The KNI Lab at Caltech - User contributions [en]

Guy A. DeRose, PhD

2026-02-12T21:26:02Z

Derose: Changed name of position

__NOTOC__
{{StaffMemberInfobox
|StaffName = Guy A. DeRose, PhD
|StaffPhoto = Guy-A-DeRose.jpg
|JobTitle = Director of Technical Operations
|AreasResponsibility = Lab Technical Operations, [[Equipment_List#Lithography|Lithography]]
|CaltechID = derose
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|OfficeLocation = 126 Steele
}}
== About ==
===== Role in the KNI =====
Guy DeRose, a Member of the Professional Staff, is the Director of Technical Operations in the Kavli Nanoscience Institute (KNI) at The California Institute of Technology, and has been in that position since the laboratory opened in 2008. He is in charge of laboratory operations, managing KNI laboratory members' needs and expectations, and supervising the KNI technical staff. Direct equipment responsibilities include the electron beam lithography systems, which he has been managing since the EBPG 5000+ was installed in 2003.

Guy joined Caltech in January 1994 as the instructor for the PMA Division’s Advanced Physics Labs. After also working in several additional academic labs in Physics, he moved to EAS in 2000 to manage a research lab in electrical engineering and applied physics and to coordinate the EAS Division’s teaching labs. He helped to establish the Laboratory for Large-Scale Integration of Nanostructures (LSI-Nano) with two faculty members, which laid much of the groundwork for what subsequently grew into the KNI, and has been involved with the KNI since its inception. Those experiences have given Guy the opportunity to publish scientific papers as well as to write funding proposals with Caltech faculty members.

===== Education =====
Guy earned his BS from Indiana University of Pennsylvania and MS and PhD degrees from Case Western Reserve University, all in Physics.

== List of Managed Instruments ==
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]

== Selected Publications ==
[[Image:Use-of-Supramolecular-Assemblies-as-Lithographic-Resists Fig3d-f.png|thumb|upright=1.25|Figure 3e-f from "Use of Supramolecular Assemblies as Lithographic Resists," depicting (d) lines of resist written with 30 keV electrons on silicon, followed by (e) 210 second ICP-RIE etch and (f) removal of the remaining resist to leaving 36:1 aspect ratio silicon fins. https://doi.org/10.1002/anie.201700224]]
* Scott M. Lewis, Guy A. DeRose, Matthew S. Hunt, Hayden Alty, Alex Werthiem, Jarvis Li, Trevor Fowler, Axel Scherer, Stepen G. Yeates, Richard E. P. Winpenny ''et al'', "Design and Implementation of the Next Generation Electron Beam Resists for the Production of EUVL Photomasks," ''Photomask Technology 2018'', p 24. https://doi.org/10.1117/12.2501808.
* Scott M. Lewis, Antonio Fernandez, Guy A. DeRose, Matthew S. Hunt, Axel Scherer, Stephen G. Yeates, Richard E. P. Winpenny ''et al'', "Use of Supramolecular Assemblies as Lithographic Resists," ''Angew. Chem. Int. Ed.'' 2017, 56 (24), 6749–6752. https://doi.org/10.1002/anie.201700224.
* Scott M. Lewis, Guy A. DeRose, "SML electron beam resist: Ultra-high aspect ratio nanolithography," Materials and Processes for Next-Generation Lithography Book Series: Frontiers of Nanoscience Volume: 11, 421-446, 2016. https://doi.org/10.1016/B978-0-08-100354-1.00012-0
* Guy A. DeRose, Lin Zhu, Joyce K.S. Poon, Amnon Yariv, Axel Scherer, "Periodic sub-wavelength electron beam lithography defined photonic crystals for mode control in semiconductor lasers," Microelectronic Engineering, Volume: 85, Issue: 5-6, 758-760, (2008). https://doi.org/10.1016/j.mee.2007.12.030
* Lin Zhu, Xiankai Sun, Guy A. DeRose, Axel Scherer, and Amnon Yariv, "Room temperature continuous wave operation of single-mode, edge-emitting photonic crystal Bragg lasers," Optics Express Vol. 16, Issue 2, 502-506 (2008). https://doi.org/10.1364/OE.16.000502
* Joyce K. S. Poon, Lin Zhu, John M. Choi, Guy A. DeRose, Axel Scherer, and Amnon Yariv, "Active coupled-resonator optical waveguides. II. Current injection InP–InGaAsP Fabry–Perot resonator arrays," Journal of the Optical Society of America B, Vol. 24, Issue 9, 2389-2393 (2007). https://doi.org/10.1364/JOSAB.24.002389
* Lin Zhu, Xiankai Sun, Guy A. DeRose, Axel Scherer, and Amnon Yariv, "Spatial modal control of two-dimensional photonic crystal Bragg lasers," Optics Letters, Vol. 32, Issue 16, 2273-2275 (2007). https://doi.org/10.1364/OL.32.002273
* Lin Zhu, Xiankai Sun, Guy A. DeRose, Axel Scherer, and Amnon Yariv, "Continuous-wave operation of electrically pumped, single-mode, edge-emitting photonic crystal Bragg lasers," Appl. Phys. Lett. 90, 261116 (2007). https://doi.org/10.1063/1.2752124

Dimension Icon: Atomic Force Microscope (AFM)

2025-09-24T23:17:43Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = alexw@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/HIaTe0Bb5xs Part 1: Setting up an Experiment & Aligning the Scanner]
* [https://youtu.be/Oq8djKI8gHM Part 2: Navigating to Sample & Explanation of Scanning Parameters]
* [https://youtu.be/1lEmg0p_uaw Part 3: Basics of Scanning & Using Analysis Software]
* [https://youtu.be/0SYBS5gQTM0 Extras: Probe & Scanner Mounting]

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help calibrate the microscope and to troubleshoot problems related to scanning and the probe]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference (VGRP-15M):''' Features are 6x6 μm wide, on a 10 μm pitch, and etched 180 nm deep into SiO2. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that while it does not necessarily do a good job of predicting the behavior of scans that look at features on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights), if this 180 nm calibration is within an error of less than 1%, then you can be generally confident in your small-scale scans. Consider using – or devising – a 2D material standard as a check on your own 2D material scans to be assured of accuracy.
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Carbon Evaporator

2025-09-24T23:14:07Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Carbon Evaporator
|HeaderColor = #F2682A
|ImageOne = EM-ACE600-Carbon-Evaporator.jpg
|ImageTwo = EM-ACE600-Carbon-Evaporator.jpg
|InstrumentType = [[Equipment_List#Deposition|Deposition]], [[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5885
|PrimaryStaff = Alex Wertheim
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Leica
|Model = EM ACE600
|Techniques = Carbon Deposition and Gold Sputtering
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin (e.g. 2-10 nm), conductive layer of carbon on the surface can help. This carbon evaporator produces amorphous, conductive films, the morphology of which is not detectable in an SEM or FIB image. After imaging is complete, the carbon can be gently removed with an O2 plasma using, for example, the lab's [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner]].
===== Applications =====
* Coat material surface to make sample conductive for use in an SEM or FIB
* Coat resist surface to make sample conductive for use with e-beam lithography
* Apply carbon to a specimen or device for any other fabrication use

== Resources ==
===== Equipment Data =====

[[Image:Carbon-Evaporator-Source-Thread.jpg|thumb|top|upright=0.9|The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]

===== SOP & Troubleshooting =====
* [https://caltech.box.com/s/1l8kxgkiti1kgmvysl2tpu68r1desi8m SOP & Troubleshooting Guide]
* The procedure to install a new carbon thread can be found on [https://www.manualslib.com/manual/1525180/Leica-Em-Ace600.html?page=43#manual Page 39 of the Operating Manual]
** Note: always install as a "double thread," i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator's door width is long enough to double over and install.

===== Video =====
* [https://www.youtube.com/watch?v=Qj3Y-WfNbvM Leica's Product Overview Video]

===== Technical Notes =====
* [https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-ace600/downloads/ Technical Notes Provided by Leica]
===== Manufacturer Manual =====
* [https://caltech.box.com/s/xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Operating Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://www.leica-microsystems.com/fileadmin/downloads/Leica%20EM%20ACE600/Brochures/EMACECoaters_Brochure_09_17_EN.pdf Manufacturer Product Guide]

===== Carbon Evaporation Specifications =====
* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)
* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want
 
 
== Related Instrumentation in the KNI ==
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

Rapid Thermal Processor

2025-09-24T23:10:29Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Solaris Rapid Thermal Processor
|HeaderColor = #F5A81C
|ImageOne = RTP.jpeg
|ImageTwo =
|InstrumentType = [[Equipment_List#Metrology|Metrology]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Surface Science Integration
|Model = Solaris 150
|Techniques = Rapid Thermal Processing
|RequestTraining = alexw@caltech.edu
|EmailList = kni-metrology
|EmailListName = Metrology
}}
== Description ==
The Solaris 150 is a manual loading Rapid Thermal Processor system that can process up to 6 inch substrates. The system is designed for silicon implant annealing and monitoring and compound semiconductor implant activation and ohmic alloying.
===== Applications =====
*Temperature range from room temperature to 1200 degrees C.
* Processing gasses available:
**Nitrogen
**Argon
**Forming Gas (5% H2 in N2)

== Resources ==
===== SOPs =====
*[https://caltech.box.com/s/9less1mp9tg7xya8ugycnw11dhw0lnjf Solaris 150 – Rapid Thermal Processor -Short SOP]
*[https://caltech.box.com/s/7uozrq6pmgkcr6l8u3qhnka9sgtgf3u9 Solaris 150 – Rapid Thermal Processor -Long SOP]

===== Manuals =====
*[https://caltech.app.box.com/file/1237887943601 Solaris 150 - Rapid Thermal Processor Manual]

Rapid Thermal Processor

2025-09-24T23:09:37Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Solaris Rapid Thermal Processor
|HeaderColor = #F5A81C
|ImageOne = RTP.jpeg
|ImageTwo =
|InstrumentType = [[Equipment_List#Metrology|Metrology]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3171
|Manufacturer = Surface science integration
|Model = Solaris 150
|Techniques = Rapid Thermal Processing
|RequestTraining = alexw@caltech.edu
|EmailList = kni-metrology
|EmailListName = Metrology
}}
== Description ==
The Solaris 150 is a manual loading Rapid Thermal Processor system that can process up to 6 inch substrates. The system is designed for silicon implant annealing and monitoring and compound semiconductor implant activation and ohmic alloying.
===== Applications =====
*Temperature range from room temperature to 1200 degrees C.
* Processing gasses available:
**Nitrogen
**Argon
**Forming Gas (5% H2 in N2)

== Resources ==
===== SOPs =====
*[https://caltech.box.com/s/9less1mp9tg7xya8ugycnw11dhw0lnjf Solaris 150 – Rapid Thermal Processor -Short SOP]
*[https://caltech.box.com/s/7uozrq6pmgkcr6l8u3qhnka9sgtgf3u9 Solaris 150 – Rapid Thermal Processor -Long SOP]

===== Manuals =====
*[https://caltech.app.box.com/file/1237887943601 Solaris 150 - Rapid Thermal Processor Manual]

Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner

2025-09-24T23:08:25Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Tergeo Plus Plasma Cleaner
|HeaderColor = #FFE2B9
|ImageOne = Tergeo-Plus-O2-Ar-Plasma-Cleaner.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Etching]], [[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = Nathan Lee
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = PIE Scientific
|Model = Tergeo Plus
|Techniques = Plasma Cleaning, Direct Mode (ICP), Remote Mode (CCP)
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Tergeo Plus is an easy-to-use, versatile plasma cleaner that can operate in a number of different modes using a range of gases. Currently, only oxygen and argon gases are hooked up to the instrument, which are suitable for many sample cleaning and resist ashing (i.e. resist removal) applications, though a third gas connection exists if there is a need to use another gas (e.g. hydrogen for plasma cleaning with a reducing environment). This cleaner can be operated in Direct Mode (aka Immersion Mode), which involves striking an inductively-coupled plasma (ICP) directly in the sample chamber, or Remote Mode (aka Indirect Mode), which involves striking a capacitively-coupled plasma (CCP) in a remote chamber. The Remote Mode is the more gentle cleaning mode because it only allows neutral species to make their way into the chamber and participate in cleaning by means of chemical reaction (e.g. oxygen radicals react with surface hydrocarbons to create volatile species like CO and CO2 that can then be removed via the vacuum). Low power modes can also be achieved in either Direct or Remote Mode by varying the pulsing ratio. See below for the full list of resources related to this instrument.
===== Applications =====
* Remove hydrocarbons from SEM/FIB samples to prevent "black box" effect from happening while imaging (use O2 or O2/Ar plasma)
* Remove residual resist from developed lithography processes, aka "descumming" of the substrate surface (use O2 or O2/Ar plasma)
* Sputter away small amounts of surface materials (use high-power Ar plasma)
* Activate the surface of PDMS polymer to make it adhesive to e.g. glass slides, for use in microfluidic device fabrication (use O2 plasma)
* Running a hydrogen plasma has not yet been tried but could theoretically clean e.g. graphene without oxidizing it (O2 plasma would)
* Any other process that requires the non-directional removal of material by reactive-ion plasma

== Resources ==
===== Equipment Data =====
[[Image:Tergeo-Plus-Plasma-Cleaner–Parameters-Overview-Graphic.jpg|thumb|top|upright=1.35|An overview of the available modes and parameter ranges]]

===== SOP & Troubleshooting =====
* [https://caltech.box.com/s/0dkpffpstz2y1mmnywa4br9er07irvsv SOP & Troubleshooting Document]

===== Graphical Handouts =====
* [https://caltech.box.com/s/ics22ljdscnz5zcdct351iw10os97u01 Graphical Handout] (see it also pictured at right)
===== Video =====
* [https://www.youtube.com/watch?v=UNrwtm6puLs PIE Scientific's Product Overview Video]
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Operating Manual]
* [https://caltech.box.com/s/flz7maaqq1k80pdacpqqd9yaps63agjp Quick Start Guide]
===== Note on Cleaning for SEM & FIB Samples =====
[[Image:Black-Box-Effect.jpg|thumb|top|upright=1.00|An example fo the "black box effect" that one tries to avoid by plasma cleaning the sample before SEM or FIB imaging. It is caused by scanning a beam over an area that is covered by copious amounts of hydrocarbons.]]
* During SEM or FIB imaging, the local specimen area will heat up due to added energy from the beam. If there is organic matter on the surface from a previous process (e.g. solvent treatment) or from simply being exposed to the ambient environment, the heat causes hydrocarbons to evolve from the surface, whereupon they become a precursor gas for an electron-beam- or ion-beam-aided, chemical-vapor-deposition of carbon back onto the surface, now in a denser form. This carburization of the surface often results in a “black box” appearing in areas where the beam was highly concentrated, e.g. where a reduced area window was used for a focusing step (carbon has a low yield of secondary electrons, SEs, and thus the carbon area appears darker). Note that the carburization process happens more quickly at lower e-beam accelerating voltages because the chemical vapor deposition is dependent on the presence of SEs, which are emitted in higher quantities at low voltage. Cleaning a specimen with an O2 and/or Ar plasma (or H2 if a reducing environment is necessary to prevent oxidation) will remove the hydrocarbons and prevent this process from happening to a noticeable degree while imaging.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Manufacturer Data Sheet]

===== Mode 1 Specifications =====
* Power Range: 1 to 150 W
* Pulsing Duty Ratio Range (N/255): 1 to 255, where
** Example: With 10 W power, if N=25 then the average power as a function of pulsing would be [10 W * (25/255) = 0.98 W, on average]
* Gas Flow Rates: 0.1 to 100.0 sccm
* Ultimate Vacuum: < 30 mTorr
 
 
== Related Instrumentation in the KNI ==
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

EBPG 5000+: 100 kV Electron Beam Lithography

2025-08-08T20:30:02Z

Derose: /* General SOPs */

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.app.box.com/file/1697395588371 EBPG reservation and use policy (Updated April 2024)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/4t687ozlf79m1t8yg1bb51z5mhdblrk6 EBPG 5000+ Airlock Operations video (Caltech-only access)]
* [https://caltech.box.com/s/o3vnlrldejttsanvrviqwdllkir7f5oo EBPG 5000+ Sample Mounting video (Caltech-only access)]
* [https://caltech.box.com/s/5q7a4m1e2wzbdg40iflqahtdd5yxg69n EBPG 5000+ Sample Unmounting video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/05w5x6u01gzpdn1ksa9r7967m2fdidai EBPG Handling Large Pattern Files SOP]
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/s2p10a6r3ds8h8al8bejjv2yvkuc7pez EBPG 5000+ Holder 5 adapter plate SOP]
* [https://caltech.box.com/s/ec5aeg0nx53mvze0zsg1dp25q0iq48ou EBPG 5000+ Holder 8 SOP]
* [https://caltech.box.com/s/bz8i2tvwklzgh1u6cval5n72kui3wuk3 EBPG 5000+ Raith screwdriver SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/ojrq79u8p5xnhck8p5gi9fskl4nzsj3b Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/1ge5czbz4b1pbfz2wrzbjmynnktdc0ci EBPG 5000+ Troubleshooting Loader errors]
* [https://caltech.box.com/s/qfy0tyiwynl06b7i2zuxe7rfdd9gec7k EBPG 5000+ Reattach alignment microscope coupling spring video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/t300bkjjyfq2bn7uw2nlfujqfsbpf1ui BEAMER Tutorial – Fracturing circles and angled features]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]


===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2025-08-08T20:29:08Z

Derose: /* General SOPs */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV). 
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.app.box.com/file/1697395588371 EBPG reservation and use policy (Updated April 2024)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training Materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/i2q9ow1pkkidt1z7st0czvazobpxours EBPG 5200 sample mounting training video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/05w5x6u01gzpdn1ksa9r7967m2fdidai EBPG Handling Large Pattern Files SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/1vul3cyoudr1k3e8zoctne3oyt4irx3y EBPG 5200 Holder 200 SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/rwhke2ck8539d3p9pfhgvu3f62uasfhq EBPG Holder Fixture handling SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/3lt47igh9wcza5ck9nl3i4ansn1jy4q7 EBPG 5200 troubleshooting loader issues training video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video (Caltech-only access)]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

KNI Staff Members

2025-07-10T17:18:03Z

Derose: Title

{| class="wikitable" style="width: 90%;"
|-
!scope="col" style="text-align:left; width: 15%"| Name
!scope="col" style="text-align:left; width: 16%" | Job Title
!scope="col" style="text-align:left; width: 18%"| Email
!scope="col" style="text-align:left; width: 14%"| Office & Phone
!scope="col" style="text-align:left; width: 20%"| Areas of Responsibility
!scope="col" style="text-align:center;"| Photo
|-
{{StaffMemberTableItem|
|Name = Guy A. DeRose, PhD
|JobTitle = Technical Director Member of the Professional Staff
|CaltechID = derose
|Office = 126 Steele
|Phone = 626-395-3423 (office) 626-676-8529 (cell)
|AreasResponsibility = Electron Beam Lithography, Lab Technical Operations
|Photo = Guy-A-DeRose.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Tiffany Kimoto
|JobTitle = Executive Director
|CaltechID = tkimoto
|Office = 119A Steele
|Phone = 626-395-3914 (office) 310-291-7977 (cell)
|AreasResponsibility = Programs, Outreach, Communications, Financial Management
|Photo = Tiffany-Kimoto.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Sydney Garstang
|JobTitle = Senior Administrative Coordinator
|CaltechID = sydney
|Office = 128 Steele
|Phone = 626-395-3244 (office)
|AreasResponsibility = Accounts, Billing, Purchase Orders
|Photo = Sydney-Garstang.jpg
}}
|-
{{StaffMemberTableItem|
|Name = Alireza Ghaffari
|JobTitle = KNI Laboratory Staff Member of the Professional Staff
|CaltechID = alireza
|Office = 176 Watson
|Phone = 626-395-3984 (office) 
|AreasResponsibility = Foundry, AFM, photolithography, support tools
|Photo = alireza-ghaffari.png
}}
{{StaffMemberTableItem|
|Name = Nathan S. Lee
|JobTitle = Laboratory Infrastructure Manager
|CaltechID = nathslee
|Office = 124 Steele
|Phone = 626-395-4075 (office) 626-395-4386 (cell)
|AreasResponsibility = General infrastructure, safety
|Photo = Nathan-S-Lee.jpg
}}
|-
|-
|-
|-
{{StaffMemberTableItem|
|Name = Kelly McKenzie
|JobTitle = Plasma Process Engineer
|CaltechID = kmmckenz
|Office = 330 Steele
|Phone = 626-395-5732 (office)
|AreasResponsibility = Plasma etch / deposition, Tube furnaces
|Photo = McKenzie_Kelly_2.jpg
}}
{{StaffMemberTableItem|
|Name = Alex Wertheim
|JobTitle = Materials Process Engineer
|CaltechID = alexw
|Office = 303 Steele
|Phone = 626-395-3371 (office)
|AreasResponsibility = Physical Deposition, 3D Printing, Ellipsometry
|Photo = Alex-Wertheim.jpg
}}
{{StaffMemberTableItem|
|Name = Patama Taweesup
|JobTitle = Grants Manager
|CaltechID = patama
|Office = 142B Moore
|Phone = 626-395-8542 (office)
|AreasResponsibility = Grant Management
|Photo = Patama-Taweesup.jpg
}}
|}

Wedge-Wedge Wire Bonder

2025-02-18T17:53:32Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Wire Bonder
|HeaderColor = #E6E7E8
|ImageOne = Wedge-Wedge-Wire-Bonder_Westbond-7476D-79.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Device_Processing|Device Processing]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Nathan Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = WestBond
|Model = 7476D-79
|Techniques = Wire Bonding
|EmailList = kni-wirebonder
|EmailListName = WestBond Wire Bonder
}}
== Description ==
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
===== Applications =====
* Bonding aluminum wire to a metal bond pads.
* Aluminum wire thickness currently being used is 0.001 inch.

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/x5q9oxso8k1rn03d12iyqdr3egytg1br WestBond - General SOP]
* [https://caltech.box.com/s/rx72y31eba3tnn36mq5ewwcdwpsgxmfe WestBond - Tool Change SOP]
* [https://caltech.box.com/s/l8y5e4etpes7v7vpih57w043dzvean7r WestBond - Changing the wire spool]-This presentation also give guidance on THREADING THE WIRE.

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 WestBond 7476D Wire Bonder Manual]
* [https://caltech.box.com/s/7yfera0l0q9hpc5i4rcmameuu6h3yszs WestBond K1200D Temperature Controller Manual]
===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 See - WestBond 7476D Wire Bonder Manual]
* Recommended Bond Pad Requirements:
::1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.
:::Bonding will be difficult and little room for error.
::2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).
::3. Minimum Pad Thickness - 150nm Gold (thicker is better).
::4. Suggested Pad Thickness - 250nm Gold.

Electrical Probing Station

2025-02-18T16:08:23Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Electrical Probing Station
|HeaderColor = #E6E7E8
|ImageOne = Electrical-Probing-Station_Cascade-M150.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Metrology|Metrology]], [[Equipment_List#Device_Processing|Device Processing]], 
|RoomLocation = B213 Steele
|LabPhone = 626-395-1537
|PrimaryStaff = [[Nathan Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Cascade Microtech
|Model = M150
|Techniques = Electrical Probing
|EmailList = kni-metrology
|EmailListName = Metrology
}}
== Description ==
A manual probe station used for electrical testing of devices. Six probes are available; users are expected to supply their own probe tips. An HP4145B Parameter Analyzer is available and/or users are encouraged to bring in their own electrical equipment to use with the station.
===== Applications =====
* Miscellaneous electrical measurements

== Resources ==
===== Manufacturer Resources =====
* [https://caltech.box.com/s/kmf1kby5d5hgmnq49x52g8vfeufbhtdq Cascade Microtech MPS150 Probe Station – Data Sheet (newer model than the one in KNI)]
* [https://caltech.box.com/s/xumvbal8rmyggb3h87hk0g5s8b957hqg HP4145B Parameter Analyzer – Manufacturer Manual]

== Specifications ==
===== Hardware Specifications =====
* [https://caltech.box.com/s/kmf1kby5d5hgmnq49x52g8vfeufbhtdq Cascade Microtech MPS150 Probe Station – Data Sheet (newer model than the one in KNI)]
* [https://caltech.box.com/s/r65uh023p5s2tni3g3lvh7nd3mdxrfky Cascade Microtech MPS150 Probe Station – Product Highlights (newer model than the one in KNI)]

Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF

2025-02-05T22:39:38Z

Derose: /* SOPs & Troubleshooting */

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-30
|HeaderColor = #F5A81C
|ImageOne = Mouse-Footpad-Peripheral-Nerve-Fiber-3D-Tomography_Mark-S-Ladinksy.jpg
|ImageTwo = Tecnai-TF30.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B242F Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Guy DeRose]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-30
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = derose@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
[[Image:TF-30-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-30 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-30 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 50 to 300 kV. Operating at 300 kV, the TF-30  has analytical options such as EELS and EFTEM. The TF-30 is also equipped with a high-angle annular dark field (HAADF) detector for use in STEM mode, and an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode). The Serial EM program allows for automated collection of images at variable tilt angles for performing tomography. See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a High-Angle Annular Dark Field (HAADF) detector
* Energy Dispersive Spectroscopy (EDS) with an Oxford INCA system
* Automatically capture tilt series of images for tomographic imaging

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* SOPs ([https://caltech.box.com/s/v7oih7yv8yxai5ybkg8znplc54xc99if Long Version] | [https://caltech.box.com/s/uq2x3x6jfbrwm7sll3zfvb4h4naip7rj Short, Conceptual Version])
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/b5h0v6s2ethshh2fs5o4eqwf7pe8sdwc Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]

===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM/Ga-FIB system]] (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools

===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/e2mw7hh44g2hbcui5m3hnnqnlyunb8lf TF-30 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 F30 Family
* Voltage Range: 50-300 kV
* Point resolution: 0.20 nm
* Line resolution: 0.10 nm
* STEM resolution: 0.17 nm
* Information limit: 0.14 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±40°
* Max alpha-tilt angle with tomography holder: ±80°
* Maximum diffraction angle: ±12°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscope =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]

===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Quanta 200F: SEM, ESEM, Lithography & Probe Station

2025-02-05T22:38:20Z

Derose: /* SOPs & Troubleshooting */

{{InstrumentInfoboxOneImage|
|InstrumentName = Quanta 200F
|HeaderColor = #F5A81C
|ImageOne = Quanta-200F-SEM.jpg
|ImageTwo = Quanta-200F-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Quanta 200F
|Techniques = SEM, ESEM, E-beam Lithography, Electrical 4-Point Probe Station, Hot Stage, Cold Stage
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Quanta 200F is a field emission gun (FEG) scanning electron microscope (SEM) that can also be operated in environmental (ESEM) mode, where a higher chamber pressure (0.1 to 27 mbar) allows for the imaging of e.g. biological samples without lysing cells. While the Quanta does not have an immersion lens for ultra-high-resolution imaging, as all other KNI SEMs do, this actually allows the Quanta's non-immersion objective lens to be optimally placed for "field-free imaging," making it the KNI's highest resolution SEM when operating outside of Immersion Mode. The Quanta is also equipped with an e-beam lithography system, a four-point electrical probing station, and a Hot/Cold Stage attachment. Its small chamber allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for the Quanta below.
===== SEM Applications =====
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD)
* Backscattered Electron (BSE) imaging with a solid-state Backscattered Electron Detector (BSED)
* ESEM Mode for imaging biological samples using Large Field Detector (LFD) & Gaseous Secondary Electron Detector (GSED)
* ESEM Mode for imaging highly non-conductive samples using LFD & GSED (the water vapor environment wicks away charge from sample); 500 μm clip-on aperture (to the bottom of the SEM column) is available for use in ESEM Mode to improve resolution
===== Other Applications =====
* E-beam lithography with the Nanometer Pattern Generating System (NPGS) software
* Hot & Cold Stage for observing a sample from -185 to 240 °C
* Four-Point Electrical Probe Station for ''in situ'' electrical measurements

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/1yqfsg1cl6x9w9414bsqiqxcp4cl2bub Short Version] | [https://caltech.box.com/s/qwjhdb252dq8lk5ap5up829pvd3g1fvo Long Version])
* E-beam Lithography SOPs ([https://caltech.box.com/s/n5ft2s02i92698vy3m1w6tp60s2o407s Short Version] | [https://caltech.box.com/s/pt78znsx8dj01t7fuwdknzq0uzvy3ueg Long Version])
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned Patterning Steps with NPGS] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide]
* [https://caltech.box.com/s/xa6da8tjz4u5yksi9ozhvg1l1f6v357a Review Paper on secondary electron contrast in low-vacuum and ESEM of dielectrics]
* [https://caltech.box.com/s/n91a9brnyg5ntg48ztkzn95knl63i9ed Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on ESEM, Lithography, Probe Station, Hot & Cold Stage)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/urxbsk9wrruxcnj345c3rjb37dc48k64 Quanta 200F SEM Operation Manual]
* [https://caltech.box.com/s/ijtjy0dzm7kwiidm0v87jlw8t9azi0xr Mailbox Prober Operation Manual]
* [https://caltech.box.com/s/07oq9u320tfds4iktjzlr62n8l1rh95r Gatan C1002 Cold Stage Users Manual]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== SEM & ESEM Specifications =====
* Minimum Feature Size Resolved in SEM Mode: ~15 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spot Size" 1 to 7 (approximately 30 pA to 20 nA), with increments of 0.1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 10 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -150 to 70° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* Ultimate Vacuum: 3e-7 mbar
* ESEM Mode Pressure Range: 0.1 to 27.0 mbar (water vapor is used as chamber gas)
* Minimum Feature Size Resolved in ESEM Mode: ~10 nm

===== Lithography with NPGS Specifications =====
* Minimum Feature Produced: ~17 nm diameter dots & ~20 nm wide lines (via liftoff of 10 nm Ti on Si)
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Writing Speed: 5 MHz
* Digital-to-Analog Converter (DAC): 16-bit
* Keithley 487 Picoammeter / Voltage Source is available for measuring beam current
===== Probe Station Specifications =====
* Probe Station Manufacturer: Kammrath & Weiss
* Parameter Analyzer: HP4145B Available [https://caltech.box.com/s/xumvbal8rmyggb3h87hk0g5s8b957hqg (Manual)], or bring your own
* Keithley 487 Picoammeter / Voltage Source is available as a function generator
* Probe station connectors rated up to 42 V, measure up to mA of current
===== Hot & Cold Stage Specifications =====
* Temperature Range: -185 to 240° C
* Stage is cooled by air that is itself cooled by flowing it through a liquid nitrogen heat exchanger
* Stage is heated by a resistive heating element
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscope =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2025-02-05T22:36:53Z

Derose: /* SOPs & Troubleshooting */

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar

Nova 200 NanoLab: SEM & EDS

2025-02-05T22:35:43Z

Derose: /* SOPs & Manuals & SDS */

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/4f1hqp83pwc1v1k5qke6xi68i28fjvz8 Nova200 and EDS SOP, Manuals, SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f .pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 .pptx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2025-02-05T22:35:10Z

Derose: /* SOPs & Manuals & SDS */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/a7rguo6eyf5aq5tpel3bsu2xsg8ko9an Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V

ORION NanoFab: Helium, Neon & Gallium FIB

2025-02-05T22:34:35Z

Derose: /* SOPs & Troubleshooting */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = alireza@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating hydrocarbon deposition on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).
* There is no need to coat non-conductive samples, the ORION NanoFab is equipped with a floodgun which can be used for charge compensation.
* You can of course still use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Equipment List

2025-02-05T22:33:56Z

Derose: /* Microscopy */

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Wet Chemistry Resources

2025-01-22T06:19:01Z

Derose: /* External Laboratories */

=Sample Cleaning Resources=

*[https://www.sciencedirect.com/book/9780323510844/handbook-of-silicon-wafer-cleaning-technology#book-description Handbook of Silicon Wafer Cleaning Technology]

*[https://www.microsi.com/silicon-wafer-cleaning/ UC Irvine Cleaning Procedures for Silicon]

*[https://cleanroom.byu.edu/clean BYU Substrate Cleaning Guide]

*https://www.microsi.com/silicon-wafer-cleaning/

==Solvent Cleans==

*[https://www-s.mechse.uiuc.edu/cleanroom/files/Procedures/Process/Wafer%20Cleaning%20Procedure%20V1.0.pdf UIUC Wafer Cleaning Procedure]

*'''Acetone, IPA''' -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
*'''Acetone, Methanol''' -Similar to above except Methanol is more toxic, and a polar molecule versus IPA which is non-polar
*'''Acetone, Methanol, IPA'''
*'''Acetone, Methanol, IPA, DI Water'''
*'''Remover PG (60°C), IPA''' -Caution, low flashpoint, do not leave unattended
**Nano Remover PG Spec Sheet
**[https://static1.squarespace.com/static/57b26cc76b8f5b7524bf9ed2/t/57f9725d725e25a7b5dd12fe/1475965533625/Remover-PG-Process.pdf Columbia University Remover PG Process]
*'''Dichloromethane, IPA''' -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice

==Etching Cleans==

Caution. All of these processes require a buddy and adequate chemical safety training.

===RCA Clean===

Prepares wafers for high-temperature processing steps. Standardized protocol developed by RCA in 1960s.

*https://en.wikipedia.org/wiki/RCA_clean

===Nanostrip Etch===
Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

*'''Nanostrip (60°C)''' -Rinse with DI
**https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm
**https://braungroup.beckman.illinois.edu/files/2018/02/SOP_BI-005_Nanostrip.pdf

===Piranha Etch===

Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

*[https://mmrc.caltech.edu/Safety/SOPs/Piranha%20Etch%20SOP.pdf Caltech MMRC Piranha Etch]

*[http://lnf-wiki.eecs.umich.edu/wiki/Piranha_Etch UMich LNF Piranha Etch]

*[https://www.chemistry.mcmaster.ca/moran-mirabal/resources/PIRANHA-CLEAN-5-2014.pdf McMaster University Piranha Etch]

*[https://www.bu.edu/photonics/files/2011/02/Piranha_clean.pdf Boston University Piranha Etch]

===HF Dip===

Removes native oxide from surfaces.

*[https://www.inrf.uci.edu/wordpress/wp-content/uploads/sop-wet-hf-2-percent-dip.pdf UCI Irvine HF 2% Dip]

*[http://www.nanofab.ubc.ca/processes/cleaning/boe-buffered-oxide-etch-and-hf-dip/ UBC BOE Etch and HF Dip]

==Plasma Cleans==

Plasma cleaning via oxygen, argon, etc. may be the more optimal choice for certains samples such as fragile membranes. More information can be found on the tool page for the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner.]]

=Wet Etching Resources=

==Reference Articles and Texts==

*[http://ieeexplore.ieee.org/abstract/document/546406/ Etch Rates for Micromachining Processing]

*[https://ieeexplore.ieee.org/document/1257354 Etch Rates for Micromachining Processing-Part II]

*[https://vector.umd.edu/images/links/Handbook_of_Metal_Etchants.pdf Handbook of Metal Etchants]

==External Laboratories==

*[https://cleanroom.byu.edu/wet_etch BYU Etching list]

*[http://lnf-wiki.eecs.umich.edu/wiki/Wet_etching UMich Wet Etching info]

*[https://cleanroom.byu.edu/wet_etch BYU Etching Guidance]

*[https://wiki.nanofab.ucsb.edu/wiki/Wet_Etching_Recipes UCSB Wet Etching Recipes]

*[https://nanolab.berkeley.edu/public/manuals/process_manual.shtml Berkeley Marvell Nanofab Process Manual]

*[https://cleanroom.byu.edu/KOH BYU KOH processing]

*[https://www.inrf.uci.edu/wordpress/wp-content/uploads/sop-wet-anisotropic-si-etch-using-koh.pdf UC Irvine KOH Etching]

*[https://www.nanofab.ualberta.ca/wp-content/uploads/downloads/2016/07/KOH-Etching-Info-2013_V2.pdf U Alberta KOH Etching]

==Commercial Materials==

*[http://transene.com/etch-compatibility/ Transene Etch Compatibility Chart]

*[https://transene.com/etchants/ Transene Etchant List]

*[https://www.microchemicals.com/downloads/application_notes.html MicroChemicals trove of application notes]

==KNI Wet Etch Recipes Table==

{| class="wikitable sortable"
|-
! Material !! Etchant !! Rate (nm/min) !! Anisotropy !! Selective to !! Selectivity !! Origin and Notes
|-
| [[CHA: Electron Beam Evaporator |KNI CHA]] Al|| Al Etch Type A|| X || - || Al || Good || Matches Transene's expected rate
|-
| [[CHA: Electron Beam Evaporator |KNI CHA]] Al|| Al Etch Type D|| X || - || Al || High || Matches Transene's expected rate
|-
| [[CHA: Electron Beam Evaporator |KNI CHA]] Al2O3|| Phosphoric Acid || X || - || - || - || Measured 11/19 by
|-
| [[Wet thermal Oxidation | KNI Tystar Furnace ]] 1000°C SiO2 || HF || 111 || Very Low || SiO2 || High || Measured 11/19 by Alex Wertheim
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] 350°C SiO2 || HF || 486 || Low || SiO2 || High || Measured 11/19 by Alex Wertheim
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] 200°C SiO2 || HF || 1398 || High || SiO2 || High || Measured 11/19 by Alex Wertheim
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] 350°C Si3N4|| Phosphoric Acid || X || - || - || - || Measured 11/19 by
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] a-Si|| KOH || X || High || Si || High || Link here to KNI member's research paper
|}

=Other Procedures=

==Liftoff==

*[https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Lift-Off_Techniques UCSB liftoff guidance]

*[https://snf.stanford.edu/SNF/processes/process-modules/photolithography/lift-off-lol-procedures/liftoff Stanford SNF liftoff procedures]

==Electroplating==

*[https://www.technic.com/chemistry Technic electroplating materials supplier]

=Safety Resources=

*[[Lab Rules & Safety | KNI Lab Rules & Safety]]

*[https://cleanroom.byu.edu/acid_safety BYU Acid Safety], [https://cleanroom.byu.edu/HF_safety HF Safety], [https://cleanroom.byu.edu/solvent_safety Solvent Safety]

Wet Chemistry Resources

2025-01-22T06:16:16Z

Derose: /* External Laboratories */

=Sample Cleaning Resources=

*[https://www.sciencedirect.com/book/9780323510844/handbook-of-silicon-wafer-cleaning-technology#book-description Handbook of Silicon Wafer Cleaning Technology]

*[https://www.microsi.com/silicon-wafer-cleaning/ UC Irvine Cleaning Procedures for Silicon]

*[https://cleanroom.byu.edu/clean BYU Substrate Cleaning Guide]

*https://www.microsi.com/silicon-wafer-cleaning/

==Solvent Cleans==

*[https://www-s.mechse.uiuc.edu/cleanroom/files/Procedures/Process/Wafer%20Cleaning%20Procedure%20V1.0.pdf UIUC Wafer Cleaning Procedure]

*'''Acetone, IPA''' -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
*'''Acetone, Methanol''' -Similar to above except Methanol is more toxic, and a polar molecule versus IPA which is non-polar
*'''Acetone, Methanol, IPA'''
*'''Acetone, Methanol, IPA, DI Water'''
*'''Remover PG (60°C), IPA''' -Caution, low flashpoint, do not leave unattended
**Nano Remover PG Spec Sheet
**[https://static1.squarespace.com/static/57b26cc76b8f5b7524bf9ed2/t/57f9725d725e25a7b5dd12fe/1475965533625/Remover-PG-Process.pdf Columbia University Remover PG Process]
*'''Dichloromethane, IPA''' -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice

==Etching Cleans==

Caution. All of these processes require a buddy and adequate chemical safety training.

===RCA Clean===

Prepares wafers for high-temperature processing steps. Standardized protocol developed by RCA in 1960s.

*https://en.wikipedia.org/wiki/RCA_clean

===Nanostrip Etch===
Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

*'''Nanostrip (60°C)''' -Rinse with DI
**https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm
**https://braungroup.beckman.illinois.edu/files/2018/02/SOP_BI-005_Nanostrip.pdf

===Piranha Etch===

Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

*[https://mmrc.caltech.edu/Safety/SOPs/Piranha%20Etch%20SOP.pdf Caltech MMRC Piranha Etch]

*[http://lnf-wiki.eecs.umich.edu/wiki/Piranha_Etch UMich LNF Piranha Etch]

*[https://www.chemistry.mcmaster.ca/moran-mirabal/resources/PIRANHA-CLEAN-5-2014.pdf McMaster University Piranha Etch]

*[https://www.bu.edu/photonics/files/2011/02/Piranha_clean.pdf Boston University Piranha Etch]

===HF Dip===

Removes native oxide from surfaces.

*[https://www.inrf.uci.edu/wordpress/wp-content/uploads/sop-wet-hf-2-percent-dip.pdf UCI Irvine HF 2% Dip]

*[http://www.nanofab.ubc.ca/processes/cleaning/boe-buffered-oxide-etch-and-hf-dip/ UBC BOE Etch and HF Dip]

==Plasma Cleans==

Plasma cleaning via oxygen, argon, etc. may be the more optimal choice for certains samples such as fragile membranes. More information can be found on the tool page for the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Tergeo Plus Plasma Cleaner.]]

=Wet Etching Resources=

==Reference Articles and Texts==

*[http://ieeexplore.ieee.org/abstract/document/546406/ Etch Rates for Micromachining Processing]

*[https://ieeexplore.ieee.org/document/1257354 Etch Rates for Micromachining Processing-Part II]

*[https://vector.umd.edu/images/links/Handbook_of_Metal_Etchants.pdf Handbook of Metal Etchants]

==External Laboratories==

*[https://cleanroom.byu.edu/wet_etch BYU Etching list]

*[http://lnf-wiki.eecs.umich.edu/wiki/Wet_etching UMich Wet Etching info]

*[https://cleanroom.byu.edu/wet_etch BYU Etching Guidance]

*[https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Etching_Recipes UCSB Wet Etching Recipes]

*[https://nanolab.berkeley.edu/public/manuals/process_manual.shtml Berkeley Marvell Nanofab Process Manual]

*[https://cleanroom.byu.edu/KOH BYU KOH processing]

*[https://www.inrf.uci.edu/wordpress/wp-content/uploads/sop-wet-anisotropic-si-etch-using-koh.pdf UC Irvine KOH Etching]

*[https://www.nanofab.ualberta.ca/wp-content/uploads/downloads/2016/07/KOH-Etching-Info-2013_V2.pdf U Alberta KOH Etching]

==Commercial Materials==

*[http://transene.com/etch-compatibility/ Transene Etch Compatibility Chart]

*[https://transene.com/etchants/ Transene Etchant List]

*[https://www.microchemicals.com/downloads/application_notes.html MicroChemicals trove of application notes]

==KNI Wet Etch Recipes Table==

{| class="wikitable sortable"
|-
! Material !! Etchant !! Rate (nm/min) !! Anisotropy !! Selective to !! Selectivity !! Origin and Notes
|-
| [[CHA: Electron Beam Evaporator |KNI CHA]] Al|| Al Etch Type A|| X || - || Al || Good || Matches Transene's expected rate
|-
| [[CHA: Electron Beam Evaporator |KNI CHA]] Al|| Al Etch Type D|| X || - || Al || High || Matches Transene's expected rate
|-
| [[CHA: Electron Beam Evaporator |KNI CHA]] Al2O3|| Phosphoric Acid || X || - || - || - || Measured 11/19 by
|-
| [[Wet thermal Oxidation | KNI Tystar Furnace ]] 1000°C SiO2 || HF || 111 || Very Low || SiO2 || High || Measured 11/19 by Alex Wertheim
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] 350°C SiO2 || HF || 486 || Low || SiO2 || High || Measured 11/19 by Alex Wertheim
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] 200°C SiO2 || HF || 1398 || High || SiO2 || High || Measured 11/19 by Alex Wertheim
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] 350°C Si3N4|| Phosphoric Acid || X || - || - || - || Measured 11/19 by
|-
| [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | KNI PECVD ]] a-Si|| KOH || X || High || Si || High || Link here to KNI member's research paper
|}

=Other Procedures=

==Liftoff==

*[https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Lift-Off_Techniques UCSB liftoff guidance]

*[https://snf.stanford.edu/SNF/processes/process-modules/photolithography/lift-off-lol-procedures/liftoff Stanford SNF liftoff procedures]

==Electroplating==

*[https://www.technic.com/chemistry Technic electroplating materials supplier]

=Safety Resources=

*[[Lab Rules & Safety | KNI Lab Rules & Safety]]

*[https://cleanroom.byu.edu/acid_safety BYU Acid Safety], [https://cleanroom.byu.edu/HF_safety HF Safety], [https://cleanroom.byu.edu/solvent_safety Solvent Safety]

EBPG 5000+: 100 kV Electron Beam Lithography

2024-11-11T22:06:04Z

Derose: /* General SOPs */

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/c217cz3i7crvafhlsssh6lauirixgji5 EBPG reservation and use policy (Updated April 2024)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/4t687ozlf79m1t8yg1bb51z5mhdblrk6 EBPG 5000+ Airlock Operations video (Caltech-only access)]
* [https://caltech.box.com/s/o3vnlrldejttsanvrviqwdllkir7f5oo EBPG 5000+ Sample Mounting video (Caltech-only access)]
* [https://caltech.box.com/s/5q7a4m1e2wzbdg40iflqahtdd5yxg69n EBPG 5000+ Sample Unmounting video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/05w5x6u01gzpdn1ksa9r7967m2fdidai EBPG Handling Large Pattern Files SOP]
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/s2p10a6r3ds8h8al8bejjv2yvkuc7pez EBPG 5000+ Holder 5 adapter plate SOP]
* [https://caltech.box.com/s/ec5aeg0nx53mvze0zsg1dp25q0iq48ou EBPG 5000+ Holder 8 SOP]
* [https://caltech.box.com/s/bz8i2tvwklzgh1u6cval5n72kui3wuk3 EBPG 5000+ Raith screwdriver SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/ojrq79u8p5xnhck8p5gi9fskl4nzsj3b Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/1ge5czbz4b1pbfz2wrzbjmynnktdc0ci EBPG 5000+ Troubleshooting Loader errors]
* [https://caltech.box.com/s/qfy0tyiwynl06b7i2zuxe7rfdd9gec7k EBPG 5000+ Reattach alignment microscope coupling spring video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/t300bkjjyfq2bn7uw2nlfujqfsbpf1ui BEAMER Tutorial – Fracturing circles and angled features]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]


===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2024-11-11T22:05:15Z

Derose: /* General SOPs */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV). 
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/c217cz3i7crvafhlsssh6lauirixgji5 EBPG reservation and use policy (Updated April 2024)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training Materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/i2q9ow1pkkidt1z7st0czvazobpxours EBPG 5200 sample mounting training video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/05w5x6u01gzpdn1ksa9r7967m2fdidai EBPG Handling Large Pattern Files SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/1vul3cyoudr1k3e8zoctne3oyt4irx3y EBPG 5200 Holder 200 SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/rwhke2ck8539d3p9pfhgvu3f62uasfhq EBPG Holder Fixture handling SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/3lt47igh9wcza5ck9nl3i4ansn1jy4q7 EBPG 5200 troubleshooting loader issues training video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video (Caltech-only access)]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Wedge-Wedge Wire Bonder

2024-07-09T00:44:14Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Wire Bonder
|HeaderColor = #E6E7E8
|ImageOne = Wedge-Wedge-Wire-Bonder_Westbond-7476D-79.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Device_Processing|Device Processing]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = WestBond
|Model = 7476D-79
|Techniques = Wire Bonding
|EmailList = kni-wirebonder
|EmailListName = WestBond Wire Bonder
}}
== Description ==
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
===== Applications =====
* Bonding aluminum wire to a metal bond pads.
* Aluminum wire thickness currently being used is 0.001 inch.

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/x5q9oxso8k1rn03d12iyqdr3egytg1br WestBond - General SOP]
* [https://caltech.box.com/s/rx72y31eba3tnn36mq5ewwcdwpsgxmfe WestBond - Tool Change SOP]
* [https://caltech.box.com/s/l8y5e4etpes7v7vpih57w043dzvean7r WestBond - Changing the wire spool]-This presentation also give guidance on THREADING THE WIRE.

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 WestBond 7476D Wire Bonder Manual]
* [https://caltech.box.com/s/7yfera0l0q9hpc5i4rcmameuu6h3yszs WestBond K1200D Temperature Controller Manual]
===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 See - WestBond 7476D Wire Bonder Manual]
* Recommended Bond Pad Requirements:
::1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.
:::Bonding will be difficult and little room for error.
::2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).
::3. Minimum Pad Thickness - 150nm Gold (thicker is better).
::4. Suggested Pad Thickness - 250nm Gold.

Wet Chemistry

2024-06-29T19:22:19Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Wet Chemistry
|HeaderColor = #E6E7E8
|ImageOne = Wet-Chemistry_Solvents-and-HF.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Wet Chemistry|Wet Chemistry]]
|RoomLocation = B211 Steele
|LabPhone = 626-395-1538
|PrimaryStaff = [[Alex Weretheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = NA
|Model = NA
|Techniques = Wet Chemical Processing: Acids, Bases, Solvents, and Electroplating
|EmailList = kni-chemistry
|EmailListName = Chemistry
}}
==Facilities==

'''Wet Benches in the Wet Chemistry Room: [https://caltech.box.com/s/kgxh5cmzbotufvlnbonldcurmz23xasz Standard Wet Chemistry Video] Watch this video before using the wet benches in the cleanroom.'''
*ACID BENCH: Personal Protective Equipment required to be worn.
**Okay to store acid resistant gloves on top
*BASE/CAUSTIC BENCH: Personal Protective Equipment required to be worn.
**Okay to store acid resistant gloves on top
*ELECTROPLATING BENCH: Personal Protective Equipment required to be worn.
*HF ACID BENCH (Hydrofluoric Acid): Personal Protective Equipment required to be worn.
**Okay to store acid resistant gloves on top
**Type of plasticware RECOMMENDED for use with Hydrofluoric Acid:
:::ECTFE(Halar®), Fluorosint®, HDPE, PET, Polycarbonate, Polypropylene, Polysulfone, PVC Type I, PVC Type II, PVDF, Tecator™ / Torlon®, UHMW.
*KOH BENCH (Potassium Hydroxide): Personal Protective Equipment required to be worn.
*SOLVENTS BENCH: Double Nitrile Gloves and Safety Glasses required to be worn.

'''------> Note: Personal Protective Equipment or "PPE": [https://lab.kni.caltech.edu/index.php/Wet_Chemistry_Safety#Personal_Protective_Equipment_or_PPE_Overview PPE Overview]'''
*1) Acid Resistant Apron (Green) - PUT ON FIRST, Remove Last
*2) Face Shield (WITH SAFETY GLASSES) - PUT ON SECOND, Remove Second
*3) Trionic E-194 Tripoly Acid Resistant Gloves - PUT ON LAST, Remove First
Write NAME and DATE on both Trionic gloves when opening package. Acid gloves typically last 2 weeks. INSPECT BEFORE EACH USE.

'''Wet Bench in the Optical Lithography Room:'''
*DEVELOP BENCH (base/caustic): Double Nitrile Gloves and Safety Glasses required to be worn.
**Solvent Develop (SU8 developer) must be performed on the SOLVENT BENCH in the Wet Chemistry Room.
'''Fumed Hoods inside the Optical Lithography Room:'''
*SPINNER BENCH (solvent hood): Laurell 1 (SU8 only), Laurell 2 (Positive,nLOF SPR), and Headway Spinner (Large Substrates and special Coatings)
*HOT PLATE BENCH (solvent hood): Torrey Pines Scientific hot plate(programable up to 350C), Two - Fairweather TPS88 hot plates(Non-Programable up to 150C) Solvent Hood.

'''Wet Bench in the E-beam Lithography Area:'''
*DEVELOP and SPINNER BENCH (solvent bench): Double Nitrile Gloves and Safety Glasses required to be worn.
'''Hazardous Waste Handling: [https://caltech.box.com/s/kgxh5cmzbotufvlnbonldcurmz23xasz Hazardous Waste Handling Video] Watch this video before using the wet benches in the cleanroom.'''
*AUTOMATIC BOTTLE WASHER: Located inside the Wet Chemistry Room
*SATELLITE ACCUMULATION AREA: Located in the Oxford Chase next to the Water Chiller.
**STORAGE CART for storage of TAGGED full waste bottles.
**STORAGE BIN (next to the cart) is for "DOUBLE BAGGED AND TAGGED" waste which can also be used for TAGGED containers that do not fit inside the cart.

== Chemistry Procedures and Safety ==

* [[Wet Chemistry Safety | Wet Chemistry Safety Procedures]] - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
* [[Wet Chemistry Resources | Wet Chemistry Resources Page]] - Contains fabrication recipes and procedures
* [[Lab_Rules_&_Safety | Lab Rules & Safety]] - KNI cleanroom safety handbook

== Chemical Safety Data Sheet Lists ==

* '''[[Provided_Chemicals | Chemicals Provided by the KNI with typical SDS]]'''
* '''[[Safety Data Sheets (SDS) | Approved Chemicals Allowed to be used in the KNI with typical SDS (chemical not provided by the KNI)]]'''
* [https://www.chemicalsafety.com/sds-search Search for Safety Data Sheets (SDS)] - New Chemical Search (Web Search)

==Requesting New Chemicals==
===NEVER bring in any chemicals into the KNI Lab before receiving an approval through email that your chemical has been allowed to be used inside the lab.===
*Always thoroughly review the SAFETY DATA SHEET of the new chemical being requested BEFORE submitting a request.
*Submit the request through email to the KNI Lab Safety Officer - [mailto:bertm@caltech.edu Bert Mendoza]
*Email should include:
**(1) SAFETY DATA SHEET (attached) from manufacture.
**(2) PROCESS DESCRIPTION - a detailed description of the process and how the chemical will be used.
**(3) AMOUNT OR QUANTITY of chemical to be brought into the KNI Lab.
*The KNI Lab provides many chemicals for processing. If the requested chemical will improve your process and can be valuable to other members, include the reasons in the request. Staff may decide it would be beneficial to provide the new chemical for all members and add it to the '''[[Provided_Chemicals | Chemicals Provided by the KNI with typical SDS]]''' list.
*If the chemical is unique to your process, you will be required to supply the chemical and the chemical will be added to the'''[[Safety Data Sheets (SDS) | Approved Chemicals with typical SDS]]''' list.

XeF2 Etcher for Silicon

2024-06-29T19:17:42Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = XeF2 Silicon Etcher
|HeaderColor = #FFE2B9
|ImageOne = XeF2-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = N/A
|Model = N/A
|Techniques = Selective dry Si etching
|RequestTraining = kmmckenz@caltech.edu
|EmailList = kni-XeF2
|EmailListName = XeF2
}}
== Description ==
The XeF2 etcher flows pressure- and time-controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices.

===== Applications =====
* Very high selectivity dry Si etching
* MEMS fabrication

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/2zf5dwmdjyjxptvoscxkxe6yt57vr85v KNI SOP]

Parylene Coater

2024-06-29T19:16:24Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Parylene Coater
|HeaderColor = #F2682A
|ImageOne = LabTop-3000-Parylene-Coater.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Para Tech
|Model = LabTop 3000
|Techniques = Parylene Deposition
|RequestTraining = Alexw@caltech.edu
|EmailList = kni-parylene
|EmailListName = Parylene
}}
== Description ==
The ParaTech LabTop 3000 Parylene coater uses a multi-stage thermal process to deposit a conformal parylene film on your substrates. Multiple wafers up to 150 mm diameter may be coated at once. Samples are under vacuum during and not subject to heat during coating.

===== Applications =====
* Bio-compatible/moisture protection packaging
* Dielectric polymer coating

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/rff803khc95ooyn96uj2rdc7mn02dyes KNI SOP]

CNI-PV 2.1: Nano Imprint Lithography

2024-06-29T19:13:52Z

Derose:

{{instrument|{{PAGENAME}}
|InstrumentName = NIL Technology CNI-PV 2.1 Nano Imprint Lithography System
|HeaderColor = #F5A81C
|ImageResearch = NILT_Imprint_process.png
|ImageInstrument = CNI_NILT_wiki.jpeg
|InstrumentType = Lithography
|RoomLocation = B217 Steele
|LabPhone = 626-395-1536
|PrimaryStaff = Guy DeRose
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = NIL Technology
|Techniques = Thermal and UV Nanoimprint Lithography
|RequestTraining = mailto: derose@caltech.edu
|EmailListName = kni-photolith
|EmailList = kni-photolith@caltech.edu
}}
== Description ==
The NIL Technology CNI-PV 2.1 Nano Imprint Lithography System is a lithography tool that is used to enable nanoscale printing by thermal or UV exposure of photoresist with an imprint stamp. Vacuum in the imprint chamber is enabled down to 1 micron, and thermal imprint of up to 240°C is available. The system is compatible with UV-cured resists, and has an integral UV light source for those processes. It allows up to 200 mm diameter substrates with UV, or up to 150x150 mm substrates with thermal processing.
===== Operational Applications =====
* Thermal Nano Imprint Lithography
* UV Nano Imprint Lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/b18bwz6vibzsz08hnhior52vcep8cww4 CNI v2.1 PV Edition description]
===== General SOPs =====
* [https://caltech.box.com/s/3hxilag7uca8wurqkscar8jbtbzmczf3 NILT - Operation SOP]

===== FBS Reservation Rules:=====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

===== Training Materials =====
*
===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/8tv6lvwmwbecgwd9qayq73mbdje4klmk NanoImprint Resists flyer]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
===== Advanced Troubleshooting SOPs =====
*
===== Data Preparation Resources =====
*
===== Lithography Process Information =====
* [https://youtu.be/YzzHchJZaCw Hot Embossing Demo from NILT (YouTube - external)]
===== Manufacturer Manuals =====
*

== Specifications ==
* Thermal NanoImprint: Up to 240°C with 150x150 mm substrate
* UV NanoImprint up to 200 mm wafers
 
 

== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

Wafer Stepper

2024-06-29T19:12:37Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Stepper
|HeaderColor = #FFFFFF
|ImageOne = I-Line-Wafer-Stepper GCA-6300.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1536
|PrimaryStaff = [[Guy DeRose]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = GCA
|Model = 6300
|Techniques = Wafer Patterning, Pattern Alignments
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2-, 3-, 4-, 6-, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain +/-0.1 °C temperature control.

Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X- & Y-coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X- & Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.
===== Applications =====
* Step exposure with alignments
* Step exposure without alignments

== Resources ==
=== Specifications ===
* Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
* System is setup for 4 inch wafers and pieces smaller than 100mm.

=== FBS Reservation Rules:===
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== SOPs ===
* [https://caltech.box.com/s/z6q0ovarnkwe1sec645uq8kti44r4jwc GCA 6300 Operation Quick Guide Reference]
* [https://caltech.box.com/s/o634f2xum216ah4lrmxy67nurxbt5iqg GCA 6300 Operation SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
Manufacturer Manuals
* [https://caltech.box.com/s/tq6pr3f9yldpfnr30kcx0jhre85541nz System Operation Manual]
* [https://caltech.box.com/s/87i1mym5d2nxluk4zim4wemf5zbhsm5w Advanced Operation & Utilization Manual]
* [https://caltech.box.com/s/1fzh7r5ceopxyamnss0i3gen7nashnnt Advanced Information Package]
* [https://caltech.box.com/s/h7jdk8uxhfygcuhx0e0a3jsrlp0q4ztq Reticle Handbook]
* [https://caltech.box.com/s/m6wb60586w93z2ys8emz8nhg8e0yxtv3 Baseline Procedure]
* [https://caltech.box.com/s/kqn62mmqrslz8x8bm2t7qqybjqulrosu Acceptance Test Procedures]

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]

== Related Instrumentation in the KNI ==
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Contact Mask Aligners: MA6 & MA6/BA6

2024-06-29T19:11:40Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Suss Contact Mask Aligner MA6/BA6
|HeaderColor = #FFFFFF
|ImageOne = Mask-Aligner_Suss-MicroTec-MA6-BA6.jpg
|ImageTwo = Instrument-Image.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1535
|PrimaryStaff = Alireza Ghaffari
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = Suss MicroTec
|Model = MA6 & MA6/BA6
|Techniques = Frontside Alignment, Backside Alignment,Flood exposure
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
[[Image:Mask-Aligner_Suss-MicroTec-MA6.jpg|thumb|upright=1.12|Suss MicroTec model MA6 Mask Aligner (model MA6/BA6 is shown at the top of the infobox)]]
The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography). The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.
==== Suss1 MA6/BA6 Applications ====
* Front Side Flood Exposure (no mask)
* Front Side Alignment & Exposure
* Back Side Alignment with Front Side Exposure

==== Suss2 MA6 Applications ====
* Front Side Alignment & Exposure
* Back Side Alignment with Front Side Exposure

== Resources ==
=== Manufacturer Specifications ===
* Whole wafers 2” up to 6” can be loaded.
* Samples pieces up to 6”x6” square can be loaded.
* Samples up to 6mm thick can be loaded..
* Exposure Resolution:
::Soft Contact Mode = 1 - 2 um
::Hard Contact Mode = 1 um
::Soft Vacuum Contact Mode = 1 - 0.5 um
::Vacuum Contact Mode = 0.4 - 0.5 um
''' Suss 1 Exposure Settings '''
* Channel 1 is 365nm wavelength at 15 mW/cm2.
* Channel 2 is 405nm wavelength at 25 mW/cm2.
''' Suss 2 Exposure Settings '''
* Channel 1 is 365nm wavelength at 10 mW/cm2.
* Channel 2 is 405nm wavelength at 15 mW/cm2.

=== SOPs & Troubleshooting ===
* [https://caltech.box.com/s/gkhncvqe25uccym7cs5aj0n00krbmnw1 General SOP & Troubleshooting]
* [https://caltech.box.com/s/bbk4f9vi6jerhi9fcqoqa78n5npkwxkr Lamp Change SOP]
* [https://caltech.box.com/s/mj01k4mxgsxbnctv3fayzaje1ph4bfop Lamp Re-Ignition SOP]
* [https://caltech.box.com/s/xq40xbslhezrn4dyrblsgxrojd21lb8g Suss 1 Lamp Re-Ignition Video]
* [https://caltech.box.com/s/f5f4z86p8v9i43nvs7ntbgkzrog44jpm Suss 2 Lamp Re-Ignition Video]
Manufacturer Manuals
* [https://caltech.box.com/s/81h0w7viflquujpc960x76os52oinv1f Suss MA6/BA6 System Manual]
* [https://caltech.box.com/s/0bdk31f09vxui62c096lhaiguzgkc1cu Suss MA6/BA6 Brochure]
* [https://caltech.box.com/s/fxyqt4fkpb6x1c0li2l84wjose5x0wke Lamp Power Supply Manual]
* [https://caltech.box.com/s/e1b5co1cb4hwbu21ala3cnqt888tma7f Alignment Mark Suggestion Document]

==== FBS Reservation Rules:====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner Cleaning SOP]
* [https://caltech.box.com/s/evjv6kciuamgl42moa8vug60dpc0gimp Laurell Spinner - Spinning Resist Video]

=== Process Recipes ===
* [https://lab.kni.caltech.edu/index.php/Process_Recipe_Library#Optical_Lithography Optical Lithography Photoresist Recipes]

== Related Instrumentation in the KNI ==
=== Optical Lithography ===
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
=== Electron Beam Lithography ===
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
=== Ion Beam Lithography ===
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5000+: 100 kV Electron Beam Lithography

2024-05-21T21:49:35Z

Derose: /* Sample Prep and Writing SOPs */

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/4t687ozlf79m1t8yg1bb51z5mhdblrk6 EBPG 5000+ Airlock Operations video (Caltech-only access)]
* [https://caltech.box.com/s/o3vnlrldejttsanvrviqwdllkir7f5oo EBPG 5000+ Sample Mounting video (Caltech-only access)]
* [https://caltech.box.com/s/5q7a4m1e2wzbdg40iflqahtdd5yxg69n EBPG 5000+ Sample Unmounting video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/05w5x6u01gzpdn1ksa9r7967m2fdidai EBPG Handling Large Pattern Files SOP]
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/s2p10a6r3ds8h8al8bejjv2yvkuc7pez EBPG 5000+ Holder 5 adapter plate SOP]
* [https://caltech.box.com/s/ec5aeg0nx53mvze0zsg1dp25q0iq48ou EBPG 5000+ Holder 8 SOP]
* [https://caltech.box.com/s/bz8i2tvwklzgh1u6cval5n72kui3wuk3 EBPG 5000+ Raith screwdriver SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/ojrq79u8p5xnhck8p5gi9fskl4nzsj3b Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/1ge5czbz4b1pbfz2wrzbjmynnktdc0ci EBPG 5000+ Troubleshooting Loader errors]
* [https://caltech.box.com/s/qfy0tyiwynl06b7i2zuxe7rfdd9gec7k EBPG 5000+ Reattach alignment microscope coupling spring video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/t300bkjjyfq2bn7uw2nlfujqfsbpf1ui BEAMER Tutorial – Fracturing circles and angled features]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]


===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2024-05-21T21:48:16Z

Derose: /* Sample Prep and Writing SOPs */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV). 
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training Materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/i2q9ow1pkkidt1z7st0czvazobpxours EBPG 5200 sample mounting training video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/05w5x6u01gzpdn1ksa9r7967m2fdidai EBPG Handling Large Pattern Files SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/1vul3cyoudr1k3e8zoctne3oyt4irx3y EBPG 5200 Holder 200 SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/rwhke2ck8539d3p9pfhgvu3f62uasfhq EBPG Holder Fixture handling SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/3lt47igh9wcza5ck9nl3i4ansn1jy4q7 EBPG 5200 troubleshooting loader issues training video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video (Caltech-only access)]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Dektak 3ST: Profilometer

2024-04-24T00:51:53Z

Derose: /* Resources */

{{InstrumentInfoboxOneImage|
|InstrumentName = Veeco Dektak 3ST Profilometer
|HeaderColor = #F5A81C
|ImageOne = Dektak-3ST-Profilometer.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Metrology|Metrology]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = Veeco
|Model = Dektak 3ST
|Techniques = Surface Profiling
|RequestTraining = alireza@caltech.edu
|EmailList = kni-metrology
|EmailListName = Metrology
}}
== Description ==
The Dektak 3ST profilometer is a stylus-type surface profiler. It is equipped with a camera for locating the region of interest, manual sample manipulation & tilt correction, and profile analysis software. It can be used to get a rough idea of the topography of features by scanning a single line across the surface. Features as small as 100 nm in height can be determined with some approximation.

===== Applications =====
* Surface Profiling

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/hdic8scc882tkrcjqsbaruqph9jgo75t KNI SOP]
* [https://caltech.box.com/s/j6br8jpkr7ov0k9dwx7wzyzt9f5fj3rt Dektak Operations Manual]
 
 

== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2024-04-19T22:07:33Z

Derose: /* Resources */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/a7rguo6eyf5aq5tpel3bsu2xsg8ko9an Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* SEM Essentials: Capabilities and Limitations of Scanning Electron Microscopy; and SEM Setup, Parameters and Theory for Successful Operations and Measurements
**[https://caltech.box.com/s/eg20eqw7si5ka0bms251qurfwhys0hta Download .pptx Slides]
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V

Contact Mask Aligners: MA6 & MA6/BA6

2024-02-17T06:41:07Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Suss Contact Mask Aligner MA6/BA6
|HeaderColor = #FFFFFF
|ImageOne = Mask-Aligner_Suss-MicroTec-MA6-BA6.jpg
|ImageTwo = Instrument-Image.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1535
|PrimaryStaff = Bert Mendoza
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Suss MicroTec
|Model = MA6 & MA6/BA6
|Techniques = Frontside Alignment, Backside Alignment,Flood exposure
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
[[Image:Mask-Aligner_Suss-MicroTec-MA6.jpg|thumb|upright=1.12|Suss MicroTec model MA6 Mask Aligner (model MA6/BA6 is shown at the top of the infobox)]]
The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography). The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.
==== Suss1 MA6/BA6 Applications ====
* Front Side Flood Exposure (no mask)
* Front Side Alignment & Exposure
* Back Side Alignment with Front Side Exposure

==== Suss2 MA6 Applications ====
* Front Side Alignment & Exposure
* Back Side Alignment with Front Side Exposure

== Resources ==
=== Manufacturer Specifications ===
* Whole wafers 2” up to 6” can be loaded.
* Samples pieces up to 6”x6” square can be loaded.
* Samples up to 6mm thick can be loaded..
* Exposure Resolution:
::Soft Contact Mode = 1 - 2 um
::Hard Contact Mode = 1 um
::Soft Vacuum Contact Mode = 1 - 0.5 um
::Vacuum Contact Mode = 0.4 - 0.5 um
''' Suss 1 Exposure Settings '''
* Channel 1 is 365nm wavelength at 15 mW/cm2.
* Channel 2 is 405nm wavelength at 25 mW/cm2.
''' Suss 2 Exposure Settings '''
* Channel 1 is 365nm wavelength at 10 mW/cm2.
* Channel 2 is 405nm wavelength at 15 mW/cm2.

=== SOPs & Troubleshooting ===
* [https://caltech.box.com/s/gkhncvqe25uccym7cs5aj0n00krbmnw1 General SOP & Troubleshooting]
* [https://caltech.box.com/s/bbk4f9vi6jerhi9fcqoqa78n5npkwxkr Lamp Change SOP]
* [https://caltech.box.com/s/mj01k4mxgsxbnctv3fayzaje1ph4bfop Lamp Re-Ignition SOP]
* [https://caltech.box.com/s/xq40xbslhezrn4dyrblsgxrojd21lb8g Suss 1 Lamp Re-Ignition Video]
* [https://caltech.box.com/s/f5f4z86p8v9i43nvs7ntbgkzrog44jpm Suss 2 Lamp Re-Ignition Video]
Manufacturer Manuals
* [https://caltech.box.com/s/81h0w7viflquujpc960x76os52oinv1f Suss MA6/BA6 System Manual]
* [https://caltech.box.com/s/0bdk31f09vxui62c096lhaiguzgkc1cu Suss MA6/BA6 Brochure]
* [https://caltech.box.com/s/fxyqt4fkpb6x1c0li2l84wjose5x0wke Lamp Power Supply Manual]
* [https://caltech.box.com/s/e1b5co1cb4hwbu21ala3cnqt888tma7f Alignment Mark Suggestion Document]

==== Labrunr Reservation Rules:====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Suss1 or Suss2 from the dropdown menu)

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner Cleaning SOP]
* [https://caltech.box.com/s/evjv6kciuamgl42moa8vug60dpc0gimp Laurell Spinner - Spinning Resist Video]

=== Process Recipes ===
* [https://lab.kni.caltech.edu/index.php/Process_Recipe_Library#Optical_Lithography Optical Lithography Photoresist Recipes]

== Related Instrumentation in the KNI ==
=== Optical Lithography ===
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
=== Electron Beam Lithography ===
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
=== Ion Beam Lithography ===
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF

2023-12-05T22:09:20Z

Derose:

{{InstrumentInfobox|
|InstrumentName = Tecnai TF-30
|HeaderColor = #F5A81C
|ImageOne = Mouse-Footpad-Peripheral-Nerve-Fiber-3D-Tomography_Mark-S-Ladinksy.jpg
|ImageTwo = Tecnai-TF30.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B242F Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Guy DeRose]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = FEI (now Thermo Fisher)
|Model = Tecnai TF-30
|Techniques = TEM, STEM, Bright & Dark Field Imaging, EDS, HAADF, Electron Diffraction, Tomography
|RequestTraining = derose@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
[[Image:TF-30-Schematic-KNI-Caltech.jpg|thumb|top|upright=1.00|A schematic of the KNI's Tecnai TF-30 TEM/STEM. Modified from an original schematic that is courtesy of Portland State University.]]
The Tecnai TF-30 is a transmission electron microscope (TEM) that can also be operated in scanning transmission electron microscopy (STEM) mode, with a voltage range of 50 to 300 kV. Operating at 300 kV, the TF-30  has analytical options such as EELS and EFTEM. The TF-30 is also equipped with a high-angle annular dark field (HAADF) detector for use in STEM mode, and an energy dispersive spectroscopy (EDS) detector for compositional analysis (in both TEM mode and, most often, in STEM mode). The Serial EM program allows for automated collection of images at variable tilt angles for performing tomography. See a full list of training and educational resources for this instrument below.
===== Applications =====
* High-Resolution TEM (HRTEM) imaging without an objective aperture
* Bright Field (BF) & Dark Field (DF) imaging with an objective aperture
* Selected Area Electron Diffraction (SAED)
* STEM imaging with a High-Angle Annular Dark Field (HAADF) detector
* Energy Dispersive Spectroscopy (EDS) with an Oxford INCA system
* Automatically capture tilt series of images for tomographic imaging

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Tecnai TF-30 from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SOPs ([https://caltech.box.com/s/v7oih7yv8yxai5ybkg8znplc54xc99if Long Version] | [https://caltech.box.com/s/uq2x3x6jfbrwm7sll3zfvb4h4naip7rj Short, Conceptual Version])
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]
* [https://caltech.box.com/s/b5h0v6s2ethshh2fs5o4eqwf7pe8sdwc Troubleshooting Guide]

===== Manufacturer Resources =====
* Full manufacturer manual is accessible via the UI under the ''Help'' menu
===== Other Online Resources =====
* Rodenburg.org's [http://www.rodenburg.org/guide/index.html Learn to Use a TEM]

===== Sample Preparation =====
* Sample preparation is a highly specific task related to each sample type and is therefore primarily the responsibility of the user to carry out.
** KNI staff can teach users how to create lamellae from a bulk specimen using an [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM/Ga-FIB system]] (see [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 SOP] and [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s YouTube playlist])
** The KNI also has a [[TEM Sample Preparation Equipment | TEM sample preparation lab]] that is primarily used to make cross-section samples by traditional methods (i.e. glue together a stack, cut out 3 mm core, thin by polishing, dimple, then final polish with argon mill); inquire with staff for help with these sample preparation tools

===== Order Your Own Grids =====
* Grids used for mounting specimens are considered a personal, consumable item in the KNI. You are required to supply your own grids.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/e2mw7hh44g2hbcui5m3hnnqnlyunb8lf TF-30 Product Guide & Specifications]
===== TEM & STEM Specifications =====
* From FEI’s (now Thermo Fisher’s) Tecnai G2 F30 Family
* Voltage Range: 50-300 kV
* Point resolution: 0.20 nm
* Line resolution: 0.10 nm
* STEM resolution: 0.17 nm
* Information limit: 0.14 nm
* Energy spread: 0.7 eV
* Max alpha-tilt angle with double-tilt holder: ±40°
* Max alpha-tilt angle with tomography holder: ±80°
* Maximum diffraction angle: ±12°
* Camera length: 35–2300 mm
* EDS solid angle: 0.13 srad
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscope =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]

===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Quanta 200F: SEM, ESEM, Lithography & Probe Station

2023-10-01T04:17:54Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Quanta 200F
|HeaderColor = #F5A81C
|ImageOne = Quanta-200F-SEM.jpg
|ImageTwo = Quanta-200F-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Quanta 200F
|Techniques = SEM, ESEM, E-beam Lithography, Electrical 4-Point Probe Station, Hot Stage, Cold Stage
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Quanta 200F is a field emission gun (FEG) scanning electron microscope (SEM) that can also be operated in environmental (ESEM) mode, where a higher chamber pressure (0.1 to 27 mbar) allows for the imaging of e.g. biological samples without lysing cells. While the Quanta does not have an immersion lens for ultra-high-resolution imaging, as all other KNI SEMs do, this actually allows the Quanta's non-immersion objective lens to be optimally placed for "field-free imaging," making it the KNI's highest resolution SEM when operating outside of Immersion Mode. The Quanta is also equipped with an e-beam lithography system, a four-point electrical probing station, and a Hot/Cold Stage attachment. Its small chamber allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for the Quanta below.
===== SEM Applications =====
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD)
* Backscattered Electron (BSE) imaging with a solid-state Backscattered Electron Detector (BSED)
* ESEM Mode for imaging biological samples using Large Field Detector (LFD) & Gaseous Secondary Electron Detector (GSED)
* ESEM Mode for imaging highly non-conductive samples using LFD & GSED (the water vapor environment wicks away charge from sample); 500 μm clip-on aperture (to the bottom of the SEM column) is available for use in ESEM Mode to improve resolution
===== Other Applications =====
* E-beam lithography with the Nanometer Pattern Generating System (NPGS) software
* Hot & Cold Stage for observing a sample from -185 to 240 °C
* Four-Point Electrical Probe Station for ''in situ'' electrical measurements

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Quanta 200F from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/1yqfsg1cl6x9w9414bsqiqxcp4cl2bub Short Version] | [https://caltech.box.com/s/qwjhdb252dq8lk5ap5up829pvd3g1fvo Long Version])
* E-beam Lithography SOPs ([https://caltech.box.com/s/n5ft2s02i92698vy3m1w6tp60s2o407s Short Version] | [https://caltech.box.com/s/pt78znsx8dj01t7fuwdknzq0uzvy3ueg Long Version])
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned Patterning Steps with NPGS] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide]
* [https://caltech.box.com/s/xa6da8tjz4u5yksi9ozhvg1l1f6v357a Review Paper on secondary electron contrast in low-vacuum and ESEM of dielectrics]
* [https://caltech.box.com/s/n91a9brnyg5ntg48ztkzn95knl63i9ed Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on ESEM, Lithography, Probe Station, Hot & Cold Stage)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/urxbsk9wrruxcnj345c3rjb37dc48k64 Quanta 200F SEM Operation Manual]
* [https://caltech.box.com/s/ijtjy0dzm7kwiidm0v87jlw8t9azi0xr Mailbox Prober Operation Manual]
* [https://caltech.box.com/s/07oq9u320tfds4iktjzlr62n8l1rh95r Gatan C1002 Cold Stage Users Manual]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== SEM & ESEM Specifications =====
* Minimum Feature Size Resolved in SEM Mode: ~15 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spot Size" 1 to 7 (approximately 30 pA to 20 nA), with increments of 0.1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 10 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -150 to 70° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* Ultimate Vacuum: 3e-7 mbar
* ESEM Mode Pressure Range: 0.1 to 27.0 mbar (water vapor is used as chamber gas)
* Minimum Feature Size Resolved in ESEM Mode: ~10 nm

===== Lithography with NPGS Specifications =====
* Minimum Feature Produced: ~17 nm diameter dots & ~20 nm wide lines (via liftoff of 10 nm Ti on Si)
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Writing Speed: 5 MHz
* Digital-to-Analog Converter (DAC): 16-bit
* Keithley 487 Picoammeter / Voltage Source is available for measuring beam current
===== Probe Station Specifications =====
* Probe Station Manufacturer: Kammrath & Weiss
* Parameter Analyzer: HP4145B Available [https://caltech.box.com/s/xumvbal8rmyggb3h87hk0g5s8b957hqg (Manual)], or bring your own
* Keithley 487 Picoammeter / Voltage Source is available as a function generator
* Probe station connectors rated up to 42 V, measure up to mA of current
===== Hot & Cold Stage Specifications =====
* Temperature Range: -185 to 240° C
* Stage is cooled by air that is itself cooled by flowing it through a liquid nitrogen heat exchanger
* Stage is heated by a resistive heating element
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscope =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2023-10-01T04:16:49Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Sirion from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar

ORION NanoFab: Helium, Neon & Gallium FIB

2023-10-01T04:16:02Z

Derose:

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = alireza@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Orion NanoFab from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating hydrocarbon deposition on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).
* There is no need to coat non-conductive samples, the ORION NanoFab is equipped with a floodgun which can be used for charge compensation.
* You can of course still use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2023-10-01T04:15:37Z

Derose:

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Nova 600 NanoLab from the dropdown menu)

===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V

Nova 200 NanoLab: SEM & EDS

2023-10-01T04:15:11Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = alireza@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Nova 200 NanoLab from the dropdown menu)

===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/4f1hqp83pwc1v1k5qke6xi68i28fjvz8 Nova200 and EDS SOP, Manuals, SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar

ORION NanoFab: Helium, Neon & Gallium FIB

2023-10-01T04:14:07Z

Derose:

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Orion NanoFab from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating hydrocarbon deposition on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).
* There is no need to coat non-conductive samples, the ORION NanoFab is equipped with a floodgun which can be used for charge compensation.
* You can of course still use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2023-10-01T04:13:20Z

Derose:

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Nova 600 NanoLab from the dropdown menu)

===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V

EBPG 5000+: 100 kV Electron Beam Lithography

2023-09-21T16:28:07Z

Derose: /* Description */

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select EBPG 5000+ from the dropdown menu)

===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/4t687ozlf79m1t8yg1bb51z5mhdblrk6 EBPG 5000+ Airlock Operations video (Caltech-only access)]
* [https://caltech.box.com/s/o3vnlrldejttsanvrviqwdllkir7f5oo EBPG 5000+ Sample Mounting video (Caltech-only access)]
* [https://caltech.box.com/s/5q7a4m1e2wzbdg40iflqahtdd5yxg69n EBPG 5000+ Sample Unmounting video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/s2p10a6r3ds8h8al8bejjv2yvkuc7pez EBPG 5000+ Holder 5 adapter plate SOP]
* [https://caltech.box.com/s/ec5aeg0nx53mvze0zsg1dp25q0iq48ou EBPG 5000+ Holder 8 SOP]
* [https://caltech.box.com/s/bz8i2tvwklzgh1u6cval5n72kui3wuk3 EBPG 5000+ Raith screwdriver SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/ojrq79u8p5xnhck8p5gi9fskl4nzsj3b Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/1ge5czbz4b1pbfz2wrzbjmynnktdc0ci EBPG 5000+ Troubleshooting Loader errors]
* [https://caltech.box.com/s/qfy0tyiwynl06b7i2zuxe7rfdd9gec7k EBPG 5000+ Reattach alignment microscope coupling spring video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/t300bkjjyfq2bn7uw2nlfujqfsbpf1ui BEAMER Tutorial – Fracturing circles and angled features]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]


===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2023-09-21T16:27:33Z

Derose: /* Description */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV). 
It is important that users have the time needed to prepare their data and job files without the pressure of being on the clock. This approach gives them a better chance of not having to repeat charged exposures through so much trial and error. Please note that we do not charge for the time required to prepare pattern files (in Layout Beamer and Tracer), or for preparing exposure job files (cjob). Users will receive instructions for secure remote access during training.
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Chalc_Sputter from the dropdown menu)

===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training Materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/i2q9ow1pkkidt1z7st0czvazobpxours EBPG 5200 sample mounting training video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/1vul3cyoudr1k3e8zoctne3oyt4irx3y EBPG 5200 Holder 200 SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/rwhke2ck8539d3p9pfhgvu3f62uasfhq EBPG Holder Fixture handling SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/3lt47igh9wcza5ck9nl3i4ansn1jy4q7 EBPG 5200 troubleshooting loader issues training video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video (Caltech-only access)]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5000+: 100 kV Electron Beam Lithography

2023-08-31T21:00:15Z

Derose: /* Data Preparation Resources */

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select EBPG 5000+ from the dropdown menu)

===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/4t687ozlf79m1t8yg1bb51z5mhdblrk6 EBPG 5000+ Airlock Operations video (Caltech-only access)]
* [https://caltech.box.com/s/o3vnlrldejttsanvrviqwdllkir7f5oo EBPG 5000+ Sample Mounting video (Caltech-only access)]
* [https://caltech.box.com/s/5q7a4m1e2wzbdg40iflqahtdd5yxg69n EBPG 5000+ Sample Unmounting video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/s2p10a6r3ds8h8al8bejjv2yvkuc7pez EBPG 5000+ Holder 5 adapter plate SOP]
* [https://caltech.box.com/s/ec5aeg0nx53mvze0zsg1dp25q0iq48ou EBPG 5000+ Holder 8 SOP]
* [https://caltech.box.com/s/bz8i2tvwklzgh1u6cval5n72kui3wuk3 EBPG 5000+ Raith screwdriver SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/ojrq79u8p5xnhck8p5gi9fskl4nzsj3b Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/1ge5czbz4b1pbfz2wrzbjmynnktdc0ci EBPG 5000+ Troubleshooting Loader errors]
* [https://caltech.box.com/s/qfy0tyiwynl06b7i2zuxe7rfdd9gec7k EBPG 5000+ Reattach alignment microscope coupling spring video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/t300bkjjyfq2bn7uw2nlfujqfsbpf1ui BEAMER Tutorial – Fracturing circles and angled features]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]


===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2023-08-31T20:59:08Z

Derose: /* Data Preparation Resources */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Chalc_Sputter from the dropdown menu)

===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training Materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/i2q9ow1pkkidt1z7st0czvazobpxours EBPG 5200 sample mounting training video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/1vul3cyoudr1k3e8zoctne3oyt4irx3y EBPG 5200 Holder 200 SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/rwhke2ck8539d3p9pfhgvu3f62uasfhq EBPG Holder Fixture handling SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/3lt47igh9wcza5ck9nl3i4ansn1jy4q7 EBPG 5200 troubleshooting loader issues training video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass Exposure (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video (Caltech-only access)]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2023-08-31T20:58:03Z

Derose: /* Data Preparation Resources */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Chalc_Sputter from the dropdown menu)

===== General SOPs =====
* [https://caltech.box.com/s/c9t6f1bkxqqfhz5lovjmm1iwg34s2m5v EBPG reservation and use policy (Updated 1 October 2022)]
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cf5ix7iraea7m3jepjwylf4nd51d8hrg Remote EBPG access via HP Remote Graphics Server (Caltech-Only)]

===== Training Materials =====
* [https://caltech.box.com/s/zq75pq1acpuhcef7xqr64bklhvknlqac EBPG Training Lecture video series (Caltech-only access)]
* [https://caltech.box.com/s/v58ny963v34uwm2ggxwjrn74sc8w7jx3 EBPG Pre-exposure Walkthrough procedure (video)]
* [https://caltech.box.com/s/4h37s09pg1lc2khlwjc67z95qlooa6az EBPG System Introduction main room training video]
* [https://caltech.box.com/s/fd9wzhdt2a0qmkgcwerqd27lvi26ca8x EBPG System Introduction service chase overview training video]
* [https://caltech.box.com/s/ykm83f8maelbqb65140rd6607hayjwa9 EBPG System Introduction UPS and alignment microscopes training video]
* [https://caltech.box.com/s/i2q9ow1pkkidt1z7st0czvazobpxours EBPG 5200 sample mounting training video (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/1vul3cyoudr1k3e8zoctne3oyt4irx3y EBPG 5200 Holder 200 SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/rwhke2ck8539d3p9pfhgvu3f62uasfhq EBPG Holder Fixture handling SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/dcdxqas5594rlgme00qbiuuapripgbiy EBPG Aperture changers SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Advanced Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qr7lqvsjc7cgv471f33smyn6gqjzdqfr EBPG BEAMS crash recovery SOP (run before a coldstart if BEAMS freezes)]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/et1ak4l0t7cwermp3h51w1aolywe09vr EBPG Procedure to degauss the final lens (run after every coldstart)]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/3lt47igh9wcza5ck9nl3i4ansn1jy4q7 EBPG 5200 troubleshooting loader issues training video (Caltech-only access)]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction (Caltech-only access)]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization (Caltech-only access)]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization (Caltech-only access)]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules (Caltech-only access)]
* [https://caltech.box.com/s/g3haulnez2ls6r2ezklcjei7jl8nx03b App Note: Multipass (Caltech-only access)]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options (Caltech-only access)]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter (Caltech-only access)]
* [https://www.genisys-gmbh.com/webinar-series-beamer-training.html Webinar Series - BEAMER Training]
* [https://www.genisys-gmbh.com/webinar-series-proximity-effect-in-e-beam-lithography.html Webinar Series: Proximity Effect in E-Beam Lithography]
* [https://www.genisys-gmbh.com/webinar-e-beam-lithography-simulation.html Webinar: e-Beam Lithography Simulation]
* [https://caltech.box.com/s/iaq5dsl4olmj1er5gfm805hfpy4gknk9 March 2020 Genisys BEAMeeting at Caltech]
* [https://caltech.box.com/s/uwlcuus2wny3hoplvszazhxgb6fzzzwq June 2020 Genisys BEAMeeting Layout Beamer training video (Caltech-only access)]
* [https://caltech.box.com/s/fgp1elkr3nfirkidd7shgbhwjx72ij9y September 2020 Genisys BEAMeeting MNE (virtual) Presentations and Training]
* [https://caltech.box.com/s/0tuq46h6qcgcg7fji6bpzjn01ayuj6la February - April 2021 Layout Beamer Training Webinars (Caltech-only access)]
* [https://caltech.box.com/s/8qj5nssyfr4mty8pwzba6lexco96mfmw GenIsys BEAMeeting presentations and notes (Caltech-only access)]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/db1hiyshj5vovhwr3mvxn0glzn0xnabp Recipe to prepare PMMA developer (MIBK:IPA 1:3)]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]
* [https://caltech.box.com/s/ybozdh0es8nzd6ujlx28lk7cnimlxwfm New Laurell Spinner WS-650Mz-23NPPB-IND Documentation (Caltech-only access)]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes (Caltech-only access)]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual (Caltech-only access)]
* [https://caltech.box.com/s/e177zgemo96fddfrkdqsh3cu15k0snbg CEBUS 2021 Presentations (Caltech-only access)]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)
* [https://caltech.box.com/s/7gw32ios7yqj3d8ghj336u0ksm6gued6 Torrey Pines HS30A Programmable hotplate manual]

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Parylene Coater

2023-08-30T16:04:33Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Parylene Coater
|HeaderColor = #F2682A
|ImageOne = LabTop-3000-Parylene-Coater.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Bert Mendoza]]
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Para Tech
|Model = LabTop 3000
|Techniques = Parylene Deposition
|RequestTraining = bertm@caltech.edu
|EmailList = kni-parylene
|EmailListName = Parylene
}}
== Description ==
The ParaTech LabTop 3000 Parylene coater uses a multi-stage thermal process to deposit a conformal parylene film on your substrates. Multiple wafers up to 150 mm diameter may be coated at once. Samples are under vacuum during and not subject to heat during coating.

===== Applications =====
* Bio-compatible/moisture protection packaging
* Dielectric polymer coating

== Resources ==
===== SOPs =====
* [https://caltech.box.com/s/rff803khc95ooyn96uj2rdc7mn02dyes KNI SOP]

Light Microscope with Spectroscopic Reflectometer

2023-07-19T15:41:22Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Light Microscope with Reflectometry
|HeaderColor = #F5A81C
|ImageOne = Olympus-BX51M-with-Filmetrics-F40.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Optical Characterization|Optical Characterization]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1535
|PrimaryStaff = Alireza Ghaffari
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = Olympus / Filmetrics
|Model = BX51M / F40
|Techniques = Optical Microscopy, Spectroscopic Reflectometry
|EmailList = kni-metrology
|EmailListName = Metrology
}}
== Description ==
This light microscope (Olympus BX51M) can be used to observe patterns and samples optically via 5x, 10x, 50x and 100x objective lenses. It also is equipped with a spectroscopic reflectometer (Filmetrics model F40) that can measure the thickness of transparent and translucent thin films. Spectroscopic reflectometry works by comparing the spectral amplitude and periodicity of light that is reflected at normal incidence from a thin film against the light that is reflected from a known reference sample; the results are fit to a mathematical model that takes into account estimated values for ''n'' (refractive index), ''k'' (absorption coefficient), and thickness.

===== Applications =====
* Optical imaging
* Thickness determinations

== Resources ==
===== SOP =====
* [https://caltech.box.com/s/sztwanjtw3ro1rm2h638qbwdljfs0sq0 KNI SOP]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/uvxpaugne3poa6s91ljdyxw64r3hzwoj Microscope Manual]
* [https://caltech.box.com/s/mjvrqf3mcido11wogctgrnoyfcasgz42 Filmetrics Manual]

== Specifications ==
* Objective Lenses: 5x, 10x, 50x, 100x
* Optical Image Modes: Bright Field, Dark Field
* Thickness Range: 20 nm to 40 μm
* Wavelength Range: 400 to 850 nm

Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner

2023-07-19T15:39:46Z

Derose:

{{InstrumentInfoboxOneImage|
|InstrumentName = Tergeo Plus Plasma Cleaner
|HeaderColor = #FFE2B9
|ImageOne = Tergeo-Plus-O2-Ar-Plasma-Cleaner.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Etching]], [[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = Alireza Ghaffari
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = PIE Scientific
|Model = Tergeo Plus
|Techniques = Plasma Cleaning, Direct Mode (ICP), Remote Mode (CCP)
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Tergeo Plus is an easy-to-use, versatile plasma cleaner that can operate in a number of different modes using a range of gases. Currently, only oxygen and argon gases are hooked up to the instrument, which are suitable for many sample cleaning and resist ashing (i.e. resist removal) applications, though a third gas connection exists if there is a need to use another gas (e.g. hydrogen for plasma cleaning with a reducing environment). This cleaner can be operated in Direct Mode (aka Immersion Mode), which involves striking an inductively-coupled plasma (ICP) directly in the sample chamber, or Remote Mode (aka Indirect Mode), which involves striking a capacitively-coupled plasma (CCP) in a remote chamber. The Remote Mode is the more gentle cleaning mode because it only allows neutral species to make their way into the chamber and participate in cleaning by means of chemical reaction (e.g. oxygen radicals react with surface hydrocarbons to create volatile species like CO and CO2 that can then be removed via the vacuum). Low power modes can also be achieved in either Direct or Remote Mode by varying the pulsing ratio. See below for the full list of resources related to this instrument.
===== Applications =====
* Remove hydrocarbons from SEM/FIB samples to prevent "black box" effect from happening while imaging (use O2 or O2/Ar plasma)
* Remove residual resist from developed lithography processes, aka "descumming" of the substrate surface (use O2 or O2/Ar plasma)
* Sputter away small amounts of surface materials (use high-power Ar plasma)
* Activate the surface of PDMS polymer to make it adhesive to e.g. glass slides, for use in microfluidic device fabrication (use O2 plasma)
* Running a hydrogen plasma has not yet been tried but could theoretically clean e.g. graphene without oxidizing it (O2 plasma would)
* Any other process that requires the non-directional removal of material by reactive-ion plasma

== Resources ==
===== Equipment Data =====
[[Image:Tergeo-Plus-Plasma-Cleaner–Parameters-Overview-Graphic.jpg|thumb|top|upright=1.35|An overview of the available modes and parameter ranges]]

===== SOP & Troubleshooting =====
* [https://caltech.box.com/s/0dkpffpstz2y1mmnywa4br9er07irvsv SOP & Troubleshooting Document]

===== Graphical Handouts =====
* [https://caltech.box.com/s/ics22ljdscnz5zcdct351iw10os97u01 Graphical Handout] (see it also pictured at right)
===== Video =====
* [https://www.youtube.com/watch?v=UNrwtm6puLs PIE Scientific's Product Overview Video]
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Operating Manual]
* [https://caltech.box.com/s/flz7maaqq1k80pdacpqqd9yaps63agjp Quick Start Guide]
===== Note on Cleaning for SEM & FIB Samples =====
[[Image:Black-Box-Effect.jpg|thumb|top|upright=1.00|An example fo the "black box effect" that one tries to avoid by plasma cleaning the sample before SEM or FIB imaging. It is caused by scanning a beam over an area that is covered by copious amounts of hydrocarbons.]]
* During SEM or FIB imaging, the local specimen area will heat up due to added energy from the beam. If there is organic matter on the surface from a previous process (e.g. solvent treatment) or from simply being exposed to the ambient environment, the heat causes hydrocarbons to evolve from the surface, whereupon they become a precursor gas for an electron-beam- or ion-beam-aided, chemical-vapor-deposition of carbon back onto the surface, now in a denser form. This carburization of the surface often results in a “black box” appearing in areas where the beam was highly concentrated, e.g. where a reduced area window was used for a focusing step (carbon has a low yield of secondary electrons, SEs, and thus the carbon area appears darker). Note that the carburization process happens more quickly at lower e-beam accelerating voltages because the chemical vapor deposition is dependent on the presence of SEs, which are emitted in higher quantities at low voltage. Cleaning a specimen with an O2 and/or Ar plasma (or H2 if a reducing environment is necessary to prevent oxidation) will remove the hydrocarbons and prevent this process from happening to a noticeable degree while imaging.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/k2dsd20hzq0vu8mhk1oohh4o5hfcdpfq Manufacturer Data Sheet]

===== Mode 1 Specifications =====
* Power Range: 1 to 150 W
* Pulsing Duty Ratio Range (N/255): 1 to 255, where
** Example: With 10 W power, if N=25 then the average power as a function of pulsing would be [10 W * (25/255) = 0.98 W, on average]
* Gas Flow Rates: 0.1 to 100.0 sccm
* Ultimate Vacuum: < 30 mTorr
 
 
== Related Instrumentation in the KNI ==
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]