The KNI Lab at Caltech - User contributions [en]

ATC Orion 8: Dielectric Sputter System

2026-03-19T19:30:38Z

Alexw: /* Electron Beam Evaporation Systems */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Dielectric-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC, pulsed DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion dielectric sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load lock that allows for automatic sample transfer. There are eight magnetron guns, seven 2" guns, and one 3" gun. A total of two RF and three DC power supplies can be used on any of the eight guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. One of the DC guns is a pulsed DC supply. Uniformity across a 6" wafer is <5% variation for the 2" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to five materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during process, allowing oxides and nitrides to be formed from pure metal targets. The pulsed DC supply is ideally suited for such reactive processes where a dielectric material is synthesized. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate. This can be used as a surface cleaner, etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Metal and dielectric deposition. Allows ferromagnetics and diamagnetics.
* Surface cleaning & in-situ plasma etch
* Ion-Assisted Deposition

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/hhgq1sg92wttazsllqsv5yaj2yvo2tfj KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/6q6vh9resic35esnczpipwse1b2nlnrc Reference/supplemental Materials]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]
* [https://caltech.box.com/s/33nf5yz3iuebm3fkhn303rhul1hpiwie Material Deposition Overview - Indium-Tin Oxide]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

===== Current Target Status =====
The following link will take you to a document which displays the current target configuration. This is updated after each time targets are rearranged.
* [https://caltech.box.com/s/zvvx785imo20hzngib5e1ck1uoipe6w6 Current target configuration]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-9 to 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with automatic sample transfer
* Substrate holder accepts 150 mm and 100 mm wafers, as well as small chips affixed via pressure clips
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Eight Magnetron sputter guns
** Seven confocally-oriented 2" guns (faces substrate at angle)
** One centrally-located 3" gun (directly faces substrate)
* Power Supplies:
** Three RF Supplies
*** One 100 W supply for substrate plasma generation
*** One 600 W
*** One 300 W, equipped with 3-position switch router which enables sequential switching between 3 connected magnetrons
** Two 1500 W DC
** One 2000 W pulsed DC
*** Equipped with a two-position switch router that enables sequential switching between two connected magnetrons
*** Frequency range: 1-100 kHz
*** This unit is ideal for reactively sputtering dielectrics from metal targets

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator|AJA Orion ATC Series Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Chalcogenide Sputter System

2026-03-19T19:30:05Z

Alexw: /* Electron Beam Evaporation Systems */

{{InstrumentInfoboxOneImage|
|InstrumentName = Chalcogenide Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Chalcogenide-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion chalcogenide sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load-lock for fast sample transfer. There are five magnetron guns, three 2" guns and two 3" guns. A total of three RF and one DC power supplies can be used on any of the five guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. Uniformity across a 6" wafer is <5% variation for the 2" guns and <1.5% for the 3" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to four materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during processing, allowing oxides and nitrides to be formed from pure metal targets. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate; this can be used as a surface cleaner & etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Deposition of metals, dielectrics, and other special elements
** For reactive synthesis of dielectric materials, the [[ATC Orion 8: Dielectric Sputter System | Orion 8 dielectric sputter system]] is better suited
** For sputtering materials such as Te, Bi, Se, and Sb
*** Cr, Mn, Ni, Co and Fe are excluded from this chamber
* Surface cleaning & in-situ plasma etch

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/nqpy11vmb3g2feo6km3qcpje52u181wc KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
** The chalcogenide and dielectric systems are extremely similar; Please see the SOP for some differences
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

== Specifications ==
===== Hardware Specifications =====
* Ultimate Base Pressure: 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with manual sample transfer system
* Substrate holder accepts 150 mm samples and smaller
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Five Magnetron sputter guns
** Three confocally-oriented 3" guns (faces substrate at angle)
** Two confocally-oriented 2" guns (faces substrate at angle)
* Power Supplies:
** Four RF Supplies
*** One 100 W supply for substrate bias
*** One 600 W
*** Two 300 W
** One 1500 W DC Supply
*** Equipped with 2two-position switch router that enables sequential switching between two connected magnetrons

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator|AJA Orion ATC Series Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Chalcogenide Sputter System

2026-03-19T19:29:31Z

Alexw: /* Applications */

{{InstrumentInfoboxOneImage|
|InstrumentName = Chalcogenide Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Chalcogenide-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion chalcogenide sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load-lock for fast sample transfer. There are five magnetron guns, three 2" guns and two 3" guns. A total of three RF and one DC power supplies can be used on any of the five guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. Uniformity across a 6" wafer is <5% variation for the 2" guns and <1.5% for the 3" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to four materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during processing, allowing oxides and nitrides to be formed from pure metal targets. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate; this can be used as a surface cleaner & etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Deposition of metals, dielectrics, and other special elements
** For reactive synthesis of dielectric materials, the [[ATC Orion 8: Dielectric Sputter System | Orion 8 dielectric sputter system]] is better suited
** For sputtering materials such as Te, Bi, Se, and Sb
*** Cr, Mn, Ni, Co and Fe are excluded from this chamber
* Surface cleaning & in-situ plasma etch

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/nqpy11vmb3g2feo6km3qcpje52u181wc KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
** The chalcogenide and dielectric systems are extremely similar; Please see the SOP for some differences
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

== Specifications ==
===== Hardware Specifications =====
* Ultimate Base Pressure: 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with manual sample transfer system
* Substrate holder accepts 150 mm samples and smaller
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Five Magnetron sputter guns
** Three confocally-oriented 3" guns (faces substrate at angle)
** Two confocally-oriented 2" guns (faces substrate at angle)
* Power Supplies:
** Four RF Supplies
*** One 100 W supply for substrate bias
*** One 600 W
*** Two 300 W
** One 1500 W DC Supply
*** Equipped with 2two-position switch router that enables sequential switching between two connected magnetrons

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Dielectric Sputter System

2026-03-19T19:28:53Z

Alexw: /* Applications */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Dielectric-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC, pulsed DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion dielectric sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load lock that allows for automatic sample transfer. There are eight magnetron guns, seven 2" guns, and one 3" gun. A total of two RF and three DC power supplies can be used on any of the eight guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. One of the DC guns is a pulsed DC supply. Uniformity across a 6" wafer is <5% variation for the 2" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to five materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during process, allowing oxides and nitrides to be formed from pure metal targets. The pulsed DC supply is ideally suited for such reactive processes where a dielectric material is synthesized. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate. This can be used as a surface cleaner, etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Metal and dielectric deposition. Allows ferromagnetics and diamagnetics.
* Surface cleaning & in-situ plasma etch
* Ion-Assisted Deposition

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/hhgq1sg92wttazsllqsv5yaj2yvo2tfj KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/6q6vh9resic35esnczpipwse1b2nlnrc Reference/supplemental Materials]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]
* [https://caltech.box.com/s/33nf5yz3iuebm3fkhn303rhul1hpiwie Material Deposition Overview - Indium-Tin Oxide]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

===== Current Target Status =====
The following link will take you to a document which displays the current target configuration. This is updated after each time targets are rearranged.
* [https://caltech.box.com/s/zvvx785imo20hzngib5e1ck1uoipe6w6 Current target configuration]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-9 to 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with automatic sample transfer
* Substrate holder accepts 150 mm and 100 mm wafers, as well as small chips affixed via pressure clips
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Eight Magnetron sputter guns
** Seven confocally-oriented 2" guns (faces substrate at angle)
** One centrally-located 3" gun (directly faces substrate)
* Power Supplies:
** Three RF Supplies
*** One 100 W supply for substrate plasma generation
*** One 600 W
*** One 300 W, equipped with 3-position switch router which enables sequential switching between 3 connected magnetrons
** Two 1500 W DC
** One 2000 W pulsed DC
*** Equipped with a two-position switch router that enables sequential switching between two connected magnetrons
*** Frequency range: 1-100 kHz
*** This unit is ideal for reactively sputtering dielectrics from metal targets

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

AJA Orion ATC Series Electron Beam Evaporator

2026-03-19T19:28:19Z

Alexw: /* Applications */

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne = PXL 20230728 000709710 (1).jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition. Allows ferromagnetics and diamagnetics
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/zygxa14nklirrtd6aw0fjdvqlggdyjh6 Standard Operating Procedures (SOP)]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Labline: Electron Beam Evaporator

2026-03-19T19:27:15Z

Alexw: /* Electron Beam Evaporation Systems */

{{InstrumentInfoboxOneImage|
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Model = Labline
|Techniques = E-beam Evaporation, Ion-Assisted Deposition (IAD),Ion Milling
|EmailList = kni-labline
|EmailListName = Labline
}}
== Description ==
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

===== Applications =====
* Metal deposition (Ti, Pt, Au, Al)
** Other materials may be available upon request with restrictions: metals such as Cr, Fe, Ni, Co are not available. If you wish to deposit these see the links to related systems on this page.
* Lift-off
* Non-selective etch
* Ion-assisted deposition (simultaneous etching & deposition)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)
* Accepts up to 1x 150mm wafer or smaller wafers/pieces

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[AJA Orion ATC Series Electron Beam Evaporator|AJA Orion ATC Series Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Labline: Electron Beam Evaporator

2026-03-19T19:25:55Z

Alexw: /* Applications */

{{InstrumentInfoboxOneImage|
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Model = Labline
|Techniques = E-beam Evaporation, Ion-Assisted Deposition (IAD),Ion Milling
|EmailList = kni-labline
|EmailListName = Labline
}}
== Description ==
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

===== Applications =====
* Metal deposition (Ti, Pt, Au, Al)
** Other materials may be available upon request with restrictions: metals such as Cr, Fe, Ni, Co are not available. If you wish to deposit these see the links to related systems on this page.
* Lift-off
* Non-selective etch
* Ion-assisted deposition (simultaneous etching & deposition)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)
* Accepts up to 1x 150mm wafer or smaller wafers/pieces

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Equipment List

2024-06-21T23:12:59Z

Alexw:

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions:''' [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2024-06-21T23:12:28Z

Alexw:

'''NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions.'''
* [[FBS Instructions | FBS Instructions]]

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]

* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- List of Chemicals Supplied by KNI with Safety Data Sheets

- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Digital Microscope Keyence VHX7000 | Digital Microscope and Camera: Keyence HVX-7000]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

AJA Orion ATC Series Electron Beam Evaporator

2024-04-26T00:47:32Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne = PXL 20230728 000709710 (1).jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/zygxa14nklirrtd6aw0fjdvqlggdyjh6 Standard Operating Procedures (SOP)]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

File:PXL 20230728 000709710 (1).jpg

2024-04-26T00:46:20Z

Alexw:

AJA Orion ATC Series Electron Beam Evaporator

2024-04-26T00:42:22Z

Alexw: /* Resources */

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/zygxa14nklirrtd6aw0fjdvqlggdyjh6 Standard Operating Procedures (SOP)]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

AJA Orion ATC Series Electron Beam Evaporator

2024-04-26T00:41:59Z

Alexw: /* SOPs & Troubleshooting */

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/zygxa14nklirrtd6aw0fjdvqlggdyjh6 Standard Operating Procedures (SOP)]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [linkgoeshere General System Operation]
* [linkgoeshere In-Situ Crucible Exchange]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Digital Microscope Keyence VHX7000

2023-12-15T19:52:12Z

Alexw: /* Manufacturer Manuals */

{{InstrumentInfoboxOneImage|
|InstrumentName = Keyence VHX-7000
|HeaderColor = #FFFFFF
|ImageOne = Keyence VHX-7000.jpg
|InstrumentType = [[Equipment_List#Metrology|Metrology]], [[Equipment_List#Optical Characterization|Optical Characterization]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1535
|PrimaryStaff = Bert Mendoza
|StaffEmail = bertm@caltech.edu
|StaffPhone = 626-395-4075
|Manufacturer = Keyence Corporation
|Model = VHX-7000
|Techniques = 2D/3D measurements Digital CameraHigh Magnification Inspection
}}
== Description ==
[[Image:Keyence VHX-7000 closeup.jpg|thumb|upright=1.12|Keyence Corporation model VHX-7000]]

The Keyence VHX Series 4K Digital Microscope uses high-resolution 4K imaging and advanced analysis software for high-magnification imaging, 2D/3D measurements, and more. The VHX Series has a depth of field that is 20 times greater than conventional optical microscopes. 2D and 3D measurements for roughness, contamination, grain size, and other measurements can be performed. The digital images can be saved in their original form or with measurements applied.

==== Objectives Available ====
* Low Magnification Lens = 20-100x
* Medium Magnification Lens = 100-500x
* High Magnification Lens = 500-2500x
* Highest Magnification Lens = 2500-6000x

== Resources ==

=== SOPs & Troubleshooting ===
* coming soon
=== Manufacturer Manuals ===
* [https://caltech.box.com/s/xoegl6wje7foaq65osiqei1bzwbwgwhv Keyence VHX-7000 Manual]

== Related Instrumentation in the KNI ==

=== Metrology ===
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

=== Optical Characterization ===
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]

=== Scanning Electron Microscopes (SEMs) ===
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]

=== Scanning Probe Microscopes ===
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]

AJA Orion ATC Series Electron Beam Evaporator

2023-11-22T01:14:22Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select AJA Orion E-Beam Evaporator from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/zygxa14nklirrtd6aw0fjdvqlggdyjh6 Standard Operating Procedures (SOP)]
* [linkgoeshere Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [linkgoeshere General System Operation]
* [linkgoeshere In-Situ Crucible Exchange]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

AJA Orion ATC Series Electron Beam Evaporator

2023-07-26T23:29:34Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select AJA Orion E-Beam Evaporator from the dropdown menu)

===== SOPs & Troubleshooting =====
* [linkgoeshere Standard Operating Procedures (SOP)]
* [linkgoeshere Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [linkgoeshere General System Operation]
* [linkgoeshere In-Situ Crucible Exchange]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

AJA Orion ATC Series Electron Beam Evaporator

2023-07-26T23:28:29Z

Alexw: /* Description */

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

===== Applications =====
* Metal deposition
* Semiconductor deposition (in-situ doping not possible)
* Oxide deposition
* Lift-off

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select AJA Orion E-Beam Evaporator from the dropdown menu)

===== SOPs & Troubleshooting =====
* [linkgoeshere Standard Operating Procedures (SOP)]
* [linkgoeshere Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [linkgoeshere General System Operation]
* [linkgoeshere In-Situ Crucible Exchange]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

AJA Orion ATC Series Electron Beam Evaporator

2023-07-26T23:04:41Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==
The AJA International ATC Orion Series system allows for programmable evaporation processes and a convenient ease of maintaining.

===== Applications =====
* Metal deposition
* Oxide deposition
* Lift-off

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select AJA Orion E-Beam Evaporator from the dropdown menu)

===== SOPs & Troubleshooting =====
* [linkgoeshere Standard Operating Procedures (SOP)]
* [linkgoeshere Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [linkgoeshere General System Operation]
* [linkgoeshere In-Situ Crucible Exchange]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

AJA Orion ATC Series Electron Beam Evaporator

2023-07-26T22:44:19Z

Alexw: Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = AJA Orion ATC Series Electron Beam Evaporator |HeaderColor = #F2682A |ImageOne = |ImageTwo = |InstrumentType = Deposition |RoomLocation = B235C Steele |LabPhone = 626-395-1539 |PrimaryStaff = Alex Wertheim |StaffEmail = alexw@caltech.edu |StaffPhone = 626-395-3371 |Manufacturer = AJA International |Model = ATC Orion |Techniques = E-beam Evaporation |EmailList = |EmailListName = }} == De..."

{{InstrumentInfoboxOneImage|
|InstrumentName = AJA Orion ATC Series Electron Beam Evaporator
|HeaderColor = #F2682A
|ImageOne =
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion
|Techniques = E-beam Evaporation
|EmailList =
|EmailListName =
}}
== Description ==

===== Applications =====
* Metal deposition
* Oxide deposition
* Lift-off

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select AJA Orion E-Beam Evaporator from the dropdown menu)

===== SOPs & Troubleshooting =====
* [linkgoeshere KNI SOP]
* [linkgoeshere Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [linkgoeshere General System Operation]
* [linkgoeshere In-Situ Crucible Exchange]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: <5E-9 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with automatic wafer transfer
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
** Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
* Accepts up to 1x 150mm wafer or smaller wafers/pieces
* Optional lift-off dome holds 4x 100mm wafers for batch processing
* Camera for E-Beam/Crucible observation during process
* Inficon CrystalSix(TM)
** 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
* Programmable deposition processes

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Equipment List

2023-07-26T22:13:29Z

Alexw: /* Evaporation */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]]

===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- Chemicals Supplied by KNI

- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2023-07-26T22:12:18Z

Alexw:

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- Chemicals Supplied by KNI

- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Nanoscribe PPGT: Microscale 3D Printer

2022-07-26T18:33:16Z

Alexw:

{{InstrumentInfobox|
|InstrumentName = Photonic Professional GT
|HeaderColor = #FFFFFF
|ImageOne = Geodesic-Domes_Xiaoxing-Xia.jpg
|ImageTwo = Nanoscribe-PPGT.jpg
|InstrumentType = [[Equipment_List#Photolithography|Photolithography]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Nanoscribe
|Model = PPGT
|Techniques = Two-Photon Lithography (Optical 3D printing)
|RequestTraining = alexw@caltech.edu
|EmailList = kni-nanoscribe
|EmailListName = Nanoscribe
}}
== Description ==
The Nanoscribe Photonic Professional GT (PPGT) is a high-precision microscale 3D printer that utilizes two-photon polymerization of various photoresists. The PPGT uses its own scripting environment to control a wide variety of writing parameters and to define points and paths to be written in the chosen resist. While many resists can theoretically be used, Nanoscribe has its own specially-formulated resins optimized for their two-photon lithography system. Writing at different length scales and resolutions can be optimized by choosing the appropriate resin. The software also includes slicing capability so that CAD files in STL format can be converted to a tool path much like what is found in common FDM 3D printers. Writing can be performed across areas as large as 100 mm x 100 mm, with features approximately as small as 200 nm x 500 nm, and can be viewed in real time during the writing process.

===== Applications =====
* Micro/mesoscale Optical 3D Printing
* Maskless 2D Lithography

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Nanoscribe from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/poquw902yg9epv65pibqpat7zzoq7htq KNI SOP]

===== Scheduling Policy =====
* [https://caltech.box.com/s/tzu3ugpyh793s5itqb2ci0yd07ezbul9 Scheduling Policy]

== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Optical Lithography Resources]]

Nanoscribe PPGT: Microscale 3D Printer

2022-07-26T00:02:02Z

Alexw: /* Resources */

{{InstrumentInfobox|
|InstrumentName = Photonic Professional GT
|HeaderColor = #FFFFFF
|ImageOne = Geodesic-Domes_Xiaoxing-Xia.jpg
|ImageTwo = Nanoscribe-PPGT.jpg
|InstrumentType = [[Equipment_List#Photolithography|Photolithography]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Nanoscribe
|Model = PPGT
|Techniques = Two-Photon Lithography (Optical 3D printing)
|RequestTraining = alexw@caltech.edu
|EmailList = kni-nanoscribe
|EmailListName = Nanoscribe
}}
== Description ==
The Nanoscribe Photonic Professional GT (PPGT) is a high-precision microscale 3D printer that utilizes two-photon polymerization of various photoresists. The PPGT uses its own scripting environment to control a wide variety of writing parameters and to define points and paths to be written in the chosen resist. While many resists can theoretically be used, Nanoscribe has its own specially-formulated resins optimized for their two-photon lithography system. Writing at different length scales and resolutions can be optimized by choosing the appropriate resin. The software also includes slicing capability so that CAD files in STL format can be converted to a tool path much like what is found in common FDM 3D printers. Writing can be performed across areas as large as 100 mm x 100 mm, with features approximately as small as 200 nm x 500 nm, and can be viewed in real time during the writing process.

===== Applications =====
* Micro/mesoscale Optical 3D Printing
* Maskless 2D Lithography

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Nanoscribe from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/poquw902yg9epv65pibqpat7zzoq7htq KNI SOP]

===== Scheduling Policy =====
* [https://caltech.box.com/s/0v5c2wp57a65w6zlayxttsflcify16y4 Scheduling Policy]

== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Optical Lithography Resources]]

ATC Orion 8: Dielectric Sputter System

2021-04-09T00:12:13Z

Alexw: /* Process Recipes */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Dielectric-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC, pulsed DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion dielectric sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load lock that allows for automatic sample transfer. There are eight magnetron guns, seven 2" guns, and one 3" gun. A total of two RF and three DC power supplies can be used on any of the eight guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. One of the DC guns is a pulsed DC supply. Uniformity across a 6" wafer is <5% variation for the 2" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to five materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during process, allowing oxides and nitrides to be formed from pure metal targets. The pulsed DC supply is ideally suited for such reactive processes where a dielectric material is synthesized. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate. This can be used as a surface cleaner, etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Metal and dielectric deposition
* Surface cleaning & in-situ plasma etch
* Ion-Assisted Deposition

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/lul90odaqj4rp9inb6qt2mft2ean0qqa Deposition Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/hhgq1sg92wttazsllqsv5yaj2yvo2tfj KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/6q6vh9resic35esnczpipwse1b2nlnrc Reference/supplemental Materials]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]
* [https://caltech.box.com/s/33nf5yz3iuebm3fkhn303rhul1hpiwie Material Deposition Overview - Indium-Tin Oxide]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

===== Current Target Status =====
The following link will take you to a document which displays the current target configuration. This is updated after each time targets are rearranged.
* [https://caltech.box.com/s/zvvx785imo20hzngib5e1ck1uoipe6w6 Current target configuration]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-9 to 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with automatic sample transfer
* Substrate holder accepts 150 mm and 100 mm wafers, as well as small chips affixed via pressure clips
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Eight Magnetron sputter guns
** Seven confocally-oriented 2" guns (faces substrate at angle)
** One centrally-located 3" gun (directly faces substrate)
* Power Supplies:
** Three RF Supplies
*** One 100 W supply for substrate plasma generation
*** One 600 W
*** One 300 W, equipped with 3-position switch router which enables sequential switching between 3 connected magnetrons
** Two 1500 W DC
** One 2000 W pulsed DC
*** Equipped with a two-position switch router that enables sequential switching between two connected magnetrons
*** Frequency range: 1-100 kHz
*** This unit is ideal for reactively sputtering dielectrics from metal targets

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Labline: Electron Beam Evaporator

2021-01-04T22:24:50Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Model = Labline
|Techniques = E-beam Evaporation, Ion-Assisted Deposition (IAD),Ion Milling
|EmailList = kni-labline
|EmailListName = Labline
}}
== Description ==
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

===== Applications =====
* Metal deposition (Ti, Pt, Au, Al)
* Lift-off
* Non-selective etch
* Ion-assisted deposition (simultaneous etching & deposition)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/lul90odaqj4rp9inb6qt2mft2ean0qqa Deposition Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)
* Accepts up to 1x 150mm wafer or smaller wafers/pieces

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Chalcogenide Sputter System

2020-12-09T03:08:07Z

Alexw: /* Video Tutorials */

{{InstrumentInfoboxOneImage|
|InstrumentName = Chalcogenide Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Chalcogenide-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion chalcogenide sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load-lock for fast sample transfer. There are five magnetron guns, three 2" guns and two 3" guns. A total of three RF and one DC power supplies can be used on any of the five guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. Uniformity across a 6" wafer is <5% variation for the 2" guns and <1.5% for the 3" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to four materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during processing, allowing oxides and nitrides to be formed from pure metal targets. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate; this can be used as a surface cleaner & etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Deposition of metals, dielectrics, and other special elements
** For reactive synthesis of dielectric materials, the [[ATC Orion 8: Dielectric Sputter System | Orion 8 dielectric sputter system]] is better suited
** For sputtering materials such as Te, Bi, Se, and Sb
*** Cr, Mn, Ni, and Fe are excluded from this chamber
* Surface cleaning & in-situ plasma etch

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/lul90odaqj4rp9inb6qt2mft2ean0qqa Deposition Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/nqpy11vmb3g2feo6km3qcpje52u181wc KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
** The chalcogenide and dielectric systems are extremely similar; Please see the SOP for some differences
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

== Specifications ==
===== Hardware Specifications =====
* Ultimate Base Pressure: 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with manual sample transfer system
* Substrate holder accepts 150 mm samples and smaller
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Five Magnetron sputter guns
** Three confocally-oriented 3" guns (faces substrate at angle)
** Two confocally-oriented 2" guns (faces substrate at angle)
* Power Supplies:
** Four RF Supplies
*** One 100 W supply for substrate bias
*** One 600 W
*** Two 300 W
** One 1500 W DC Supply
*** Equipped with 2two-position switch router that enables sequential switching between two connected magnetrons

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Dielectric Sputter System

2020-12-09T03:05:55Z

Alexw: /* Video Tutorials */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Dielectric-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC, pulsed DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion dielectric sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load lock that allows for automatic sample transfer. There are eight magnetron guns, seven 2" guns, and one 3" gun. A total of two RF and three DC power supplies can be used on any of the eight guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. One of the DC guns is a pulsed DC supply. Uniformity across a 6" wafer is <5% variation for the 2" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to five materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during process, allowing oxides and nitrides to be formed from pure metal targets. The pulsed DC supply is ideally suited for such reactive processes where a dielectric material is synthesized. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate. This can be used as a surface cleaner, etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Metal and dielectric deposition
* Surface cleaning & in-situ plasma etch
* Ion-Assisted Deposition

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/lul90odaqj4rp9inb6qt2mft2ean0qqa Deposition Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/hhgq1sg92wttazsllqsv5yaj2yvo2tfj KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/6q6vh9resic35esnczpipwse1b2nlnrc Reference/supplemental Materials]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
* [https://youtu.be/FlSFfF8C6WQ Advanced Layer Creation - Part 1]
* [https://youtu.be/Ymb-mZGOjgw Advanced Layer Creation - Part 2]

===== Current Target Status =====
The following link will take you to a document which displays the current target configuration. This is updated after each time targets are rearranged.
* [https://caltech.box.com/s/zvvx785imo20hzngib5e1ck1uoipe6w6 Current target configuration]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-9 to 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with automatic sample transfer
* Substrate holder accepts 150 mm and 100 mm wafers, as well as small chips affixed via pressure clips
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Eight Magnetron sputter guns
** Seven confocally-oriented 2" guns (faces substrate at angle)
** One centrally-located 3" gun (directly faces substrate)
* Power Supplies:
** Three RF Supplies
*** One 100 W supply for substrate plasma generation
*** One 600 W
*** One 300 W, equipped with 3-position switch router which enables sequential switching between 3 connected magnetrons
** Two 1500 W DC
** One 2000 W pulsed DC
*** Equipped with a two-position switch router that enables sequential switching between two connected magnetrons
*** Frequency range: 1-100 kHz
*** This unit is ideal for reactively sputtering dielectrics from metal targets

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Labline: Electron Beam Evaporator

2020-10-13T17:39:32Z

Alexw: /* Video Tutorials */

{{InstrumentInfoboxOneImage|
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Model = Labline
|Techniques = E-beam Evaporation, Ion-Assisted Deposition (IAD),Ion Milling
|EmailList = kni-labline
|EmailListName = Labline
}}
== Description ==
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

===== Applications =====
* Metal deposition (Ti, Pt, Au, Al)
* Lift-off
* Non-selective etch
* Ion-assisted deposition (simultaneous etching & deposition)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/lul90odaqj4rp9inb6qt2mft2ean0qqa Deposition Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ORION NanoFab: Helium, Neon & Gallium FIB

2020-10-13T17:31:14Z

Alexw: /* Video Tutorials */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = derose@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/ls0irl1ocme9pmqili2vxurgqo7050d9 SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild & Trimer Formation Guide]
* [https://caltech.box.com/s/s0zbkyct23o0fxmzpzhrymaz1g82s68d Troubleshooting Guide]

===== Process Recipes =====
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
* [https://youtu.be/tWhyT3Rq_k8 Getting Started] | [https://youtu.be/lxFGaZSvgP0 Introduction to GFIS Parameters (He- & Ne-FIB)]
* [https://youtu.be/elS3FBC7o3g Sample Load & Transfer]
* [https://youtu.be/nxjpI7CUdOc GFIS Alignments (He- & Ne-FIB)]
* [https://youtu.be/r4jcT6HuApk Using the Electron Flood Gun for Charge Compensation]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there] (recorded for SEM, same principles apply here)
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]) (recorded on SEM/Ga-FIB)
* Preparing a Trimer ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL 7-Part Playlist] | [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Written Guide])
* [https://youtu.be/L4ipEtoQC9c How to Remove Adatoms and Recover Your Trimer]

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/2f5semkplrho29lgugdjigroh0jip97h Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM & FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Dimension Icon: Atomic Force Microscope (AFM)

2020-09-10T01:04:22Z

Alexw: /* Video Tutorials */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dimension Icon AFM
|HeaderColor = #F5A81C
|ImageOne = Dimension-Icon-AFM.jpg
|ImageTwo = Dimension-Icon-AFM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203B Steele
|LabPhone = 626-395-1545
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Bruker
|Model = Dimension Icon
|Techniques = PeakForce Tapping Mode, Tapping Mode, Contact Mode, Quantitative NanoMechanics, Piezoresponse Force Microscopy, Magnetic Force Microscopy, Electrostatic Force Microscopy
|RequestTraining = derose@caltech.edu
|EmailList = kni-afm
|EmailListName = AFM
}}
== Description ==
An AFM measures a sample's topographic and other surface information by interacting a nanoscale probe with the sample. The Dimension Icon offers three main interaction modes: (1) PeakForce Tapping Mode, which operates in conjunction with Bruker's ScanAsyst® to allow the software to automatically optimize several imaging parameters for high-quality, relatively easily-obtained images; with tapping oscillations of 0.25 to 2.0 kHz, it is also capable of capturing a force curve at each pixel in order to facilitate extraction of mechanical property data using the Quantitative NanoMechanics (QNM) software package; (2) Tapping Mode, a more traditional tapping interaction that operates near the probe cantilever's resonant frequency (usually 10s to 100s of kHz) to provide topographic and phase imaging; (3) Contact Mode, for direct, constant contact between the probe and surface, which is necessary for several other surface measurement techniques.

===== Applications =====
* Topographic imaging of surface features ranging from sub-nm to several microns in height
* Roughness measurements resulting from sub-nm Z resolution
* Phase imaging to qualitatively identify different phases of material by their surface properties
* Quantitative NanoMechanics (QNM) to extract material property data from force curves (e.g. elastic modulus, adhesion, energy dissipation)
* Piezoresponse Force Microscopy (PFM)
* Magnetic Force Microscopy (MFM) using Lift Mode
* Electrostatic Force Microscopy (EFM) using Lift Mode
* Surface Potential measurements
* Measurements in liquid environments are possible
* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

== Resources ==
===== SOPs & Troubleshooting =====
* PeakForce Tapping & Tapping Mode SOPs ([https://caltech.box.com/s/d7wtme94vifmfzgqgr0t4sou2rb66n4y Short Version] | [https://caltech.box.com/s/izpbyf7udhjbm24vz9z20swi516wzaky Long Version])
* [https://caltech.box.com/s/74auo2yullutbcmnp3u1osjl4l4vwjpl Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/HIaTe0Bb5xs Part 1: Setting up an Experiment & Aligning the Scanner]
* [https://youtu.be/Oq8djKI8gHM Part 2: Navigating to Sample & Explanation of Scanning Parameters]
* [https://youtu.be/1lEmg0p_uaw Part 3: Basics of Scanning & Using Analysis Software]
* [https://youtu.be/0SYBS5gQTM0 Extras: Probe & Scanner Mounting]

===== Technical Notes =====
* [https://caltech.box.com/s/mljbcq17wcwxvye53k59p9oajxa4zj3y Introduction to Bruker's ScanAsyst and PeakForce Tapping AFM Technology]

===== Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Bruker's presentation on Quantitative NanoMechanics (QNM)]

===== Analysis Software =====
* [ftp://anonymous@sboftp.bruker-nano.com/outgoing/GPTech/Software/NanoScope_Analysis_x86_v190r1sr2.exe Download & Install Bruker's Analysis Software for free]
* [http://gwyddion.net/ Install free Gwyddion Software] as an alternative to Bruker's own Analysis Software

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/d1xa73nzilukfok7yn38zub0yziv4pq6 Bruker Dimension Icon Instruction Manual] (Scanning Software)
* [https://caltech.box.com/s/7ui5b0tcymyhm2xzjmmwecmpgppm1oec Bruker NanoScope Analysis V150 Manual] (Analysis Software)

===== Order Your Own Probes =====
* Probes are considered consumable items that users users are responsible for investigating and purchasing themselves. ScanAsyst-Air probes are commonly used with PeakForce Tapping Mode for topographic imaging, while the selection of Tapping Mode probes relies on a number of factors related to your sample. See [http://www.brukerafmprobes.com Bruker's "Easy Product Wizard,"] for example, for some probe selection guidance.

===== Using Standard Samples =====
[[File:Bruker-AFM-Standard-Samples.jpg|thumb|right|300px|Use standard samples to help calibrate the microscope and to troubleshoot problems related to scanning and the probe]]

* Note that in order to troubleshoot scanning problems (e.g. to determine if the problem has to do with the sample, the probe, or the microscope itself), it can be helpful to scan a standard sample. The standards are located in a case underneath the AFM desk. These are the three most recommended standards; typically choose the one that is closest to your own sample:
#'''Surface Topography Reference (VGRP-15M):''' Features are 6x6 μm wide, on a 10 μm pitch, and etched 180 nm deep into SiO2. This works well to check the accuracy and morphology of step heights, and is used to periodically recalibrate the Z dimension of the AFM scanner. Note that while it does not necessarily do a good job of predicting the behavior of scans that look at features on a scale that is an order-of-magnitude or two smaller (e.g. measuring 2D material step heights), if this 180 nm calibration is within an error of less than 1%, then you can be generally confident in your small-scale scans. Consider using – or devising – a 2D material standard as a check on your own 2D material scans to be assured of accuracy.
#'''SAPPHIRE-12M" Sample (#5 in PFQNM-SMPKIT-12M Box 2/2):''' Has an Rq roughness (aka RMS roughness) on the order of 1 nm. This can be used to check the microscope performance on very flat samples, e.g. 2D materials step heights or substrate roughness. Since this is a very hard sample, consider lowering your engage force setpoint to avoid blunting your tip upon making contact (e.g. to 0.03 V or lower for the Peakforce Engage Setpoint).
#'''RS-12M Titanium Roughness Sample (#6 in PFQNM-SMPKIT-12M Box 2/2):''' Has Rq roughness of about 30 nm and can be used generally to check that you are getting good topography scans on features ranging from 10s to 100s of nm.

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/7jldvrco0pymuxkluxhe8s3enkl8tcag Dimension Icon Product Guide & Data Sheet]

===== AFM Specifications =====
* Minimum Feature Size Resolved, Z: ~0.1 nm
* Minimum Feature Size Resolved, X & Y: ~2 nm
* X & Y scan range: 90 μm x 90 μm
* Z scan range: up to 10 μm
* Z noise floor: <30 pm RMS in appropriate environment (imaging bandwidth up to 625 Hz)
* Z sensor noise level(closed-loop): 35 pm RMS (imaging bandwidth up to 625 Hz); 50 pm RMS force curve bandwidth (0.1 Hz to 5 kHz)
* X & Y position noise (closed-loop): ≤0.15 nm RMS (imaging bandwidth up to 625 Hz)
* X & Y position noise (open-loop): ≤0.10 nm RMS (imaging bandwidth up to 625 Hz)
* Integral nonlinearity (X-Y-Z): <0.5%
* Sample Size: ≤210 mm diameter, ≤15 mm thick
* Motorized position stage (X-Y axis): 180 mm × 150 mm inspectable area; 2 μm repeatability, unidirectional; 3 μm repeatability, bidirectional
* Microscope optics: 5-megapixel digital camera; 180 μm to 1465 μm viewing area; Digital zoom and motorized focus
 
 
== Related Instrumentation in the KNI ==
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]
===== Sample Preparation for Microscopy =====
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
===== Scanning Electron & Ion Microscopes =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]

ATC Orion 8: Chalcogenide Sputter System

2020-06-25T22:53:06Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = Chalcogenide Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Chalcogenide-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion chalcogenide sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load-lock for fast sample transfer. There are five magnetron guns, three 2" guns and two 3" guns. A total of three RF and one DC power supplies can be used on any of the five guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. Uniformity across a 6" wafer is <5% variation for the 2" guns and <1.5% for the 3" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to four materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during processing, allowing oxides and nitrides to be formed from pure metal targets. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate; this can be used as a surface cleaner & etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Deposition of metals, dielectrics, and other special elements
** For reactive synthesis of dielectric materials, the [[ATC Orion 8: Dielectric Sputter System | Orion 8 dielectric sputter system]] is better suited
** For sputtering materials such as Te, Bi, Se, and Sb
*** Cr, Mn, Ni, and Fe are excluded from this chamber
* Surface cleaning & in-situ plasma etch

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/nqpy11vmb3g2feo6km3qcpje52u181wc KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
** The chalcogenide and dielectric systems are extremely similar; Please see the SOP for some differences

== Specifications ==
===== Hardware Specifications =====
* Ultimate Base Pressure: 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with manual sample transfer system
* Substrate holder accepts 150 mm samples and smaller
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Five Magnetron sputter guns
** Three confocally-oriented 3" guns (faces substrate at angle)
** Two confocally-oriented 2" guns (faces substrate at angle)
* Power Supplies:
** Four RF Supplies
*** One 100 W supply for substrate bias
*** One 600 W
*** Two 300 W
** One 1500 W DC Supply
*** Equipped with 2two-position switch router that enables sequential switching between two connected magnetrons

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Dielectric Sputter System

2020-06-25T22:52:27Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Dielectric-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC, pulsed DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion dielectric sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load lock that allows for automatic sample transfer. There are eight magnetron guns, seven 2" guns, and one 3" gun. A total of two RF and three DC power supplies can be used on any of the eight guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. One of the DC guns is a pulsed DC supply. Uniformity across a 6" wafer is <5% variation for the 2" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to five materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during process, allowing oxides and nitrides to be formed from pure metal targets. The pulsed DC supply is ideally suited for such reactive processes where a dielectric material is synthesized. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate. This can be used as a surface cleaner, etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Metal and dielectric deposition
* Surface cleaning & in-situ plasma etch
* Ion-Assisted Deposition

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/hhgq1sg92wttazsllqsv5yaj2yvo2tfj KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/6q6vh9resic35esnczpipwse1b2nlnrc Reference/supplemental Materials]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 12 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 7 || 24 || 24
|}

===== Process Recipes =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]

===== Current Target Status =====
The following link will take you to a document which displays the current target configuration. This is updated after each time targets are rearranged.
* [https://caltech.box.com/s/zvvx785imo20hzngib5e1ck1uoipe6w6 Current target configuration]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-9 to 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with automatic sample transfer
* Substrate holder accepts 150 mm and 100 mm wafers, as well as small chips affixed via pressure clips
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Eight Magnetron sputter guns
** Seven confocally-oriented 2" guns (faces substrate at angle)
** One centrally-located 3" gun (directly faces substrate)
* Power Supplies:
** Three RF Supplies
*** One 100 W supply for substrate plasma generation
*** One 600 W
*** One 300 W, equipped with 3-position switch router which enables sequential switching between 3 connected magnetrons
** Two 1500 W DC
** One 2000 W pulsed DC
*** Equipped with a two-position switch router that enables sequential switching between two connected magnetrons
*** Frequency range: 1-100 kHz
*** This unit is ideal for reactively sputtering dielectrics from metal targets

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Labline: Electron Beam Evaporator

2020-06-25T22:51:03Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Model = Labline
|Techniques = E-beam Evaporation, Ion-Assisted Deposition (IAD),Ion Milling
|EmailList = kni-labline
|EmailListName = Labline
}}
== Description ==
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

===== Applications =====
* Metal deposition (Ti, Pt, Au, Al)
* Lift-off
* Non-selective etch
* Ion-assisted deposition (simultaneous etching & deposition)

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

CHA: Electron Beam Evaporator

2020-06-25T22:47:57Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = CHA Evaporator
|HeaderColor = #F2682A
|ImageOne = CHA-Industries-Mark-40_E-Beam-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = CHA Industries
|Model = Mark 40
|Techniques = E-beam Evaporation
|EmailList = kni-cha
|EmailListName = E-beam Evaporator
}}
== Description ==
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.

===== Applications =====
* Metal & Oxide Deposition
* Lift-off
* Etch Hard-mask Formation

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP]
* [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide]
* [https://caltech.box.com/s/qp616ky1g083wqfeb1nokp4jtnqjifkc QCM Crystal Sensor Replacement Instructions]
* [https://caltech.box.com/s/e0oelbvt8cj4fg9bemitidnwee068qrn E-beam Process Maintenance Guide]
* [https://caltech.box.com/s/0ulhxthe9i465bpzinugiiefmfy6t0rb Materials Filling and Crucible Swap Instructions]
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 12
|-
| Weeknight || 7 || 12 || 12
|-
| Weekend || 14 || 12 || 12
|}

===== Video Tutorials =====
* [https://youtu.be/4K75m4V0Lq4 CHA Training]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-6 to 1E-7 Torr
* All dry pumping system (cryo & dry mechanical pump)
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

CHA: Electron Beam Evaporator

2020-06-25T22:46:52Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = CHA Evaporator
|HeaderColor = #F2682A
|ImageOne = CHA-Industries-Mark-40_E-Beam-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = CHA Industries
|Model = Mark 40
|Techniques = E-beam Evaporation
|EmailList = kni-cha
|EmailListName = E-beam Evaporator
}}
== Description ==
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.

===== Applications =====
* Metal & Oxide Deposition
* Lift-off
* Etch Hard-mask Formation

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP]
* [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide]
* [https://caltech.box.com/s/qp616ky1g083wqfeb1nokp4jtnqjifkc QCM Crystal Sensor Replacement Instructions]
* [https://caltech.box.com/s/e0oelbvt8cj4fg9bemitidnwee068qrn E-beam Process Maintenance Guide]
* [https://caltech.box.com/s/0ulhxthe9i465bpzinugiiefmfy6t0rb Materials Filling and Crucible Swap Instructions]
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! _ !! Advanced Reservation (days) !!! Limit per Reservation (hrs) !!!! Limit per week (hrs)
|-
| Weekday || 7 ||| 6 |||| 12
|-
| Weeknight || 7 ||| 12 |||| 12
|-
| Weekend || 14 ||| 12 |||| 12
|}

===== Video Tutorials =====
* [https://youtu.be/4K75m4V0Lq4 CHA Training]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-6 to 1E-7 Torr
* All dry pumping system (cryo & dry mechanical pump)
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

CHA: Electron Beam Evaporator

2020-06-25T22:46:00Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = CHA Evaporator
|HeaderColor = #F2682A
|ImageOne = CHA-Industries-Mark-40_E-Beam-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = CHA Industries
|Model = Mark 40
|Techniques = E-beam Evaporation
|EmailList = kni-cha
|EmailListName = E-beam Evaporator
}}
== Description ==
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.

===== Applications =====
* Metal & Oxide Deposition
* Lift-off
* Etch Hard-mask Formation

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP]
* [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide]
* [https://caltech.box.com/s/qp616ky1g083wqfeb1nokp4jtnqjifkc QCM Crystal Sensor Replacement Instructions]
* [https://caltech.box.com/s/e0oelbvt8cj4fg9bemitidnwee068qrn E-beam Process Maintenance Guide]
* [https://caltech.box.com/s/0ulhxthe9i465bpzinugiiefmfy6t0rb Materials Filling and Crucible Swap Instructions]
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.

=== Tool Reservation Rules ===
{| class="wikitable"
|-
! !! Advanced Reservation (days) !!! Limit per Reservation (hrs) !!!! Limit per week (hrs)
|-
| Weekday || 7 ||| 6 |||| 12
|-
| Weeknight || 7 ||| 12 |||| 12
|-
| Weekend || 14 ||| 12 |||| 12
|}

===== Video Tutorials =====
* [https://youtu.be/4K75m4V0Lq4 CHA Training]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-6 to 1E-7 Torr
* All dry pumping system (cryo & dry mechanical pump)
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Process Recipe Library

2020-03-31T23:48:49Z

Alexw: /* Optical Lithography */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.app.box.com/file/634677863695 ma-N Chrome Mask Writing/Etching Recipe]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist Recipe]
* [https://caltech.box.com/s/sq7yuzpfhuanmsrs4nswk5t05vt3adk9 Suss Mask Aligner - Double Side Alignment using AZ5214 Resist]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist Recipe]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/zpnz9i72rrzn2jzfn2gxd8cf0yw19uig NR9-1000PY Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist Recipe]
* [https://caltech.app.box.com/file/634671303816 SU-8 Photoresist Recipe]
* [https://caltech.box.com/s/3bw1oifk4uysj4ehmyeivhngmkpt0r4p Lift-Off with LOR7B & S1805 Photoresist Recipe]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/40kaaqur8ohyg55uq2pv3jqrzlgi98ts Comparison of Pseudo-Bosch ICP-RIE Etch of SiO2-SiNx]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
** [https://caltech.box.com/s/lhaweqbefmep8n79u4nvynsv0cjctuc1 Process Recipe for TEM Lamella prep for Thin Films on Si Substrates]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Thermal Processing ==
===== Wet Oxidation =====
* [https://caltech.box.com/s/nqiiqwlhip4dcult2mtuvvdlxw0gv086 Wet Oxidation at 1000C on Tystar Tube Furnaces]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Process Recipe Library

2020-03-31T23:47:07Z

Alexw: /* Optical Lithography */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.app.box.com/file/634677863695 ma-N Chrome Mask Writing/Etching Recipe]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist Recipe]
* [https://caltech.box.com/s/sq7yuzpfhuanmsrs4nswk5t05vt3adk9 Suss Mask Aligner - Double Side Alignment using AZ5214 Resist]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist Recipe]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/zpnz9i72rrzn2jzfn2gxd8cf0yw19uig NR9-1000PY Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist Recipe]
* [https://caltech.app.box.com/file/634671303816 SU-8 Photoresist Recipe]
* [https://caltech.box.com/s/3bw1oifk4uysj4ehmyeivhngmkpt0r4p LOR7B & S1805 Photoresist Stack Recipe]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/40kaaqur8ohyg55uq2pv3jqrzlgi98ts Comparison of Pseudo-Bosch ICP-RIE Etch of SiO2-SiNx]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
** [https://caltech.box.com/s/lhaweqbefmep8n79u4nvynsv0cjctuc1 Process Recipe for TEM Lamella prep for Thin Films on Si Substrates]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Thermal Processing ==
===== Wet Oxidation =====
* [https://caltech.box.com/s/nqiiqwlhip4dcult2mtuvvdlxw0gv086 Wet Oxidation at 1000C on Tystar Tube Furnaces]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

Spectroscopic Ellipsometer

2020-03-30T23:48:12Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = M-2000 Spectroscopic Ellipsometer
|HeaderColor = #F5A81C
|ImageOne = M-2000-Ellipsometer.jpg
|ImageTwo = M-2000-Ellipsometer.jpg
|InstrumentType = [[Equipment_List#Optical Characterization|Optical Characterization]], [[Equipment_List#Metrology|Metrology]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = J.A. Woolam Company
|Model = M-2000
|Techniques = Ellipsometry
|EmailList = kni-metrology
|EmailListName = Metrology
}}
== Description ==
The J.A. Woolam M-2000 spectroscopic ellipsometer is a tool for optical thin film analysis that enables determination of thickness, optical constants ''n'' and ''k'' (refractive index and absorption coefficient), and allows modeling of electronic characteristics such as majority carrier concentration and band-gap. The beam incidence angle ranges from 45-90°, allowing both standard ellipsometry and transmission measurements. It is equipped with a motorized sample stage that enables wafer-scale measurements. The CompleteEASE control and analysis software possesses detailed measurement and modeling capability.
===== Applications =====
* Thickness measurement
* Optical & electronic property analysis
* Surface roughness measurement
* Materials identification

== Resources ==
===== SOP =====
* [https://caltech.box.com/s/jeu08iii0khpxbhuwvaiow3vvyix8t4m KNI SOP]
===== Video Tutorials =====
* Ellipsometry & CompleteEASE:
** [https://youtu.be/M4jGUP-883U Part 1: Fitting basics for transparent films]
** [https://youtu.be/54w-i0R4SMA Part 2: Transparent polymers]
** [https://youtu.be/l6-uTJ-V3EU Part 3: Absorbing Films via B-Spline]
** [https://youtu.be/grQ1izdiT4A Part 4: Modeling Absorption with Oscillators]
** [https://youtu.be/EY7wKNnstMw Part 5: Thickness Measurement of Metals]

== Specifications ==
===== Hardware Specifications =====
* CompleteEASE measurement and analysis software
* Spectral Range: 370-1000 nm
* Motorized stage enables automated mapping scans across up to 100 mm wafers
* Automatic measurement angle control
* Automatic sample alignment
* 2 mm spot size
** Removable beam focusing probes can reduce spot size to 300 μm

Spectroscopic Ellipsometer

2020-03-30T23:36:42Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = M-2000 Spectroscopic Ellipsometer
|HeaderColor = #F5A81C
|ImageOne = M-2000-Ellipsometer.jpg
|ImageTwo = M-2000-Ellipsometer.jpg
|InstrumentType = [[Equipment_List#Optical Characterization|Optical Characterization]], [[Equipment_List#Metrology|Metrology]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = J.A. Woolam Company
|Model = M-2000
|Techniques = Ellipsometry
|EmailList = kni-metrology
|EmailListName = Metrology
}}
== Description ==
The J.A. Woolam M-2000 spectroscopic ellipsometer is a tool for optical thin film analysis that enables determination of thickness, optical constants ''n'' and ''k'' (refractive index and absorption coefficient), and allows modeling of electronic characteristics such as majority carrier concentration and band-gap. The beam incidence angle ranges from 45-90°, allowing both standard ellipsometry and transmission measurements. It is equipped with a motorized sample stage that enables wafer-scale measurements. The CompleteEASE control and analysis software possesses detailed measurement and modeling capability.
===== Applications =====
* Thickness measurement
* Optical & electronic property analysis
* Surface roughness measurement
* Materials identification

== Resources ==
===== SOP =====
* [https://caltech.box.com/s/jeu08iii0khpxbhuwvaiow3vvyix8t4m KNI SOP]
===== Video Tutorials =====
* Ellipsometry & CompleteEASE:
** [https://youtu.be/M4jGUP-883U Part 1: Fitting basics for transparent films]
** [https://youtu.be/54w-i0R4SMA Part 2: Transparent polymers]
** [https://youtu.be/l6-uTJ-V3EU Part 3: Absorbing Films via B-Spline]
** [https://youtu.be/grQ1izdiT4A Part 4: Modeling Absorption with Oscillators]

== Specifications ==
===== Hardware Specifications =====
* CompleteEASE measurement and analysis software
* Spectral Range: 370-1000 nm
* Motorized stage enables automated mapping scans across up to 100 mm wafers
* Automatic measurement angle control
* Automatic sample alignment
* 2 mm spot size
** Removable beam focusing probes can reduce spot size to 300 μm

CHA: Electron Beam Evaporator

2020-03-24T02:35:14Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = CHA Evaporator
|HeaderColor = #F2682A
|ImageOne = CHA-Industries-Mark-40_E-Beam-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = CHA Industries
|Model = Mark 40
|Techniques = E-beam Evaporation
|EmailList = kni-cha
|EmailListName = E-beam Evaporator
}}
== Description ==
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.

===== Applications =====
* Metal & Oxide Deposition
* Lift-off
* Etch Hard-mask Formation

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP]
* [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide]
* [https://caltech.box.com/s/qp616ky1g083wqfeb1nokp4jtnqjifkc QCM Crystal Sensor Replacement Instructions]
* [https://caltech.box.com/s/e0oelbvt8cj4fg9bemitidnwee068qrn E-beam Process Maintenance Guide]
* [https://caltech.box.com/s/0ulhxthe9i465bpzinugiiefmfy6t0rb Materials Filling and Crucible Swap Instructions]
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.

===== Video Tutorials =====
* [https://youtu.be/4K75m4V0Lq4 CHA Training]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-6 to 1E-7 Torr
* All dry pumping system (cryo & dry mechanical pump)
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

CHA: Electron Beam Evaporator

2020-03-17T04:59:42Z

Alexw: /* SOPs & Troubleshooting */

{{InstrumentInfoboxOneImage|
|InstrumentName = CHA Evaporator
|HeaderColor = #F2682A
|ImageOne = CHA-Industries-Mark-40_E-Beam-Evaporator.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = CHA Industries
|Model = Mark 40
|Techniques = E-beam Evaporation
|EmailList = kni-cha
|EmailListName = E-beam Evaporator
}}
== Description ==
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.

===== Applications =====
* Metal & Oxide Deposition
* Lift-off
* Etch Hard-mask Formation

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP]
* [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide]
* [https://caltech.box.com/s/qp616ky1g083wqfeb1nokp4jtnqjifkc QCM Crystal Sensor Replacement Instructions]
* [https://caltech.box.com/s/e0oelbvt8cj4fg9bemitidnwee068qrn E-beam process maintenance guide]
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.

===== Video Tutorials =====
* [https://youtu.be/4K75m4V0Lq4 CHA Training]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-6 to 1E-7 Torr
* All dry pumping system (cryo & dry mechanical pump)
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Chalcogenide Sputter System

2020-03-17T00:49:38Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = Chalcogenide Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Chalcogenide-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion chalcogenide sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load-lock for fast sample transfer. There are five magnetron guns, three 2" guns and two 3" guns. A total of three RF and one DC power supplies can be used on any of the five guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. Uniformity across a 6" wafer is <5% variation for the 2" guns and <1.5% for the 3" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to four materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during processing, allowing oxides and nitrides to be formed from pure metal targets. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate; this can be used as a surface cleaner & etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Deposition of metals, dielectrics, and other special elements
** For reactive synthesis of dielectric materials, the [[ATC Orion 8: Dielectric Sputter System | Orion 8 dielectric sputter system]] is better suited
** For sputtering materials such as Te, Bi, Se, and Sb
*** Cr, Mn, Ni, and Fe are excluded from this chamber
* Surface cleaning & in-situ plasma etch

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/nqpy11vmb3g2feo6km3qcpje52u181wc KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

===== Process Recipes =====
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]
** The chalcogenide and dielectric systems are extremely similar; Please see the SOP for some differences

== Specifications ==
===== Hardware Specifications =====
* Ultimate Base Pressure: 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with manual sample transfer system
* Substrate holder accepts 150 mm samples and smaller
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Five Magnetron sputter guns
** Three confocally-oriented 3" guns (faces substrate at angle)
** Two confocally-oriented 2" guns (faces substrate at angle)
* Power Supplies:
** Four RF Supplies
*** One 100 W supply for substrate bias
*** One 600 W
*** Two 300 W
** One 1500 W DC Supply
*** Equipped with 2two-position switch router that enables sequential switching between two connected magnetrons

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

ATC Orion 8: Dielectric Sputter System

2020-03-17T00:48:12Z

Alexw:

{{InstrumentInfoboxOneImage|
|InstrumentName = Dielectric Sputter System
|HeaderColor = #F2682A
|ImageOne = Orion-8-Dielectric-Sputter-System.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = AJA International
|Model = ATC Orion 8
|Techniques = Magnetron Sputtering (RF,DC, pulsed DC), In-situ Plasma Etch & Surface Cleaning,Reactive Sputtering, Co-Sputtering
|EmailList = kni-sputter
|EmailListName = Sputter
}}
== Description ==
The AJA UHV Orion dielectric sputter system is capable of reaching UHV pressures as low as 1E-10 Torr. It is equipped with a load lock that allows for automatic sample transfer. There are eight magnetron guns, seven 2" guns, and one 3" gun. A total of two RF and three DC power supplies can be used on any of the eight guns, some with an internal switch box allowing for one power source to be sequentially routed to different guns, enabling automatic processes without manual cable swapping. One of the DC guns is a pulsed DC supply. Uniformity across a 6" wafer is <5% variation for the 2" guns. Pre-mixed targets of specific alloys and compounds may be sputtered. In addition, having multiple power supplies allows for co-sputtering of up to five materials simultaneously. Reactive sputtering may be performed by introducing oxygen and/or nitrogen into the chamber during process, allowing oxides and nitrides to be formed from pure metal targets. The pulsed DC supply is ideally suited for such reactive processes where a dielectric material is synthesized. Co-sputtering multiple elements in a reactive process can produce complex ceramics. An RF power supply is also present specifically for generating a localized plasma at the substrate. This can be used as a surface cleaner, etcher, for techniques such as ion-assisted deposition, and to assist in the reactive formation of metal-nitrides. This tool is also capable of substrate heating up to 800 °C, which can be used to facilitate reactions, alloying, to control film stress, and to control crystal growth mechanisms.

===== Reasons to Utilize Sputtering =====
* Ability to synthesize compounds and control compositions
* Wide variety of high quality oxides & nitrides may be synthesized
* Generally produces more uniform, better adhering films when compared to evaporation
* More conformal sidewall coverage for coating patterned substrates
** More conformal than evaporation, less conformal than CVD & ALD

===== Applications =====
* Metal and dielectric deposition
* Surface cleaning & in-situ plasma etch
* Ion-Assisted Deposition

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/hhgq1sg92wttazsllqsv5yaj2yvo2tfj KNI SOP]
* [https://caltech.box.com/s/z3u5bywcp0vlg4usb73i46v0ggnfuooi Troubleshooting Guide]
* [https://caltech.box.com/s/6q6vh9resic35esnczpipwse1b2nlnrc Reference/supplemental Materials]
* [https://caltech.box.com/s/1wl0hntcbzskq05im9lxdqjl0irtkir2 Sputter gun cable swap instructions]
* [https://caltech.box.com/s/sca3m472qwie0uehx6uv1strte3w2nxx QCM Deposition Rate Measurement Instructions]

===== Process Recipes =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Video Tutorials =====
* [https://youtu.be/y7JbzNZwZvs KNI Intro to Sputtering Presentation]
* [https://youtu.be/MlxUnwviBiI Dielectric Sputter Training]

===== Current Target Status =====
The following link will take you to a document which displays the current target configuration. This is updated after each time targets are rearranged.
* [https://caltech.box.com/s/zvvx785imo20hzngib5e1ck1uoipe6w6 Current target configuration]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-9 to 1E-10 Torr
* All dry pumping system (cryo & turbo & roots & diaphragm pumps)
* Load-lock-equipped system with automatic sample transfer
* Substrate holder accepts 150 mm and 100 mm wafers, as well as small chips affixed via pressure clips
* Substrate heating up to 800 °C provided by backside heating lamps
* Semiconductor grade Ar, N2, O2 process gases
* Eight Magnetron sputter guns
** Seven confocally-oriented 2" guns (faces substrate at angle)
** One centrally-located 3" gun (directly faces substrate)
* Power Supplies:
** Three RF Supplies
*** One 100 W supply for substrate plasma generation
*** One 600 W
*** One 300 W, equipped with 3-position switch router which enables sequential switching between 3 connected magnetrons
** Two 1500 W DC
** One 2000 W pulsed DC
*** Equipped with a two-position switch router that enables sequential switching between two connected magnetrons
*** Frequency range: 1-100 kHz
*** This unit is ideal for reactively sputtering dielectrics from metal targets

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Dual Chamber RIE: Silicon, III-V Material & Organics Etcher

2020-03-13T22:26:19Z

Alexw: /* Process Documents */

{{InstrumentInfoboxOneImage|
|InstrumentName = Dual Chamber RIE
|HeaderColor = #FFE2B9
|ImageOne = Dual-Chamber-RIE_Plasma-Therm-SLR.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Nathan S. Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-1319
|Manufacturer = Plasma-Therm
|Model = SLR 720
|Techniques = Silicon and compound semiconductor Reactive Ion Etching
|EmailList = kni-plasmatherm
|EmailListName = Plasmatherm RIE
}}
== Description ==
The Plasma-Therm SLR 720 is a dual-chamber reactive ion etching (RIE) system with a load-lock. It is designated for etching silicon and III-V compound semiconductors with a traditional RIE process.
===== Applications =====
* Silicon Etching
* III-V Material Etching
* Organic Material Etching

===== Allowed Material in RIE =====
* Si, SixNy, SiO2, Ge
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3 hard masks
* Buried/backside metal ok if never exposed (not an etch stop)

===== RIE Gas List =====
* SF6
* CHF3
* CF4
* O2
* Ar
* He
* H2

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/jsskat7yic4p7td31941dxuj97ja6er5 KNI SOP]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]

===== Process Documents =====
* [https://caltech.box.com/s/3n21r2o30u476ppnxfp657o3zbs9f0on Process Standards]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/tfieodeis71aligdpgp3g13kuceefnh0 Oxford Plasmalab System 100 DRIE Manual]
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/85mj9roas98jtwee9d22hk0wk9un54fl Manufacturer System Configuration]
===== System Features =====
* Universal base console which houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software
* 100 mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Close-coupled gas pod to ICP for two digital non-toxic mass-flow-controlled gas lines (SF6, and C4F8)
* Six line gas pod with 3 non-toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option
* Single user license for Anisotropic Silicon Etch Process (Bosch)
===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -150 to 400 °C
* ICP 380mm remote high-density plasma source with 8 kW RF generator and automatic matching unit close-coupled to the source.
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling

ICP-RIE: III-V, Metal & Silicon Etcher

2020-03-13T22:25:32Z

Alexw: /* Process Documents */

{{InstrumentInfoboxOneImage|
|InstrumentName = III-V, Metal & Si Etcher
|HeaderColor = #FFE2B9
|ImageOne = ICP-RIE_III-V,Metal,Si-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Nathan S. Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-1319
|Manufacturer = Oxford Instruments
|Techniques = pseudo-Bosch & Cryogenic Si Etch Compound Semiconductor Etching
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The III-V, Metal & Silicon inductively-coupled plasma reactive-ion etcher (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for the etching of compound semiconductors, metals, and silicon. In addition to a wide range of gases for etching a variety of III-V materials and metals, this system is configured for highly-selective ICP-RIE of silicon via the pseudo-Bosch process, allowing silicon etching with SF6 and C4F8 gases as well as cryogenic silicon etching with SF6 and O2 over a temperature range of -140 to 300 °C. This system supports wafer sizes up to 6 inches.
===== Applications =====
* InP grating etch
* GaAs photonics device etch
* pseudo-Bosch of silicon
* Metals etch
* Cryogenic etch of silicon (available upon request)
===== Allowed Material in Etcher =====
* Si, SixNy, SiO2, Ge, InP, GaAs, Al, Mo, Nb, W, Ti
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3, Cr hard masks
* Metal in etch stack
===== Etching Gas List =====
* SF6
* C4F8
* O2
* Ar
* Cl2
* SiCl4
* CH4
* H2
* HBr

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/nondj2ore8rg61tpur6hj4a3hvj8j9s5 Process Standards]
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen (KNI Recipe)]
* [https://caltech.box.com/s/wybxe3urco5s6bqw5getfu7p0amxq7wx AlGaN/GaN Etch with Photoresist Mask]
* [https://caltech.box.com/s/q3sq9cwkp5dicigkj6gkvohuqtf5ivwx InP Etch]
* [https://caltech.box.com/s/4e22q4i3e5cpgjyrykf7r4bm0m0pob59 InP/ InGaAsP Laser Facet ICP Etching]
* [https://caltech.box.com/s/borba8iuvxi9qj2pe8g0vj5vo7xpta0d GaAs Via Hole Etch]
* [https://caltech.box.com/s/x0mm9bsvwc17ev3vx5ks759mwa36tpxm Selective GaAs Etch]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Silicon Nitride etch]
* [https://caltech.box.com/s/4e6rskkmv1sgu9ipgfnrzeq0cguo1gc0 Hard Mask Oxide Etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/40kaaqur8ohyg55uq2pv3jqrzlgi98ts Comparison of Pseudo-Bosch ICP-RIE Etch of SiO2-SiNx]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (login to LabRunr required)
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/f8f1fx1ffz4ql71suxsvrw0p20b2inp5 Manufacturer Data Sheet]

===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software (Not Bosch)
* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Twelve line gas pod with three non-toxic and six toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option

===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -140 to 400 °C
* ICP 380 mm remote high-density plasma source with 5 kW RF generator and automatic matching unit close-coupled to the source
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling

Process Recipe Library

2020-03-13T22:24:48Z

Alexw: /* Dry Etching */

You can browse the available recipes below, by lab area. You can also browse directly within the KNI's Box directory. Note that the vast majority of recipes are being made publicly available; only a select few are password-protected for members of the Caltech community:
# [https://caltech.app.box.com/folder/89929833301 All Content (requires login with a caltech.edu email address)]
# [https://caltech.box.com/s/uqtkc7xev3xvda2ueykt7cj1886ok1mg Publicly available content (no login required)]

== Lithography Process Recipes ==
===== Electron Beam Lithography =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg KNI Introduction to BEAMER]
* [https://youtu.be/AV-SeYZktu4 How to Spin Photoresist onto Wafers and Pieces (Video)]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]

===== Helium Ion Beam Lithography =====
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]

===== Neon Ion Beam Lithography =====
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Optical Lithography =====
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 Photoresist spinning procedure]
* [https://caltech.box.com/s/xqwbmcj7l4itj6nqp6lbo7h4vexee0tr AZ9260 Photoresist spinning procedure]
* [https://caltech.box.com/s/6et86m5wlrjf80ew9yo0v8rgjifsdzfs AZ nLof 2000 Photoresist Recipe]
* [https://caltech.box.com/s/3pa2im5jj1e86rdozwigt8yfnb8fi5k3 S1813 Photoresist spinning procedure]

== Deposition Process Recipes ==
===== Sputtering =====
* [https://caltech.box.com/s/z043k1ne91oowp70lzt69kau0u2nq79f SnO2 sputtering recipe]
* [https://caltech.box.com/s/oxxv5sy3j7wbqyjc8r9x2wqheabne2lg NbOx sputtering recipe]
* [https://caltech.box.com/s/95qrpvvggcaztmpc7whd9v9o4d9rih5x TiO2 sputtering recipe]
* [https://caltech.box.com/s/k669kh04xglamkidhuo7xq04xan146xt AlN sputtering recipe]
* [https://caltech.box.com/s/7cqdk2g5ic2wa35lu4y2fu03esfk7sdy Al2O3 sputtering recipe]
* [https://caltech.box.com/s/a49yh35hkb2x5qnskivzde0y8z0o4cpn Guide to maintaining a plasma using gradual pressure changes]

===== Chemical Vapor Deposition (CVD) =====
* [https://caltech.box.com/s/qnxzioeoudzbnow9aopguf9xkysxsey3 PECVD amorphous Si recipe]
* [https://caltech.box.com/s/gy10uau7tikhvhakgpjvlzalb7boavbv PECVD SiO2 (350 C) recipe]

== Etching Process Recipes ==
===== Dry Etching =====
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/vbjlzmbprhw1sg3auoz1oso5clwrme87 In-situ (dielectric sputter) RF plasma etch of thermal SiO2]
* [https://caltech.box.com/s/40kaaqur8ohyg55uq2pv3jqrzlgi98ts Comparison of Pseudo-Bosch ICP-RIE Etch of SiO2-SiNx]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Wet Etching =====
* [https://caltech.box.com/s/ob0wosa8tp79xo3wa3taxbjy24kya6qs HF etching of SiO2 deposited via wet thermal oxidation]
* [https://caltech.box.com/s/fjww9pngq4fwzbd26iz5rci4cyc5jv0b HF etching of SiO2 deposited via PECVD]

== Microscopy Process Recipes ==
===== Focused Ion Beam (FIB) Systems =====
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-sections with SEM/Ga-FIB]
* [https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Preparing TEM Lamella Samples with SEM/Ga-FIB]
** [https://caltech.box.com/s/lhaweqbefmep8n79u4nvynsv0cjctuc1 Process Recipe for TEM Lamella prep for Thin Films on Si Substrates]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild Guide for ORION NanoFab He- & Ne-FIB]

===== Scanning Electron Microscopes (SEMs) =====
* [https://caltech.box.com/s/e5cdnag69i2w9nm1d0p07fyun4k15b5c Environmental SEM (ESEM) Imaging Guide (for biological and highly non-conductive specimens)]
* [https://caltech.box.com/s/vg9rpa4ac9e1eki79hfecccpohl3qp6u Performing Aligned EBL Patterning Steps with NPGS on an SEM] | [https://caltech.box.com/s/tl4bliegxptu5tfmzu0p7vs1hcnxtyj8 Alignment Template Files]

===== Transmission Electron Microscopes (TEMs) =====
* [https://caltech.box.com/s/fwhkep9qf3bhdygshvfi4dycy2qpmi0i STEM mode EDS on TF-20 TEM (emphasis on high-resolution 2D mapping)]
* [https://caltech.box.com/s/lstv8e5zy94fnt3o0y7urfw41mpesd38 Procedure to Evaluate Selected Area Electron Diffraction (SAED) Patterns]
**[https://caltech.box.com/s/59upcnvhlqulnazm51b0dihd942xebn3 All Resources for SAED Evaluation, including DPs captured of standard samples]

== Thermal Processing ==
===== Wet Oxidation =====
* [https://caltech.box.com/s/nqiiqwlhip4dcult2mtuvvdlxw0gv086 Wet Oxidation at 1000C on Tystar Tube Furnaces]

== Multi-Technique Fabrication Processes ==
* [https://caltech.box.com/s/ohm3fp2h3203yxi6j8peo8bf4v1mz0yt Si-W notched nanopillar fabrication]

EBPG 5000+: 100 kV Electron Beam Lithography

2020-03-12T18:01:37Z

Alexw: /* Lithography Process Information */

{{InstrumentInfoboxOneImage|
|InstrumentName = EBPG 5000+
|HeaderColor = #FFFFFF
|ImageOne = EBPG-5000+.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Model = EBPG 5000+
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
}}
== Description ==
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cwp88iw2q5t8eygl114zs8ywlhraxo16 EBPG reservation and use policy]
* [https://caltech.box.com/s/s21wk4nw02qmbugt4z30zjbold5sz41p EBPG Training presentation (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/xvj8jjzjyocr8kht8xfl7e6qb024t5a6 EBPG Preparing pieces for exposure on 5000+ SOP]
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5000+ page)

===== Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]
* [https://caltech.box.com/s/1ge5czbz4b1pbfz2wrzbjmynnktdc0ci EBPG 5000+ Troubleshooting Loader errors]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules]
* [https://caltech.box.com/s/wnx3fid41baefile9epmm797tbf81z59 App Note: Multipass]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)

== Specifications ==
===== Manufacturer Specifications and Manuals =====
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual]

===== Specifications =====
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 300μm, 300μm, 400μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

EBPG 5200: 100 kV Electron Beam Lithography

2020-03-12T17:40:29Z

Alexw: /* Lithography Process Information */

{{InstrumentInfobox|
|InstrumentName = EBPG 5200
|HeaderColor = #FFFFFF
|ImageOne = Wavelength-scale-Piezoelectric-Transducer_Alp-Sipahigil.jpg
|ImageTwo = EBPG-5200.jpg
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B233C Steele
|LabPhone = 626-395-1531 & -1540
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Raith Lithography BV
|Techniques = Electron Beam Lithography
|EmailList = kni-ebpg
|EmailListName = EBPG
|Model = EBPG 5200
}}
== Description ==
The Raith EBPG 5200 is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 3" wafers, piece parts from a couple of mm to 3" diameter and up to 6.35 mm thick, and 6" mask plates. This instrument can be outfitted with substrate holders to handle up to 200 mm wafers. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
===== Operational Applications =====
* Non-aligned electron beam lithography
* Aligned (aka direct-write) electron beam lithography

===== Scientific / Technical Applications =====
* Nanophotonics
* Nano-optics
* Waveguides

== Resources ==
===== General SOPs =====
* [https://caltech.box.com/s/qzhf1h1su3a1vadl6p76mg6tav49uisn EBPG SOP]
* [https://caltech.box.com/s/jq0s85sdsd069cv9aesdfixy5fueihyh User's Guide to the EBPG pg computer desktop]
* [https://caltech.box.com/s/9whswv26y0w6yua8073nw080r3lcfdz4 EBPG Troubleshooting Guide]
* [https://caltech.box.com/s/cwp88iw2q5t8eygl114zs8ywlhraxo16 EBPG reservation and use policy]
* [https://caltech.box.com/s/s21wk4nw02qmbugt4z30zjbold5sz41p EBPG Training presentation (Caltech-only access)]

===== Sample Prep and Writing SOPs =====
* [https://caltech.box.com/s/ys4qbxnsqfqbrdo4dm7t48z1z9dljuwi EBPG High Resolution Mode SOP]
* [https://caltech.box.com/s/vpkguvtrdw9eup3rytljb5re9rfbe1fb EBPG 5200 Piece part prep SOP]
* [https://caltech.box.com/s/6yp4eq33y84y12hon075sbh1t7uukvay EBPG Preparing sample for exposure SOP]
* [https://caltech.box.com/s/c5gz16zs97vcsnlayr5kj7zffnv9mq81 EBPG Beam Adjustment SOP]
* [https://caltech.box.com/s/3cs4x9gw0b3jdrg1acpt9e0lt5wbphzb EBPG Adjust Aperture SOP]
* [https://caltech.box.com/s/uoeq30e8bxh8r3dza33ju4sid5qycg8z EBPG Marker definition Procedure]
* [https://caltech.box.com/s/ah2irxdmlw1x4xiodi8wdhxa6yn671uu EBPG JOY Marker Procedure]
* [https://caltech.box.com/s/6mqfko3fswi0rwrt8zfaj8nwjfr9v2c7 EBPG Disable marker height check SOP]
* [https://caltech.box.com/s/weqpi9oam0hbvxefqp8md1q4z8q14hze EBPG 5200 Secondary Electron Detector SOP]
* [https://caltech.box.com/s/k2sicwqfbin5ktns5m30ir8wtdjqhea0 EBPG Holderfix SOP]
* [https://labrunr.caltech.edu/Equipment_2.aspx EBPG Remote Access SOP] (log into ''LabRunr'' and download SOP from EBPG 5200 page)

===== Troubleshooting SOPs =====
* [https://caltech.box.com/s/55zji9vfs8kuxl0aye1sw1iy8xi0rd9c Information Archive Beam]
* [https://caltech.box.com/s/qnl5l52v936kql830kt0fyrmlaj8cbmo BEAMS $pg shutdown / coldstart SOP]
* [https://caltech.box.com/s/vvv20x3k5xd0g8ie5039ox9cz601h7nn Beam file Recovery SOP]
* [https://caltech.box.com/s/afdyjxjo54l1v2ukubon5ntin73aflc1 Lindgren MACS SOP]
* [https://caltech.box.com/s/tf87blqopht0y51hy4agn2fsfjh7wot9 EBPG Emergency air cylinder SOP]
* [https://caltech.box.com/s/e9jsz2kisfzjsyeomqr5gmjj3fc0nifx EBPG Unlocking the stage SOP]
* [https://caltech.box.com/s/pol1ceg2sbjsmbb6b5vtsw641hwj5r2l EBPG SAEHT not initialized SOP]
* [https://caltech.box.com/s/lsrjqc5n6pwqpc4al8qxaxq03k21y38i EBPG SAEHT no route to host recovery SOP]
* [https://caltech.box.com/s/1fe4803rl38fa7a7w50r77c4nf64818l EBPG hotbox slave communications fault recovery SOP]
* [https://caltech.box.com/s/emfc1i4qeg9psatj6enpm9g38f5a2u9r EBPG FEG recovery and new beam table SOP]
* [https://caltech.box.com/s/oxjf52qwvj0ocnx151aqd6tso8ykfkca Raith Common errors and solutions with aligned writing SOP]

===== Data Preparation Resources =====
* [https://caltech.box.com/s/0xofm2zqmhzm6tv85ihfnhdhzuo8jpjg SOP: KNI Introduction to Layout BEAMER]
* [https://caltech.box.com/s/fql3uk5i3j8kv7tkx9auveomg0clubhn App Note: 3D Surface Proximity Effect Correction]
* [https://caltech.box.com/s/a0mym20drharh2fj1ne8nex6a0jw3te4 App Note: Fracture Optimization]
* [https://caltech.box.com/s/ef3zou8b9xk597jxs7bs1s1yck1lo5cu App Note: Writing Time Optimization]
* [https://caltech.box.com/s/c8hsz4opsgb0j8nmqq48v64wnlxth5l5 App Note: Formulas in Beamer Modules]
* [https://caltech.box.com/s/wnx3fid41baefile9epmm797tbf81z59 App Note: Multipass]
* [https://caltech.box.com/s/yh1ku02vjnf3ew8uvmjbyn8hv5t0em72 App Note: Mixed Export Options]
* [https://caltech.box.com/s/9wbovly55qu2plfmoian6a7ocbw7pk2h App Note: GPF Formatter]

===== Lithography Process Information =====
* [https://caltech.box.com/s/nwuxjbfm0fp0lb4k12albsr3zbnqk9po Bi-Layer PMMA Resist Spinning Recipe]
* [https://caltech.box.com/s/2pumpha7ywa8zenvfzjxlggglvm4u3h5 MAN Resist Data Sheet]
* [https://caltech.box.com/s/lw2h56h0lqabwo82yofu52dqgi61gcp9 PMMA Resist Data Sheet]
* [https://caltech.box.com/s/acjh5syhzh4zm55jp76ef2hrzkeo4htw SML Resist Data Sheet]
* [https://caltech.box.com/s/vfvq5l8apkzzefxiu6weexpt37xpx9os ZEP Resist Data Sheet]
* [https://caltech.app.box.com/file/549582924881 ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/lijnz00qwpk7z5qbz8kn9tjo0kqfgz4a HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)]
* [https://caltech.box.com/s/ji4zqki1wps2anyjy45on7cp0szvb3yk Supramolecular Resist processing (Caltech-only access)]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner cleaning SOP]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/wob17hrfwphxuu2a897pwlx2sn0d0pmu EBPG 5200 system manual (Caltech-only access)]
* [https://caltech.box.com/s/wzeujygt2qof76x9r5wd5e5mrz5liy0i Raith cjob manual (Caltech-only access)]
* [https://caltech.box.com/s/gvgy6vpty5g33qvf9pdef629770vmjiw Layout Beamer Release Notes]
* [https://caltech.box.com/s/6047un2cme4wwgs9ztvexjelp5x7e79p Layout Beamer Manual]
* [https://labrunr.caltech.edu/Equipment_2.aspx Laurell Spin Coater Manual] (log into ''LabRunr'' and download Manual from EBPG 5000+ page)

== Specifications ==
* Voltage Range: 20, 50 or 100 kV
* Current Range: 50 pA to 200 nA
* Main Field Size: Up to 1 mm x 1 mm
* Main Field Resolution: 20 bit
* Maximum Writing Frequency: 100 MHz
* Aperture Sizes: 200 μm, 300 μm, 400 μm
 
 
== Related Instrumentation in the KNI ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

ICP-RIE: III-V, Metal & Silicon Etcher

2020-03-10T18:46:31Z

Alexw: /* Process Documents */

{{InstrumentInfoboxOneImage|
|InstrumentName = III-V, Metal & Si Etcher
|HeaderColor = #FFE2B9
|ImageOne = ICP-RIE_III-V,Metal,Si-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Nathan S. Lee]]
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-1319
|Manufacturer = Oxford Instruments
|Techniques = pseudo-Bosch & Cryogenic Si Etch Compound Semiconductor Etching
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The III-V, Metal & Silicon inductively-coupled plasma reactive-ion etcher (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for the etching of compound semiconductors, metals, and silicon. In addition to a wide range of gases for etching a variety of III-V materials and metals, this system is configured for highly-selective ICP-RIE of silicon via the pseudo-Bosch process, allowing silicon etching with SF6 and C4F8 gases as well as cryogenic silicon etching with SF6 and O2 over a temperature range of -140 to 300 °C. This system supports wafer sizes up to 6 inches.
===== Applications =====
* InP grating etch
* GaAs photonics device etch
* pseudo-Bosch of silicon
* Metals etch
* Cryogenic etch of silicon (available upon request)
===== Allowed Material in Etcher =====
* Si, SixNy, SiO2, Ge, InP, GaAs, Al, Mo, Nb, W, Ti
* PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3, Cr hard masks
* Metal in etch stack
===== Etching Gas List =====
* SF6
* C4F8
* O2
* Ar
* Cl2
* SiCl4
* CH4
* H2
* HBr

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/nondj2ore8rg61tpur6hj4a3hvj8j9s5 Process Standards]
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen (KNI Recipe)]
* [https://caltech.box.com/s/wybxe3urco5s6bqw5getfu7p0amxq7wx AlGaN/GaN Etch with Photoresist Mask]
* [https://caltech.box.com/s/q3sq9cwkp5dicigkj6gkvohuqtf5ivwx InP Etch]
* [https://caltech.box.com/s/4e22q4i3e5cpgjyrykf7r4bm0m0pob59 InP/ InGaAsP Laser Facet ICP Etching]
* [https://caltech.box.com/s/borba8iuvxi9qj2pe8g0vj5vo7xpta0d GaAs Via Hole Etch]
* [https://caltech.box.com/s/x0mm9bsvwc17ev3vx5ks759mwa36tpxm Selective GaAs Etch]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Silicon Nitride etch]
* [https://caltech.box.com/s/4e6rskkmv1sgu9ipgfnrzeq0cguo1gc0 Hard Mask Oxide Etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/40kaaqur8ohyg55uq2pv3jqrzlgi98ts Comparison of Pseudo-Bosch ICP-RIE Etch of SiO2-SiNx]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (login to LabRunr required)
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/f8f1fx1ffz4ql71suxsvrw0p20b2inp5 Manufacturer Data Sheet]

===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software (Not Bosch)
* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Twelve line gas pod with three non-toxic and six toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option

===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -140 to 400 °C
* ICP 380 mm remote high-density plasma source with 5 kW RF generator and automatic matching unit close-coupled to the source
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling