley 487 Picoammeter / Voltage Source is available for measuring beam current
===== Probe Station Specifications =====
* Probe Station Manufacturer: Kammrath & Weiss
* Parameter Analyzer: HP4145B Available [https://caltech.box.com/s/xumvbal8rmyggb3h87hk0g5s8b957hqg (Manual)], or bring your own
* Keithley 487 Picoammeter / Voltage Source is available as a function generator
* Probe station connectors rated up to 42 V, measure up to mA of current
===== Hot & Cold Stage Specifications =====
* Temperature Range: -185 to 240° C
* Stage is cooled by air that is itself cooled by flowing it through a liquid nitrogen heat exchanger
* Stage is heated by a resistive heating element
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

KNI Staff Members

2020-01-28T06:55:59Z

Matthew:

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Associate Director of Technical Operations
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Associate Director of Business Operations
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 626-744-9908 (fax) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-Kimoto.jpg
}}
{{StaffMemberTableItem|
|Name = Matthew S. Hunt, PhD
|JobTitle = Assistant Director of Staff Research & Lead Microscopist
|CaltechID = matthew.hunt
|Office = 303 Steele
|Phone = 626-395-5994 (office) 203-470-0861 (cell)
|AreasResponsibility = Microscopy, Staff-Led Research Projects
|Photo = Matthew-S-Hunt.jpg
}}
{{StaffMemberTableItem|
|Name = Bert Mendoza
|JobTitle = Laboratory Coordinator
|CaltechID = bertm
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-491-2970 (cell)
|AreasResponsibility = Lab Safety & Coordination, Wet Chemistry, Photolithography
|Photo = Bert-Mendoza.jpg
}}
{{StaffMemberTableItem|
|Name = Jennifer Palmer
|JobTitle = Administrative Lead
|CaltechID = jpalmer
|Office = 128 Steele
|Phone = 626-395-3244 (office) 626-744-9908 (fax)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Jennifer-Palmer.jpg
}}
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Plasma Process Engineer
|CaltechID = nathslee
|Office = 319 Steele
|Phone = 626-395-1319 (office)
|AreasResponsibility = Reactive Ion Etching, Plasma-Enhanced CVD
|Photo = Nathan-S-Lee.jpg
}}
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 130 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|Photo = Alex-Wertheim.jpg
}}
{{StaffMemberTableItem|
|Name = Evan Piano
|JobTitle = Nanofabrication Process Engineer Intern
|CaltechID = empiano
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Process Development
|Photo = Evan-piano.jpg
}}
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}

Process Recipe Library

2020-01-22T08:45:38Z

Matthew: /* Electron Beam Lithography */

EBPG 5000+: 100 kV Electron Beam Lithography

2020-01-22T08:45:06Z

Matthew: /* Lithography Process Information */

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg@caltech.edu
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cwp88iw2q5t8eygl114zs8ywlhraxo16 EBPG reservation and use policy]
* [https://caltech.box.com/s/s21wk4nw02qmbugt4z30zjbold5sz41p EBPG Training presentation (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules]
* [https://caltech.box.com/s/wnx3fid41baefile9epmm797tbf81z59 App Note: Multipass]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter]

===== Lithography Process Information =====
* [https://caltech.box.com/s/tfg34i85sknxsrqqbrjtszmd0fqhgnt1 Bilayer PMMA Liftoff Procedure]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2020-01-22T08:44:33Z

Matthew: /* Lithography Process Information */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg@caltech.edu
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cwp88iw2q5t8eygl114zs8ywlhraxo16 EBPG reservation and use policy]
* [https://caltech.box.com/s/s21wk4nw02qmbugt4z30zjbold5sz41p EBPG Training presentation (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules]
* [https://caltech.box.com/s/wnx3fid41baefile9epmm797tbf81z59 App Note: Multipass]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter]

===== Lithography Process Information =====
* [https://caltech.box.com/s/tfg34i85sknxsrqqbrjtszmd0fqhgnt1 Bilayer PMMA Liftoff Procedure]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2020-01-22T08:43:49Z

Matthew: /* Lithography Process Information */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg@caltech.edu
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cwp88iw2q5t8eygl114zs8ywlhraxo16 EBPG reservation and use policy]
* [https://caltech.box.com/s/s21wk4nw02qmbugt4z30zjbold5sz41p EBPG Training presentation (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules]
* [https://caltech.box.com/s/wnx3fid41baefile9epmm797tbf81z59 App Note: Multipass]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter]

===== Lithography Process Information =====
* [https://caltech.box.com/s/tfg34i85sknxsrqqbrjtszmd0fqhgnt1 Bilayer PMMA Liftoff Procedure]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A resist spinning, writing & development pricedure (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ resist spinning, writing & development pricedure (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

KNI Staff Members

2020-01-22T03:09:33Z

Matthew:

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Associate Director of Technical Operations
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Associate Director of Business Operations
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 626-744-9908 (fax) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-Kimoto.jpg
}}
{{StaffMemberTableItem|
|Name = Matthew S. Hunt, PhD
|JobTitle = Assistant Director of Staff Research & Lead Microscopist
|CaltechID = matthew.hunt
|Office = 303 Steele
|Phone = 626-395-5994 (office) 203-470-0861 (cell)
|AreasResponsibility = Microscopy, Staff Research Projects
|Photo = Matthew-S-Hunt.jpg
}}
{{StaffMemberTableItem|
|Name = Bert Mendoza
|JobTitle = Laboratory Coordinator
|CaltechID = bertm
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-491-2970 (cell)
|AreasResponsibility = Lab Safety & Coordination, Wet Chemistry, Photolithography
|Photo = Bert-Mendoza.jpg
}}
{{StaffMemberTableItem|
|Name = Jennifer Palmer
|JobTitle = Administrative Lead
|CaltechID = jpalmer
|Office = 128 Steele
|Phone = 626-395-3244 (office) 626-744-9908 (fax)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Jennifer-Palmer.jpg
}}
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Plasma Process Engineer
|CaltechID = nathslee
|Office = 319 Steele
|Phone = 626-395-1319 (office)
|AreasResponsibility = Reactive Ion Etching, Plasma-Enhanced CVD
|Photo = Nathan-S-Lee.jpg
}}
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 130 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|Photo = Alex-Wertheim.jpg
}}
{{StaffMemberTableItem|
|Name = Evan Piano
|JobTitle = Nanofabrication Process Engineer Intern
|CaltechID = empiano
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Process Development
|Photo = Evan-piano.jpg
}}
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}